All IPs > Interface Controller & PHY > D2D
Device-to-Device (D2D) communication is a critical component in modern electronics, enabling direct interaction between devices without intermediary network infrastructure. Within our Interface Controller & PHY category, the D2D segment offers specialized semiconductor IPs designed to streamline and enhance these direct connections. These IPs are indispensable in creating an efficient communication link that can handle the increasing data demands seen in consumer electronics, automotive systems, and IoT devices.
Our D2D semiconductor IPs consist of essential building blocks such as interface controllers and Physical Layer (PHY) IP cores. These components are engineered to facilitate seamless communication between devices, whether it be for transferring data, synchronizing functions, or sharing resources in real-time. By leveraging these IPs, manufacturers can achieve low latency, high-speed data transfer, and robust connectivity, making these components suitable for applications requiring precise and rapid interaction.
Incorporating D2D IPs into your design allows for efficient use of bandwidth and power, critical factors in battery-operated or compact devices. The versatility of these semiconductor IPs makes them a popular choice in developing smart home devices, wearables, and vehicle infotainment systems, where direct and reliable device-to-device communication is paramount. These IPs also help minimize reliance on external network structures, providing a more secure and localized network environment.
The D2D interface controller and PHY IPs in our collection are developed to cater to the demanding needs of modern technological solutions. Whether you are designing a new IoT ecosystem or enhancing an automobile's connectivity suite, selecting the right D2D IP core can significantly impact your product’s performance and user experience. Explore our offerings to find the IP solutions that best align with your innovation goals, ensuring your devices communicate effectively and efficiently.
Panmnesia's CXL 3.1 Switch is an integral component designed to facilitate high-speed, low-latency data transfers across multiple connected devices. It is architected to manage resource allocation seamlessly in AI and high-performance computing environments, supporting broad bandwidth, robust data throughput, and efficient power consumption, creating a cohesive foundation for scalable AI infrastructures. Its integration with advanced protocols ensures high system compatibility.
Universal Chiplet Interconnect Express (UCIe) is a cutting-edge technology designed to enhance chiplet-based system integrations. This innovative interconnect solution supports seamless data exchange across heterogeneous chiplets, promoting a highly efficient and scalable architecture. UCIe is expected to revolutionize system efficiencies by enabling a smoother and more integrated communication framework. By employing this technology, developers can leverage its superior power efficiency and adaptability to different mainstream technology nodes. It makes it possible to construct complex systems with reduced energy consumption while ensuring performance integrity. UCIe plays a pivotal role in accelerating the transition to the chiplet paradigm, ensuring systems are not only up to current standards but also adaptable for future advancements. Its robust framework facilitates improved interconnect strategies, crucial for next-generation semiconductor products.
The NuLink Die-to-Die PHY for Standard Packaging represents Eliyan's cornerstone technology, engineered to harness the power of standard packaging for die-to-die interconnects. This technology circumvents the limitations of advanced packaging by providing superior performance and power efficiencies traditionally associated only with high-end solutions. Designed to support multiple standards, such as UCIe and BoW, the NuLink D2D PHY is an ideal solution for applications requiring high bandwidth and low latency without the cost and complexity of silicon interposers or silicon bridges. In practical terms, the NuLink D2D PHY enables chiplets to achieve unprecedented bandwidth and power efficiency, allowing for increased flexibility in chiplet configurations. It supports a diverse range of substrates, providing advantages in thermal management, production cycle, and cost-effectiveness. The technology's ability to split a Network on Chip (NoC) across multiple chiplets, while maintaining performance integrity, makes it invaluable in ASIC designs. Eliyan's NuLink D2D PHY is particularly beneficial for systems requiring physical separation between high-performance ASICs and heat-sensitive components. By delivering interposer-like bandwidth and power in standard organic or laminate packages, this product ensures optimal system performance across varied applications, including those in AI, data processing, and high-speed computing.
The CT25205 is a robust digital IP core designed for IEEE 802.3cg 10BASE-T1S Ethernet Physical Layer. It includes PMA, PCS, and PLCA Reconciliation Sublayer blocks, enhancing compatibility with standard IEEE MACs via the MII. Featuring a fully synthesizable Verilog design, it is deployable on standard cells and FPGAs. With integrated PLCA RS, this IP provides advanced features without necessitating additional extensions, making it a vital component for Zonal Gateways SoCs.
