All IPs > Interface Controller & PHY > D2D
Device-to-Device (D2D) communication is a critical component in modern electronics, enabling direct interaction between devices without intermediary network infrastructure. Within our Interface Controller & PHY category, the D2D segment offers specialized semiconductor IPs designed to streamline and enhance these direct connections. These IPs are indispensable in creating an efficient communication link that can handle the increasing data demands seen in consumer electronics, automotive systems, and IoT devices.
Our D2D semiconductor IPs consist of essential building blocks such as interface controllers and Physical Layer (PHY) IP cores. These components are engineered to facilitate seamless communication between devices, whether it be for transferring data, synchronizing functions, or sharing resources in real-time. By leveraging these IPs, manufacturers can achieve low latency, high-speed data transfer, and robust connectivity, making these components suitable for applications requiring precise and rapid interaction.
Incorporating D2D IPs into your design allows for efficient use of bandwidth and power, critical factors in battery-operated or compact devices. The versatility of these semiconductor IPs makes them a popular choice in developing smart home devices, wearables, and vehicle infotainment systems, where direct and reliable device-to-device communication is paramount. These IPs also help minimize reliance on external network structures, providing a more secure and localized network environment.
The D2D interface controller and PHY IPs in our collection are developed to cater to the demanding needs of modern technological solutions. Whether you are designing a new IoT ecosystem or enhancing an automobile's connectivity suite, selecting the right D2D IP core can significantly impact your product’s performance and user experience. Explore our offerings to find the IP solutions that best align with your innovation goals, ensuring your devices communicate effectively and efficiently.
Panmnesia's CXL 3.1 Switch is an integral component designed to facilitate high-speed, low-latency data transfers across multiple connected devices. It is architected to manage resource allocation seamlessly in AI and high-performance computing environments, supporting broad bandwidth, robust data throughput, and efficient power consumption, creating a cohesive foundation for scalable AI infrastructures. Its integration with advanced protocols ensures high system compatibility.
The NuLink Die-to-Die PHY for Standard Packaging represents Eliyan's cornerstone technology, engineered to harness the power of standard packaging for die-to-die interconnects. This technology circumvents the limitations of advanced packaging by providing superior performance and power efficiencies traditionally associated only with high-end solutions. Designed to support multiple standards, such as UCIe and BoW, the NuLink D2D PHY is an ideal solution for applications requiring high bandwidth and low latency without the cost and complexity of silicon interposers or silicon bridges. In practical terms, the NuLink D2D PHY enables chiplets to achieve unprecedented bandwidth and power efficiency, allowing for increased flexibility in chiplet configurations. It supports a diverse range of substrates, providing advantages in thermal management, production cycle, and cost-effectiveness. The technology's ability to split a Network on Chip (NoC) across multiple chiplets, while maintaining performance integrity, makes it invaluable in ASIC designs. Eliyan's NuLink D2D PHY is particularly beneficial for systems requiring physical separation between high-performance ASICs and heat-sensitive components. By delivering interposer-like bandwidth and power in standard organic or laminate packages, this product ensures optimal system performance across varied applications, including those in AI, data processing, and high-speed computing.
The CT25205 digital core serves as a comprehensive solution for implementing the IEEE 802.3cg® 10BASE-T1S Ethernet Physical Layer. Crafted in Verilog 2005 HDL, this synthesizable core adapts elegantly to standard cells and FPGA environments. It incorporates critical components like the PMA, PCS, and PLCA Reconciliation Sublayer, working seamlessly with any Ethernet MAC conforming to the IEEE CSMA/CD standards using the MII interface. A unique feature of CT25205 is its integrated PLCA RS, which enables existing MAC devices to access PLCA functionalities without further hardware modifications. This digital core also features connectivity with a standard OPEN Alliance 10BASE-T1S PMD interface, making it pivotal in enhancing communication for Zonal Gateway SoCs and MCUs that demand advanced 10BASE-T1S capabilities.
