All IPs > Memory Controller & PHY
The "Memory Controller & PHY" category within our semiconductor IP catalog encompasses a wide array of specialized IP cores designed to manage data flow to and from memory subsystems across different types of semiconductor technologies. Memory controllers and PHYs play a crucial role in interfacing with various memory types, ensuring efficient data transfer, and optimizing performance for diverse applications. Whether dealing with high-performance computing or consumer electronics, these IPs are fundamental to developing competent and reliable semiconductor solutions.
Memory controllers are integral components responsible for managing the communication between the system processor and memory. They ensure high-speed data access and are critical in determining a system's data throughput and latency. Within this category, you will encounter IP solutions for DDR (Double Data Rate) memory types, offering compatibility with the latest DDR3, DDR4, and upcoming DDR5 standards. Among other offerings, you'll also find HBM (High Bandwidth Memory) solutions for applications requiring ultra-high bandwidth and reduced power consumption, such as gaming consoles and GPUs.
PHYs, or physical layer interfaces, complement memory controllers by handling the electrical signaling and protocol adherence necessary for data transmission over physical mediums. Together with controllers, they form the backbone that bridges the communications between processors and different memory modules. Our catalog includes a variety of PHY solutions for diverse standards like eMMC, ONFI, and NVMe, facilitating efficient and secure data transactions.
The "Memory Controller & PHY" category caters to a broad range of products and applications. From mobile DDR and SDR controllers used in portable devices like smartphones to high-speed NAND flash controllers intended for storage solutions, the diversity of this category reflects the engineering rigor and adaptability required in modern semiconductor design. By browsing through our offerings, semiconductor developers can pinpoint the exact IP needed to enhance their memory management strategies and bring high-performance, low-latency solutions to market effectively.
The GL3590-S is a USB 3.2 Gen 2 hub controller that features integrated support for USB Type-C connections and multiple upstream ports. This product is engineered to enhance connectivity by providing efficient data transfer speeds up to 10 Gbps, facilitating rapid communication across various peripherals. It supports advanced power management capabilities, allowing devices to negotiate power delivery efficiently. Additionally, the GL3590-S incorporates robust security protocols to ensure data integrity during transmission. This controller is ideal for applications needing versatile USB connectivity with high-speed data transfers. It can be utilized in computing setups, where the demand for reliable and fast data exchanges is paramount. Moreover, its compatibility with USB Type-C enables seamless integration with a wide array of modern devices, enhancing its applicability in contemporary technological environments. In terms of technical advancements, the GL3590-S simplifies the integration process by supporting multiple upstream ports, making it easier for developers to utilize its capabilities in complex designs. Furthermore, the energy-efficient design reduces power consumption, making it a sustainable choice for manufacturers looking to include environmentally friendly components in their products. Thanks to its advanced features, the GL3590-S is an attractive option for any stakeholder in need of high-speed data management and efficient power usage. Its adaptability and performance make it a cornerstone in the development of innovative USB solutions.
The NVMe Host Controller from iWave Global offers an advanced solution for managing NVMe drive interfaces in computing systems. This controller is designed to facilitate the high-speed data exchange that NVMe drives demand, streamlining operations across data-centric applications. Engineered for scalability and performance, the NVMe Host Controller supports high data throughput, ensuring quick access and transfer of data between storage devices and host systems. Its design caters to the demands of modern computational environments where rapid data retrieval and storage are critical. The controller is integral in systems requiring high-performance storage solutions, and its support for multiple interfaces underscores its adaptability and broad applicability in data-intensive industries such as enterprise storage and high-performance computing.
The Aries fgOTN processor family is engineered according to the ITU-T G.709.20 fgOTN standard. This line of processors handles a variety of signals, including E1/T1, FE/GE, and STM1/STM4, effectively monitoring and managing alarms and performance metrics. Aries processors excel at fine-grain traffic aggregation, efficiently channeling fgODUflex traffic across OTN lines to support Ethernet, SDH, PDH client services. Their capacity to map signals to fgODUflex containers, which are then multiplexed into higher order OTN signals, demonstrates their versatility and efficiency. By allowing cascaded configurations with other Aries devices or Apodis processors, Aries products optimize traffic routes through OTN infrastructures, positioning them as essential components in optical networking and next-generation access scenarios.
