All IPs > Interface Controller & PHY
Interface Controller & PHY semiconductor IPs are integral components in modern digital systems that facilitate communication between various parts of an electronic system, including processors, memory, and peripherals. These IPs are designed to manage data traffic efficiently, ensuring reliable and high-speed data transfer between different interfaces and devices. This catalog features a wide range of IPs that serve various standard and custom interface protocols, making them indispensable for semiconductor companies developing complex SoCs (System on Chips) and digital systems.
In this category, you will find a selection of IPs tailored for popular interface protocols such as AMBA (AHB, APB, AXI), HDMI, PCI, USB, and MIPI, among others. Each IP solution is optimized for performance, supporting high-speed data transfer and reduced latency to meet the demanding needs of today's applications. These IPs not only provide seamless integration capabilities into your design but also ensure compliance with industry standards, which is crucial for interoperability in multi-vendor environments.
The embedded controllers within these IPs handle the logical functions necessary for device communication, while the PHY (physical layer) IPs manage the actual transmission and reception of data across physical media. Together, they enable efficient bridging between different communication protocols, making them critical components in a vast array of devices ranging from consumer electronics like smartphones and gaming consoles to industrial systems and automotive applications.
Our catalog also offers specialized solutions such as Multi-Protocol PHYs that support multiple standards within a single IP, providing flexibility and reducing the footprint for designs that require versatile connectivity options. By selecting the right Interface Controller & PHY IP from our catalog, developers can significantly enhance the functionality and overall performance of their products, leveraging the latest advancements in data interface technology. Explore our offerings and find the precise IP solutions needed to bring your innovative designs to life.
Sunplus' LVDS IP provides a high-speed solution for data transmission across electronic devices, optimizing communication between integrated circuits. LVDS, or Low-Voltage Differential Signaling, is an effective way to achieve rapid data transfer rates with minimal electromagnetic interference, making it ideal for high-performance computer and multimedia applications. The IP is a key component in facilitating the transfer of video and display data, ensuring a crisp and clear output. Its ability to handle high data transfer speeds while maintaining a reduced power footprint is advantageous for modern consumer electronics that prioritize both performance and energy efficiency. With its adaptable design, Sunplus' LVDS IP can be integrated across a wide array of devices, providing developers with the flexibility needed for customized solutions. Its robust signal management capabilities ensure that data integrity is preserved even in complex operational environments, enhancing overall system reliability and user satisfaction.
The KL730 AI SoC is a state-of-the-art chip incorporating Kneron's third-generation reconfigurable NPU architecture, delivering unmatched computational power with capabilities reaching up to 8 TOPS. This chip's architecture is optimized for the latest CNN network models and performs exceptionally well in transformer-based applications, reducing DDR bandwidth requirements substantially. Furthermore, it supports advanced video processing functions, capable of handling 4K 60FPS outputs with superior image handling features like noise reduction and wide dynamic range support. Applications can range from intelligent security systems to autonomous vehicles and commercial robotics.
Primesoc's PCIE GEn7 IP is dual mode controller , supporting upto 128Gbps per lane data rate , which can work as root complex or as an endpoint. This is a soft IP which can support serdes and non serdes architectures and PIPE interface of 64bit and lanes configurable from 1/2/4/8/16.
Advanced Peripheral Bus (APB) is one of the Advanced Microcontroller Bus Architecture (AMBA) family protocols. It is a low-cost interface that is designed for low power consumption and interface simplicity. Unlike AHB, it is a non-pipelined protocol for connecting low-bandwidth peripherals. Mostly used to link external peripherals to the SOC. Every APB transfer requires at least two clock cycles (SETUP Cycle and ACCESS Cycle) to finish. The APB interface is designed for accessing the programmable control registers of peripheral devices. The APB protocol has two independent data buses, one for read data and one for write data. The buses can be 8, 16, or 32 bits wide. The read and write data buses must have the same width. Data transfers cannot occur concurrently because the read data and write data buses do not have their own individual handshake signals.
Silicon Creations' SerDes Interfaces are crafted to handle high-speed data transmission challenges over varied processes, ranging from 12nm to 180nm. Addressing multiple protocols such as CPRI, PCIe, and SATA, these interfaces demonstrate flexibility by supporting data transmission speeds from 100 Mbps to beyond 32 Gbps. The architecture incorporates a host of advanced features including adaptive equalization techniques and programmable de-serialization widths, making it stand out in terms of performance and signal integrity even under challenging conditions. With ultra-low latency PMAs, they sustain excellent operational speed and efficiency, imperative for sophisticated communication applications. Moreover, Silicon Creations partners with leading entities to provide comprehensive solutions, including complete PCIe PHY integrations. This synergy ensures that SerDes Interfaces are fully optimized for operational excellence, delivering stable and reliable communication signals. With an emphasis on low power and minimized area requirements, they cater to burgeoning industry needs for power-efficient and space-conservative designs.
AMBA AHB is a bus interface designed for high-performance synthesizable applications. It specifies the interface between components such as initiator , interconnects, and targets. AMBA AHB incorporates the features needed for high-performance, high clock frequency systems. The most common AHB targets are internal memory devices, external memory interfaces, and high-bandwidth peripherals.