The ePHY-5616 delivers data rates from 1 to 56Gbps across technology nodes of 16nm and 12nm. Designed for a diverse range of applications, this product offers superior BER and low latency, making it ideal for enterprise equipment like routers, switches, and network interface cards. The ePHY-5616 employs a highly configurable DSP-based receiver architecture designed to manage various insertion loss scenarios, from 10dB up to over 35dB. This ensures robust and reliable data transfer across multiple setups.
Brite Semiconductor's YouSerdes provides a flexible solution of multi-speed SERDES IP with rates ranging from 2.5 Gbps to 32 Gbps. This offering is characterized by its smooth integration of multiple SERDES channels, ensuring high performance, efficiency, and low power consumption.<br><br>The technology is engineered to offer excellent connectivity solutions, making it ideal for applications that require precise and high-speed data transfer. Its compact and efficient design positions it favorably against other products in the market, providing a balance of speed and area utilization.<br><br>YouSerdes stands out for its adaptability and compatibility, meeting the needs of a range of applications including telecommunication networks and data centers where reliable, high-speed data processing is crucial.
Brite Semiconductor's YouSerdes provides a flexible solution of multi-speed SERDES IP with rates ranging from 2.5 Gbps to 32 Gbps. This offering is characterized by its smooth integration of multiple SERDES channels, ensuring high performance, efficiency, and low power consumption.<br><br>The technology is engineered to offer excellent connectivity solutions, making it ideal for applications that require precise and high-speed data transfer. Its compact and efficient design positions it favorably against other products in the market, providing a balance of speed and area utilization.<br><br>YouSerdes stands out for its adaptability and compatibility, meeting the needs of a range of applications including telecommunication networks and data centers where reliable, high-speed data processing is crucial.
MAXVY UCIe VIP , a state-of-the-art solution that offers a comprehensive set of features and capabilities to ensure the quality and performance of your UCIe designs. MAXVY UCIe VIP is fully compliant with UCIe Specification version 1.0 and supports all the layers of the UCIe stack, such as FDI, RDI, LogPHY, PCIe, and CXL protocols. MAXVY UCIe VIP is also very user-friendly and flexible, with simple APIs, easy integrations, and configurable parameters. You can easily customize and control the UCIe functionality according to your needs. MAXVY UCIe VIP also provides a rich set of verification capabilities, such as protocol checks, functional coverage, traffic generation, error injection, and debug tools. You can easily monitor, detect, and report any issues or violations in your UCIe designs. MAXVY UCIe VIP is compatible with the industry-standard Universal Verification Methodology (UVM) and supports all leading simulators. With MAXVY UCIe VIP, very flexible for unit level testing, you can achieve faster verification closure and higher quality of your UCIe designs.
Credo's SerDes PHY stands at the forefront of customizable analog and digital signal processing technology, specifically engineered for integration into sophisticated ASIC designs. This high-performance technology seamlessly addresses the demands of today's advanced computing and data environments, offering a robust solution with optimal power consumption and cost-efficiency. The architecture of Credo's SerDes PHY is particularly notable for its unique design, which optimally balances the performance, power cost, and risks associated with the semiconductor manufacturing process. By employing a patented mixed signal DSP framework, this IP delivers unparalleled signal integrity across a variety of environments, including data centers, AI applications, and high-performance computing scenarios. Reliably designed to operate across a wide range of process nodes, Credo's technology is adaptable to various company-specific needs, supporting integration into multichip module systems on chip (MCM SoC) as well as 2.5D silicon interposer architectures. This adaptability and high precision signal management ensure Credo's customers can meet the evolving requirements of their industries with confidence.
