All IPs > Interface Controller & PHY > D2D
Device-to-Device (D2D) communication is a critical component in modern electronics, enabling direct interaction between devices without intermediary network infrastructure. Within our Interface Controller & PHY category, the D2D segment offers specialized semiconductor IPs designed to streamline and enhance these direct connections. These IPs are indispensable in creating an efficient communication link that can handle the increasing data demands seen in consumer electronics, automotive systems, and IoT devices.
Our D2D semiconductor IPs consist of essential building blocks such as interface controllers and Physical Layer (PHY) IP cores. These components are engineered to facilitate seamless communication between devices, whether it be for transferring data, synchronizing functions, or sharing resources in real-time. By leveraging these IPs, manufacturers can achieve low latency, high-speed data transfer, and robust connectivity, making these components suitable for applications requiring precise and rapid interaction.
Incorporating D2D IPs into your design allows for efficient use of bandwidth and power, critical factors in battery-operated or compact devices. The versatility of these semiconductor IPs makes them a popular choice in developing smart home devices, wearables, and vehicle infotainment systems, where direct and reliable device-to-device communication is paramount. These IPs also help minimize reliance on external network structures, providing a more secure and localized network environment.
The D2D interface controller and PHY IPs in our collection are developed to cater to the demanding needs of modern technological solutions. Whether you are designing a new IoT ecosystem or enhancing an automobile's connectivity suite, selecting the right D2D IP core can significantly impact your product’s performance and user experience. Explore our offerings to find the IP solutions that best align with your innovation goals, ensuring your devices communicate effectively and efficiently.
Universal Chiplet Interconnect Express, or UCIe, is a forward-looking interconnect technology that enables high-speed data exchanges between various chiplets. Developed to support a modular approach in chip design, UCIe enhances flexibility and scalability, allowing manufacturers to tailor systems to specific needs by integrating multiple functions into a single package. The architecture of UCIe facilitates seamless data communication, crucial in achieving high-performance levels in integrated circuits. It is designed to support multiple configurations and implementations, ensuring compatibility across different designs and maximizing interoperability. UCIe is pivotal in advancing the chiplet strategy, which is becoming increasingly important as devices require more complex and diverse functionalities. By enabling efficient and quick interchip communication, UCIe supports innovation in the semiconductor field, paving the way for the development of highly efficient and sophisticated systems.
Eliyan's NuLink Die-to-Die (D2D) PHY products are designed to provide high-performance, low-power connectivity between chips, or 'chiplets,' in a system. Using standard organic laminate packaging, these IP cores maintain power and performance levels that would traditionally require advanced packaging techniques like silicon interposers. This eliminates the need for such technology, allowing cost-effective system design and reducing thermal, test, and production challenges while maintaining performance. Eliyan’s approach enables flexibility, allowing a broad substrate area that supports more chiplets in the package, significantly boosting performance and power metrics. These D2D PHY cores accommodate various industry standards, including UCIe and BoW, providing configurations tailor-made for optimal bump map layout, thus enhancing overall system efficiency.
Analog Bits's SERDES solutions are at the pinnacle of high-speed, low-power design suitable for PCIe Gen 3/4/5, integrating seamlessly with today's demanding digital environments. Their multi-protocol, enterprise-class PCIe Gen 4/5 SerDes operate at 32Gbps, with customizable options to fit specific market needs. Notably, these solutions halve the power requirements compared to competitors and require minimal die area, providing efficient communication solutions across diverse applications like mobile computing and flat panel displays.
Credo Semiconductor excels in SerDes (Serializer/Deserializer) IP for custom ASICs, providing solutions that facilitate easy integration into various System on Chip (SoC) designs. The architecture of Credo's SerDes IP is based on a mixed-signal DSP approach that enhances performance while minimizing power and integration challenges. This architecture is especially beneficial for high-bandwidth data processing scenarios, making it an ideal choice for applications in AI, high-performance computing, and advanced telecommunication infrastructures.<br /><br />Their custom-built SerDes solutions stand out for the ability to handle tens and even hundreds of lanes, thanks to their innovative approach that seamlessly bridges the gap between core and analog logic deployment. These IPs are crafted to thrive even in mature process nodes, delivering remarkable efficiency in terms of power consumption and cost-effectiveness. By implementing these IPs, companies can ensure their systems are robust, future-proof, and capable of handling substantial data transmission tasks.<br /><br />Among the notable advantages offered by Credo’s SerDes IP is their adaptability with various signaling standards such as NRZ and PAM4, facilitating diverse data rate requirements up to 112G per lane. This flexibility not only aligns with current technological trends but also positions companies to swiftly adapt to future advancements in data communication technology, leveraging Credo's partnership with leading foundries and process nodes, such as TSMC's N3 and N5 technologies.
