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Credo Semiconductor

Credo Semiconductor is at the forefront of providing cutting-edge semiconductor IP solutions that address the challenges of modern data infrastructures. Their expertise lies in breaking bandwidth barriers with high-speed connectivity solutions, ensuring seamless and reliable communication between sophisticated data infrastructure components. By embracing innovation, the company offers advanced technologies and architectures tailored for the needs of AI infrastructure and next-generation data centers. Credo's products are designed to integrate seamlessly, offering reliability, energy efficiency, and high performance in AI and data communication networks. Credo distinguishes itself through its revolutionary Active Electrical Cables (AECs), which virtually eliminate link flaps in complex GPU clusters. These innovations underscore their commitment to enhancing reliability and performance. Through the use of their Predictive Integrity Link Optimization and Telemetry (PILOT) platform, Credo provides tools that prevent system-level failures, enabling designers to scale AI deployments confidently. The company is also committed to community engagement and fostering a culture of collaboration and innovation. The Credo Cares initiative underscores their commitment to bridging technology and community impact. With a strategic focus on reliability and performance, Credo Semiconductor positions itself as a leader in the semiconductor IP market, particularly for AI, cloud, and hyperscale network needs. Credo's technological advancements include high-performance SerDes IP, optical DSPs for high-bandwidth data transmission, and advanced PCIe retimers. These elements combine to provide a robust foundation for AI infrastructure, meeting the demands of scale-up and scale-out networking architectures, and ensuring optimized performance for hyperscale data centers. Read more

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SerDes PHY

The SerDes PHY is a high-performance solution designed to facilitate high-speed data transmission within sophisticated data infrastructures. Offering support for various signaling options from 28G to 224G, this PHY is engineered to provide reliable, high-bandwidth communication required by next-generation AI and data centers. With the highly adaptable architecture, it ensures seamless integration into multiple designs including those that require long reach and very short reach plus options. Its design emphasis is on achieving low latency and high reliability, making it indispensable in environments demanding maximum uptime and efficiency. Incorporating cutting-edge mixed signal DSP technology, the SerDes PHY can effectively manage high data rates, making it ideal for switch fabric ASICs, AI ASICs, and machine learning applications. The underlying technology is manufactured on advanced process nodes, which enhances both the performance and power efficiency of the solutions. Through its innovative design, the SerDes PHY supports a range of applications that include interconnecting AI clusters, supporting cloud infrastructures, and enhancing hyperscale networking systems. It stands out for its ability to support seamless operation at various data rates, ensuring future-proofing for scaling AI and data center demands. Utilizing this PHY can enable the development of high-performance, optimized solutions that push the boundaries of current technological capabilities.

Credo Semiconductor
TSMC
3nm, 7nm
AMBA AHB / APB/ AXI, D2D, Ethernet, Gen-Z, IEEE1588, Interlaken, Multi-Protocol PHY, PCI
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Latest News About Credo Semiconductor

Credo Technology: Breaking Records in Semiconductor Connectivity

Credo Technology reports impressive financial results for fiscal year 2025, highlighting innovation in high-speed connectivity solutions alongside substantial growth. Read more

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