The CXL 3.1 Switch by Panmnesia is a high-performance solution facilitating flexible and scalable inter-device connectivity. Designed for data centers and HPC systems, this switch supports extensive device integration, including memory, CPUs, and accelerators, thanks to its advanced connectivity features. The switch's design allows for complex networking configurations, promoting efficient resource utilization while ensuring low-latency communication between connected devices. It stands as an essential component in disaggregated compute environments, driving down latency and operational costs.
The bus converter module transforms wide initiator data buses to smaller target data buses or vice-versa. A narrow target on a wide bus, only requires external logic and no internal design changes. * APB: 32-bit wide initiator data buses to 16-bit target data buses. * AHB: 64-bit wide initiator data buses to 32-bit target data buses. * AXI: 256-bit wide initiator data buses to 64-bit target data buses A wide target on a narrow bus, only requires external logic and no internal design changes. * APB: 16-bit wide initiator data buses to 32-bit target data buses. * AHB: 32-bit wide initiator data buses to 64-bit target data buses. * AXI: 64-bit wide initiator data buses to 256-bit target data buses.
Axelera AI has crafted a PCIe AI acceleration card, powered by their high-efficiency quad-core Metis AIPU, to tackle complex AI vision tasks. This card provides an extraordinary 214 TOPS, enabling it to process the most demanding AI workloads. Enhanced by the Voyager SDK's streamlined integration capabilities, this card promises quick deployment while maintaining superior accuracy and power efficiency. It is tailored for applications that require high throughput and minimal power consumption, making it ideal for edge computing.
The Advanced eXtensible Interface(AXI) bus is a high-performance parallel bus that connects on-chip peripheral circuits (or IP blocks) to processor cores. The AXI bus employs "channels" to divide read and write transactions into semi-independent activities that can run at their own pace. The Read Address and Read Data channels send data from the target to the initiator, whereas the Write Address, Write Data, and Write Response channels transfer data from the initiator to the target.
Exostiv is designed to provide significant visibility inside FPGA systems, enabling engineers to conduct real-environment testing and ensure that designs function efficiently before entering production. Featuring high-speed probes capable of capturing complex signals, Exostiv supports advanced FPGA debugging through its user-centric interface and adaptable insertion flows. It facilitates both pre-silicon validation and debugging by allowing in-depth monitoring across various clock domains. With connectivity options like QSFP28 and SAMTEC ARF-6, Exostiv empowers engineers with a flexible approach to manage different prototyping platforms effectively. The scalability of Exostiv allows its users to adapt to diverse FPGA configurations by adjusting the number and type of probes. Exostiv significantly reduces the likelihood of FPGA bugs in end-user environments by enabling engineers to thoroughly validate and adjust designs dynamically as needed. Its modular setup characterizes the adaptive nature of Exostiv’s architecture, making it suitable for application-specific optimizations in complex design environments.
The Multi-Protocol SERDES offered by Pico Semiconductor is a versatile solution capable of handling a variety of communication protocols. This series of SERDES includes a 4-channel configuration that supports data rates up to 32Gbps, designed for integration with XAUI, RXAUI, and SGMII. It is compatible with multiple process nodes provided by foundries like TSMC and GF, offering robust performance across different semiconductor environments. These SERDES are crafted to meet high-performance metrics, capturing speeds up to 16Gbps and 6.5Gbps across various models, with advanced versions reaching up to 32Gbps. This exceptional range not only ensures compatibility with current technologies but also prepares systems for future updates, sustaining high data throughput. By delivering reliable high-speed data transmission capabilities, the Multi-Protocol SERDES from Pico Semiconductor is integral for networking, high-speed computing, and data storage applications, where efficient and speedy data transfer is paramount.
Overview: The MIPI CSI-2 (Camera Serial Interface) defines an interface between a peripheral device (camera) and host processor (application engine) for mobile applications. It offers the mobile industry a standard, robust, scalable, low-power, high-speed, and cost-effective interface that supports a wide range of imaging solutions for mobile devices. Key Features:  Compliance with MIPI-CSI-2 version 3.0  Compliance with C-PHY 2.0 for MIPI CSI-2 Version 3.0  Compliance with D-PHY 2.5 for MIPI CSI-2 Version 3.0  Compatibility with I2C and I3C (SDR, DDR) for CCI interface  Support for C-PHY 2.0, D-PHY 2.5, A-PHY, M-PHY with configurable PHY layer  Processor Interfaces: AHB Lite/APB/AXI for configuration  Lane Merging Function for consolidating packet data in CSI-2 Receiver  De-skew detection in D-PHY and sync word detection in C-PHY  Pixel Formats Supported: YUV, RGB, and RAW data  Virtual Channels: 16 for D-PHY, 32 for C-PHY  Error detection, interleaving, scrambling, and descrambling support  Byte to pixel conversion in LLP layer Applications:  Imaging  Surveillance  Gaming  Sensor devices  Internet of Things (IoT)  Wearable devices  Virtual Reality  Augmented Reality  Automotive Systems
The Metis M.2 AI accelerator module from Axelera AI is a cutting-edge solution for embedded AI applications. Designed for high-performance AI inference, this card boasts a single quad-core Metis AIPU that delivers industry-leading performance. With dedicated 1 GB DRAM memory, it operates efficiently within compact form factors like the NGFF M.2 socket. This capability unlocks tremendous potential for a range of AI-driven vision applications, offering seamless integration and heightened processing power.
eSi-Connect delivers a comprehensive suite of AMBA-compliant peripheral IPs, designed to streamline connectivity in SoC designs. This suite includes a range of interface controllers, memory controllers, and standard I/O components like UART, SPI, I2C, and much more. Designed with integration flexibility in mind, these components utilize the AMBA AXI, AHB, and APB protocols to ensure seamless communication across different modules within a chip. Each peripheral is equipped with low-level software drivers, enhancing their deployment in real-time environments and alleviating integration and development burdens from engineers.