High-Speed SerDes for Chiplets is engineered to provide exceptional interconnect solutions tailored for chiplet architectures. This product offers ultra-low power consumption while maintaining high data transfer rates, essential for modern multi-die systems. By facilitating rapid communication between chiplets, it enhances overall system efficiency and performance. This SerDes solution is optimized for integration with a range of tech nodes, ensuring compatibility with various semiconductor manufacturing processes. Its design is focused on providing robust data integrity and reducing latency, which are crucial for efficient system operation in complex, integrated circuits. High-Speed SerDes addresses the growing demand for advanced interconnect solutions in chiplet architectures, making it an indispensable tool for developing next-generation semiconductor devices. Its ability to support high data throughput while keeping power use minimal makes it a standout choice in high-performance design environments.
MAXVY UCIe VIP , a state-of-the-art solution that offers a comprehensive set of features and capabilities to ensure the quality and performance of your UCIe designs. MAXVY UCIe VIP is fully compliant with UCIe Specification version 1.0 and supports all the layers of the UCIe stack, such as FDI, RDI, LogPHY, PCIe, and CXL protocols. MAXVY UCIe VIP is also very user-friendly and flexible, with simple APIs, easy integrations, and configurable parameters. You can easily customize and control the UCIe functionality according to your needs. MAXVY UCIe VIP also provides a rich set of verification capabilities, such as protocol checks, functional coverage, traffic generation, error injection, and debug tools. You can easily monitor, detect, and report any issues or violations in your UCIe designs. MAXVY UCIe VIP is compatible with the industry-standard Universal Verification Methodology (UVM) and supports all leading simulators. With MAXVY UCIe VIP, very flexible for unit level testing, you can achieve faster verification closure and higher quality of your UCIe designs.
SkyeChip's Die-to-Die Interconnect technology provides a lightweight, efficient solution for die-to-die communication, conforming to the Universal Chiplet Interconnect Express (UCIe) 2.0 specifications. This system offers high performance with minimal power and area requirements, supporting transfer rates up to 32 Gbps per pin and die edge bandwidth up to 10.5 Tbps/mm. It accommodates various protocols, offering flexibility for seamless integration with existing chip designs, ensuring broad applicability across different technology platforms.
The BlueLynx Chiplet Interconnect system provides an advanced die-to-die connectivity solution designed to meet the demanding needs of diverse packaging configurations. This interconnect solution stands out for its compliance with recognized industry standards like UCIe and BoW, while offering unparalleled customization to fit specific applications and workloads. By enabling seamless connection to on-die buses and Networks-on-Chip (NoCs) through standards such as AMBA, AXI, ACE, and CHI, BlueLynx facilitates faster and cost-effective integration processes. The BlueLynx system is distinguished by its adaptive architecture that maximizes silicon utilization, ensuring high bandwidth along with low latency and power efficiency. Designed for scalability, the system supports a remarkable range of data rates from 2 to 40+ Gb/s, with an impressive bandwidth density of 15+ Tbps/mm. It also provides support for multiple serialization and deserialization ratios, ensuring flexibility for various packaging methods, from 2D to 3D applications. Compatible with numerous process nodes, including today’s most advanced nodes like 3nm and 4nm, BlueLynx offers a progressive pathway for chiplet designers aiming to streamline transitions from traditional SoCs to advanced chiplet architectures.
