All IPs > Interface Controller & PHY > D2D
Device-to-Device (D2D) communication is a critical component in modern electronics, enabling direct interaction between devices without intermediary network infrastructure. Within our Interface Controller & PHY category, the D2D segment offers specialized semiconductor IPs designed to streamline and enhance these direct connections. These IPs are indispensable in creating an efficient communication link that can handle the increasing data demands seen in consumer electronics, automotive systems, and IoT devices.
Our D2D semiconductor IPs consist of essential building blocks such as interface controllers and Physical Layer (PHY) IP cores. These components are engineered to facilitate seamless communication between devices, whether it be for transferring data, synchronizing functions, or sharing resources in real-time. By leveraging these IPs, manufacturers can achieve low latency, high-speed data transfer, and robust connectivity, making these components suitable for applications requiring precise and rapid interaction.
Incorporating D2D IPs into your design allows for efficient use of bandwidth and power, critical factors in battery-operated or compact devices. The versatility of these semiconductor IPs makes them a popular choice in developing smart home devices, wearables, and vehicle infotainment systems, where direct and reliable device-to-device communication is paramount. These IPs also help minimize reliance on external network structures, providing a more secure and localized network environment.
The D2D interface controller and PHY IPs in our collection are developed to cater to the demanding needs of modern technological solutions. Whether you are designing a new IoT ecosystem or enhancing an automobile's connectivity suite, selecting the right D2D IP core can significantly impact your product’s performance and user experience. Explore our offerings to find the IP solutions that best align with your innovation goals, ensuring your devices communicate effectively and efficiently.
The "1G to 224G SerDes" solution from Alphawave Semi offers an extensive range of multi-standard connectivity IPs, designed to deliver optimal high-speed data transfer. These full-featured building blocks can be integrated into various chip designs, providing scalability and reliability across numerous protocols and standards. Supporting data rates from 1 Gbps to 224 Gbps, this SerDes solution accommodates diverse signaling schemes, including PAM2, PAM4, PAM6, and PAM8. Alphawave Semi's SerDes IP is engineered to meet the demands of modern communication systems, ensuring connectivity across a wide spectrum of applications. These include data centers, telecom networks, and advanced networking systems where high data transfer speeds are a necessity. This solution is crafted with energy efficiency in mind, helping reduce power consumption while maintaining a robust data connection. The SerDes solutions come equipped with advanced features like low latency and noise resilience, which are crucial for maintaining signal integrity over various transmission distances. This facilitates seamless integration into enterprises looking to boost their processing capabilities while minimizing downtime and operational inefficiencies. These capabilities make Alphawave Semi's SerDes IP a vital component in the evolving landscape of technology connectivity applications.
Universal Chiplet Interconnect Express, or UCIe, is a forward-looking interconnect technology that enables high-speed data exchanges between various chiplets. Developed to support a modular approach in chip design, UCIe enhances flexibility and scalability, allowing manufacturers to tailor systems to specific needs by integrating multiple functions into a single package. The architecture of UCIe facilitates seamless data communication, crucial in achieving high-performance levels in integrated circuits. It is designed to support multiple configurations and implementations, ensuring compatibility across different designs and maximizing interoperability. UCIe is pivotal in advancing the chiplet strategy, which is becoming increasingly important as devices require more complex and diverse functionalities. By enabling efficient and quick interchip communication, UCIe supports innovation in the semiconductor field, paving the way for the development of highly efficient and sophisticated systems.
The SERDES solutions by Analog Bits are integral components for high-speed data transfer applications, effectively serializing and deserializing data streams to improve bandwidth efficiency in electronic devices. These SERDES IPs support data rates that suit a variety of communication standards, including Ethernet and PCI Express. Leveraging state-of-the-art design techniques, these solutions optimize data throughput and reduce latency, providing the necessary data integrity and speed for applications like telecommunications and high-performance computing. Their scalable architecture allows for customization across different technology nodes, catering to specific design needs and operational environments. Analog Bits' SERDES IPs are commonly implemented in data-intensive applications, making them suitable for industries demanding high-speed connectivity, such as data centers, automotive electronics, and mobile communications. These products are validated on leading process nodes, ensuring that they deliver consistent performance even under stringent conditions.
The NuLink Die-to-Die PHY for Standard Packaging by Eliyan offers an innovative solution for high-performance interconnects between die on the same package. This technology significantly boosts bandwidth and energy efficiency, using industry-standard organic/laminate substrates to simplify design and reduce costs. It leverages a unique implementation that negates the need for more expensive silicon interposers or silicon bridges while maintaining exceptional signal integrity and compact form factors. With conventional bump pitches ranging from 100um to 130um, these PHY units support various industry standards such as UCIe, BoW, UMI, and SBD, delivering a versatile platform suitable for a wide array of applications. This flexibility ensures it meets the rigorous demands of data-centric and performance-oriented computing needs, with optimal performance observed at advanced process nodes like 5nm and below. Eliyan's NuLink PHY further breaks technological barriers by delivering synchronous unidirectional and bidirectional communication capabilities, achieving data rates up to 64 Gbps. Its design supports 32 transmission and receiving lanes to ensure robust data management in complex systems, making it an ideal solution for today's and future's data-heavy applications.