The High-Speed SerDes is an advanced solution engineered to deliver high-performance data transmission in chiplet architectures. Leveraging our innovative digital-centric design, this SerDes offers unmatched low power consumption, making it ideal for high-speed ASIC applications. It ensures optimal performance and efficiency, supporting systems with varying speeds and complexities. This SerDes is adept at handling the demands of modern data transfer, ensuring reliable and fast communication between chiplets in an integrated system. Its ability to function at high speeds while maintaining energy efficiency is what sets it apart in the domain of interconnect technologies. Designed to be scalable, it facilitates the development of systems that are not just current with today’s technological demands but are also prepared for the innovations of tomorrow. This makes it a critical component in the expansion of semiconductor capabilities, supporting diverse applications across multiple sectors.
SkyeChip offers a Die-to-Die Interconnect designed for effective communications between dies using minimal power and area. This solution supports lightweight, high-performance interconnections compliant with the Universal Chiplet Interconnect Express (UCIe) 2.0 specification, which ensures high-speed data transfers at low energy costs. The D2D Interconnect allows transfer rates up to 32 Gbps per pin, supporting bandwidth up to 8Tbps, conducive to expanding communication protocols such as PCIe and CXL across multiple dies. It's compatible with key packaging technologies and includes support for PHY-to-PHY loopback tests, enhancing inter-system verification. Crucially, this interconnected solution incorporates built-in self-test and repair functionalities to maximize yield, thereby reducing post-package repairs and ensuring robust performance over an extended lifecycle. The capability to integrate seamlessly with existing UCIe systems further emphasizes its utility in multi-die integration strategies.
The CXL 3.0 solution from Rapid Silicon is an advanced Controller IP designed to enhance your FPGA design with superior performance and flexibility. This IP is compliant with CXL specifications up to version 3.0, along with support for earlier versions 2.0, 1.1, and 1.0. It offers seamless integration capabilities with PCIe, standing up to PCIe 6.0 and ensuring backward compatibility. The architecture of the CXL Controller IP is highly configurable, providing adaptability for specific application requirements, including lane configurations, datapath widths, and efficiency in power management. One of the standout features of the CXL 3.0 IP is its support for advanced functionalities such as lane bonding, multicast, and robust error correction mechanisms. These features ensure the IP delivers reliable and efficient performance in diverse environments. Ideal for critical data-intensive tasks, the IP is suited for telecommunications, industrial applications, and more, where data throughput and protocol bridging are crucial. With its focus on delivering unmatched speed, efficiency, and scalability, the CXL 3.0 IP from Rapid Silicon is positioned as a key component for enabling sophisticated FPGA designs tailored to meet modern technology demands. Its architecture is crafted to support the burgeoning needs of applications that require high degrees of data handling and processing accuracy, making it a preferred choice in the semiconductor industry.
APIX3 technology represents the pinnacle of data communication solutions for advanced automotive infotainment and cockpit systems. It supports ultra-high definition video resolutions, facilitated by its capacity for multi-channel high-speed data transmission. The technology enables a scalable bandwidth that adapts from entry-level to luxurious, high-end automotive systems, ensuring a broad range of application compatibilities. APIX3 modules are engineered to transmit data at rates of up to 6 Gbps over a shielded twisted pair cable and up to 12 Gbps over a quad twisted pair. This makes them invaluable in systems requiring high levels of data integrity and precision, such as those found in modern, connected vehicle architectures. In addition to supporting complex video channels, APIX3 is compatible with 100 Mbps Ethernet and integrates advanced diagnostic capabilities for cable monitoring, which allows for predictive maintenance by detecting cable degradation. Its backwards compatibility with APIX2 ensures seamless integration and upgradability in existing infrastructures, reinforcing its status as a future-proof solution.
The BlueLynx Chiplet Interconnect is a sophisticated die-to-die interconnect solution that offers industry-leading performance and flexibility for both advanced and conventional packaging applications. As an adaptable subsystem, BlueLynx supports the integration of Universal Chiplet Interconnect Express (UCIe) as well as Bunch of Wires (BoW) standards, facilitating high bandwidth capabilities essential for contemporary chip designs.\n\nBlueLynx IP emphasizes seamless connectivity to on-die buses and network-on-chip (NoCs) using standards such as AMBA, AXI, and ACE among others, thereby accelerating the design process from system-on-chip (SoC) architectures to chiplet-based designs. This innovative approach not only allows for faster deployment but also mitigates development risks through a predictable and silicon-friendly design process with comprehensive support for rapid first-pass silicon success.\n\nWith BlueLynx, designers can take advantage of a highly optimized performance per watt, offering customizable configurations tailored to specific application needs across various markets like AI, high-performance computing, and mobile technologies. The IP is crafted to deliver outstanding bandwidth density and energy efficiency, bridging the requirements of advanced nodal technologies with compatibility across several foundries, ensuring extensive applicability and cost-effectiveness for diverse semiconductor solutions.