Brite Semiconductor's YouSerdes provides a flexible solution of multi-speed SERDES IP with rates ranging from 2.5 Gbps to 32 Gbps. This offering is characterized by its smooth integration of multiple SERDES channels, ensuring high performance, efficiency, and low power consumption.<br><br>The technology is engineered to offer excellent connectivity solutions, making it ideal for applications that require precise and high-speed data transfer. Its compact and efficient design positions it favorably against other products in the market, providing a balance of speed and area utilization.<br><br>YouSerdes stands out for its adaptability and compatibility, meeting the needs of a range of applications including telecommunication networks and data centers where reliable, high-speed data processing is crucial.
Brite Semiconductor's YouSerdes provides a flexible solution of multi-speed SERDES IP with rates ranging from 2.5 Gbps to 32 Gbps. This offering is characterized by its smooth integration of multiple SERDES channels, ensuring high performance, efficiency, and low power consumption.<br><br>The technology is engineered to offer excellent connectivity solutions, making it ideal for applications that require precise and high-speed data transfer. Its compact and efficient design positions it favorably against other products in the market, providing a balance of speed and area utilization.<br><br>YouSerdes stands out for its adaptability and compatibility, meeting the needs of a range of applications including telecommunication networks and data centers where reliable, high-speed data processing is crucial.
The ePHY-5616 delivers data rates from 1 to 56Gbps across technology nodes of 16nm and 12nm. Designed for a diverse range of applications, this product offers superior BER and low latency, making it ideal for enterprise equipment like routers, switches, and network interface cards. The ePHY-5616 employs a highly configurable DSP-based receiver architecture designed to manage various insertion loss scenarios, from 10dB up to over 35dB. This ensures robust and reliable data transfer across multiple setups.
MAXVY UCIe VIP , a state-of-the-art solution that offers a comprehensive set of features and capabilities to ensure the quality and performance of your UCIe designs. MAXVY UCIe VIP is fully compliant with UCIe Specification version 1.0 and supports all the layers of the UCIe stack, such as FDI, RDI, LogPHY, PCIe, and CXL protocols. MAXVY UCIe VIP is also very user-friendly and flexible, with simple APIs, easy integrations, and configurable parameters. You can easily customize and control the UCIe functionality according to your needs. MAXVY UCIe VIP also provides a rich set of verification capabilities, such as protocol checks, functional coverage, traffic generation, error injection, and debug tools. You can easily monitor, detect, and report any issues or violations in your UCIe designs. MAXVY UCIe VIP is compatible with the industry-standard Universal Verification Methodology (UVM) and supports all leading simulators. With MAXVY UCIe VIP, very flexible for unit level testing, you can achieve faster verification closure and higher quality of your UCIe designs.
The Universal Chiplet Interconnect Express (UCIe) by EXTOLL presents a forward-thinking solution for seamless connectivity in chiplet applications. This interconnect technology is tailored to integrate multiple chiplets into one cohesive system, enabling efficient communication pathways within heterogeneous integrations. Highlighted by its robust design, the UCIe stands out in providing ultra-fast transfer rates while significantly reducing latency, a crucial factor for next-gen computing systems that rely on rapid and reliable data exchange. Designed for compatibility with contemporary fabrication technologies, it supports tech nodes typically used in the semiconductor industry. The architectural design of UCIe facilitates the efficient construction of chiplet-based platforms, thereby driving advancements in scalability and flexibility for computing environments. As industries push towards integrating various functionalities on a single system, EXTOLL’s UCIe offers the interconnect solution that meets these complex requirements.
The High-Speed SerDes from EXTOLL is an essential component in facilitating chiplet-based designs, offering an advanced solution for data transmission. This SerDes is engineered to provide high-speed data communication necessary for modern computing systems, making it an integral part of system on chip (SoC) architectures. In addition to supporting rapid data transfer between chiplets, it also ensures compatibility with various tech nodes. Designed for ultra-low power consumption, EXTOLL’s High-Speed SerDes utilizes a unique digital-centric architecture. This ensures the component not only supports swift data rates but also optimizes energy efficiency and cost-effectiveness. By delivering high-performance results while minimizing power usage, it meets the critical demands of modern electronic designs. The SerDes is suitable for a variety of applications, especially those requiring rapid signal transfers in compact designs. Its integration capabilities are further enhanced by its architectural compatibility with a range of standard process nodes, including 12nm through 28nm. These features make EXTOLL’s SerDes a leading choice for companies looking to enhance their chiplet technology.