Overview: The MIPI I3C Controller IP Core is fully compliant with the latest I3C specification, offering high bandwidth and scalability for integrating multiple sensors into mobile, automotive, and IoT system-on-chips (SoCs). This controller support in-band interrupts within the 2-wire interface, reducing pin count, simplifying board design, and lowering power and system costs. Backward compatibility with I2C ensures future-proof designs, and the controller's operating modes enable efficient connectivity for systems with multiple ICs and sensors on a single I3C bus. The ARM® AMBA® Advanced High-Performance Bus (AHB) facilitates seamless integration of the IP into the SoC. Key Features:  Compliance with MIPI-I3C Basic v1.0  Backward compatibility with I2C  Two-wire serial interface up to 12.5MHz using Push-Pull  Dynamic and Static Addressing support  Single Data Rate messaging (SDR)  Broadcast and Direct Common Command Code (CCC) Messages support  In-Band Interrupt capability  Hot-Join Support Applications:  Consumer Electronics  Defense  Aerospace  Virtual Reality  Augmented Reality  Medical  Biometrics (Fingerprints, etc.)  Automotive Devices  Sensor Devices
The AHB-Lite APB4 Bridge from Roa Logic is a versatile interconnect solution, designed to serve as a bridge between the AMBA 3 AHB-Lite v1.0 and the APB v2.0 (APB4) bus protocols. This soft IP core facilitates the connection of multiple APB4 peripherals through a single bridge, optimizing system design by reducing complexity and cost. The core is fully parameterized, supporting various APB4 address and data widths, and offers the capability to handle burst transfers automatically. It also supports different clock domains per interface, efficiently managing cross-domain timing with ease. This flexibility in design makes it suitable for a wide range of applications, especially those requiring efficient, cost-effective interconnect solutions. The AHB-Lite APB4 Bridge is ideal for use in applications requiring high integration and efficient communication between high-speed processors and peripheral devices. Source code and detailed documentation are readily available for download from Roa Logic's GitHub repository, ensuring developers have all necessary resources for seamless integration.
RaiderChip's GenAI v1 is a pioneering hardware-based generative AI accelerator, designed to perform local inference at the Edge. This technology integrates optimally with on-premises servers and embedded devices, offering substantial benefits in privacy, performance, and energy efficiency over traditional hybrid AI solutions. The design of the GenAI v1 NPU streamlines the process of executing large language models by embedding them directly onto the hardware, eliminating the need for external components like CPUs or internet connections. With its ability to support complex models such as the Llama 3.2 with 4-bit quantization on LPDDR4 memory, the GenAI v1 achieves unprecedented efficiency in AI token processing, coupled with energy savings and reduced latency. What sets GenAI v1 apart is its scalability and cost-effectiveness, significantly outperforming competitive solutions such as Intel Gaudi 2, Nvidia's cloud GPUs, and Google's cloud TPUs in terms of memory efficiency. This solution maximizes the number of tokens generated per unit of memory bandwidth, thus addressing one of the primary limitations in generative AI workflow. Furthermore, the adept memory usage of GenAI v1 reduces the dependency on costly memory types like HBM, opening the door to more affordable alternatives without diminishing processing capabilities. With a target-agnostic approach, RaiderChip ensures the GenAI v1 can be adapted to various FPGAs and ASICs, offering configuration flexibility that allows users to balance performance with hardware costs. Its compatibility with a wide range of transformers-based models, including proprietary modifications, ensures GenAI v1's robust placement across sectors requiring high-speed processing, like finance, medical diagnostics, and autonomous systems. RaiderChip's innovation with GenAI v1 focuses on supporting both vanilla and quantized AI models, ensuring high computation speeds necessary for real-time applications without compromising accuracy. This capability underpins their strategic vision of enabling versatile and sustainable AI solutions across industries. By prioritizing integration ease and operational independence, RaiderChip provides a tangible edge in applying generative AI effectively and widely.
The secondary or slave PHY interface, specifically designed for LPDDR4/4X/5, serves as a pivotal element for AI processors and alternative ASICs seeking the latest in high-speed, low-power LPDDR interface protocols. This IP facilitates seamless data interchange across various devices, compliant with established JEDEC standards. While initially crafted for the 7nm TSMC node, this PHY can be adapted for other logical processes, making it suitable for a diverse array of memory types ranging from traditional DRAM and SRAM to innovative non-volatile memories. This adaptability illustrates its robust application scope within modern technological frameworks.