Analog Bits provides advanced I/O solutions tailored for high-speed data transfer and die-to-die communication. Their I/O offerings are designed to minimize power consumption while delivering optimal signaling quality through differential clocking and signaling techniques. These solutions are crafted to ensure effective integration with modern SoC architectures, providing customization options to meet specific technical requirements. The I/O technologies developed by Analog Bits are proven in high-volume production at nodes as small as 5nm, ensuring reliability and performance. Manufactured using state-of-the-art processes, Analog Bits' I/O IP supports a broad range of applications, from consumer electronics to complex server environments. Their expertise in transistor-efficient architecture further boosts signaling capabilities while maintaining compact die areas, making them an ideal choice for next-generation semiconductor development.
Enclustra offers a UDP/IP Ethernet Communication core that simplifies the creation of FPGA-based subsystems communicating over Ethernet. This IP core leverages the efficiency and speed of UDP protocol to enable high-speed data exchanges between different network nodes, making it ideal for real-time communications and data streaming applications. The Ethernet Communication core is highly configurable, adaptable to various data rates, and network configurations. This adaptability ensures that systems can be rapidly deployed in diverse network environments while maintaining low latency and high throughput. Designed with ease of integration in mind, the UDP/IP core ensures that developers can focus on core system functionalities rather than on complex networking protocols. This significantly reduces development time and accelerates time to market, which is critical in today's fast-paced technology landscape.
Designed to revolutionize AI-driven data centers, the Photowave Optical Communications Hardware capitalizes on the inherent advantages of photonics. With capabilities that support PCIe 5.0/6.0 and CXL 2.0/3.0, this hardware facilitates enhanced scalability of AI memory applications within data centers. The technology provides significant latency reduction and energy efficiency, allowing for more effective resource allocation across server racks, which is a crucial feature for modern data infrastructure. The Photowave hardware serves the evolving needs of data-driven applications, ensuring seamless integration and performance boosts in environments demanding high-speed data transfer and processing. By addressing the latency and power efficiency concerns prevalent in traditional electronics, it is integral in the transition towards faster, more sustainable data center operations. Incorporating these photonic advantages, Photowave stands as a testament to Lightelligence’s goal of transforming data operations and enhancing the utility of AI technologies. Its role in this ecosystem is vital, making it a cornerstone product for entities looking to modernize their computational frameworks.
The Chiplet Interface solutions provided by Neuron IP include cutting-edge PHY & D2D Adapter IP for chiplet products. These solutions are built around the latest UCIe v1.1 specification and are designed to support a wide range of application verticals. They are well-known for their unparalleled PPA-differentiated architecture, which includes 32Gbps UCIe-Advanced and Standard cores. These interfaces are set to revolutionize the way microprocessors work in ultra-low latency environments, enhancing both performance and efficiency.
StreamDSP's VITA 17.3 Serial FPDP Gen3 Solution is an advanced high-speed communication framework designed to meet the latest standards in data transfer technology. This solution offers improved data throughput and enhanced interoperability with existing systems, making it an invaluable asset for applications demanding the utmost precision and speed. Leveraging enhanced protocol designs, this IP solution integrates seamlessly with a broad array of FPGA platforms, providing users with unmatched performance and reliability in critical data communication setups. This makes it indispensable for applications in fields such as defense, scientific research, and real-time data processing.