The SerDes PHY is a high-performance solution designed to facilitate high-speed data transmission within sophisticated data infrastructures. Offering support for various signaling options from 28G to 224G, this PHY is engineered to provide reliable, high-bandwidth communication required by next-generation AI and data centers. With the highly adaptable architecture, it ensures seamless integration into multiple designs including those that require long reach and very short reach plus options. Its design emphasis is on achieving low latency and high reliability, making it indispensable in environments demanding maximum uptime and efficiency. Incorporating cutting-edge mixed signal DSP technology, the SerDes PHY can effectively manage high data rates, making it ideal for switch fabric ASICs, AI ASICs, and machine learning applications. The underlying technology is manufactured on advanced process nodes, which enhances both the performance and power efficiency of the solutions. Through its innovative design, the SerDes PHY supports a range of applications that include interconnecting AI clusters, supporting cloud infrastructures, and enhancing hyperscale networking systems. It stands out for its ability to support seamless operation at various data rates, ensuring future-proofing for scaling AI and data center demands. Utilizing this PHY can enable the development of high-performance, optimized solutions that push the boundaries of current technological capabilities.
High-Speed SerDes for Chiplets is engineered to provide exceptional interconnect solutions tailored for chiplet architectures. This product offers ultra-low power consumption while maintaining high data transfer rates, essential for modern multi-die systems. By facilitating rapid communication between chiplets, it enhances overall system efficiency and performance. This SerDes solution is optimized for integration with a range of tech nodes, ensuring compatibility with various semiconductor manufacturing processes. Its design is focused on providing robust data integrity and reducing latency, which are crucial for efficient system operation in complex, integrated circuits. High-Speed SerDes addresses the growing demand for advanced interconnect solutions in chiplet architectures, making it an indispensable tool for developing next-generation semiconductor devices. Its ability to support high data throughput while keeping power use minimal makes it a standout choice in high-performance design environments.
YouSerdes offers a versatile, high-speed serial interface solution supporting a broad range of data rates from 2.5Gbps to 32Gbps. The multi-rate SERDES solution is innovatively designed to incorporate multiple SERDES channels, delivering superior performance, minimized area, and reduced power consumption compared to other competitive products. This solution is ideal for high-speed data transfer applications, delivering reliable performance across various industry standards. Its optimized architecture ensures that designers can achieve maximum throughput, catering to the demanding needs of telecommunication, data center, and consumer electronic applications. Moreover, YouSerdes is crafted to provide a seamless integration experience, backed by comprehensive compatibility with different IC platforms. This adaptability facilitates a smoother system design process, allowing developers to integrate high-speed connectivity into their products efficiently.
The Die-to-Die (D2D) Interconnect from SkyeChip is a finely-tuned solution engineered to knit together multiple dies in sophisticated electronic systems. Leveraging efficient die-to-die technology, this interconnect supports cutting-edge 2.5D and 3D packaging methods and protocols such as PCIe and CXL, thus catering to diverse communication frameworks across die setups. SkyeChip's D2D Interconnect is designed to foster high-speed communication, supporting data transfers up to 32 Gbps per pin, effectively meeting the demands of high-bandwidth applications. Its lightweight architecture minimizes area and power consumption, contributing to the creation of compact and energy-efficient devices. The solution also incorporates test and repair functionalities to maximize post-packaging yields, cementing its role in high-reliability device manufacturing.
MAXVY UCIe VIP , a state-of-the-art solution that offers a comprehensive set of features and capabilities to ensure the quality and performance of your UCIe designs. MAXVY UCIe VIP is fully compliant with UCIe Specification version 1.0 and supports all the layers of the UCIe stack, such as FDI, RDI, LogPHY, PCIe, and CXL protocols. MAXVY UCIe VIP is also very user-friendly and flexible, with simple APIs, easy integrations, and configurable parameters. You can easily customize and control the UCIe functionality according to your needs. MAXVY UCIe VIP also provides a rich set of verification capabilities, such as protocol checks, functional coverage, traffic generation, error injection, and debug tools. You can easily monitor, detect, and report any issues or violations in your UCIe designs. MAXVY UCIe VIP is compatible with the industry-standard Universal Verification Methodology (UVM) and supports all leading simulators. With MAXVY UCIe VIP, very flexible for unit level testing, you can achieve faster verification closure and higher quality of your UCIe designs.