The NuLink Die-to-Die PHY for Standard Packaging is a cutting-edge interconnect solution that bridges multiple dies on a single standard package substrate. This technology supports numerous industry standards, including UCIe and BoW, and adapts to both advanced and conventional packaging setups. It enables low-power, high-performance interconnections that are instrumental in the design of multi-die systems like SiPs, facilitating bandwidth and power efficiencies comparable to that of more costly packaging technologies. Eliyan's PHY technology, distinctive for its innovative implementation methods, offers similar performance attributes as advanced packaging alternatives but at a fraction of the thermal, cost, and production time expenditures. This design approach effectively utilizes standard packages, circumventing the complexities associated with silicon interposers, while still delivering robust data handling capabilities essential for sophisticated ASIC designs. With up to 64 data lanes, and operating at data rates that reach 32Gbps per lane, the NuLink Die-to-Die interconnect elements ensure consistent performance. Such specifications make them suitable for high-demand applications requiring reliable, efficient data transmission across multiple processing elements, reinforcing their role as a fundamental building block in the semiconductor landscape.
MAXVY UCIe VIP , a state-of-the-art solution that offers a comprehensive set of features and capabilities to ensure the quality and performance of your UCIe designs. MAXVY UCIe VIP is fully compliant with UCIe Specification version 1.0 and supports all the layers of the UCIe stack, such as FDI, RDI, LogPHY, PCIe, and CXL protocols. MAXVY UCIe VIP is also very user-friendly and flexible, with simple APIs, easy integrations, and configurable parameters. You can easily customize and control the UCIe functionality according to your needs. MAXVY UCIe VIP also provides a rich set of verification capabilities, such as protocol checks, functional coverage, traffic generation, error injection, and debug tools. You can easily monitor, detect, and report any issues or violations in your UCIe designs. MAXVY UCIe VIP is compatible with the industry-standard Universal Verification Methodology (UVM) and supports all leading simulators. With MAXVY UCIe VIP, very flexible for unit level testing, you can achieve faster verification closure and higher quality of your UCIe designs.
Overview: The SPD5 Hub controller IP is designed to interface with the I3C/I2C Host Bus, allowing for the isolation of local devices such as Temperature Sensors (TS) from the master host bus. It features a Two-wire serial interface with SCL and SDA busses. Key Features:  Compliance with JEDEC's JESD300-5  Support for speeds up to 12.5MHz  Bus Reset functionality  SDA arbitration support  Enabled Parity Check  Support for Packet Error Check (PEC)  Switch between I2C and I3C Basic Mode  Default Read address pointer Mode  Write and read operations for SPD5 Hub with or without PEC  In-band Interrupt (IBI) support  Write Protection for NVM memory blocks  Arbitration for Interrupts  Clearing of Device Status and IBI Status Registers  Error handling for Packet Error Check and Parity Errors  Common Command Codes (CCC) for I3C Basic Mode  Dynamic IO Operation Mode Switching  Bus Clear and Bus Reset capabilities  SPD5 Command features for NVM memory and Register Space  Read and Write access to NVM memory  Support for Offline Tester operation Applications:  DDR5 DIMM Application Environment  DDR5 NVDIMM Application Environment  Automotive Devices  Memory Devices  Power Management Devices  Defense/Aerospace/Customer Electronics
The CT25205 is a comprehensive digital core designed for IEEE 802.3cg® 10BASE-T1S Ethernet applications, incorporating the Physical Medium Attachment (PMA), Physical Coding Sublayer (PCS), and Physical Layer Coordination (PLCA) Reconciliation Sublayers. Written in Verilog 2005 HDL, this IP core is versatile enough to be implemented in standard cells and FPGA systems. It interfaces seamlessly with IEEE Ethernet MACs through a Media Independent Interface (MII), and the PLCA RS supports legacy MACs, enhancing functionality without additional extensions. The PMA is compatible with OPEN Alliance 10BASE-T1S PMD, perfect for Zonal Gateways and MCUs in advanced network architectures.
Overview: The MIPI DSI Transmitter IP is designed to transmit data to the host processor, providing the mobile industry with a standard, robust, scalable, low-power, high-speed, and cost-effective interface that supports a wide range of imaging solutions for mobile devices. Key Features:  Compliance with MIPI-DSI-2 version 2.0  Compliance with C-PHY version 2.0 for DSI-2 Version-2  Compliance with D-PHY version 1.2 for DSI-2 Version-2.0  Compliance with D-PHY version 2.0 for DSI-2 Version-2.0  Compliance with D-PHY version 3.0 for DSI-2 Version-2.0  Compliance with MIPI SDF specification  Compliance with DBI-2 and DPI-2  Pixel to Byte conversion support from Application layer to LLP layer  Support for Command Mode and Video Mode  Continuous clock behavior in clock lane for D-PHY physical layer  De-skew sequence pattern for video mode support  Lane Distribution Function for distributing packet bytes across N-Lanes  Connectivity with two, three, or four DSI Receivers  HS mode and Escape mode support for transmission of Packets in both C-PHY and D-PHY  Symbol slip detection code and sync symbol insertion in C-PHY physical layer Target Applications:  Imaging  Surveillance  Gaming  Sensor devices  Internet of Things (IoT)  Wearable devices  Virtual Reality  Augmented Reality  Automotive Systems
The Mixed-Signal CODEC by Archband integrates advanced audio and voice processing capabilities, designed to deliver high-fidelity sound in a compact form. This technology supports applications across various audio devices, ensuring quality performance even at low power consumption levels. With its ability to handle both mono and stereo channels, it is perfectly suited for modern audio systems.