The CXL 3.0 solution from Rapid Silicon is an advanced Controller IP designed to enhance your FPGA design with superior performance and flexibility. This IP is compliant with CXL specifications up to version 3.0, along with support for earlier versions 2.0, 1.1, and 1.0. It offers seamless integration capabilities with PCIe, standing up to PCIe 6.0 and ensuring backward compatibility. The architecture of the CXL Controller IP is highly configurable, providing adaptability for specific application requirements, including lane configurations, datapath widths, and efficiency in power management. One of the standout features of the CXL 3.0 IP is its support for advanced functionalities such as lane bonding, multicast, and robust error correction mechanisms. These features ensure the IP delivers reliable and efficient performance in diverse environments. Ideal for critical data-intensive tasks, the IP is suited for telecommunications, industrial applications, and more, where data throughput and protocol bridging are crucial. With its focus on delivering unmatched speed, efficiency, and scalability, the CXL 3.0 IP from Rapid Silicon is positioned as a key component for enabling sophisticated FPGA designs tailored to meet modern technology demands. Its architecture is crafted to support the burgeoning needs of applications that require high degrees of data handling and processing accuracy, making it a preferred choice in the semiconductor industry.
Analog Bits specializes in low power I/O technologies designed with customization for die-to-die communication needs. These I/O solutions, proven efficient with low transistor usage, offer high signal quality specifically at 5nm and with future applications extending into 3nm technology nodes. The customizable differential clocking and crystal oscillator IPs optimize noise levels and energy efficiency in diverse environments, ensuring robust operations in integrated circuits.
The UDP/IP Ethernet Communication core from Enclustra provides an essential interface for seamless communication in FPGA setups, facilitating high-speed data exchange using the UDP protocol. Designed to integrate effortlessly into communication infrastructures, this core enables reliable and efficient data transmission between connected subsystems across Ethernet networks. Employing the lightweight UDP protocol, this IP core supports rapid data transfer rates, ideal for applications that require fast and efficient network communication such as video streaming, VoIP, and real-time data acquisition systems. Its minimalist design minimizes resource use while ensuring optimal data flow, making it ideal for network-based applications. This solution is engineered for straightforward integration into both new and existing FPGA systems, offering versatility and ease-of-use. Through its sustainable design and reliable performance, the UDP/IP Ethernet core supports innovation, allowing developers to streamline network communications effectively and efficiently.
The JESD204B Multi-Channel PHY from Naneng Microelectronics is designed to meet the rigorous demands of high-speed data transmission. Featuring a data rate capability of up to 12.5Gbps, this physical layer multi-channel interface supports a wide array of applications requiring reliable and efficient data transfer. Its versatile architecture ensures seamless integration into complex systems, providing robust performance benefits in the field of data communications. A comprehensive design enhances usability and flexibility, allowing customization for specific industrial needs. This PHY is particularly adept in high-density environments, ensuring precision synchronization across multiple channels, critical for signal integrity in today's intricate electronic ecosystems. Furthermore, the solution's efficient layout allows for ease of interoperability with existing infrastructure, reducing integration costs and time-to-market for end-users. This makes the JESD204B Multi-Channel PHY an attractive choice for enterprises aiming for optimal performance in digital communication systems without compromising efficiency.
The Chiplet Interface solutions provided by Neuron IP include cutting-edge PHY & D2D Adapter IP for chiplet products. These solutions are built around the latest UCIe v1.1 specification and are designed to support a wide range of application verticals. They are well-known for their unparalleled PPA-differentiated architecture, which includes 32Gbps UCIe-Advanced and Standard cores. These interfaces are set to revolutionize the way microprocessors work in ultra-low latency environments, enhancing both performance and efficiency.
Designed to revolutionize AI-driven data centers, the Photowave Optical Communications Hardware capitalizes on the inherent advantages of photonics. With capabilities that support PCIe 5.0/6.0 and CXL 2.0/3.0, this hardware facilitates enhanced scalability of AI memory applications within data centers. The technology provides significant latency reduction and energy efficiency, allowing for more effective resource allocation across server racks, which is a crucial feature for modern data infrastructure. The Photowave hardware serves the evolving needs of data-driven applications, ensuring seamless integration and performance boosts in environments demanding high-speed data transfer and processing. By addressing the latency and power efficiency concerns prevalent in traditional electronics, it is integral in the transition towards faster, more sustainable data center operations. Incorporating these photonic advantages, Photowave stands as a testament to Lightelligence’s goal of transforming data operations and enhancing the utility of AI technologies. Its role in this ecosystem is vital, making it a cornerstone product for entities looking to modernize their computational frameworks.