The BlueLynx Chiplet Interconnect system provides an advanced die-to-die connectivity solution designed to meet the demanding needs of diverse packaging configurations. This interconnect solution stands out for its compliance with recognized industry standards like UCIe and BoW, while offering unparalleled customization to fit specific applications and workloads. By enabling seamless connection to on-die buses and Networks-on-Chip (NoCs) through standards such as AMBA, AXI, ACE, and CHI, BlueLynx facilitates faster and cost-effective integration processes. The BlueLynx system is distinguished by its adaptive architecture that maximizes silicon utilization, ensuring high bandwidth along with low latency and power efficiency. Designed for scalability, the system supports a remarkable range of data rates from 2 to 40+ Gb/s, with an impressive bandwidth density of 15+ Tbps/mm. It also provides support for multiple serialization and deserialization ratios, ensuring flexibility for various packaging methods, from 2D to 3D applications. Compatible with numerous process nodes, including today’s most advanced nodes like 3nm and 4nm, BlueLynx offers a progressive pathway for chiplet designers aiming to streamline transitions from traditional SoCs to advanced chiplet architectures.
The CXL 3.0 solution from Rapid Silicon is an advanced Controller IP designed to enhance your FPGA design with superior performance and flexibility. This IP is compliant with CXL specifications up to version 3.0, along with support for earlier versions 2.0, 1.1, and 1.0. It offers seamless integration capabilities with PCIe, standing up to PCIe 6.0 and ensuring backward compatibility. The architecture of the CXL Controller IP is highly configurable, providing adaptability for specific application requirements, including lane configurations, datapath widths, and efficiency in power management. One of the standout features of the CXL 3.0 IP is its support for advanced functionalities such as lane bonding, multicast, and robust error correction mechanisms. These features ensure the IP delivers reliable and efficient performance in diverse environments. Ideal for critical data-intensive tasks, the IP is suited for telecommunications, industrial applications, and more, where data throughput and protocol bridging are crucial. With its focus on delivering unmatched speed, efficiency, and scalability, the CXL 3.0 IP from Rapid Silicon is positioned as a key component for enabling sophisticated FPGA designs tailored to meet modern technology demands. Its architecture is crafted to support the burgeoning needs of applications that require high degrees of data handling and processing accuracy, making it a preferred choice in the semiconductor industry.
The Glasswing Ultra-Short Reach SerDes is a cutting-edge interconnect solution leveraging the unique CNRZ-5 Chord Signaling technology. It is designed to enhance high-bandwidth and low-power performance across chip-to-chip interfaces, optimizing silicon use by lowering pin count while boosting throughput. This innovative technology transmits five bits over six wires, effectively doubling bandwidth and minimizing power requirements. This solution allows the seamless creation of a chiplet ecosystem, facilitating complex connections in high-performance computing environments. Notably, Glasswing delivers significantly higher throughput per pin, alongside lower power consumption compared to traditional NRZ solutions. This feature makes it particularly valuable for applications such as AI, ML, networking, and high-performance computing, where efficiency and throughput are critical. Glasswing excels in modularity and diagnostics, offering dynamic configuration and real-time signal strength monitoring. Its capabilities allow integration into large multi-chip modules with high signal integrity, unlocking potential in fields ranging from satellite communications to consumer electronics. Furthermore, the use of substrate rather than complex silicon interposers reduces cost and complexity, making it a financially attractive option for large-scale projects.
Analog Bits provides robust I/O solutions that are essential for the efficient transfer of signals between semiconductor devices and their external environment. These input/output interfaces are designed to meet the most demanding performance criteria, ensuring fast data rates and minimal signal distortion. Their I/O IP solutions can accommodate a variety of protocols, including high-speed digital interfaces and analog conversions, offering versatility and support for applications such as networking, data processing, and consumer electronics. By optimizing the signal integrity and electromagnetic compatibility, these I/Os enhance the overall system performance. Equipped with advanced features for low power consumption, these I/Os contribute to reducing the overall energy footprint of semiconductor devices, making them ideal for battery-operated devices and environmentally sensitive applications. Analog Bits' I/Os are comprehensively integrated to function seamlessly within mixed-signal environments, further broadening their application range.
The UDP/IP Ethernet core by Enclustra is crafted to facilitate efficient and reliable data communication over Ethernet networks using the User Datagram Protocol (UDP). This IP core is integral for FPGA-based subsystems requiring seamless interconnectivity with other subsystems across network domains. By leveraging the simplicity and low overhead characteristics of UDP, this core ensures high-speed data transfer and is especially suited for applications where performance and simplicity are paramount, such as in embedded systems and networked control systems. It supports the transmission of data across various Ethernet configurations, thereby enhancing the flexibility and scalability of networking components. The core's implementation provides a reliable means of sending and receiving data packets across networks, making it a vital component for developers looking to create connected systems. Its integration into existing FPGA designs is straightforward, enabling quick deployment and consistent communication performance across Ethernet infrastructures.