The AHB-Lite Multilayer Switch by Roa Logic is engineered to provide a high-performance, low-latency interconnect fabric for systems employing numerous AHB-Lite bus masters and slaves. This IP core enables configurations that support virtually unlimited bus connections, facilitated by slave-side arbitration for each slave port, thereby eliminating the need for individual bus masters to implement arbitration logic. A standout feature of this switch is its use of priority and round-robin based arbitration methods to efficiently manage multiple bus requests. Typically achieving arbitration within a single clock cycle, this design ensures minimal delay in data transfer across the network, promoting seamless communication in complex systems. With a fully parameterized architecture, it allows for the customization of bus interfaces to meet specific design needs, ensuring compatibility and optimal performance across varied configurations. Complete source code and comprehensive documentation are made available through Roa Logic’s GitHub repository, providing developers with the resources needed for successful integration and deployment.
An interconnect component connects multi initiators and multi targets in a system. A single initiator system simply requires a decoder and multiplexor.
This high-powered TCP Offload Engine aims to deliver superior efficiency by offloading TCP processing from the CPU. By integrating a MAC interface, it reduces processing latencies and broadens throughput, thereby optimizing network operations substantially. This IP suite maintains rapid data processing speeds and addresses a broad array of network optimization needs for today's high-demand environments. Optimized for high-speed networking environments, the TOE offers unprecedented latency reduction through its hardware-accelerated design. The integration of a refined MAC interface plays a crucial role in translating packet data into usable formats swiftly, a crucial factor in enhancing overall system performance, particularly in data-intensive industries. This technology’s edge lies in its ability to seamlessly deliver full data transfer acceleration. Its design caters to enterprises that prioritize low-processing overheads and need to maximize network efficiency without the traditional constraints of higher CPU usage. Thus, Intilop's 10G TCP Offload Engine represents a benchmark in high-performance data handling systems.
The ePHY-5616 is a high-performance SerDes solution from eTopus, designed for versatile use across enterprise, data center, and 5G applications. Operating efficiently at data rates from 1 to 56 Gbps, this product exploits advanced DSP techniques for superior signal integrity and robustness. It accommodates wide insertion loss ranges of 10dB to over 35dB, thus ensuring reliable performance in challenging communication environments. Its architecture supports direct optical drives and quad/octal configurations, making it ideal for network interface cards, routers, and high-speed switches in a data center setup. The embedded DSP architecture is developed with eTopus's proprietary algorithms, which enable rapid SerDes tuning and performance optimization. The ePHY-5616 is also characterized by its low Bit Error Rate (BER), ensuring data reliability and integrity. Moreover, it supports multiple protocols, including Ethernet and PCIe, enhancing its integration potential in modern broadband networks.
The AHB-Lite Timer from Roa Logic is a versatile and fully parameterized soft IP designed to implement multiple timers as per the specifications laid out in the RISC-V Privileged 1.9.1 specification. This timer core interfaces through a well-compliant AHB-Lite Slave interface, allowing seamless integration into systems requiring precise timing functionalities. Offering extensive configurability, the IP allows users to define the number of timers, address and data widths, as well as the time base, which is derived from the AHB-Lite bus clock, scaled down according to programmable values. This flexibility supports a range of applications requiring accurate time tracking. Ideal for various embedded applications where timing precision is paramount, the AHB-Lite Timer features a single interrupt output that triggers when any enabled timer is activated. Developers can access detailed resources including source code and documentation from Roa Logic’s GitHub repository, ensuring an easy setup and integration process.
The ORC3990 SoC is a state-of-the-art solution designed for satellite IoT applications within Totum's DMSSâ„¢ network. This low-power sensor-to-satellite system integrates an RF transceiver, ARM CPUs, memories, and PA to offer seamless IoT connectivity via LEO satellite networks. It boasts an optimized link budget for effective indoor signal coverage, eliminating the need for additional GNSS components. This compact SoC supports industrial temperature ranges and is engineered for a 10+ year battery life using advanced power management.
The Yitian 710 Processor is an advanced Arm-based server chip developed by T-Head, designed to meet the extensive demands of modern data centers and enterprise applications. This processor boasts 128 high-performance Armv9 CPU cores, each coupled with robust caches, ensuring superior processing speeds and efficiency. With a 2.5D packaging technology, the Yitian 710 integrates multiple dies into a single unit, facilitating enhanced computational capability and energy efficiency. One of the key features of the Yitian 710 is its memory subsystem, which supports up to 8 channels of DDR5 memory, achieving a peak bandwidth of 281 GB/s. This configuration guarantees rapid data access and processing, crucial for high-throughput computing environments. Additionally, the processor is equipped with 96 PCIe 5.0 lanes, offering a dual-direction bandwidth of 768 GB/s, enabling seamless connectivity with peripheral devices and boosting system performance overall. The Yitian 710 Processor is meticulously crafted for applications in cloud services, big data analytics, and AI inference, providing organizations with a robust platform for their computing needs. By combining high core count, extensive memory support, and advanced I/O capabilities, the Yitian 710 stands as a cornerstone for deploying powerful, scalable, and energy-efficient data processing solutions.