The VITA 17.1 Serial FPDP Solution from StreamDSP is designed for high-speed data transfer applications. This solution leverages industry-standard interfaces to facilitate efficient serial data communications, ensuring seamless data flow in demanding environments. It's ideal for applications that require robust data integrity and low-latency transmission, making it a perfect fit for military and aerospace operations. By supporting a range of configurations and offering flexibility in integration, this solution helps address specific user needs while maintaining compatibility with widely used FPGA devices.
StreamDSP's VITA 17.3 Serial FPDP Gen3 Solution is an advanced high-speed communication framework designed to meet the latest standards in data transfer technology. This solution offers improved data throughput and enhanced interoperability with existing systems, making it an invaluable asset for applications demanding the utmost precision and speed. Leveraging enhanced protocol designs, this IP solution integrates seamlessly with a broad array of FPGA platforms, providing users with unmatched performance and reliability in critical data communication setups. This makes it indispensable for applications in fields such as defense, scientific research, and real-time data processing.
AresCORE UCIe Die-to-Die PHY is a tailored solution for die-to-die interconnects, designed to simplify the link between chiplets within a complex system. It addresses the critical demand for reliable, high-bandwidth communication channels in multi-die packages, facilitating scalable system architectures. Capable of supporting wide bandwidth requirements, AresCORE enhances performance with minimized power consumption, essential in preventing bottlenecks in data-intensive applications. This PHY is engineered to seamlessly integrate into modern SoC designs, offering flexibility and enhanced operational efficiency. The robust architecture and comprehensive testing capabilities of AresCORE ensure data integrity and compatibility with future technological advancements. Its adaptability to various implementation scenarios makes it a suitable choice for next-generation computing technologies.
The Glasswing Ultra-Short Reach SerDes is a cutting-edge interconnect solution leveraging the unique CNRZ-5 Chord Signaling technology. It is designed to enhance high-bandwidth and low-power performance across chip-to-chip interfaces, optimizing silicon use by lowering pin count while boosting throughput. This innovative technology transmits five bits over six wires, effectively doubling bandwidth and minimizing power requirements. This solution allows the seamless creation of a chiplet ecosystem, facilitating complex connections in high-performance computing environments. Notably, Glasswing delivers significantly higher throughput per pin, alongside lower power consumption compared to traditional NRZ solutions. This feature makes it particularly valuable for applications such as AI, ML, networking, and high-performance computing, where efficiency and throughput are critical. Glasswing excels in modularity and diagnostics, offering dynamic configuration and real-time signal strength monitoring. Its capabilities allow integration into large multi-chip modules with high signal integrity, unlocking potential in fields ranging from satellite communications to consumer electronics. Furthermore, the use of substrate rather than complex silicon interposers reduces cost and complexity, making it a financially attractive option for large-scale projects.
Sofics has verified its TakeCharge ESD protection clamps on technology nodes between 0.25um CMOS down to 3nm across various fabs and foundries. The ESD clamps are silicon and product proven in more than 5000 mass produced IC-products. The cells provide competitive advantage through improved yield, reduced silicon footprint and enable low-leakage, high-speed or high voltage tolerant interfaces. The ESD protection described in this document can be used for 1.6V chiplet (die-2-die) interface pads in the GF 22nm FDX technology. The ESD robustness is strongly reduced in order to reduce the size and capacitance.
The Regli PCIe Retimer by Kandou AI is a standout solution for high-performance communication in computer systems and data networks. Built to deliver extremely low latency under 10 nanoseconds, this retimer upholds exceptional signal integrity thanks to its ultra-low error rate of 1E-12. Designed for integration into PCIe networks, it supports data transactions at significant speeds, ensuring seamless communication between components. One of the main features of the Regli PCIe Retimer is its versatility in supporting PCIe 5.0 and CXL 2.0 standards, providing bidirectional data lanes capable of speeds up to 32 GT/s. The device is particularly suited for servers, workstations, and other systems requiring pristine data communication over extended distances. It excels within PCIe active cables and large network configurations such as in hyperscale data centers, offering massive data transfer benefits. Security is a top priority for the Regli PCIe Retimer, as it includes robust on-chip diagnostics and secure boot capabilities. Its design simplifies system architectures, providing system designers with flexible options to implement high-speed, reliable networks. With built-in control interfaces and flexible clock modes, this retimer is a dream solution for system architects who value both performance and security.
