Hermes X3D focuses on rapid and precise RLGC parametrization specifically for power, package, and touch panel modeling. It provides engineers with the tools necessary to model the complex physical interactions present in these systems, ensuring performance reliability and manufacturing feasibility.
Designed to facilitate quick extraction of resistance, inductance, capacitance, and conductance (RLGC) parameters, Hermes X3D enables detailed analysis of components essential for high-performance and high-reliability electronic systems. Its applications spread across power distribution networks, package interconnections, and touch interface electronics, reflecting its adaptability to modern technological demands.
The tool is integral for engineers needing to validate and optimize designs quickly, helping build advanced systems that meet emerging industry standards. Its precise modeling capabilities facilitate efficient design cycles, reducing time-to-market and enhancing the competitiveness of products in areas such as consumer devices and communication technologies.