The JESD204B Multi-Channel PHY is a versatile high-speed data interface designed to handle numerous channels simultaneously. Its architecture supports top speeds reaching 12.5Gbps, which is crucial in applications where data transfer efficiency and reliability are paramount. This technology is often employed in systems requiring high bandwidth and precision synchronization, making it ideal for advanced communication networks and high-resolution broadcasting environments. This product stands out for its capacity to neatly integrate with various semiconductor processes, ensuring seamless compatibility and broad functionality. Whether in complex signal processing or high-speed data acquisition contexts, it provides the necessary infrastructure to maintain robust data transmission with minimal latency and power consumption. Moreover, the JESD204B Multi-Channel PHY is designed to support multiple serial data rates, offering great flexibility to developers working within diverse technology applications. Its comprehensive design ensures that it meets the standards of modern digital systems, helping to push the envelope of data-transfer capabilities in state-of-the-art technological infrastructures.
Capable of handling data rates from 1 to 112Gbps, the ePHY-11207 is a powerful solution designed for 7nm node technologies. It is specifically tailored for environments requiring ultra-low latency and robust error correction capabilities, making it a perfect fit for high-performance data center and 5G network applications. The ePHY-11207 integrates an advanced DSP-based receiver that ensures adaptability to various signaling conditions and insertion loss scenarios, therefore boosting operational reliability across complex systems.
The VITA 17.1 Serial FPDP Solution from StreamDSP is designed for high-speed data transfer applications. This solution leverages industry-standard interfaces to facilitate efficient serial data communications, ensuring seamless data flow in demanding environments. It's ideal for applications that require robust data integrity and low-latency transmission, making it a perfect fit for military and aerospace operations. By supporting a range of configurations and offering flexibility in integration, this solution helps address specific user needs while maintaining compatibility with widely used FPGA devices.
DapTechnology's FireCore solutions offer sophisticated support for both PHY and Link Layer functionalities of the IEEE-1394b-2008 and AS5643 standards. Engineered for adaptability, these solutions integrate seamlessly into various FPGA families, supporting custom configurations tailored to specific operational requirements. FireCore was developed to handle transmission speeds from S100 to S3200, ensuring high performance across numerous industrial contexts. A notable feature of FireCore solutions is their customizable nature, allowing for precise adaptation to unique system needs. This flexibility extends to the configuration of PHY ports, host interface compatibility, as well as advanced error monitoring capabilities. The solutions also include key enhancements for real-time data handling such as Bit Error Injection and Bit Error Rate Testing. The robust configuration options offered by FireCore ensure that users can effectively streamline data encapsulation and transmission processes, minimizing latency and maximizing data integrity. These solutions are particularly valuable for users aiming to expedite their data processing capabilities while maintaining rigorous compliance with industry standards.
The Interconnect Generator offers a robust, protocol-agnostic solution for developing sophisticated bus interconnects. Supporting both AXI and OCP Master/Slave configurations, it can be customized as simple, pipelined, or crossbar structures. Designed to handle both atomic requests and response transactions, it provides a versatile foundation for implementing inter-device communications. Key features include a built-in reorder buffer with configurable depth, enabling multiple outstanding requests while ensuring data delivery remains orderly. This flexibility makes it suitable for various applications, from simple device communication to complex data transactions that require precise data alignment and delivery integrity. This generator simplifies the intricate process of designing protocol behaviors and aids in the efficient management of address and data phases. By offering customizable solutions that precisely fit client specifications, the Interconnect Generator is essential for projects demanding high-performance communication infrastructures.
The 10GBASE-KR Ethernet IP offers high-speed data transmission capabilities tailored for Ethernet applications. Its design is optimized to comply with the IEEE standards, providing reliable communication over backplane environments. With a strong focus on minimizing latency and maximizing signal integrity, this IP is built for systems requiring robust performance in high-density network setups. It's particularly suited to telecom environments where consistent connectivity is vital.
Aragio's LVDS solutions are tailored for high-speed data transmission up to 1 GHz for drivers and 1.2 GHz for receivers. Designed to meet the LVDS standard, the offering includes a CML interface to the core and power-up sequence independence. The solution provides flexibility with both 50Ω and 100Ω termination options, tailored to provide low power consumption while maintaining high performance. These features make it suitable for diverse high-speed data applications, ensuring reliability and energy efficiency.