InnoSilicon's 56G SerDes Solution caters to the high-speed data transfer needs of today's semiconductor industry, offering a robust and flexible platform for a variety of high-bandwidth applications. This SerDes solution provides a comprehensive interface for seamless integration in networking and communication systems, including PCIe, USB, and Ethernet. Engineered for performance, the 56G SerDes boasts multi-protocol support, which allows for versatility in system design. It offers unmatched signal integrity, optimizing data rate speeds across various environments while minimizing electromagnetic interference. This ensures reliable communication channels capable of handling the complexities of modern digital data transfer. The solution's adaptability to different process nodes enhances its utility in diverse technological settings, promoting efficiency and reducing power consumption. It is especially suited for use in data centers, telecommunications infrastructure, and other areas where high-speed data processing is required. Through its advanced modulation techniques and streamlined architecture, the 56G SerDes Solution provides a valuable foundation for building next-generation networking solutions.
Aragio's LVDS solutions are tailored for high-speed data transmission up to 1 GHz for drivers and 1.2 GHz for receivers. Designed to meet the LVDS standard, the offering includes a CML interface to the core and power-up sequence independence. The solution provides flexibility with both 50Ω and 100Ω termination options, tailored to provide low power consumption while maintaining high performance. These features make it suitable for diverse high-speed data applications, ensuring reliability and energy efficiency.
Silvaco’s AMBA cores and subsystems support the development of complex SoCs by offering high-performance, low-power architectures that facilitate seamless component integration. These cores enable efficient handling of high-bandwidth data, ensuring scalable concurrent processing tasks. The subsystems cater to a range of applications, from simple embedded systems to intricate chip designs, marking them as indispensable tools for modern electronics manufacturing. AMBA (Advanced Microcontroller Bus Architecture) solutions from Silvaco are optimized through modular design, which allows for scalability and ease of integration. This flexibility is crucial in meeting the diverse demands of modern computation and consumer electronics where diverse processing requirements are a standard. Additionally, Silvaco’s solutions incorporate sophisticated diagnostic and management features, ensuring that systems operate with optimum efficiency and reliability. Supported by extensive ecosystem components, training, and support, Silvaco’s AMBA offerings streamline the design process and reduce time to market, making them highly attractive for companies looking to innovate rapidly. Advanced methodologies for power management and system architecture keep these subsystems ahead of evolving tech landscapes, catering to next-gen embedded applications.
The FireCore PHY & Link Layer solutions from DapTechnology provide state-of-the-art components crucial for implementing IEEE-1394 and AS5643 standards. Designed for adaptability, these solutions cater to multiple FPGA families, offering a combined PHY and LLC (Link Layer Controller) approach. They efficiently operate across a range of transmission speeds (S100 to S3200), making them valuable assets in various high-speed data environments. FireCore solutions are crafted with a focus on flexibility and reliability. They encompass significant enhancements such as configurable PHY ports, bit error injection, and rate testing features, catering to the diverse needs of modern digital communications. By integrating these dynamic capabilities, DapTechnology’s FireCore solutions improve packet management and overall network efficiency. Through continuous innovation, FireCore solutions have fortified DapTechnology's position as a leader in IEEE-1394 and Mil1394 technologies. These components provide the foundational architecture for performance-driven application in critical systems, especially within industries demanding high standards of data integrity and speed.
The SerDes IP by KNiulink Semiconductor is built using advanced architecture and technology, specifically crafted for applications demanding low power consumption and high performance. This IP showcases a high degree of configurability, making it seamlessly integrable into user logic or as part of an SOC.
The UCIe Chiplet Interconnect is an advanced solution facilitating unparalleled communication across chiplets, ensuring efficient system scalability and integration. This interconnect standard supports high data rates ranging from 24Gbps to 32Gbps, making it essential for cutting-edge multi-chip module (MCM) designs and System in Package (SiP) technologies. Designed with flexibility, it bridges various interfaces such as AXI and CHI, providing designers with versatile options for high-throughput interconnection across different silicon pieces. Its architecture supports both die-to-die and chip-to-chip communications, essential for modern heterogeneous applications that require diverse functionalities within a compact system footprint. InnoSilicon’s UCIe solution promotes seamless data exchange and minimizes bottlenecks, improving the efficiency of systems relying heavily on parallel processing and large data transfers. This technology plays a critical role in the rapid prototyping and mass production of high-performance computing systems and AI-powered devices. Supporting current and future process nodes, the UCIe Chiplet Interconnect ensures adaptability and relevance in an evolving semiconductor landscape, contributing to the growing demand for modular and customizable semiconductor infrastructure.