Silicon Creations crafts highly reliable LVDS interfaces designed to meet diverse application needs, going from bi-directional I/Os to specialized uni-directional configurations. Spanning process compatibilities from 90nm CMOS to advanced 7nm FinFET, these interfaces are a cornerstone for high-speed data communication systems, thriving particularly in video data transmission and chip-to-chip communications. Supporting robust data rates over multiple channels, the LVDS Interfaces guarantee flexible programmability and protocol compatibility with standards such as FPD-Link and Camera-Link. They capitalize on proven PLL and CDR architectures for superior signal integrity and error-free data transfers. Operating efficiently in various technology nodes, they remain highly effective across collaborative chipset environments. The interfaces are fortified with adaptable features like dynamic phase alignment to stabilize data sequences and on-die termination options for superior signal integrity. Their proven record places them as a critical enabler in applications where consistent high-speed data transfer is paramount, demonstrating Silicon Creations’ prowess in delivering industry-leading communication solutions.
Archband's PDM-to-PCM Converter is a versatile module designed to facilitate digital audio transformation. By converting Pulse Density Modulated audio signals into Pulse Code Modulated signals, this converter enhances audio clarity and fidelity in modern digital interfaces. It suits applications where efficient data streaming and noise reduction are critical, such as in high-quality audio devices and communications technology.
The Ethernet Real-Time Publish-Subscribe (RTPS) IP Core provides an all-encompassing solution for Ethernet-based RTPS protocols, ensuring efficient network data management and publication in real-time systems. This IP core supports crucial applications in environments where time-sensitive communication is paramount. Ideal for industrial and aerospace settings, the core manages data transactions with precision, leveraging real-time processing and minimal latency to ensure seamless data exchange. By facilitating controlled and secure communication network streams, the core optimally handles various multi-subscriber environments. With its highly dependable architecture, the RTPS IP Core integrates easily into existing systems, providing scalability and adaptability for evolving network requirements. This capability makes it indispensable for systems demanding high reliability and rapid information exchange across distributed networks.
MIPI I3C Controller IP Core is fully compliant with the latest I3C specification and delivers high bandwidth and scalability for integration of multiple sensors into mobile, automotive and IoT system-on-chips (SoCs). The MIPI I3C Controller supports in-band interrupts within the 2-wire interface provides significantly lower pin count, simplifying board design and reducing power and cost of the system. The MIPI I3C Controller IP is fully backward compatible with I2C, allowing designers to future proof their design, and the I3C controller IP operating modes enable systems with several ICs to efficiently connect to all sensors on a single I3C bus. The standard-based ARM® AMBA® Advanced High Performance Bus (AHB) connects the IP to the rest of the SoC offering easy IP integration. MIPI I3C Controller IP is designed to easily integrate into any SoC offering lowest gate count and quickly fit into any Chip development flow.
The Aries fgOTN processor family is engineered according to the ITU-T G.709.20 fgOTN standard. This line of processors handles a variety of signals, including E1/T1, FE/GE, and STM1/STM4, effectively monitoring and managing alarms and performance metrics. Aries processors excel at fine-grain traffic aggregation, efficiently channeling fgODUflex traffic across OTN lines to support Ethernet, SDH, PDH client services. Their capacity to map signals to fgODUflex containers, which are then multiplexed into higher order OTN signals, demonstrates their versatility and efficiency. By allowing cascaded configurations with other Aries devices or Apodis processors, Aries products optimize traffic routes through OTN infrastructures, positioning them as essential components in optical networking and next-generation access scenarios.
This ultra-compact and high-speed H.264 core is engineered for FPGA platforms, boasting industry-leading size and performance. Capable of providing 1080p60 H.264 Baseline support, it accommodates various customization needs, including different pixel depths and resolutions. The core is particularly noted for its minimal latency of less than 1ms at 1080p30, a significant advantage over competitors. Its flexibility allows integration with a range of FPGA systems, ensuring efficient compression without compromising on speed or size. In one versatile package, users have access to a comprehensive set of encoding features including variable and fixed bit-rate options. The core facilitates simultaneous processing of multiple video streams, adapting to various compression ratios and frame types (I and P frames). Its support for advanced video input formats and compliance with ITAR guidelines make it a robust choice for both military and civilian applications. Moreover, the availability of low-cost evaluation licenses invites experimentation and custom adaptation, promoting broad application and ease of integration in diverse projects. These cores are especially optimized for low power consumption, drawing minimal resources in contrast to other market offerings due to their efficient FPGA design architecture. They include a suite of enhanced features such as an AXI wrapper for simple system integration and significantly reduced Block RAM requirements. Embedded systems benefit from its synchronous design and wide support for auxiliary functions like simultaneous stream encoding, making it a versatile addition to complex signal processing environments.