The Die-to-Die (D2D) Interconnect by SkyeChip provides a lightweight and efficient solution for die-to-die communication, adhering to the UCIe 2.0 specification. It supports high data transfer rates up to 32 Gbps per pin, offering unprecedented bandwidth efficiency. This interconnect is adaptable to various communication protocols and offers built-in functionality for link initialization and testing, ensuring optimal performance and yield in IC manufacturing.
APIX3 represents the third-generation transmission technology developed by INOVA, targeted at enhancing infotainment and cockpit architectures in vehicles. This series features transmitters and receivers that can handle multiple ultra-high-definition (UHD) video streams and Ethernet communication over shielded twisted pairs or quad twisted pairs. APIX3 is uniquely positioned to meet the demands of high bandwidth automotive applications, supporting data rates of up to 6 Gbps on a single shielded cable and reaching up to 12 Gbps on quad twisted pair connections. This improved bandwidth allows for seamless transmission of multiple video and data channels, crucial for the sophisticated display systems used in modern vehicles. The technology also emphasizes diagnostic capabilities, including cable monitoring for preemptive maintenance, enhancing the reliability and longevity of the overall system. Its backward compatibility with APIX2 ensures a smooth transition and integration into existing setups, making it a flexible and future-proof solution for automotive manufacturers.
The BlueLynx Chiplet Interconnect is a sophisticated die-to-die interconnect solution that offers industry-leading performance and flexibility for both advanced and conventional packaging applications. As an adaptable subsystem, BlueLynx supports the integration of Universal Chiplet Interconnect Express (UCIe) as well as Bunch of Wires (BoW) standards, facilitating high bandwidth capabilities essential for contemporary chip designs.\n\nBlueLynx IP emphasizes seamless connectivity to on-die buses and network-on-chip (NoCs) using standards such as AMBA, AXI, and ACE among others, thereby accelerating the design process from system-on-chip (SoC) architectures to chiplet-based designs. This innovative approach not only allows for faster deployment but also mitigates development risks through a predictable and silicon-friendly design process with comprehensive support for rapid first-pass silicon success.\n\nWith BlueLynx, designers can take advantage of a highly optimized performance per watt, offering customizable configurations tailored to specific application needs across various markets like AI, high-performance computing, and mobile technologies. The IP is crafted to deliver outstanding bandwidth density and energy efficiency, bridging the requirements of advanced nodal technologies with compatibility across several foundries, ensuring extensive applicability and cost-effectiveness for diverse semiconductor solutions.
The CXL 3.0 solution from Rapid Silicon is an advanced Controller IP designed to enhance your FPGA design with superior performance and flexibility. This IP is compliant with CXL specifications up to version 3.0, along with support for earlier versions 2.0, 1.1, and 1.0. It offers seamless integration capabilities with PCIe, standing up to PCIe 6.0 and ensuring backward compatibility. The architecture of the CXL Controller IP is highly configurable, providing adaptability for specific application requirements, including lane configurations, datapath widths, and efficiency in power management. One of the standout features of the CXL 3.0 IP is its support for advanced functionalities such as lane bonding, multicast, and robust error correction mechanisms. These features ensure the IP delivers reliable and efficient performance in diverse environments. Ideal for critical data-intensive tasks, the IP is suited for telecommunications, industrial applications, and more, where data throughput and protocol bridging are crucial. With its focus on delivering unmatched speed, efficiency, and scalability, the CXL 3.0 IP from Rapid Silicon is positioned as a key component for enabling sophisticated FPGA designs tailored to meet modern technology demands. Its architecture is crafted to support the burgeoning needs of applications that require high degrees of data handling and processing accuracy, making it a preferred choice in the semiconductor industry.
Capable of handling data rates from 1 to 112Gbps, the ePHY-11207 is a powerful solution designed for 7nm node technologies. It is specifically tailored for environments requiring ultra-low latency and robust error correction capabilities, making it a perfect fit for high-performance data center and 5G network applications. The ePHY-11207 integrates an advanced DSP-based receiver that ensures adaptability to various signaling conditions and insertion loss scenarios, therefore boosting operational reliability across complex systems.