The SPD5 Hub Function IP has been developed to interface I3C/I2C Host Bus and it allows an isolation of local devices like Temperature Sensor(TS), from master host bus. This SPD5 has Two wire serial interface like SCL, SDA
Overview: The DDR5 RCD Controller is a registering clock driver utilized in DDR5 RDIMMs and LRDIMMs. It buffers the Command/Address (CA) bus, chip selects, and clock signals between the host controller and DRAMs. Additionally, it establishes a BCOM bus to control data buffers in LRDIMMs. Key Features:  Compliance with JEDEC's JESD82-511  Maximum SCL Operating speed of 12.5MHz in I3C mode  DDR5 server speeds up to 4800MT/s  Dual-channel configuration with 32-bit data width per channel  Support for power-saving mechanisms  Rank 0 & rank 1 DIMM configurations  Loopback and pass-through modes  BCOM sideband bus for LRDIMM data buffer control  In-band Interrupt support  Packet Error Check (PEC)  CCC Packet Error Handling  Error log register  Parity Error Handling  Interrupt Arbitration  I2C Fast-mode Plus (FM+) and I3C Basic compatibility  Switch between I2C mode and I3C Basic  Clearing of Status Registers  Compliance with JESD82-511 specification  I3C Basic Common Command Codes (CCC) Applications:  RDIMM  LRDIMM  AI (Artificial Intelligence)  HPC (High-Performance Computing)  Data-intensive applications
Ilika’s Stereax batteries are thin-film solid-state batteries designed for small-scale, lightweight applications like active medical implants and industrial IoT sensors. The Stereax line is innovatively engineered to be free of liquid or polymer elements, thereby reducing risks of leakage and enhancing their operational safety. These batteries provide longevity with the capability of thousands of charge cycles and have a low power leakage characteristic in nanoamperes, making them ideal for devices needing minimal power over extended periods. In a unique collaboration with Cirtec Medical, Stereax batteries are slated for commercial production and integration in various MedTech applications. The Stereax M300, a prominent member of this battery family, boasts specifications like a size of just 3.6mm x 5.6mm, a 1.1mm thickness, and a capacity of 300 µAh. This variant specifically enjoys a pulse power capability of 12 mW and a cycle life extending beyond 1000 cycles at 50% depth of discharge. Perfect for applications such as neurostimulation, cardiac sensing, and other smart medical technologies, Stereax batteries symbolize the intersection of innovative design and operational practicality, aiming to empower the next generation of medical devices and IoT solutions with reliable, miniature energy resources.
At the forefront of memory interfaces, Dolphin Technology’s DDR PHY IPs offer exceptional performance and versatility for modern applications. This IP suite is designed to support DDR4, DDR3, and DDR2 standards, as well as LPDDR series memories. Notably, these DDR PHYs are engineered to reach speeds up to 4266 Mbps, ensuring compatibility with high-performance computing requirements. The DDR PHY IPs include features such as slew rate control, per-bit de-skew, gate training, and built-in self-test (BIST), all contributing to their robustness and adaptability in various system environments. They are compliant with the DFI 4.0 specification, providing seamless integration with DDR memory controllers to deliver comprehensive memory subsystem solutions. With proven reliability in silicon, these PHYs have been designed to efficiently integrate into SoCs, offering a high degree of speed and data integrity for advanced semiconductor applications. This makes them suitable for an array of high-performance tasks in industries ranging from consumer electronics to data center operations.
The NuLink Die-to-Die PHY for Standard Packaging by Eliyan is engineered to facilitate superior die-to-die interconnectivity on standard organic/laminate package substrates. This innovative PHY IP supports key industry standards such as UCIe and BoW, and includes proprietary technologies like UMI and SBD. The NuLink PHY delivers leading performance and power efficiency, comparable to advanced packaging technologies, but at a fraction of the cost. It features configurations with up to 64 data lanes, supporting a data rate per lane of up to 64Gbps, making it ideal for applications demanding high bandwidth and low latency. The implementation enhances system design while reducing the necessary area and thermal load, which significantly eases integration into existing hardware ecosystems.
The Rambus DDR5 Server DIMM chipset is designed to handle high-performance data centers, offering unmatched speed and efficiency. It incorporates Registering Clock Drivers (RCD), Power Management ICs (PMICs), and Temperature Sensors to ensure optimal functioning of DDR5 RDIMMs, significantly boosting data throughput. These components work in harmony to deliver up to 8000 MT/s for RDIMMs and an impressive 12800 MT/s for Multiplexed Rank DIMMs (MRDIMMs), meeting the rigorous demands of next-generation servers. This chipset represents a leap in bandwidth and scalability, allowing data centers to manage larger workloads and advanced analytics seamlessly. By integrating MRT DIMMs and PMICs, the chipset enhances power efficiency while maintaining high-performance levels. Furthermore, its innovative design not only supports the current server configurations but also future-proofs them for technological advancements expected over the coming years. Rambus's DDR5 Server DIMM chipset reflects the company's continued dedication to pushing the envelope in memory technology, making it an ideal choice for enterprises focused on adopting cutting-edge computing infrastructure. With support for high-speed data operations, this chipset plays a crucial role in upgrading server capabilities, enabling faster access times and improved data integrity.
The HBM3 PHY & Memory Controller by SkyeChip offers a high-performance, low-power memory interface solution tailored for AI, HPC data centers, and networking applications. This product conforms to HBM3 (JESD238A) JEDEC standards, supporting up to 6400 MT/s for HBM3 and 9600 MT/s for HBM3E. Notably, it offers a flexible PHY with programmable intelligent interface training sequences and supports major 2.5D/3D packaging technologies, enhancing versatility. The solution guarantees compatibility with DFI 5.1 interfaces and supports high-density configurations, making it ideal for advanced semiconductor manufacturing.