The "AresCORE UCIe Die-to-Die PHY" by Alphawave Semi represents a leading-edge solution for low-power, low-latency die-to-die connectivity. It is designed to support high-bandwidth links between two dies within the same package, ensuring fast and efficient communication essential for modern microchip architectures. Alphawave's AresCORE PHY is pivotal for applications requiring tight coupling between chiplets, without compromising on energy efficiency or speed. This makes it ideal for emerging applications in high-performance computing and artificial intelligence, where minimizing transmission delay is crucial for performance. Optimized for universal chiplet interconnect, AresCORE supports the latest industry standards, providing flexibility and forward compatibility for evolving technology landscapes. The solution is also characterized by its simple integration into existing architectures, facilitating a smoother transition to advanced chip designs while maximizing the benefits of inter-die communication across complex computing environments.
The JESD204B Multi-Channel PHY from Naneng Microelectronics is designed to meet the rigorous demands of high-speed data transmission. Featuring a data rate capability of up to 12.5Gbps, this physical layer multi-channel interface supports a wide array of applications requiring reliable and efficient data transfer. Its versatile architecture ensures seamless integration into complex systems, providing robust performance benefits in the field of data communications. A comprehensive design enhances usability and flexibility, allowing customization for specific industrial needs. This PHY is particularly adept in high-density environments, ensuring precision synchronization across multiple channels, critical for signal integrity in today's intricate electronic ecosystems. Furthermore, the solution's efficient layout allows for ease of interoperability with existing infrastructure, reducing integration costs and time-to-market for end-users. This makes the JESD204B Multi-Channel PHY an attractive choice for enterprises aiming for optimal performance in digital communication systems without compromising efficiency.
The Chiplet Interface solutions provided by Neuron IP include cutting-edge PHY & D2D Adapter IP for chiplet products. These solutions are built around the latest UCIe v1.1 specification and are designed to support a wide range of application verticals. They are well-known for their unparalleled PPA-differentiated architecture, which includes 32Gbps UCIe-Advanced and Standard cores. These interfaces are set to revolutionize the way microprocessors work in ultra-low latency environments, enhancing both performance and efficiency.
The Regli PCIe Retimer by Kandou AI is a standout solution for high-performance communication in computer systems and data networks. Built to deliver extremely low latency under 10 nanoseconds, this retimer upholds exceptional signal integrity thanks to its ultra-low error rate of 1E-12. Designed for integration into PCIe networks, it supports data transactions at significant speeds, ensuring seamless communication between components. One of the main features of the Regli PCIe Retimer is its versatility in supporting PCIe 5.0 and CXL 2.0 standards, providing bidirectional data lanes capable of speeds up to 32 GT/s. The device is particularly suited for servers, workstations, and other systems requiring pristine data communication over extended distances. It excels within PCIe active cables and large network configurations such as in hyperscale data centers, offering massive data transfer benefits. Security is a top priority for the Regli PCIe Retimer, as it includes robust on-chip diagnostics and secure boot capabilities. Its design simplifies system architectures, providing system designers with flexible options to implement high-speed, reliable networks. With built-in control interfaces and flexible clock modes, this retimer is a dream solution for system architects who value both performance and security.
The VITA 17.1 Serial FPDP Solution from StreamDSP is designed for high-speed data transfer applications. This solution leverages industry-standard interfaces to facilitate efficient serial data communications, ensuring seamless data flow in demanding environments. It's ideal for applications that require robust data integrity and low-latency transmission, making it a perfect fit for military and aerospace operations. By supporting a range of configurations and offering flexibility in integration, this solution helps address specific user needs while maintaining compatibility with widely used FPGA devices.
Photowave optical communications hardware is expertly crafted for the emerging needs of AI memory applications requiring disaggregated resources. Specifically engineered to be compatible with PCIe 5.0/6.0 and CXL 2.0/3.0, Photowave capitalizes on photonics to provide superior latency and energy efficiency. This technology is a game-changer for data centers, offering managers the ability to scale resources flexibly either within individual racks or across multiple server racks, paving the way for more adaptive and powerful data management solutions. By embracing the fundamental strengths of photonics, Photowave empowers large-scale computing systems to achieve previously unattainable levels of efficiency and responsiveness. This optical communication solution ensures seamless integration with state-of-the-art computing infrastructure, thus facilitating the shift towards more intelligent and modular computing environments which underpin the growth of AI-driven applications. The Photowave hardware is meticulously designed to uphold the highest standards in optical communication, ensuring fast data transfer capabilities that drastically reduce latency and improve the overall performance of computing tasks. In environments where swift and reliable data processing is paramount, Photowave stands out as a crucial component, helping optimize technological investments and boost the performance of AI and machine learning workloads.