Designed to revolutionize AI-driven data centers, the Photowave Optical Communications Hardware capitalizes on the inherent advantages of photonics. With capabilities that support PCIe 5.0/6.0 and CXL 2.0/3.0, this hardware facilitates enhanced scalability of AI memory applications within data centers. The technology provides significant latency reduction and energy efficiency, allowing for more effective resource allocation across server racks, which is a crucial feature for modern data infrastructure. The Photowave hardware serves the evolving needs of data-driven applications, ensuring seamless integration and performance boosts in environments demanding high-speed data transfer and processing. By addressing the latency and power efficiency concerns prevalent in traditional electronics, it is integral in the transition towards faster, more sustainable data center operations. Incorporating these photonic advantages, Photowave stands as a testament to Lightelligence’s goal of transforming data operations and enhancing the utility of AI technologies. Its role in this ecosystem is vital, making it a cornerstone product for entities looking to modernize their computational frameworks.
StreamDSP's VITA 17.3 Serial FPDP Gen3 Solution is an advanced high-speed communication framework designed to meet the latest standards in data transfer technology. This solution offers improved data throughput and enhanced interoperability with existing systems, making it an invaluable asset for applications demanding the utmost precision and speed. Leveraging enhanced protocol designs, this IP solution integrates seamlessly with a broad array of FPGA platforms, providing users with unmatched performance and reliability in critical data communication setups. This makes it indispensable for applications in fields such as defense, scientific research, and real-time data processing.
The JESD204B Multi-Channel PHY is a versatile high-speed data interface designed to handle numerous channels simultaneously. Its architecture supports top speeds reaching 12.5Gbps, which is crucial in applications where data transfer efficiency and reliability are paramount. This technology is often employed in systems requiring high bandwidth and precision synchronization, making it ideal for advanced communication networks and high-resolution broadcasting environments. This product stands out for its capacity to neatly integrate with various semiconductor processes, ensuring seamless compatibility and broad functionality. Whether in complex signal processing or high-speed data acquisition contexts, it provides the necessary infrastructure to maintain robust data transmission with minimal latency and power consumption. Moreover, the JESD204B Multi-Channel PHY is designed to support multiple serial data rates, offering great flexibility to developers working within diverse technology applications. Its comprehensive design ensures that it meets the standards of modern digital systems, helping to push the envelope of data-transfer capabilities in state-of-the-art technological infrastructures.
The Chiplet Interface solutions provided by Neuron IP include cutting-edge PHY & D2D Adapter IP for chiplet products. These solutions are built around the latest UCIe v1.1 specification and are designed to support a wide range of application verticals. They are well-known for their unparalleled PPA-differentiated architecture, which includes 32Gbps UCIe-Advanced and Standard cores. These interfaces are set to revolutionize the way microprocessors work in ultra-low latency environments, enhancing both performance and efficiency.
The UDP/IP Ethernet IP Core by Enclustra is tailored for seamless FPGA-based Ethernet communication. Operating at full gigabit speeds, it blends easily with user logic while maintaining compatibility with various media independent interfaces like MII, RMII, and GMII. This core handles UDP, IPv4, and Ethernet layer processing, offering selective header field management for optimal data handling. Ideal for applications needing robust, high-speed network communication, its compact design ensures minimal resource usage on the FPGA.
The N5186A MXG Vector Signal Generator is designed to deliver advanced RF and microwave signal simulations. It features superior spectral purity and a wide frequency range, making it ideal for demanding applications in wireless communication testing. Its architecture supports both traditional RF synthesis and faster signal processing, providing exceptional output power and dynamic range. With its highly agile and flexible design, the N5186A offers precise signal creation capabilities, enabling comprehensive testing scenarios. The generator accommodates complex signal environments, essential for evaluating performance standards of modern communications hardware. Engineers use this tool to verify the integrity and performance under real-world conditions, a critical component of product validation. Moreover, the N5186A is equipped with customizable modulation capabilities, which are crucial for diverse signal generation requirements in R&D and manufacturing. This adaptability ensures that engineers can meet specific test criteria, providing a robust framework for exploring both current and next-generation wireless applications.