CrossBar's ReRAM Memory is designed to redefine data storage with its high-density and energy-efficient characteristics. The memory solution can achieve terabyte-scale storage on-chip, significantly surpassing traditional flash memory solutions in both speed and power consumption. Offered in a 3D cross-point architecture, it is capable of providing high performance with minimal layout overhead. Engineered for next-generation applications, this ReRAM technology boasts a performance edge with 20ns read times and 12µs write capabilities, eliminating the usual erase latency. It is significantly faster than traditional NAND flash with its lightning-fast read and write speeds, making it suitable for real-time processing required by cutting-edge applications such as AI and IoT. Security is a key feature, offering tamper-resistant provisions for cryptographic key storage ensuring robust protection against data breaches. The memory solution leverages advanced technology to deliver energy savings of up to 5x compared to eFlash, and up to 40x when compared to BLE, positioning it as an ideal choice for mobile and low-power applications.
The EZiD211, also known as Oxford-2, is a leading-edge demodulator and modulator developed by EASii IC to facilitate advanced satellite communications. It embodies a sophisticated DVB-S2X wideband tuner capable of supporting LEO, MEO, and GEO satellites, integrating proprietary features like Beam Hopping, VLSNR, and Super Frame applications. With EZiD211 at the helm, satellite communications undergo a transformation in efficiency and capacity, addressing both current and future demands for fixed data infrastructures, mobility, IoT, and M2M applications. Its technological forefront facilitates seamless operations in varied European space programs, validated by its full production readiness. EZiD211's design offers a unique capability to manage complex satellite links, enhance performance, and ensure robust and reliable data transmission. EASii IC provides comprehensive support through evaluation boards and samples, allowing smooth integration and testing to meet evolving satellite communication standards.
Digital Blocks' AXI4 DMA Controller is a robust solution designed for transferring data efficiently between systems over the AXI4 interface. Supporting up to 16 independent channels, it excels in high data throughput both for small and large data sets. Its capabilities are extended with advanced DMA features, allowing custom configurations to minimize silicon usage and licensing costs. Precise control over DMA operations is facilitated through its customizable settings, supporting a flexible range of interface buses and addressing modes.
The Ncore Cache Coherent Interconnect is designed to tackle the complexities inherent in multicore SoC environments. By maintaining coherence across heterogeneous cores, it enables efficient data sharing and optimizes cache use. This in turn enhances the throughput of the system, ensuring reliable performance with reduced latency. The architecture supports a wide range of cores, making it a versatile option for many applications in high-performance computing. With Ncore, designers can address the challenges of maintaining data consistency across different processor cores without incurring significant power or performance penalties. The interconnect's capability to handle multicore scenarios means it is perfectly suited for advanced computing solutions where data integrity and speed are paramount. Additionally, its configuration options allow customization to meet specific project needs, maintaining flexibility in design applications. Its efficiency in multi-threading environments, coupled with robust data handling, marks it as a crucial component in designing state-of-the-art SoCs. By supporting high data throughput, Ncore keeps pace with the demands of modern processing needs, ensuring seamless integration and operation across a variety of sectors.
SkyeChip's DDR5/4 PHY & Memory Controller delivers efficient, low-power solutions that comply with DDR5 (JESD79-5) and DDR4 (JESD79-4) JEDEC standards. With support for rates up to 4800 MT/s and upgradeability to 6400 MT/s, this product is engineered for high performance and area efficiency. Its features include flexible PHY with intelligent interface training, receiver DFE, and transmitter FFE for optimal signal processing. It supports a wide range of configurations, including x4, x8, and x16 SDRAMs, and advanced extensions such as 3DS and multiple rank support, making it suitable for diverse applications.
This product offers an extensive range of high-speed interface IP solutions developed using an array of process technologies from 28nm to 90nm nodes. It supports various technology needs and provides tailored services for IP customization and transfer, enhancing adaptability for state-of-the-art processes or more mature ones ranging from 90-180nm. These encompass technologies like USB, DDR, and MIPI, ensuring robust solutions for advanced data communication requirements.
The Apodis family of Optical Transport Network processors adheres to ITU-T standards, offering a comprehensive suite for signal termination, processing, and multiplexing. Designed to handle both SONET/SDH and Ethernet client services, these processors map signals to Optical Transport Network (OTN), empowering versatile any-port, any-service configurations. Apodis processors are notable for their capacity to support up to 16 client ports and four 10G OTN line ports, delivering bandwidth scalability up to 40G, crucial for wireless backhaul and fronthaul deployments. With a robust, non-blocking OTN switching fabric, Apodis facilitates seamless client-to-line and line-to-line connections while optimally managing network bandwidth. This adaptability makes the Apodis processors an ideal choice for next-generation access networks and optical infrastructures.