InnoSilicon's 56G SerDes Solution offers a remarkable balance of high data rates and power efficiency, making it a go-to choice for state-of-the-art digital communication systems. This high-speed serial interface is designed to meet the increasing demand for bandwidth in data-intensive applications, ensuring robust performance in networking and data transmission. This SerDes solution supports multiple protocols, providing versatile usage across different platforms and architectures. It is engineered to handle high-speed data processing, essential for modern telecommunication systems and advanced networking solutions, delivering minimal jitter and power consumption. The solution provides exceptional flexibility in integration, effectively supporting a variety of higher-end systems for optimized data delivery. InnoSilicon has structured this product to aid in the seamless transition of telecommunication infrastructures to newer, more demanding protocols, ensuring future-proofing and long-term viability.
Sofics has verified its TakeCharge ESD protection clamps on technology nodes between 0.25um CMOS down to 3nm across various fabs and foundries. The ESD clamps are silicon and product proven in more than 5000 mass produced IC-products. The cells provide competitive advantage through improved yield, reduced silicon footprint and enable low-leakage, high-speed or high voltage tolerant interfaces. The ESD protection described in this document can be used for 1.6V chiplet (die-2-die) interface pads in the GF 22nm FDX technology. The ESD robustness is strongly reduced in order to reduce the size and capacitance.
StreamDSP's VITA 17.3 Serial FPDP Gen3 Solution is an advanced high-speed communication framework designed to meet the latest standards in data transfer technology. This solution offers improved data throughput and enhanced interoperability with existing systems, making it an invaluable asset for applications demanding the utmost precision and speed. Leveraging enhanced protocol designs, this IP solution integrates seamlessly with a broad array of FPGA platforms, providing users with unmatched performance and reliability in critical data communication setups. This makes it indispensable for applications in fields such as defense, scientific research, and real-time data processing.
Aragio's LVDS solutions are tailored for high-speed data transmission up to 1 GHz for drivers and 1.2 GHz for receivers. Designed to meet the LVDS standard, the offering includes a CML interface to the core and power-up sequence independence. The solution provides flexibility with both 50Ω and 100Ω termination options, tailored to provide low power consumption while maintaining high performance. These features make it suitable for diverse high-speed data applications, ensuring reliability and energy efficiency.
DapTechnology's FireCore is a suite of PHY and Link Layer solutions, meticulously crafted for the IEEE-1394 and AS5643 interfaces. These products are engineered to push beyond standard limitations, supporting data transmission speeds from S100 to S3200. FireCore integrates seamlessly into various systems, extensively tested within DapTechnology's FireSpy analyzers, setting a new standard for data capture and analytical precision in high-speed environments. Each FireCore product is built to meet distinct IEEE-1394b-2008 and AS5643 requirements, with customization options that cater to specific project needs. The Link and PHY layers provide sophisticated features like bit error injection and testing, allowing for precise monitoring and quality assurance in data transmission. This flexibility ensures that FireCore solutions are suited for cutting-edge applications, meeting the rigorous demands of modern avionics. Beyond performance, FireCore focuses on ease of integration, providing configurable host interfaces and robust data processing features. These capabilities facilitate streamlined data management, supporting high-level test and integration systems necessary for defense and aerospace industries. The suite represents DapTechnology’s ongoing commitment to advancing IEEE-1394 and AS5643 technologies through groundbreaking solutions that anticipate the future needs of these sectors.
The innovative SerDes product encompasses a versatile range of high-speed data transmission standards such as PCIe 6.0 to 2.0, RapidIO, SATA, SAS, JESD204B/204C, USB3.1, LVDS, and MIPI C/D PHY. It's precisely designed for applications requiring low power consumption and exceptional performance. The flexibility of this product lies in its architecture, allowing tight integration with user logic or SOC. Its configurable nature ensures adaptability across diverse electronic systems, facilitating seamless data exchange. The use of cutting-edge techniques ensures it meets the rigorous demands of modern high-speed connectivity applications. From enhancing network communication infrastructures to powering advanced data storage solutions, this offering plays a crucial role in numerous sectors.
The APIX3 Transmitter and Receiver Modules represent the pinnacle of automotive data communication, offering superior bandwidth and versatility for in-car network architectures. Capable of handling up to 12Gbps with quad twisted pair connections, APIX3 supports Ultra High Definition video resolutions across multiple channels concurrently. These modules also feature robust diagnostic and cable monitoring capabilities, ensuring uninterrupted operation and ease of maintenance in automotive environments.
The 10GBASE-KR Ethernet IP is crafted to meet the needs of backplane Ethernet networking, offering a reliable solution for 10Gbps data transmission over a wide variety of network conditions. This IP ensures compliance with the 10GBASE-KR standard, supporting adaptive equalization to maintain data integrity across diverse cable lengths and network architectures. Optimized for high-performance and low-latency operation, it is suited for enterprise networking environments where data integrity and speed are paramount. Whether deployed within data centers or integrated into high-end routers and switches, this IP addresses the critical demands of modern Ethernet packets. Featuring advanced signal conditioning techniques, the 10GBASE-KR Ethernet IP provides flexible configuration options and is built to be compatible across a range of existing infrastructure, ensuring smooth deployment and high interoperability with other network components.