The 56G SerDes Solution by InnoSilicon is tailored for high-speed data transfer applications across a variety of protocols. This component is integral to facilitating data exchange over PCIe, RapidIO, and Ethernet connections, reinforcing its centrality in modern computing environments. The solution is designed to support data rates of up to 56 Gbps per lane, making it ideal for bandwidth-intensive tasks. Its architecture ensures energy-efficient performance while maintaining high throughput, making it particularly valuable in data-intensive environments like data centers and telecommunications. The 56G SerDes delivers reliable performance with enhanced signal integrity, addressing the challenges of maintaining speed and efficiency in high-frequency operations. Incorporating this SerDes solution allows developers to create systems with accelerated data handling capabilities while maintaining compact design principles. It is an essential part of any system architecture where maximizing data throughput and minimizing latency are critical needs.
The ePHY-5607 stands out for its PPA-optimized configuration, offering data rates from 1 to 56Gbps targeting the 7nm technology node. This IP is engineered for data center applications including routers, switches, and AI storage solutions. With an emphasis on superior BER and robust clock data recovery, the ePHY-5607 ensures efficient handling of high-speed data traffic. This product's distinctive feature set includes rapid temperature tracking and multi-reference clock configurations, which provide enhanced adaptability in fluctuating environments.
The VITA 17.1 Serial FPDP Solution from StreamDSP is designed for high-speed data transfer applications. This solution leverages industry-standard interfaces to facilitate efficient serial data communications, ensuring seamless data flow in demanding environments. It's ideal for applications that require robust data integrity and low-latency transmission, making it a perfect fit for military and aerospace operations. By supporting a range of configurations and offering flexibility in integration, this solution helps address specific user needs while maintaining compatibility with widely used FPGA devices.
DapTechnology's FireCore solutions offer sophisticated support for both PHY and Link Layer functionalities of the IEEE-1394b-2008 and AS5643 standards. Engineered for adaptability, these solutions integrate seamlessly into various FPGA families, supporting custom configurations tailored to specific operational requirements. FireCore was developed to handle transmission speeds from S100 to S3200, ensuring high performance across numerous industrial contexts. A notable feature of FireCore solutions is their customizable nature, allowing for precise adaptation to unique system needs. This flexibility extends to the configuration of PHY ports, host interface compatibility, as well as advanced error monitoring capabilities. The solutions also include key enhancements for real-time data handling such as Bit Error Injection and Bit Error Rate Testing. The robust configuration options offered by FireCore ensure that users can effectively streamline data encapsulation and transmission processes, minimizing latency and maximizing data integrity. These solutions are particularly valuable for users aiming to expedite their data processing capabilities while maintaining rigorous compliance with industry standards.
The Interconnect Generator offers a robust, protocol-agnostic solution for developing sophisticated bus interconnects. Supporting both AXI and OCP Master/Slave configurations, it can be customized as simple, pipelined, or crossbar structures. Designed to handle both atomic requests and response transactions, it provides a versatile foundation for implementing inter-device communications. Key features include a built-in reorder buffer with configurable depth, enabling multiple outstanding requests while ensuring data delivery remains orderly. This flexibility makes it suitable for various applications, from simple device communication to complex data transactions that require precise data alignment and delivery integrity. This generator simplifies the intricate process of designing protocol behaviors and aids in the efficient management of address and data phases. By offering customizable solutions that precisely fit client specifications, the Interconnect Generator is essential for projects demanding high-performance communication infrastructures.
Built for robust performance, Aragio's high-speed LVDS solutions address the needs for low power, high data rate communication interfaces in semiconductor designs. Featuring a three-module design—comprising input, output, and reference blocks—these LVDS I/Os cater to operations up to 1 GHz for drivers and 1.2 GHz for receivers, supporting finer technologies for optimal performance. The design operates efficiently with I/O powered at 1.8V and core supply levels from 1.0V to 1.1V, ensuring low power consumption while achieving high-speed operation. The LVDS meets the IEEE standard 1596.3-1996 for low voltage differential signaling, a testament to its reliability and robustness in communication protocols. Furthermore, these designs offer low power consumption with low differential skew and high common mode voltage ranges, critical for maintaining signal integrity. Supporting nodes from 130nm down to advanced nodes like 16nm, this solution guarantees broader applicability and integration into numerous system architectures, offering designers flexibility and scalability in high-speed data processing tasks.
