Semiconductor Equipment Corporation

For over four decades, Semiconductor Equipment Corporation has stood at the forefront of innovation in the semiconductor and related industries. The company is renowned for its expertise in designing and producing manual and semi-automatic systems used in semiconductor assembly and testing. Beyond manufacturing, they are distributors for prominent Japanese companies such as Nitto Denko, known for advanced dicing and grinding tapes, and Hugle Electronics, specialists in cleaning equipment for semiconductor environments. Their equipment serves the semiconductor, photonics, and electronics packaging sectors, providing vital solutions for handling, assembly, rework, and testing. The corporation's offerings include systems for wafer mounting, die bonding, and precision cleaning, ensuring comprehensive support for clients' microelectronic production needs. A dedication to quality is evident in their service-forward approach, supporting every product they design or distribute. Situated in Moorpark, California, Semiconductor Equipment Corporation takes pride in its role as both an innovator and a collaborator. By continually expanding its product line and enhancing equipment capabilities, the company not only addresses current technological demands but also anticipates future industry shifts, affirming its position as a key player in the market. Read more