The LineSpeed FLEX Family offers a comprehensive suite of 100G PHY products specialized in various advanced functionalities like retimer, gearbox, multiplexing, and redundant link functions. These IPs are particularly suitable for integration on line cards or within modules, supporting data exchange rates of 10G, 25G, and 100G. Key features include on-chip 100G RS-FEC for both gearbox and retimer applications, providing substantial error correction capabilities and ensuring robust data transmission over extended distances. The Multi-Link Gearbox feature of the family facilitates high-density 10GbE aggregation and enables effective handling of mixed port speeds through its independent protocol capabilities. Designed with a common register structure and pin-compatible package options, the LineSpeed FLEX Family accommodates diverse use cases in Ethernet infrastructure and serial link schemes. It is ideal for configurations that benefit from enhanced performance, such as high-reliability data transfer frameworks in next-generation network setups.
The UCIe Chiplet Interconnect from InnoSilicon is at the forefront of chip-to-chip connectivity solutions, designed to meet the demands of high-performance computing systems. By providing a robust interconnection method between various chiplets, this product ensures seamless data transfer and communication within system-on-chip (SoC) structures. With its cutting-edge design, the UCIe Chiplet Interconnect significantly enhances data throughput between interconnected components, making it a crucial component in multi-chip systems like CPUs and GPUs. The intricate architecture supports reduced latency and optimized performance, contributing to the efficiency of next-generation computing environments. InnoSilicon’s UCIe solution is known for its versatility and compatibility with existing systems, offering flexible integration options tailored to specific needs. This adaptability, coupled with its high-performance capabilities, makes the UCIe Chiplet Interconnect an essential resource for industries pushing the boundaries of modern computing.
Actt's SerDes solution supports a range of interface protocols including USB, PCIe, and SATA, designed to meet a spectrum of communication needs for high-speed data transfer. This high-performance IP is well-suited for integrating into systems where power and space constraints are critical. The SerDes IP ensures reliable data transfer across different platforms, making it ideal for data centers, network infrastructure, and high-performance computing systems. With its compact design and robust functionality, it effectively meets the demand for high-speed interconnectivity in modern electronics.
The Wormhole series from Tenstorrent is specifically engineered to elevate AI processing through its unique Tensix architecture, featuring extensive scalability and flexibility. With a focus on high-speed data handling, Wormhole products enable developers to optimize the performance of AI workloads significantly. The architectural design supports seamless interoperability, enhancing the exchange and management of data across various computing units. Wormhole’s architecture is built to cater to the critical requirements of modern AI applications. Leveraging the power of RISC-V cores, these products offer sophisticated data processing capabilities that can adapt dynamically to the challenging demands of AI. The Wormhole series facilitates a robust computational framework that is ideal for both single-user and multi-user environments, ensuring a balanced distribution of processing tasks without compromising on efficiency. The high-bandwidth mesh topology integrated within Wormhole IP allows for expansive memory pooling and resource allocation, making it particularly advantageous for deep learning models and applications that necessitate substantial computational power. This feature holds significant benefits in data-rich environments, particularly in autonomous systems and advanced robotics where real-time processing is pivotal. By aligning seamlessly with Tenstorrent's open-source software ecosystem, Wormhole ensures that developers can manage and optimize their implementations freely. It's designed for integration into a wide range of systems, providing the versatility needed for specialized AI interventions and expansive computational tasks.
Arkville is a formidable FPGA Gen5 PCIe DMA IP solution engineered to facilitate seamless data transfer between FPGA logic and host memory at remarkable speeds of up to 60 GBytes/s (480 Gbps) bidirectionally. This high-efficiency conduit substantially reduces CPU core utilization, obliterates the need for memory copies, and ultimately refines overall system efficiency. The IP core supports widespread industry-standard APIs for zero-copy user space memory handling, catering extensively to both hardware and software engineers involved in data production and consumption. This advanced data mover offers trusted and reliable PCIe DMA offload capabilities, facilitating rapid market deployment of FPGA-based packet processing solutions. By embracing modern standards such as DPDK and AXI, Arkville ensures compatibility across a broad spectrum of use cases. Vendor agnostic in its RTL support, Arkville caters to both Intel/PSG and AMD/Xilinx FPGA devices, further extending its versatility. Beyond its intrinsic features, the Arkville solution comes with a comprehensive suite of example designs, providing users with a solid foundation upon which they can build customized solutions. These examples showcase various network configurations, from multi-port scenarios to high-speed single-port operations, highlighting Arkville's adaptability to evolving packet processing requirements.
ChipBridge facilitates AXI4 protocol communication, extending it to external FPGAs for improved peripheral management. The simplicity of using only two signal pairs for connectivity allows for efficient use of space and resources, making it well-suited for complex systems looking to separate control and processing logic across chips. This IP enables seamless integration with various FPGA families, offering flexible and scalable system design options for high-performance applications that demand robust connectivity solutions without comprising on speed or efficiency.