The UCIe Chiplet Interconnect by InnoSilicon represents a leap in semiconductor design frameworks, facilitating seamless chip-to-chip and die-to-die interactions. This interconnect setup enables ultra-high-speed data exchange, optimizing processes for systems requiring intricate inter-component communication. Engineers benefit from this solution's compatibility with AXI and CHI interfaces, which enhances the adaptability of designs across various platforms. Designed with flexibility and performance in mind, this interconnect solution supports rapid integration and prototyping. It simplifies the complexities of cross-chip communication, which is pivotal in scaling compute capabilities without increasing power consumption disproportionately. As the push towards advanced integrated systems continues, the UCIe Chiplet Interconnect positions itself as a vital component for achieving high-bandwidth and low-latency connections. This product is particularly suited for high-performance computing (HPC), AI acceleration, and network interface applications, highlighting its versatility in the tech ecosystem.
Glasswing provides a revolutionary approach to semiconductor chip-to-chip connectivity using the proprietary CNRZ-5 Chord Signaling. This PHY solution enables unparalleled flexibility and efficiency, thanks to its ability to double bandwidth while reducing power consumption compared to traditional signaling methods. The Glasswing architecture supports ultra-short range SerDes with high throughput, optimized for a myriad of applications from data centers to consumer electronics. By sending five bits of data over six wires simultaneously, the power and cost efficiency is markedly improved while maintaining throughput capabilities reaching 500 Gbits/s per pin. Glasswing is also celebrated for its advanced signal diagnostics and adaptability, making it capable of supporting complex designs without sacrificing performance. It is particularly suited for high-performance computing and AI workloads, providing substantial power savings and heightened reliability.
The Prodigy FPGA-Based Emulator offers an advanced platform for evaluating and developing Tachyum's universal processor capabilities. This emulation system is not only essential for rigorous performance testing but also for software development, debugging, and compatibility verification. The emulator consists of multiple FPGA and IO boards connected systematically, enabling it to replicate functionalities of the Prodigy chip effectively. The primary advantage of using the Prodigy FPGA-Based Emulator lies in its ability to offer a high-fidelity representation of the Prodigy processor, making it ideal for developers aiming to transition and optimize their software for this new architecture. It supports real-time testing, allowing developers to evaluate their applications within a controlled environment that mirrors final deployment scenarios. Moreover, this emulator provides a critical advantage by enabling seamless transition of existing applications through testing and verification phases without the need for immediate hardware deployment. As such, it becomes a vital tool for those seeking to leverage Tachyum's processing power while minimizing transition risks and maximizing performance outcomes.
Sofics has verified its TakeCharge ESD protection clamps on technology nodes between 0.25um CMOS down to 3nm across various fabs and foundries. The ESD clamps are silicon and product proven in more than 5000 mass produced IC-products. The cells provide competitive advantage through improved yield, reduced silicon footprint and enable low-leakage, high-speed or high voltage tolerant interfaces. The ESD protection described in this document can be used for 1.6V chiplet (die-2-die) interface pads in the GF 22nm FDX technology. The ESD robustness is strongly reduced in order to reduce the size and capacitance.
The Regli PCIe retimer from Kandou is designed to ensure low-latency and high-integrity data transmission for PCIe networks. Operating with latency under 10 nanoseconds and featuring an impressive error rate of up to 1E-12, it offers exceptional performance for data-intensive applications. The retimer supports PCIe 5.0 with speeds up to 32 GT/s and provides robust signal integrity across x16/x8/x4 bidirectional lanes. Its CXL 2.0 compatibility further enhances the system's reach and flexibility, allowing for an extended range without compromising on latency. The Regli is ideal for use in servers, workstations, 5G infrastructure, and high-speed networking applications. Key features also include secure boot, on-chip diagnostics, and multiple control interfaces, simplifying the design process. Power management is optimized with flexible voltage options, including 0.9V, 1.2V/1.5V, and 1.8V, to suit various system requirements. The compact dimensions and advanced diagnostic capabilities make it a preferred choice for system designers seeking reliability and performance in PCIe and CXL environments.
The 10GBASE-KR Ethernet IP offers high-speed data transmission capabilities tailored for Ethernet applications. Its design is optimized to comply with the IEEE standards, providing reliable communication over backplane environments. With a strong focus on minimizing latency and maximizing signal integrity, this IP is built for systems requiring robust performance in high-density network setups. It's particularly suited to telecom environments where consistent connectivity is vital.