The Regli PCIe Retimer from Kandou is designed to enhance component communication by improving signal integrity and reducing latency. This product supports PCIe 5.0 and CXL 2.0 standards, offering precision engineering that ensures high signal quality even in demanding environments. Its advanced capabilities make it an excellent choice for applications requiring robust communication channels and reliable data transfer.
The ePHY-5607 stands out for its PPA-optimized configuration, offering data rates from 1 to 56Gbps targeting the 7nm technology node. This IP is engineered for data center applications including routers, switches, and AI storage solutions. With an emphasis on superior BER and robust clock data recovery, the ePHY-5607 ensures efficient handling of high-speed data traffic. This product's distinctive feature set includes rapid temperature tracking and multi-reference clock configurations, which provide enhanced adaptability in fluctuating environments.
Glasswing is an ultra-short reach SerDes designed to utilize CNRZ-5 Chord Signaling to offer innovative solutions that enhance interface IP performance. This technology allows for more efficient connectivity between chips, providing double the bandwidth with reduced power and fewer pins compared to traditional approaches. Glasswing supports high-performance computing tasks and AI applications, delivering up to 1Tbps bandwidth at low power levels, making it a suitable choice for demanding environments.
Sofics has verified its TakeCharge ESD protection clamps on technology nodes between 0.25um CMOS down to 3nm across various fabs and foundries. The ESD clamps are silicon and product proven in more than 5000 mass produced IC-products. The cells provide competitive advantage through improved yield, reduced silicon footprint and enable low-leakage, high-speed or high voltage tolerant interfaces. The ESD protection described in this document can be used for 1.6V chiplet (die-2-die) interface pads in the GF 22nm FDX technology. The ESD robustness is strongly reduced in order to reduce the size and capacitance.
The MIPI C-PHY Interface is designed to enhance throughput in channels limited by bandwidth constraints. It delivers 5.7Gbps per lane of bandwidth, making it a powerful solution for increasing data transfer without the need for raising the signaling clock frequency. This interface is instrumental in optimizing data flows across high-capacity networks, ensuring efficient data handling and transmission.
The SerDes technology from KNiulink Semiconductor is engineered to facilitate rapid data transfer while maintaining low power consumption across diverse applications. It achieves competitive performance and flexibility through advanced architecture and configuration options, making it compatible with user logic or SoC integration. The technology supports a broad spectrum of rates, enabling seamless communication in high-demand environments.
The 5G ORAN Base Station is set to transform mobile networking by significantly enhancing wireless data capacity and opening up new opportunities for innovative wireless applications. This technology promises to exceed previous limitations by supporting a vast amount of data through increased efficiency, facilitating the expansion of wireless connectivity solutions in diverse environments. With its capability to handle high-speed data transmissions efficiently, the 5G ORAN Base Station is particularly suitable for industries seeking to leverage wireless technology for expansive, high-demand applications. It supports the integration of various critical infrastructure components, ensuring consistent and reliable performance in real-time data processing situations. This base station's architecture also supports future enhancements and scalability in evolving network environments. Primarily used in applications that require large-scale data transmission and robust connectivity, the 5G ORAN Base Station is ideal for industries ranging from telecommunications to advanced data analytics. Its adaptability allows it to cater to specific needs in any given environment, making it a versatile solution for modern wireless communication challenges.
Silvaco's AMBA Cores and Subsystems deliver a comprehensive set of IP coproducts that align with the ARM AMBA standards for designing high-performance processor-based systems. These cores and subsystems are architected to streamline communication within systems-on-a-chip (SoCs) by providing a unified framework that facilitates connectivity between processors, memory, and peripherals.\n\nThe AMBA IP from Silvaco is proven in a variety of applications and supports critical protocols such as AXI, AHB, and APB, ensuring seamless integration into existing design environments. This extensible design ensures that even the most complex systems can maintain high levels of efficiency, speed, and reliability, thus fulfilling the stringent requirements of current and emerging technologies.\n\nKey features include support for a multi-layer architecture, advanced configuration options, and secure subsystems suitable for high-security applications. These cores improve the overall system bandwidth and enable designers to create advanced models that can adapt to different use cases, making them ideal for sectors like industrial automation, healthcare, and more.