Toggle MRAM technology represents one of Everspin’s pioneering contributions to memory storage. This innovative system is engineered to deliver consistent performance with non-volatile memory capabilities, enabling persistent data retention without reliance on power. Toggle MRAM functions by storing data through magnetic states, ensuring remarkable data integrity and endurance even under strenuous conditions. Emphasizing simplicity and efficiency, the Toggle MRAM occupies a prominent space in applications requiring rapid read and write cycles. It excels in environments where durability is crucial, as it provides an unmatched lifecycle with enduring data storage capabilities. This technology proves particularly beneficial for mission-critical applications where data loss is not an option. Everspin’s Toggle MRAM is designed to seamlessly integrate with various systems, offering compatibility and flexibility to a broad range of industries, including aerospace and automotive. Its unique attributes such as fast access times and prolonged endurance make it a preferred choice for systems that require robust data logging and secure data holding capabilities.
The Ultra-Low Latency 10G Ethernet MAC from Chevin Technology is designed for FPGA applications that prioritize speed and efficiency. This IP core achieves exceptional data transfer rates with minimized latency, making it ideal for projects where time-sensitive communication is critical. Its design focuses on reducing the complexity and power consumption typical of high-speed Ethernet solutions. A key advantage of this ultra-low latency MAC is its ability to operate without the need for additional CPUs or software, thanks to its all-logic architecture. This not only simplifies integration but also reduces the overall footprint of the design, allowing more space for other functionalities within the FPGA. Targeting industries such as defense and data storage, this Ethernet MAC ensures high reliability and performance. It allows for seamless implementation into various FPGA platforms, demonstrating Chevin Technology's commitment to versatile and adaptable design solutions that meet specific industry needs.
Aeonic Power revolutionizes power delivery within SoCs through integrated on-die voltage regulation tailored to high-demand ICs and chiplets. It offers a scalable architecture that meets diverse energy needs, optimizing both energy usage and bill of materials (BOM). Aeonic Power products include agile telemetry features, allowing design teams to glean invaluable insights into power behavior and improve power grid resilience. The family supports energy optimization efforts by enabling functionalities like per-core DVFS and virtual power islands, providing a versatile approach to energy management in complex systems.
PRSsemicon's UFS solutions lead the way in high-speed storage interface technology, featuring state-of-the-art design and verification IPs. These solutions are geared to accommodate the climbing data demands of contemporary tech devices, with a strong focus on robust performance and rapid data access.\n\nFrom UFS 2.1 to UFS 3.1, solutions support device and host controllers alongside UNIPRO link layers, offering superior interface performance and ensuring optimal data transport between systems. The IPs are engineered to be backward compatible, facilitating integration with legacy systems while offering capabilities for future upgrades through UNIPRO 2.0 enhancements.\n\nThese solutions are especially beneficial in environments requiring swift data processing and retrieval, such as mobile devices, multimedia applications, and intricate computing setups. Their high durability and performance ensure that systems utilizing these IPs maintain efficient storage operations, regardless of the complexity of tasks.
The MVPM100 series revolutionizes particulate matter detection by offering compact sensors capable of weighing particles with precision traditionally seen only in larger devices. Ideal for various environments, these sensors blend accuracy with low power usage, conforming to the need for rigorous environmental monitoring and control—suitable for both industrial and consumer applications.
The ReRAM IP Cores for Embedded Non-Volatile Memory are crafted to seamlessly integrate into microcontrollers (MCUs) and systems on chips (SOCs), addressing the enduring need for efficient and scalable storage. These IP cores leverage CrossBar's signature 3D ReRAM technology to provide unparalleled performance in both speed and density, tailored specifically for embedded systems. Designed to offer superior integration capabilities, this ReRAM technology reduces traditional bottlenecks witnessed with embedded flash memory solutions. It allows for rapid data access and storage, making it a superior choice for applications requiring frequent read/write operations. By offering robust tamper-resistance for secure key storage, these IP cores also add an additional layer of security critical for modern embedded systems. They enable cost-effective scalability and flexibility for manufacturers looking to enhance their products with cutting-edge memory technology.
The 10G Ethernet MAC and PCS from Chevin Technology offers a high-performance solution for FPGA-based applications requiring efficient data transfer. Designed to maximize link utilization, this IP core provides sustained high throughput with minimal latency, utilizing a compact architecture that saves space and power. The core is suitable for environments that demand reliable Ethernet connectivity, ensuring optimal performance in FPGA designs. This IP core is particularly beneficial for energy-conscious applications as it operates with lower power consumption compared to solutions requiring additional CPU or software components. The design is optimized for both Intel and AMD FPGAs, providing a versatile solution that is easy to integrate into existing projects. By providing robust data transfer capabilities, the 10G Ethernet MAC and PCS core supports cutting-edge applications in fields such as industrial imaging, data storage, and scientific research. Its design ensures that users can implement multiple cores within a single FPGA, offering flexibility and scalability for a range of Ethernet needs.