The 5G ORAN Base Station is designed to revolutionize mobile networking by significantly increasing wireless data capacity. This opens new avenues for various wireless applications and facilitates the integration of advanced technologies into everyday connectivity solutions. Its development is aligned with the latest industry standards to ensure future-proofing of networking capabilities. The ORAN architecture emphasizes open and intelligent wireless technologies, enhancing its functionality and deployment flexibility. The Base Station supports multi-vendor interoperability, which is critical for creating ecosystems where device diversity and customer preferences dictate wireless connectivity. This adaptability leads to reduced costs and enhanced innovation, creating environments that can swiftly adapt to technological change and market demands. Incorporating this base station into a network provides a transformative experience by improving data throughput and network reliability. It operates on a spectrum that supports high-speed data transfers, ensuring that the requirements for emerging data-hungry applications are met efficiently. Moreover, its energy efficiency and support for various deployment scenarios make it an ideal choice for modern telecommunications infrastructures.
Smartlogic's AXI Bridge for PCIe IP core is engineered to proficiently manage data transactions by translating AXI4 read or write commands into PCI Express memory operations. With support for up to four AXI4 interfaces, this IP core provides a powerful and flexible solution for systems needing a bridge to facilitate memory access across different platforms. Its robust design ensures reliable performance in demanding environments requiring high-speed data exchange.
KNiulink's high-speed SerDes IP utilizes advanced architectures and technology specifically designed for applications that require low power consumption and high performance. This highly configurable IP can be seamlessly integrated with user logic or SOC, allowing for efficient and tight integrations. It supports various standards including PCIE 6.0 to 2.0, Rapid IO, SATA/SAS, JESD204, USB3.1, LVDS, and MIPI C/D PHY, with offerings like 25G/28G/32G Combo SerDes and 112G SerDes targeted at Ultra Short Reach (USR) and Extra Short Reach (XSR) applications.
The SerDes (Serializer/Deserializer) offering by Actt encapsulates comprehensive support for multiple protocol interfaces, including USB, PCIe, and SATA. This IP is pivotal in achieving high-speed data communication across varying chip interfaces. Designed for seamless data transfer, it inherently supports high-bandwidth applications demanding minimal latency and optimal signal integrity. Its architecture ensures successful conversion between serial and parallel data formats at significant speed ranges. Providing flexibility, Actt’s SerDes IP is tailored for integration in applications where data rate and integrity are of the essence, such as in storage, server technology, and networking solutions. Its capabilities significantly enhance overall system performance and reliability.
The AXI Bridge with DMA for PCIe stands as a flagship IP solution by Smartlogic, combining industry-standard AXI interfaces with efficient DMA capabilities. This IP core supports continuous data flow between the CPU's main memory and other endpoints, facilitating access via S-AXI memory-mapped interfaces. The solution is ideal for those requiring a robust bridge between AXI stream data and PCIe environments, enhancing throughput and performance through streamlined memory transactions.
The Universal Chiplet Interconnect Express (UCIe) offers a transformative approach to inter-chiplet communication, designed to elevate chiplet-based system designs. This interconnect facilitates high-speed, low-latency links crucial for the efficient operating of chiplets in sophisticated computing environments. With support for versions 1.x and 2.x, UCIe ensures robust connection integrity, offering bandwidths up to 32 Gbps. It is engineered for high scalability, supporting extensive chiplet configurations needed in next-gen processors and server designs. UCIe's architecture promotes seamless integration into complex system setups, enhancing performance in high-demand areas such as AI processing, server applications, and large-scale parallel computing systems.
ChipBridge is an AXI4-based connectivity solution from ALSE, tailored to enhance peripheral management by providing chip-to-chip communication capabilities. It extends the AXI4 interconnect framework beyond the primary chip, addressing challenges of peripheral connectivity within complex system architectures. This innovative IP eliminates the typical hindrances of peripheral interfacing, such as voltage translation, signal integrity issues, and layout complexities. By using high-speed transceivers, ChipBridge efficiently maps peripherals to an external FPGA, maintaining high bandwidth and low latency. Compatible with a broad range of FPGA platforms from vendors such as Lattice, AMD/Xilinx, and Altera/Intel, ChipBridge is versatile and adaptable. This IP leverages the Aurora Light 64B/66B protocol for physical linking, ensuring a robust and streamlined communication channel that meets the demands of sophisticated industrial applications.