Actt's SerDes IP provides comprehensive support for protocols such as USB, PCIe, and SATA, delivering high-speed data interchange capabilities. With an emphasis on versatility, this IP ensures streamlined signal conversion, facilitating seamless integration across a myriad of connectivity contexts. It is designed for high-speed performance, offering a power-efficient and compact solution ideal for network and communication applications, enhancing data throughput and system interconnectivity.
The Universal Chiplet Interconnect Express (UCIe) offers a transformative approach to inter-chiplet communication, designed to elevate chiplet-based system designs. This interconnect facilitates high-speed, low-latency links crucial for the efficient operating of chiplets in sophisticated computing environments. With support for versions 1.x and 2.x, UCIe ensures robust connection integrity, offering bandwidths up to 32 Gbps. It is engineered for high scalability, supporting extensive chiplet configurations needed in next-gen processors and server designs. UCIe's architecture promotes seamless integration into complex system setups, enhancing performance in high-demand areas such as AI processing, server applications, and large-scale parallel computing systems.
The ChipBridge AXI4 Connectivity solution by ALSE is designed to extend AXI4 communication beyond the primary FPGA chip to encompass external peripherals. This innovation enables master FPGAs or ASICs to effectively control numerous peripherals, streamlining the connection and expansion of system architecture. ChipBridge simplifies interfacing by using a transceiver and minimal wiring to achieve high-speed data transfers while maintaining system performance and reliability. Its design minimizes costs and power consumption by allowing the use of less expensive peripheral FPGAs while offloading intensive tasks from the master chip. This solution is instrumental in applications demanding logical distribution and control of peripherals, especially where design flexibility, cost reduction, and signal integrity are crucial. It offers compatibility across many leading FPGA platforms, ensuring broad usability and seamless integration into existing designs.
ALSE's Aurora 64B/66B Core is a streamlined protocol ideal for high-speed data exchanges across chip-to-chip, board-to-board, and backplane communications using advanced transceivers. Uniquely compact and optimized, this implementation ensures compatibility with Xilinx’s version, supporting growth across multiple FPGA platforms, including high-end Intel and Microchip's PolarFire. By maximizing on efficiency, the Aurora 64B/66B Core offers superior data bandwidth—up to 97%—surpassing the earlier 8B/10B protocol, which delivered 80%. This enhancement allows for better utilization of available network capacity, driving up system performance and ensuring that connections between diverse FPGAs or with other chips like ASICs are seamless and effective. Moreover, this core includes critical features such as full-duplex and simplex operations, multiple lanes utilization, flow control, and clock compensation, thereby enriching interoperability and synchronization between digital components. The architectural design extends this IP's usability to modern high-speed communication demands, making it a preferred choice for industries focused on fast, reliable data transmission.
The D2D, or Digital to Digital Interface, offers robust PHY and controller solutions, specifically the UCIe-A, UCIe-S, and IPTD2D-A PHY and Controllers. These interfaces support high-speed, high-efficiency data transmission between integrated circuits, ensuring reliable digital communication. The inclusion of different PHY and controller types provides versatility and adaptability to different system architectures. Designed to meet the demands of modern digital systems, the D2D interfaces are optimized for low power operation while maintaining high throughput. They are essential components in networked systems, facilitating data exchange and enhancing the overall efficiency of digital ecosystems. The D2D solutions adapt to various technology nodes, providing seamless integration into existing designs. This compatibility ensures that systems can evolve with advancing technology, maintaining their relevance and performance in an ever-changing digital landscape.
Complying with the PCI-SIG's PCIe v2.0 specifications, this PCIe PHY core features a configurable PIPE interface and supports a broad range of computing applications. Its architecture minimizes gate count while maximizing efficiency, with synchronized state machine transitions and an 8b/10b encoder/decoder included. The design is built to meet the demands of PCIe infrastructures, providing robust connectivity and high data transfer rates in a compact form factor.