The Chimera GPNPU by Quadric redefines AI computing on devices by combining processor flexibility with NPU efficiency. Tailored for on-device AI, it tackles significant machine learning inference challenges faced by SoC developers. This licensable processor scales massively offering performance from 1 to 864 TOPs. One of its standout features is the ability to execute matrix, vector, and scalar code in a single pipeline, essentially merging the functionalities of NPUs, DSPs, and CPUs into a single core. Developers can easily incorporate new ML networks such as vision transformers and large language models without the typical overhead of partitioning tasks across multiple processors. The Chimera GPNPU is entirely code-driven, empowering developers to optimize their models throughout a device's lifecycle. Its architecture allows for future-proof flexibility, handling newer AI workloads as they emerge without necessitating hardware changes. In terms of memory efficiency, the Chimera architecture is notable for its compiler-driven DMA management and support for multiple levels of data storage. Its rich instruction set optimizes both 8-bit integer operations and complex DSP tasks, providing full support for C++ coded projects. Furthermore, the Chimera GPNPU integrates AXI Interfaces for efficient memory handling and configurable L2 memory to minimize off-chip access, crucial for maintaining low power dissipation.
The Mixel MIPI D-PHY IP (MXL-DPHY) is a high-frequency low-power, low cost, source-synchronous, physical layer compliant with the MIPI® Alliance Standard for D-PHY. (Learn more about Mixel’s MIPI ecosystem at Mixel MIPI Central which gives you access to Mixel’s best of class MIPI ecosystem supply chain partners.) Although primarily used for connecting cameras and display devices to a core processor, this MIPI PHY can also be used for many other applications. It is used in a master-slave configuration, where high-speed signals have a low voltage swing, and low-power signals have large swing. High-speed functions are used for high-speed data traffic while low-power functions are mostly used for control. The D-PHY is partitioned into a Digital Module – CIL (Control and Interface Logic) and a Mixed Signal Module. It is provided as a combination of Soft IP views (RTL, and STA Constraints) for Digital Module, and Hard IP views (GDSII/CDL/LEF/LIB) for the Mixed Signal Module. This unique offering of Soft and Hard IP permits architectural design flexibility and seamless implementation in customer-specific design flow. The CIL module interfaces with the protocol layer and determines the global operation of the lane module. The interface between the D-PHY and the protocol is called the PHY-Protocol Interface (PPI). During normal operation, the data lane switches between low-power mode and high-speed mode. Bidirectional lanes can also switch communication direction. The change of operating mode or direction requires enabling and disabling certain electrical functions. These enable and disable events do not cause glitches on the lines that would otherwise result in detections of incorrect signal levels. Therefore, all mode and direction changes occur smoothly, ensuring proper detection of the line signals. Mixel’s D-PHY is a complete PHY, silicon-proven at multiple foundries and multiple nodes. This MIPI PHY is fully integrated and has analog circuitry, digital, and synthesizable logic. Our D-PHY is built to support the MIPI Camera Serial Interface (CSI) and Display Serial Interface (DSI) using the PHY Protocol Interface (PPI). Mixel has provided this IP in many different configurations to accommodate different applications. The Universal Lane configuration can be used to support any allowed use-case, while other configurations are optimized for many different use cases such as Transmit only, Receive only, DSI, CSI, TX+ and RX+. Both TX+ and RX+ configurations support full-speed loopback operation without the extra area associated with a universal lane configuration.
The HOTLink II Product Suite is another remarkable offering from Great River Technology. Built to complement their ARINC 818 suite, HOTLink II provides an integrated framework for crafting high-performance digital data links. This suite ensures seamless, secure, and reliable data transmission over fiber or copper cables across various platforms. Developed with a focus on flexibility and functionality, the HOTLink II capabilities enhance system integrators' ability to deploy effective communication solutions within aircraft and other demanding environments. The emphasis on robust, low-latency data transfer makes it an ideal choice for real-time applications where precision and reliability are paramount. Broad compatibility is a hallmark of HOTLink II, facilitating integration into diverse infrastructures. Backed by Great River Technology's expertise and support, customers are empowered to advance their system communication capabilities efficiently and cost-effectively.
USB PHY by Silicon Library is designed to facilitate seamless data transfer and connectivity for digital devices. This physical layer transceiver handles the electrical signaling over USB cables, providing a crucial interface between the USB controller and the actual USB connection. Engineered for efficiency, it supports varying USB standards, ensuring compatibility with a wide range of devices. The IP provides robust features meant to enhance data integrity and transfer speeds, making it ideal for applications in consumer electronics, industrial devices, and computing environments. Its design focuses on low power consumption and high performance, enabling users to integrate it into compact and power-sensitive applications without compromising on speed or durability. One of the main advantages of the USB PHY is its flexibility in deployment across multiple sectors. It covers comprehensive voltage ranges, aligning with diverse system requirements and offering an easy fit across platforms requiring reliable USB connectivity without the need for significant redesign.
DisplayPort and Embedded DisplayPort (eDP) IP by Silicon Library enables advanced digital display connectivity, offering superior video performance and enhanced sound. Designed to serve high-resolution displays, this IP supports next-gen display protocols, delivering robust signal quality and efficient energy use.
The KL630 AI SoC represents Kneron's sophisticated approach to AI processing, boasting an architecture that accommodates Int4 precision and transformers, making it incredibly adept in delivering performance efficiency alongside energy conservation. This chip shines in contexts demanding high computational intensity such as city surveillance and autonomous operation. It sports an ARM Cortex A5 CPU and a specialized NPU with 1 eTOPS computational power at Int4 precision. Suitable for running diverse AI applications, the KL630 is optimized for seamless operation in edge AI devices, providing comprehensive support for industry-standard AI frameworks and displaying superior image processing capabilities.