GUC's Die-to-Die IP facilitates seamless integration of multiple dies through advanced packaging technologies like CoWoS®. This technology supports a wide range of high-performance computing and networking applications by connecting dies in a highly efficient manner. Utilizing proprietary interposer technology, this IP ensures optimal inter-die connectivity with exceptional signal integrity and reduced cross-talk. The IP is instrumental for enabling complex chiplet-based systems, providing the backbone for 3D integration in future semiconductor innovations.
InPsytech's D2D IP consists of the UCIe-A PHY and Controller, UCIe-S PHY and Controller, as well as the IPTD2D-A PHY and Controller. These IP solutions are critical for enabling efficient and high-speed digital communications within a semiconductor device. Tailored for advanced digital on-chip communications, the D2D IP facilitates seamless interaction between different digital blocks, ensuring low latency and high data integrity. The UCIe-A and UCIe-S options provide scalable solutions that cater to diverse application needs. They are designed for easy integration into various chip architectures, reducing development complexity while enhancing system scalability. The addition of the IPTD2D-A further extends the flexibility and capability of the technology, ensuring compatibility with a wide range of design requirements. These digital interface solutions are engineered to support high data throughput while maintaining energy efficiency, making them suitable for the latest innovations in consumer electronics, telecommunications, and data processing applications. Their robust design ensures long-term performance stability across different operational environments.
The 32G UCIe PHY is engineered to achieve data rates of 32 Gbps per lane, targeting AI, HPC, xPU, and networking applications. Using TSMC's N3P process and CoWoS® packaging, this IP offers bandwidth densities of up to 10 Tbps per 1 mm of die edge. It supports Dynamic Voltage and Frequency Scaling (DVFS) for optimized power consumption and integrates preventive monitoring for sustained reliability in mission-critical environments. These capabilities position it as a leading solution for evolving chiplet-based systems that demand high-speed data transmission and robust system performance.
The Aurora 64B/66B IP Core from A.L.S.E offers a highly efficient protocol for high-speed data exchanges, designed especially for chip-to-chip and board-to-board communications. Built to work seamlessly with high-end transceivers, this IP core maximizes data throughput while minimizing the overhead, achieving an effective bandwidth of up to 97%. It achieves this with a lightweight protocol structure that surpasses the traditional Aurora 8B/10B encoding, which typically operates with around 80% bandwidth efficiency. This IP is recognized for its exceptional compatibility and interoperability with various FPGA families, including Intel, Lattice, and Microchip's PolarFire series. Moreover, it is engineered to function alongside the Xilinx Aurora core, ensuring smooth integration in mixed-vendor environments. Its wide range of supported configurations and adaptability across multiple platforms make it a versatile choice for developers seeking robust, high-speed communication capabilities. Among the supported features, the IP includes full-duplex and simplex operations, efficient framing and streaming interfaces, comprehensive flow control options, and compatibility with the AXI and Avalon-ST protocols. Such features render it a standout option for developers aiming to leverage FPGAs' full potential in high-speed applications, enabling efficient scaling in complex systems.
ALSE's Aurora 8B/10B IP Core is a streamlined protocol providing high-speed, low-latency serial communications suitable for intra-chip and inter-chip connectivity solutions. Designed in alignment with the Xilinx LogiCORE protocol, this IP extends compatibility across various FPGA platforms, including Altera/Intel, Lattice, and Microchip, facilitating multi-vendor chip communications. Engineered for versatility, this IP supports full-duplex and simplex operations at up to 6.6 Gbps per transceiver lane, with the potential for higher data rates depending on hardware specifics. It is particularly useful for applications requiring scalable solutions, such as board-to-board communication or backplane connections, utilizing up to 16 transceiver lanes for maximal data throughput. This IP's technical features include comprehensive clock compensation, advanced flow control systems, and flexible data path configurations based on operating mode and connection width. The integration is facilitated by low FPGA resource demands, maximizing performance-to-area efficiency while ensuring ease of use with standardized interface compatibility like AXI and Avalon-ST.
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