The 5G ORAN Base Station is set to redefine the landscape of mobile networking, vastly enhancing wireless data capacity and paving the way for innovative wireless applications. This product is designed to augment connectivity in both urban and rural settings, offering robust data handling capabilities and superior performance. By incorporating open RAN technology, it facilitates interoperability and vendor-neutral platforms, promoting innovation and flexibility. This cutting-edge base station supports a plethora of applications, allowing service providers to deliver high-speed 5G connectivity tailored to specific client needs. Its advanced architecture ensures seamless integration with existing network infrastructure, streamlining the adoption of next-gen technologies. Furthermore, the base station boasts energy-efficient design principles, presenting a sustainable option for expanding mobile broadband offerings. With its modular design, the 5G ORAN Base Station is versatile and scalable, suiting a range of deployment scenarios, from dense urban centers to remote and underserved areas. The inclusion of open interface standards accelerates innovation and reduces deployment costs, offering an optimal solution for service providers aiming to maximize their 5G network investments.
Alphawave Semi's "GammaCORE UCIe Die-to-Die Controller" is a sophisticated controller IP solution implementing the latest UCIe 2.0 specification. This controller is designed to manage extensive data transmission needs across dies situated within the same package, effectively supporting UCIe streaming protocol applications. Leveraging customizable architecture, GammaCORE ensures optimal performance by adapting to specific application requirements, offering low latency and efficient data flow management. It provides dynamic configurations to maintain performance across varying conditions, adaptable to a wide range of data-intensive environments. This controller serves critical roles in applications like AI and HPC that require synchronized data exchange between chiplets, ensuring seamless interoperability across diverse technological infrastructures. Its robust architecture supports the intricate demands of modern system-on-chip designs, placing it at the heart of innovative chiplet-based systems.
The Universal Chiplet Interconnect Express (UCIe) offers a transformative approach to inter-chiplet communication, designed to elevate chiplet-based system designs. This interconnect facilitates high-speed, low-latency links crucial for the efficient operating of chiplets in sophisticated computing environments. With support for versions 1.x and 2.x, UCIe ensures robust connection integrity, offering bandwidths up to 32 Gbps. It is engineered for high scalability, supporting extensive chiplet configurations needed in next-gen processors and server designs. UCIe's architecture promotes seamless integration into complex system setups, enhancing performance in high-demand areas such as AI processing, server applications, and large-scale parallel computing systems.
Designed to enhance the modularity and flexibility of data center architecture, the Switch and Endpoint Adapter for CXL Fabric enables seamless connectivity and data flow within a CXL fabric network. It is engineered to support high-speed data transfers and robust network communication, enhancing the interconnection of various computational resources. This technology is critical in developing scalable data center environments, allowing for significant improvements in data throughput and system responsiveness, which are crucial for the efficient handling of complex workloads.
The Network Attached Memory System is designed for optimizing memory allocation in server architectures. By pooling memory resources across different servers, it maximizes memory utilization and minimizes wastage. This system significantly aids in addressing the challenges of stranded memory, providing a dynamic solution that adapits to demanding computational tasks. Enhanced memory sharing allows for improved performance in processing large datasets, ideal for enterprises seeking to optimize cost and efficiency by leveraging shared memory capacities.
The Die-to-Die (2.5D/3D) interface by Global Unichip Corp. (GUC) is engineered to facilitate inter-die communication across vertical and horizontal planes within an integrated system. This interface accommodates high bandwidth data transfer between dies, essential for modern multi-die package configurations. Ideal for applications that require complex integration of multiple silicon dies, it simplifies the architecture of advanced systems. Supporting both 2.5D and 3D packaging technologies, this product is designed to deliver optimal performance by reducing latency and power consumption. It enables seamless connectivity between dies through advanced interconnect techniques, ensuring that data is transmitted efficiently across the entire system. These features are particularly beneficial in maximizing computational resources in AI and high-performance computing environments. The advanced technology used in GUC’s Die-to-Die interface ensures robust data integrity while maintaining low power usage. With its capability to support a variety of package configurations, this solution is pivotal in advancing semiconductor technologies that require efficient inter-die connectivity. As industries continue to leverage multi-die systems, the Die-to-Die (2.5D/3D) interface remains integral to optimizing performance and energy efficiency across semiconductor applications.
The Aurora 8B/10B IP Core is a versatile serial protocol core that supports up to 6.6 Gbps per lane, providing an efficient solution for inter-FPGA communication or as an alternative to high-speed serial interfaces like PCI Express. This IP is compatible with various FPGA vendors, ensuring broad interoperability and application flexibility. It offers low latency and reliable data integrity through robust error-checking mechanisms, making it ideal for high-performance applications that require stable, fast data transfer, such as in telecommunications and high-speed computing.