EverOn is sureCore's revolutionary Single Port Ultra Low Voltage (ULV) SRAM, offering significant power reductions. Proven on the 40ULP BULK CMOS process, it provides up to 80% dynamic power savings and 75% static power reduction. This memory operates across an impressive voltage range, from 0.6V to 1.21V, allowing it to support applications demanding extreme energy efficiency. The ULV compiler accommodates memory capacities from 8Kbytes to 576Kbytes and sustains a wide operational voltage spectrum. Architecturally, EverOn supports dynamic voltage and frequency scaling, using a single supply rail to simplify integration. SMART-Assist technology ensures reliable operation even at retention voltages, with architectural innovations that enhance system flexibility. By supporting various power-down states and bank control options, EverOn allows designs to be tailored specifically to varying operational conditions, making it ideal for wearable technology and IoT products. With its groundbreaking power-saving features and robust operational profile, EverOn stands as an ideal choice for developers aiming to extend battery life without compromising SRAM performance.
TwinBit Gen-1 stands as a cutting-edge, logic-based non-volatile memory suitable for 180nm to 55nm process nodes. It prides itself on remarkable endurance, capable of performing over 10,000 programming cycles. This IP macro is designed for integration into CMOS logic processes without extra masking steps, easing the implementation in advanced technology nodes. The TwinBit Gen-1 series is well-adapted for a diverse range of applications, including IoT devices, microcontrollers, FPGAs, and ASICs with embedded NOR FLASH, offering memory sizes from 64 bits to 512K bits. It provides a high-density, small-area solution, which is particularly beneficial for applications requiring field-rewritable firmware or secure data storage. This memory technology ensures low-voltage and low-power operations, accommodating automotive industry standards through compliance with AEC-Q100. TwinBit Gen-1 includes built-in test circuits that allow for stress-free testing, ensuring reliability in diverse operating conditions. The technology also supports low-cost manufacturing and faster development turnaround times.
Optimized for precision and speed, the MVDP2000 series sensors feature a capacitive sensing technology. These pressure sensors are digitally calibrated for temperature and pressure, offering low power consumption and fast readings. Perfect for applications where reliable and precise pressure measurements are critical, these sensors support a variety of industrial uses, including gas flow instruments and filter monitoring.
Dolphin Technology offers a comprehensive range of memory IP products, catering to diverse requirements in semiconductor design. These products include a variety of memory compilers, specialty memory, and robust memory test and repair solutions such as Memory BIST. Designed to meet the demands of contemporary low-power and high-density applications, these IPs are built to work across a broad spectrum of process technologies. Advanced power management features, like light and deep sleep modes and dual rails, enable these products to tackle even the toughest low-leakage challenges. What sets these products apart is their flexibility and adaptability, evident in the support for different memory types and process nodes. Dolphin Technology’s memory IPs benefit from seasoned design teams that have proven their mettle in silicon across several generations. Thus, these IPs are not only versatile but also reliable in serving a wide variety of industry needs for technology firms worldwide. Clients can expect memory solutions that are fine-tuned for both power efficiency and performance. Additional capabilities such as power gating cater to ultra-low power devices while achieving a high level of device integration and compatibility. The specialized focus on low noise and rapid cycle times makes these memory solutions highly effective for performance-driven applications. These features collectively make Dolphin Technology’s memory IP an invaluable asset for semiconductor designers striving for innovation and excellence.
Secure OTP from PUFsecurity is the next evolution in data protection, utilizing a secure anti-fuse OTP memory for storing keys and sensitive information. It enhances traditional OTP by providing a comprehensive protection mechanism against hardware attacks. The solution features digital and physical macros along with a resilient anti-tamper shell, supporting multiple interfaces for smooth integration into diverse IC applications.
The AST 500 and AST GNSS-RF represent cutting-edge semiconductor solutions in the realm of GNSS technology. These chips are meticulously designed to enhance the performance of Global Navigation Satellite Systems, allowing them to function with heightened accuracy and reliability. With advanced RF front-end technologies, these ICs efficiently handle GNSS signals across multiple satellite systems, ensuring robust connectivity and precise location tracking. Leveraging state-of-the-art process technology, AST 500 and AST GNSS-RF chips are fabricated in leading semiconductor foundries, providing superior signal integrity and low noise performance. These ICs are engineered to perform optimally under various environmental conditions, making them suitable for both commercial and defence applications. Their compatibility with systems such as GPS, GLONASS, and Galileo ensures versatility and global applicability. By integrating these chips, devices can achieve improved positioning accuracy and faster time-to-first-fix, making them an ideal choice for navigation-centric products across multiple industries, including automotive and aerospace.
The Scorpion family of processors offers support for OSU containers as per the CCSA and IEEE standards, particularly the OSUflex standard. These processors accommodate various client-side signals, including E1/T1, FE/GE, and STM1/STM4, ensuring robust performance monitoring and optional Ethernet rate limitation. Scorpion processors can adeptly map these client signals to OSU or ODU containers, which are subsequently multiplexed to OTU-1 lines. Known for their flexibility and efficiency in handling diverse traffic types, Scorpion processors serve as foundational elements for advancements in access networks and optical service units, ensuring sustained performance in increasingly complex networking environments.