ALSE's JESD204 IP streamlines the use of high-speed ADC and DAC connections by leveraging the JESD204 data converter serial interface standard. This IP is pivotal in transferring data at extreme speeds with minimal wiring requirements, ideal for applications that necessitate synchronization and precise timing across multiple converters. Supporting both JESD204B and the emerging JESD204C standards, the IP ensures deterministic latency, which is crucial for data integrity in environments where precise synchronization is paramount. The protocol efficiently manages the physical, link, and transport layers, ensuring robust data transmission and reception. This IP solves complex design challenges, especially concerning the parameterization and deployment of JESD204-compliant devices. ALSE's solution simplifies high-speed data conversion; whether used in industrial, scientific, or consumer electronics, this IP is integral in facilitating the reliable transfer and precise timing of large data streams in sophisticated digital systems.
The Aurora 8B/10B Core is a flexible and low-latency protocol tailored for establishing high-speed communication between chips or within board and backplane applications. Developed with interoperability in mind, it allows seamless integration across various FPGA platforms, including Intel, Lattice, and Microchip, as well as leveraging full compatibility with Xilinx's equivalent IP. Designed for efficiency, this core delivers up to 6.6 Gbps per transceiver lane, supporting multiple data lanes for robust and versatile communication options. The core's support for full-duplex and simplex operations, alongside flow control mechanisms, ensures efficient data exchange essential for high-paced industries. Featuring encoding and decoding capabilities, seamless clock compensation, and polarity inversion for skew management, the Aurora 8B/10B Core is engineered to simplify otherwise complex data communication designs. This IP underscores ALSE's commitment to delivering reliable and adaptable solutions that harness the full potential of high-speed serial communications within various operational frameworks.
Truechip's PCI Express Gen4 Controller is a powerful solution for managing PCIe 4.0 interfaces within a semiconductor design environment. Equipped to handle data rates that can reach 16 GT/s per lane, this controller facilitates seamless data flow while maintaining backward compatibility with prior PCIe generations. It supports both endpoint and root port configurations, offering flexibility for a variety of system architectures. Integrating this controller into a design ensures exceptional throughput and efficiency, especially for data-intensive and high-bandwidth applications. The PCIe Gen4 Controller by Truechip comes with a comprehensive set of conformance tests and debugging tools, making it easy to diagnose issues and optimize performance. By utilizing cutting-edge technology, the controller minimizes latency and power consumption, making it ideal for modern computing architectures demanding high-speed communications.
The 32G UCIe PHY from GUC is tailored to support high-speed universal chiplet interconnect express protocols. This IP is designed to meet the demanding needs of high-throughput, low-latency communication within and across chips, forming a backbone for next-generation semiconductor infrastructures. With its robust architecture, it ensures seamless data flow, critical for applications in AI, data analytics, and high-performance computing. Built to optimize system performance, the 32G UCIe PHY boosts connectivity between integrated circuits, enhancing system bandwidth and reducing power consumption. This high-speed interface facilitates rapid prototyping and integration in hyper-connected environments, paving the way for advancements in semiconductor technologies. Its advanced design minimizes electromagnetic interference, ensuring data integrity and communication stability. GUC's 32G UCIe PHY is compatible with cutting-edge process nodes, enabling developers to harness its potential across various applications. By providing high-speed data channels, it becomes integral to fostering innovation and supporting the dynamic needs of modern computing and networking solutions.
GUC's Die-to-Die Interface IP is pivotal in constructing streamlined connections across multi-die systems. It is engineered to support both 2.5D and 3D architectural frameworks, promoting efficient inter-die communication. Such enhanced connectivity enables more complex and powerful semiconductor designs, minimizing latency and maximizing throughput, crucial in applications where processing speed is critical. This interface technology creates a bridge that facilitates high-bandwidth data exchanges among integrated components, making it indispensable for AI, HPC, and semiconductor manufacturing needs. By integrating such IP, developers can achieve greater system cohesion and reduce intermodule delays, thus elevating the performance of the entire semiconductor solution. Moreover, the Die-to-Die Interface IP by GUC is crafted to meet evolving technology requirements with its support for advanced process nodes. It allows for scalable growth in semiconductor design, ensuring compatibility with future technological advancements and providing companies the agility needed to adapt to new market demands rapidly.
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