The SerDes telecommunications technology by Actt is crafted to efficiently transmit high-speed serial data signals over long distances with minimal degradation. SerDes, standing for Serializer/Deserializer, converts parallel data into serial form and vice versa, making it a critical component in high-speed communication applications. This IP supports a range of data rates and is designed to cater to the needs of modern high-performance systems requiring optimal data throughput. It ensures minimal signal loss and high data integrity, crucial for applications in data centers and high-speed computing networks. With its ability to handle extensive data transfer with precision, SerDes provides an essential link in maintaining robust communication channels. It is an adaptable solution that ensures scalability, meeting the ever-evolving demands of data processing environments.
The LineSpeed FLEX Family encompasses a range of 100G PHY products designed to facilitate high-speed communications across various interfaces, including retiming, gearbox functions, and multiplexing. These products comply with industry standards, such as IEEE, offering wide-ranging compatibility for diverse networking environments. Notably, the family supports a variety of data rates from 10G to 100G, allowing for mixed and independent port speeds. The retimers in particular are protocol-independent, providing a flexible solution adaptable to many networking configurations, particularly in line cards and modules, where space and efficiency are critical. The LineSpeed FLEX products also feature robust error correction capabilities, including on-chip RS-FEC. This assures data integrity across extensive network infrastructures, thus mitigating signal degradation over long distances. By simplifying the integration process and ensuring consistent performance, LineSpeed FLEX is integral to modern network practices, accommodating dense 10G Ethernet configurations and high-reliability systems.
Arkville is a formidable FPGA Gen5 PCIe DMA IP solution engineered to facilitate seamless data transfer between FPGA logic and host memory at remarkable speeds of up to 60 GBytes/s (480 Gbps) bidirectionally. This high-efficiency conduit substantially reduces CPU core utilization, obliterates the need for memory copies, and ultimately refines overall system efficiency. The IP core supports widespread industry-standard APIs for zero-copy user space memory handling, catering extensively to both hardware and software engineers involved in data production and consumption. This advanced data mover offers trusted and reliable PCIe DMA offload capabilities, facilitating rapid market deployment of FPGA-based packet processing solutions. By embracing modern standards such as DPDK and AXI, Arkville ensures compatibility across a broad spectrum of use cases. Vendor agnostic in its RTL support, Arkville caters to both Intel/PSG and AMD/Xilinx FPGA devices, further extending its versatility. Beyond its intrinsic features, the Arkville solution comes with a comprehensive suite of example designs, providing users with a solid foundation upon which they can build customized solutions. These examples showcase various network configurations, from multi-port scenarios to high-speed single-port operations, highlighting Arkville's adaptability to evolving packet processing requirements.
The 5G ORAN Base Station is at the forefront of mobile networking technology, designed to significantly enhance wireless data capacity and facilitate new wireless applications. With the introduction of 5G, this tool is paving the way for revolutionary changes in telecommunications, promising faster and more efficient wireless communications. It's engineered to meet the comprehensive demands of the new digital landscape, which involves a myriad of connectivity needs. This product integrates seamlessly into existing networks, providing operators the flexibility to upgrade current infrastructure and achieve better network performance. Its open architecture approach supports cooperative operation with multiple vendors' equipment, reducing cost and improving efficiency. Designed to deliver unmatched reliability, it ensures continuous connection and superior service quality across diverse user environments. Moreover, the 5G ORAN Base Station is poised to cater to various industry sectors, from retail and consumer electronics to healthcare and automotive, effectively supporting an array of novel applications. Its robust capabilities not only accommodate traditional voice communications but also support next-generation data services, interactive gaming, and immersive augmented and virtual reality experiences.
IntelliProp's Switch and Endpoint Adapter is a dedicated solution designed to interface between various CXL-compliant devices and the Omega Fabric, providing a scalable infrastructure for memory and device interconnections. Serving as a vital component in memory networking, it connects CXL memory, GPUs, and other endpoint devices to the Omega Fabric. This adapter caters to multiple configurations, offering 4, 8, or 12 ports to accommodate various setup needs and support redundancy and congestion management through path duplication. Its versatility ensures high-throughput capabilities with support for CXL devices ranging from version 1.1 to 3.0, making it a future-proof component for data centers undergoing scalability expansions. The discrete switch supports an extensive 1200Gbps total fabric capacity and built-in Single Subnet/Single Route packet routing, ensuring efficient data packet management across various networks. This flexibility undershoots its role in enhancing seamless data flow across high-demand computing environments known for their complexity and performance needs.