The High Speed Data Bus (HSDB) IP Core is engineered to provide a seamless PHY and Mac layer implementation that is fully compatible with the HSDB standard. It is specifically designed for easy integration, offering a user-friendly interface that can be incorporated into a variety of systems without a hitch. Known for its exceptional throughput, this core ensures F-22 aircraft compatibility, making it a robust choice in demanding avionics applications. This IP core excels in establishing reliable high-speed communication links, crucial for applications where data integrity and timing are paramount. By facilitating streamlined data flow with minimized latency, the HSDB IP Core enhances operational efficiency significantly. It is an ideal solution for environments requiring stringent adherence to high data rates and precise timing protocols.
Designed to ensure reliable communication in automotive networks, the TSN Switch for Automotive Ethernet orchestrates robust timing and synchronization across multiple network components. It leverages Time-Sensitive Networking (TSN) standards to guarantee real-time performance and low latency, which are critical in vehicular communication systems. This switch is pivotal for managing complex data flows in automobiles, supporting advancements in autonomous vehicle technologies by enabling the seamless integration of various data streams. The switch is engineered to align with the increasing demands for high-speed connectivity in modern automobiles. With a focus on enhancing safety and operational efficiency, it allows for precise control over packet transmission, minimizing the risk of data collisions and ensuring that high-priority information is accurately transmitted through the network. This focus on precise data management makes the TSN Switch vital for deploying advanced driver-assistance systems (ADAS) and infotainment solutions. By incorporating TSN protocols, this switch enhances the reliability of vehicle networks, thereby facilitating a safer and more interconnected driving experience. It supports the integration and coordination of sensors, processors, and communication networks within the vehicle, making it an indispensable component in the development of next-generation smart transportation solutions.
The LPDDR5/5X PHY & Memory Controller from SkyeChip is engineered to provide high-performance, power-efficient memory interfaces that adhere to the LPDDR5/5X (JESD209-5C) JEDEC standards. This solution supports data rates up to 6400 MT/s with an option to upgrade to 10667 MT/s, ensuring high-speed operations. Designed for flexibility, it accommodates various SDRAM configurations, supporting up to 32Gb addressing with back functionalities like RAS and Debug available. This product is meticulously crafted for applications demanding advanced memory solutions in various technology sectors.
The RISCV SoC - Quad Core Server Class is engineered for high-performance applications requiring robust processing capabilities. Designed around the RISC-V architecture, this SoC integrates four cores to offer substantial computing power. It's ideal for server-class operations, providing both performance efficiency and scalability. The RISCV architecture allows for open-source compatibility and flexible customization, making it an excellent choice for users who demand both power and adaptability. This SoC is engineered to handle demanding workloads efficiently, making it suitable for various server applications.
Certus Semiconductor's Digital I/O solutions are engineered to meet various GPIO/ODIO standards. These versatile libraries offer support for standards such as I2C, I3C, SPI, JEDEC CMOS, and more. Designed to withstand extreme conditions, these I/Os incorporate features like ultra-low power consumption, multiple drive strengths, and high levels of ESD protection. These attributes make them suitable for applications requiring resilient performance under harsh conditions. Certus Semiconductor’s offerings also include a variety of advanced features like RGMII-compliant IO cells, offering flexibility for different project needs.
This library is a production-quality, silicon-proven I/O library in TSMC 12nm technology. Supports multi-voltage GPIOs, capable of operating at 1.8V or 3.3V, dynamically selectable at the system level. Also included are various open-drain I/Os and hot plug detects capable of up to 5V operation. The library also includes a wide-variety of low-capacitance RF and analog ESD. There have operating ranges from 0 to 5V protection and support a wide range of high-performance interfaces including HDMI, LVDS, USB and wireless front-ends. Also included is a range of IEC 61000-4-2 system-level ESD protection that supports digital and analog I/O cells.
The LDS NVME HOST IP has been done for beginners and experts in NVMe to drive NVMe PCIe SSD. Providing a CPU interface for long sequential recording or reading and a FIFO interface for I/O intensive data transfer, it simplifies management of the IP using AXI bus. The IP automatically configures PCIe RP and EP registers and NVMe registers, manages up to 8 Name Spaces and 16 IO Queues, handles 512Bytes or 4096Bytes sector sizes, and runs admin commands in parallel with the I/O Queue. It includes options for FAT32/EXFAT file system and offers easy connection to embedded Root Port PCIe IP through the AXI bus. Verified on the ALINX AXAU15 + AB19-M2PCI Board with several disks, it provides excellent performance with increased memory configurations.
