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SkyeChip's Coherent Network-on-Chip (NOC) is specifically tailored for memory coherent systems, ensuring scalable and efficient interconnect solutions. It operates at frequencies up to 2GHz and supports protocols such as ACE4 and ACE5. This NOC plays a pivotal role in reducing routing congestion in multi-core systems. It integrates easily with SkyeChip’s non-coherent NOC to support partitioned interconnect implementations, leveraging source synchronous and synchronous clocking methodologies.
The Non-Coherent Network-on-Chip (NOC) by SkyeChip is optimized for bandwidth and latency, making it ideal for reducing silicon wire utilization. Its design significantly enhances power and area efficiency of integrated circuits. It supports various protocols, including AXI4 and AXI5, and is architected to minimize routing congestion. This NOC facilitates high frequency timing closure and supports up to 2GHz operating frequencies, offering seamless integration with coherent NOC systems for partitioned interconnect applications.
SkyeChip's Bandgap circuit serves as a vital component for establishing reference voltages within semiconductor devices. It provides a stable 0.9V output with minimal variation across temperature ranges from -40°C to 125°C. With output current capabilities of 50uA, the bandgap circuit is engineered for reliability and precision in various environmental conditions, making it an essential part of any IC requiring consistent voltage references.
The HBM3 PHY & Memory Controller offers a high-performance solution optimized for AI, HPC, data centers, and networking. It adheres to the HBM3 JEDEC standards and supports data rates up to 9600 MT/s for HBM3E. This product boasts an average random efficiency exceeding 85%, featuring a flexible PHY with programmable intelligent interface training sequences. The memory controller supports up to 32Gb density per die and up to 16H HBM3 DRAM stacks, providing significant scalability and customization options.
The LPDDR5/5X PHY & Memory Controller is engineered for seamless integration into power-sensitive devices demanding high data throughput. The controller supports JEDEC-standard LPDDR5/5X, achieving data rates up to 10667 MT/s. Its design features an average random efficiency surpassing 85%, emphasizing its low power, area-efficient architecture. The PHY provides compatibility with multiple SDRAM configurations and programmable training sequences, ensuring robust performance across various applications.
The DDR5/4 PHY & Memory Controller provides an efficient solution for modern computing systems, supporting DDR5 JEDEC standard data rates up to 6400 MT/s. Known for its low power and area efficiency, it includes an upgradable option for enhanced performance. Its I/Os feature advanced equalization techniques to ensure high fidelity data transfers. The controller accommodates various SDRAM configurations and supports 3DS extensions, allowing configurations with up to 64Gb addressing for DDR5 and 32Gb for DDR4.
The High-Speed PLL from SkyeChip is designed to meet diverse frequency synthesis needs within complex ICs. It supports a reference clock frequency range from 100MHz to 350MHz, with output frequencies ranging from 300MHz up to 3.2GHz. The PLL features extensive programmability and precision, accommodating various post-division configurations for flexible application integration.
The Die-to-Die (D2D) Interconnect by SkyeChip provides a lightweight and efficient solution for die-to-die communication, adhering to the UCIe 2.0 specification. It supports high data transfer rates up to 32 Gbps per pin, offering unprecedented bandwidth efficiency. This interconnect is adaptable to various communication protocols and offers built-in functionality for link initialization and testing, ensuring optimal performance and yield in IC manufacturing.
The MIPI D-PHY, compliant with version 2.5, is a fully integrated hard macro offering lane control and interface logic. Capable of up to 1.5 Gbps per lane, this IP is designed to support low-power and ultra-low-power state modes. This flexibility in power states makes it particularly suited for mobile and energy-sensitive applications, ensuring reliable data transmission across high-speed communication platforms.
The Configurable I/O is a high-speed interface capable of achieving signaling performance up to 3.2 GT/s. Supporting a wide array of I/O standards, it provides flexibility in design customization to meet various electrical requirements, including LVDS, POD, and HCSL standards. This adaptability enhances the capability of integrated circuits to communicate effectively in diverse environments, from industrial automation to consumer electronics.
Designed for power-efficient processing tasks, the Low Power RISC-V CPU IP offers a reduced instruction set computing (RISC) architecture that effectively handles a broad range of applications. It is optimized for low power consumption while supporting 32 vectorized interrupts and a standard RISC-V debug setup. This processor core is ideal for embedded systems where minimizing energy use is essential while maintaining robust processing capabilities.
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