The Universal Chiplet Interconnect Express (UCIe) offers a transformative approach to inter-chiplet communication, designed to elevate chiplet-based system designs. This interconnect facilitates high-speed, low-latency links crucial for the efficient operating of chiplets in sophisticated computing environments. With support for versions 1.x and 2.x, UCIe ensures robust connection integrity, offering bandwidths up to 32 Gbps. It is engineered for high scalability, supporting extensive chiplet configurations needed in next-gen processors and server designs. UCIe's architecture promotes seamless integration into complex system setups, enhancing performance in high-demand areas such as AI processing, server applications, and large-scale parallel computing systems.
Designed for high-speed inter-chip communication, the ChipBridge AXI4 Connectivity IP provides an efficient solution for connecting multiple FPGAs or ASICs. This IP enables rapid data transfer between chips, accommodating the growing demand for speed and reliability in data-intensive applications. By utilizing the AXI4 protocol, it delivers a high-performance, standard interface that ensures seamless data exchange. The ChipBridge is optimized for minimal latency and high throughput, making it critical in systems that require fast communication between integrated circuits. Its architecture supports high-frequency operation, enabling it to handle demanding applications where timing and speed are crucial. The adaptability of the ChipBridge IP allows for its integration into various design environments, making it a versatile tool for engineers seeking to develop complex chip-to-chip communication solutions. Its robustness and efficiency in managing data traffic between chips make it suitable for a range of application domains, including communication infrastructure and data centers.
GammaCORE UCIe Die-to-Die Controller offers precise control for die-to-die communications in modern computing architectures. Serving as a vital component in fragmented chip designs, this controller ensures seamless interconnectivity and functionality between discrete silicon dies. The GammaCORE is designed to excel in environments demanding high throughput and low latency communication. Its support for the UCIe protocol makes it adaptable for various chiplet configurations, thus promoting flexible design strategies across industry applications. With strong emphasis on reliability and efficiency, GammaCORE facilitates effective data flow, maintaining the integrity of operations in advanced computing systems. It underlines a pivotal shift towards modular electronics, accommodating complex designs with varying performance needs.
The Network Attached Memory (NAM) System by IntelliProp is an innovative 2U chassis solution designed to support and streamline next-generation memory pooling strategies. Capable of housing up to six EDSFF devices, this system allows for the integration and management of various CXL-based endpoints including memory, GPUs, and accelerators. Used as either a standalone added memory hub or an interconnected switch without endpoints, the NAM provides agile and flexible memory management within data centers. This feature allows enterprises to adapt to growing memory demands and efficiently distribute resources across various computational tasks, ensuring optimal performance and resource utilization. The NAM is designed to integrate seamlessly with other IntelliProp CXL-based technologies and can be customized to operate with pre-installed memory modules or remain unpopulated based on specific client requirements. As more enterprises adopt CXL standards for their operational infrastructure, the NAM offers a compatible and innovative solution ready for immediate deployment in contemporary data centers.
The Die-to-Die (2.5D/3D) offering from Global Unichip Corp. focuses on high-speed data interconnections for multiple die architectures. This innovative solution is vital for applications needing extensive data exchange between dies, which include those in networking and data center environments. By handling data rates efficiently, this IP addresses the increasing demand for higher data throughput while minimizing latency. It employs the latest advances in semiconductor packaging, allowing for versatile integration across diverse system architectures. Its adaptability ensures that it aligns with various manufacturing nodes and foundry processes, making it an excellent choice for numerous technological needs. Reliability is also a key focus, supported by a robust design strategy that ensures consistent performance under different operational conditions. The Die-to-Die technology supports not only improved bandwidth but also enhances thermal management across connected dies. This capability is crucial in ensuring seamless operation over prolonged periods, particularly in high-performance computing scenarios where heat dissipation can pose significant challenges.