The Bipolar-CMOS-DMOS (BCD) technology is purpose-built for power management applications requiring superior efficiency and control. By merging bipolar, CMOS, and DMOS transistors, this technology supports the development of integrated circuits capable of handling high voltages and currents. Its integrated nature enables compact design and high performance, particularly ideal for use in consumer electronics where space and heat dissipation are critical considerations. The BCD process excels in providing reliable performance in power switching and regulation tasks, vital for extending battery life in portable devices. This technology perfectly suits applications in the automotive and industrial sectors where robust power management is critical. Its ability to withstand high current loads and environmental stresses contributes to its selection in designing durable and efficient power systems.
TwinBit Gen-2 builds upon the foundation of its predecessor by supporting more advanced process nodes from 40nm to 22nm. Like the Gen-1 version, it is integrated into CMOS processes without necessitating additional masks or processing steps. This technology incorporates the novel Pch Schottky Non-Volatile Memory Cell, facilitating ultra-low-power operation. With the Gen-2, users gain access to a memory solution that handles both programming and erasing effectively through controlled hot carrier injection. This is achieved through intelligent cell bias manipulation, ensuring optimal performance. The process of hot-hole and hot-electron generation is finely distributed to maintain integrity during both program and erase operations. TwinBit Gen-2 is specifically advantageous for applications that demand ultra-low-power memory solutions. Its structure caters well to IoT and automotive applications where energy efficiency and reliability are paramount. Maintaining compactness and efficiency, this IP further enhances NSCore's portfolio in serving advanced technological requirements.
YouDDR is a comprehensive technology encompassing not only the DDR controller, PHY, and I/O but also features specially developed tuning and testing software. It provides a complete subsystem solution to address the complex needs of DDR memory interfaces. The integrated approach allows for cohesive synchronization between the controller and PHY, optimizing performance and reliability. The YouDDR technology ensures seamless integration into a variety of platforms, supporting a broad range of applications from simple consumer electronics to advanced computing systems. By offering enhanced tuning capabilities, it allows developers to fine-tune performance metrics, ensuring that systems can operate within their optimal performance windows. Developers utilizing YouDDR benefit from a thoroughly tested and verified subsystem that significantly simplifies the design cycle. This not only reduces development time but also enhances the likelihood of first-pass success, providing a competitive edge in manufacturing efficiency and product launch speed.
The Aeonic Integrated Droop Response System sets a new standard in addressing voltage droop issues within integrated circuits through its advanced droop detection and response capabilities. It is uniquely engineered to provide rapid, fine-grained DVFS capabilities, allowing significant reductions in system power requirements. With multi-threshold detection features and support for remote/local droop detection, this system effectively facilitates monitoring and management of critical silicon health metrics. The robust observability and programmability features make it an indispensable asset for adapting to silicon aging and optimizing lifecycle analytics.
The LEE Flash G2 transcends traditional flash memory with its advanced features and innovative use of SONOS technology. Constructed to redefine the potential of non-volatile memory (NVM) systems, G2 stands out with its ability to perform read operations at standard VDD levels. By minimizing high voltage areas within the memory block, G2 enables seamless connectivity between memory cells and logic circuits, fostering the direct integration of NV-SRAM functionality within larger systems. This unique capability stems from G2's design, which integrates SONOS transistors with advanced switching elements to offer unprecedented functionality. The low programming current, in picometric amplitude, mirrors a fraction of what is required for floating-gate technologies, presenting designers with extensive flexibility in chip architecture. The extended feature set of G2 further elevates its value, particularly for applications needing rapid data transfer, such as MCU and SoC developments. G2's proprietary NV-SRAM design allows for efficient data transfer between SRAM and non-volatile memory, providing a robust solution for applications requiring swift power cycling without data loss. It eliminates the need for separate flash blocks and interconnect interfaces, thereby streamlining design processes and reducing material costs. This makes the G2 particularly suitable for high-performance embedded systems, facilitating quicker startups and power-responsive operations.
T-Head Semiconductor's Zhenyue 510 is a high-performance SSD controller tailored for enterprise-grade solid-state drives. This controller is intricately engineered to handle large-scale data processing with enhanced reliability and speed. It integrates innovative memory management techniques that maximize the effectiveness of storage solutions, thereby supporting modern data-driven applications in various industries. The Zhenyue 510 boasts advanced error correction mechanisms and efficient power mode management, which together ensure robust data integrity and energy efficiency. Its architecture allows for seamless integration with existing server infrastructures and supports an extensive set of storage interfaces, facilitating versatile deployment options for enterprise users. These features combine to deliver a balance of speed and dependability essential for sustaining the performance demands of high-end applications. With its focus on optimizing NAND performance, the Zhenyue 510 excels in sequencing large datasets, making it indispensable for workloads that thrive on quick data access and manipulation such as databases and real-time analytics. Its design underpins T-Head Semiconductor's mission to deliver components that not only meet but exceed the rigorous expectations of contemporary technology landscapes.