PCIE is a layered protocol high speed interconnect interface supporting speeds up to 128Gbps and multi lanes and links. The layers speci_ied in PCIE speci_ication Transport, Datalink, Physical layers (digital packet) are implemented in PRIMEXPRESS IP along with PIPE interface logic connecting to PHY and AXI Bridging logic to connect to applications. Features: • Supports PCIE Gen 7 draft Spec. • Supports Pipe 6.X Spec. • PCIE Gen 7.0 Core supports Flit and non – Flit Mode. • Supports X16, X8, X4, X2, X1 Lane Configuration. • AXI MM and Streaming supported. • Supports Gen 1, Gen 2, Gen 3, Gen 4, Gen 5, Gen 6, Gen 7 modes. • Data rate support of 2.5 Gbps, 5 Gbps, 8 Gbps, 16 Gbps, 32 Gbps, 64 Gbps, 128 Gbps. • PAM support when operating at 64Gbps/ 128Gbps. • 8b/10b,128b/130b,1b/1b encoding , decoding support. • Supports serdes and non – serdes architecture. • Optional DMA support as plugin module. • Support for alternate negotiation protocol. • Lane polarity thru register control. • Lane deskew supported. • Support for L1 states. • L0P Supported. • SKP OS add/removal. • SRIS mode supported. • No equalization support thru configuration. • Deemphasis negotiation support at 5GT/s. • EI inferences in all modes. • PTM, OBFF, MSI, MSIX, Power management and all message format supports.
Polar ID offers an advanced solution for secure facial recognition in smartphones. This system harnesses the revolutionary capabilities of meta-optics to capture a unique polarization signature from human faces, adding a distinct layer of security against sophisticated spoofing methods like 3D masks. With its compact design, Polar ID replaces the need for bulky optical modules and costly time-of-flight sensors, making it a cost-effective alternative for facial authentication. The Polar ID system operates efficiently under diverse lighting conditions, ensuring reliable performance both in bright sunlight and in total darkness. This adaptability is complemented by the system’s high-resolution capability, surpassing that of traditional facial recognition technologies, allowing it to function seamlessly even when users are wearing face coverings, such as glasses or masks. By incorporating this high level of precision and security, Polar ID provides an unprecedented user experience in biometric solutions. As an integrated solution, Polar ID leverages state-of-the-art polarization imaging, combined with near-infrared technology operating at 940nm, which provides robust and secure face unlock functionality for an increasing range of mobile devices. This innovation delivers enhanced digital security and convenience, significantly reducing complexity and integration costs for manufacturers, while setting a new standard for biometric authentication in smartphones and beyond.
Designed for applications that require extremely low communication delays, this ultra-low latency Ethernet MAC supports a data rate of 10G. With a round trip in the nanoseconds range, this core is perfect for high-speed communications where timing is critical. The efficient use of FPGA resources allows for additional design logic to be integrated, maximizing the chip's potential.
Designed for 10BASE-T1S applications, the CT25203 serves as an essential analog front-end component of Ethernet transceivers. This IP component helps connect host controllers and switches by implementing a 3-pin interface compliant with the OA TC14 specification. It ensures high EMC performance thanks to its compact 8-pin design and manufacturing on high-voltage process technology. Particularly suited for automotive and industrial use, this IP core demonstrates versatility, offering robust communication with minimal footprint.
The GL3590-S is a USB 3.2 Gen 2 hub controller that seamlessly integrates multiple upstream ports with native USB Type-C functionality. Designed for versatility, it handles both SuperSpeed+ and Full-Speed data connections, ensuring backwards compatibility with USB 2.0 and 1.1. Notably, this controller supports devices drawing up to 2.4A, optimally fast-charging portable devices even when systems are in sleep or power-off states. Functionality extends to its multiple TT architecture which dedicates transaction processing to each downstream port, maintaining full-speed throughput under heavy operations. The GL3590-S manages power efficiently, adhering to USB-IF battery charging standards, thus supporting various device charging needs like Apple and Samsung Galaxy as well as BC1.2 standards. Configurations allow for flexible downstream ports, critical for customization and dynamic power management. Additionally, it includes advanced features such as built-in ESD protection, EMI reduction capabilities, firmware-upgradeable systems, and multi-port configurations catering to both original equipment manufacturer (OEM) and aftermarket applications. It’s an ideal choice for those seeking an integrated solution for USB hubs in docking stations, motherboards, and monitors.
The MXL-LVDS-MIPI-RX is a high-frequency, low-power, low-cost, source-synchronous, Physical Layer that supports the MIPI® Alliance Standard for D-PHY and compatible with the TIA/EIA-644 LVDS standard. (Learn more about Mixel’s MIPI ecosystem at Mixel MIPI Central which gives you access to Mixel’s best of class MIPI ecosystem supply chain partners.) The IP is configured as a MIPI slave and consists of 5 lanes: 1 Clock lane and 4 data lanes, which make it suitable for display serial interface applications (DSI). The High-Speed signals have a low voltage swing, while Low-Power signals have large swing. High-Speed functions are used for High-Speed Data traffic while low power functions are mostly used for control.
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