The Aurora 64B/66B IP Core supports high-speed serial communication protocols, serving as a reliable link for chip-to-chip and board-to-board data transmission. Its compact design allows for efficient use of resources, making it suitable for demanding applications across multiple FPGA platforms and even ASIC implementations. The core is engineered to maintain high throughput and low latency, essential for applications like video data transfer or high-speed networking, due to its 97% bandwidth efficiency compared to other standards. Additionally, it ensures compatibility with Xilinx Aurora cores, allowing seamless integration in existing setups.
Designed to fulfill PCI-SIG’s stringent requirements, Atria Logic’s PCIe Gen1/2 PHY efficiently handles data communication over PCIe links. Supporting dual data speeds, this PHY core integrates seamlessly through a configurable PIPE interface and adheres closely to IEEE standards. Its minimal gate count architecture maximizes efficiency, making it a critical component in systems that necessitate rapid and stable data transfers. From high-performance computing to seamless device interconnection, this PHY ensures consistent performance and reliable execution across a spectrum of embedded applications.
The NVMe Validation Test Suite from Atria Logic provides a comprehensive suite for validating NVMe Controllers in post-silicon testing environments. It's structured to ensure complete compliance with UNH_IOL standards while offering additional test features, fostering an environment of reliability and performance verification. Compatible with Linux-based systems, this test suite enhances the design confidence and efficiency, enabling simulation and emulation environments to iteratively test NVMe functionalities seamlessly supported across multiple embedded systems. The tailored suite allows developers to extend NVMe testing capabilities with unparalleled ease.
GUC's 32G UCIe PHY is a high-performance physical layer interface designed to support exceptionally fast data transfer rates across semiconductor devices. Built for UCIe (Universal Chiplet Interconnect Express) technology, this PHY facilitates seamless communication between different chiplets in a shared infrastructure, fostering interoperable integration of heterogeneous components. This PHY is meticulously crafted to handle data rates of up to 32 Gbps, supporting various high-speed interfaces commonly found in data-intensive applications. Its robust architecture ensures low power consumption while maintaining optimal signal integrity and reliability, crucial for deployments in high-performance computing and networking equipment. As chiplet-based designs gain prominence, the 32G UCIe PHY stands out by enabling designers to break down traditional monolithic system designs into flexible, chiplet-based architectures. GUC’s solution is engineered to optimize the interface’s power efficiency and data throughput, catering to the evolving needs of semiconductor technology and helping drive future computing innovations.
The Truechip PCIe Gen4 Controller offers comprehensive support for the PCI Express 4.0 specification, enabling high-speed data transfer with enhanced performance features. It is designed to meet the growing demands for high-bandwidth connections in advanced computing and networking systems. Supporting multiple data lanes and backward compatibility with previous PCIe versions, this controller provides a flexible connectivity solution. Key attributes include advanced error correction techniques, lane equalization features, and enhanced data integrity measures, critical for maintaining top-tier performance in complex setups. Truechip's PCIe Gen4 Controller is ideal for integration into applications that require rapid data interchange, like high-performance computing and data-intensive tasks. Its robust architecture supports scalability and adaptability, ensuring seamless integration into evolving system designs.
The Die-to-Die (2.5D/3D) Interface is an advanced solution designed to facilitate seamless interaction between multiple die in an integrated system. This product caters to the growing industry need for high-bandwidth, low-latency connections in complex multi-die configurations found in modern computing systems. Supporting communicative bandwidth while minimizing power consumption, this interface is engineered for applications requiring high-speed interconnects across 2.5D and 3D package structures. It transforms traditional system integrations by offering superior scalability, accommodating the burgeoning complexity of data management in edge computing, AI, and high-performance data centers. With a commitment to enhancing system connectivity, this interface allows for efficient power management and signal integrity, which are essential for maintaining performance standards in high-demand environments. The Die-to-Die (2.5D/3D) Interface paves the way for innovative semiconductor designs, enabling efficient and flexible advancements in technology integration.
This library is a production-quality, silicon-proven custom Die-to-Die high speed interface available in TSMC’s 16nm process. The I/O cell is bidirectional, has two modes of operation: standard full rail to rail swing, or a custom low noise pseudo-differential interface. The RX cells have a weak pull-down feature.
The Omega Fabric by IntelliProp is a breakthrough solution to enable composable data center infrastructure. This advanced architecture provides scalable connectivity and data integration across a variety of computational resources. With its robust framework, the Omega Fabric facilitates optimal resource allocation, improving system efficiency and adaptability to emerging technologies. This is crucial for enterprises aiming to advance their AI and hyperscale capabilities, ensuring seamless data processing and management across multiple platforms.
Designed to enhance server capabilities, the CXL Host Adapter provides critical expansion facilities for memory and processing resources. By leveraging CXL technology, it ensures efficient communication between CPUs and memory, greatly improving data throughput and system performance. This adaptor serves as a vital component for modern data centers tasked with accommodating large-scale AI applications and other data-intensive processes, offering adaptable and high-performance solutions for evolving computational demands.
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