The sensor technology from Analog Bits plays a pivotal role in monitoring and ensuring system stability and power integrity. These sensors are expertly designed to provide precise environmental data and real-time feedback critical for power management and thermal control. With exceptional accuracy, they allow devices to adjust operational parameters dynamically, enhancing the reliability and efficiency of system-wide performance. With support for extensive system diagnostics, their sensors are crucial in critical applications where stability and energy management are of utmost importance. They help in detecting power fluctuations and temperature variations, enabling proactive management strategies that prevent system failures. This adaptability is important in implementing effective industrial and enterprise-level applications that need constant monitoring. Incorporating advanced calibration features, these sensors offer remarkable precision in mixed-signal environments. They also significantly contribute to reducing power consumption and maintaining system integrity under various conditions, marking a substantial advantage in sustainable technology solutions. Their industry-leading integration capabilities make them indispensable for cutting-edge technology deployments.
The DDR solutions by PRSsemicon offer advanced design and verification IPs tailored to meet the demands of high-speed data processing. Supporting various DDR standards, these solutions ensure efficient and reliable data transmission for broad applications, from consumer electronics to sophisticated computing platforms.\n\nThese solutions include support for DDR, DDR2, DDR3, DDR4, and DDR5, as well as GDDR and LPDDR versions through LPDDR5X. This diversity allows them to cater to requirements of different bandwidths and power efficiencies. They also feature DFI interfaces and PHY options for seamless integration and enhanced performance.\n\nBy providing flexible and adaptable solutions, PRSsemicon empowers clients to develop memory systems optimized for speed, power efficiency, and overall reliability. These IPs are vital for applications demanding high-data throughput and efficient power consumption, ensuring the flawless operation of today's high-tech devices and systems.
This Secondary/Slave PHY is intended for the memory side, offering high-speed, low-power protocols for data transfer. Following the JEDEC standards for LPDDR4/4X/5, it promotes efficient communication in various devices, especially AI and memory-intensive solutions. Although designed for TSMC's 7nm technology, its flexible architecture allows adaptation across different processes and memory configurations.
PermSRAM offers a flexible non-volatile memory solution designed for seamless integration with standard CMOS processes from 180nm to 28nm and potentially beyond. Its key features include one-time programmable and pseudo multi-time capabilities with a variety of memory configurations, ranging from 64 bits to 512K bits. Notably, PermSRAM incorporates a non-rewritable hardware safety lock, which is ideal for secure storage of codes. This memory macro caters to applications requiring high security and reliability such as security code storage and program management. It provides a robust solution with stable yield performance, making it an excellent choice for various security-sensitive uses. Furthermore, it eliminates the need for additional charging circuits by operating with a typical system board voltage of 5V, which leads to significant savings in silicon area. PermSRAM is structured to handle stress-free testing environments thanks to its built-in self-test circuits, maintaining efficiency even under demanding conditions. Its small silicon footprint and highly secure data storage make it suitable for a comprehensive set of applications, including analog trimming, gamma correction, and chip identification solutions.
The RecAccel N3000 AI Inference Chip is specifically crafted for accelerating DLRM (Deep Learning Recommendation Model) workloads in data centers. This cutting-edge accelerator boasts the ability to perform one million DLRM inferences per joule of energy, showcasing its high power efficiency and sustainability. What truly sets the RecAccel apart is its ability to maintain top-tier inference accuracy, achieving INT8 DLRM accuracies close to that of FP32 at 99.97%. Power consumption efficiency stands at the heart of the RecAccel N3000's design philosophy, running models with minimal energy input, which is crucial for modern AI applications demanding sustainable infrastructure. Particularly in today's data-driven landscape, this chip's ability to sustain high recommendation inferences while minimizing power consumption addresses a critical challenge faced by many enterprises. Strategically developed for the AI inference landscape, the RecAccel N3000 aligns with Neuchips' vision of delivering solutions that not only drive performance but also emphasize environmental stewardship through energy-efficient technologies. Its role extends beyond product offerings, contributing significantly to Neuchips' reputation for innovation in AI-specific integrated circuits.
ISPido is a powerful and flexible image signal processing pipeline tailored for high-resolution image processing and tuning. It supports a comprehensive pipeline of image enhancement features such as defect correction, color filter array interpolation, and various color space conversions, all configurable via the AXI4-LITE protocol. Designed to handle input depths of 8, 10, or 12 bits, ISPido excels in processing high-definition resolutions up to 7680x7680 pixels, making it highly suitable for a variety of advanced vision applications. The architecture of ISPido is built to be highly compatible with AMBA AXI4 standards, ensuring that it can be seamlessly integrated into existing systems. Each module in the pipeline is individually configurable, allowing for extensive customization to optimize performance. Features such as auto-white balance, gamma correction, and HDR chroma resampling empower developers to produce precise and visually accurate outputs in complex environments. ISPido's modular and versatile design makes it an ideal choice for deploying in heterogeneous processing environments, ranging from low-power battery-operated devices to sophisticated vision systems capable of handling resolutions higher than 8K. This adaptability makes it a prime solution for developers working across various sectors demanding high-quality image processing.
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