The Aurora 8B/10B IP Core is crafted to support high-speed serial communication, ensuring efficient and reliable data transmission. It is optimized to address the needs of applications requiring fast, secure, and robust data exchange. This IP core facilitates the conversion of parallel signals into serial signals, enhancing the throughput of communication systems. This IP core's design is focused on delivering low-latency and high-bandwidth connectivity, ensuring the integrity and continuity of data transmissions. It is engineered to integrate smoothly with various hardware platforms, providing a flexible and scalable solution that can adapt to different applications and configurations. Furthermore, the Aurora 8B/10B IP Core exhibits excellent signal quality and robustness, making it ideal for environments that demand precise and high-speed data flow. Its efficient power usage and reliable performance make it a preferred choice for systems where both speed and energy efficiency are critical.
The Aurora 64B/66B IP Core is a high-performance core designed to facilitate high-speed serial communication protocols. Ideal for applications requiring efficient data transmission, this IP core supports a robust link layer protocol that ensures data integrity and speed. It simplifies the implementation of high bandwidth communication channels, making it suitable for use in various high-tech sectors. By converting parallel data into high-speed serial streams, the Aurora 64B/66B IP Core enhances the data throughput while maintaining signal integrity. This results in improved communication efficiency, crucial for systems where reliable data transfer is a priority. Its sleek architecture and adaptability make it compatible with multiple hardware platforms, enabling seamless integration into existing and new designs. Moreover, this IP core presents significant advantages in terms of power consumption and performance. By offering low-latency communication with optimized power usage, it suits applications that demand rapid data processing without incurring high energy costs. Its versatile nature allows for use in different configurations, providing a scalable solution to meet varied requirements.
The PCIe Gen1/2 PHY IP core is compliant with the PCIe v2.0 specifications, featuring PIPE interface flexibility and minimal gate count architecture. It is capable of generating a comprehensive set of Ordered Sets required for PCIe standards and includes an IBM-compatible 8b/10b Encoder and Decoder. This core ensures high interoperability and performance for next-generation PCIe devices, serving as a critical component in high-speed data and networking interfaces.
The 32G UCIe PHY from Global Unichip Corp. represents a significant leap in physical layer technologies, designed to meet the demands of high-speed data communication. Targeting next-generation connectivity standards, this PHY is vital for boosting data throughput in interconnected systems, particularly those foundational to computing and networking architectures. Supporting a broad range of process technologies, this PHY offers exceptional versatility and performance, catering to extensive application needs. Its design ensures robust data integrity and minimal signal degradation, essential for maintaining high performance in data-critical environments such as data centers and enterprise networks. Engineered for seamless integration, the 32G UCIe PHY supports rapid deployment and compatibility with a diverse set of systems. Additionally, its enhanced signal processing capabilities make it suitable for applications where precision and high-quality data transmission are paramount, ensuring comprehensive support for modern technological demands.
The Die-to-Die (2.5D/3D) Interface at Global Unichip Corp. is pivotal for managing inter-die communication in integrated circuits. It serves high-performance computing and AI applications, enabling efficient data communication across various dies within an integrated system. Its design helps in minimizing latency and maximizing bandwidth, critical for modern computation-intensive tasks. This interface supports advanced packaging solutions, providing extensive variability in system design, from simple to complex structures. It aligns with various semiconductor nodes, ensuring compatibility and flexibility for different technological requirements. The interface is equipped to handle the demanding needs of modern processors and computing architectures. With a focus on thermal performance, the Die-to-Die Interface is engineered to support efficient heat dissipation, a critical need in high-density computing environments. Its robust design facilitates easier integration into a variety of system configurations, supporting the next wave of high-performance semiconductor advancements.
This library is a production-quality, silicon-proven custom Die-to-Die high speed interface available in TSMC’s 16nm process. The I/O cell is bidirectional, has two modes of operation: standard full rail to rail swing, or a custom low noise pseudo-differential interface. The RX cells have a weak pull-down feature.
The IntelliProp CXL Host Adapter provides a robust solution for memory expansion and pooling within the server environment, leveraging advanced CXL technology to bridge connections between multiple hosts. Featuring two CXL links and multiple Omega Fabric ports, the adapter card includes four DDR4 memory slots to enhance server memory capacity and facilitate memory sharing between paired CXL hosts. This adapter card supports a wide compatibility range, accommodating current CXL 1.1 host processors and extending future support to include upcoming versions like CXL 2.0 and 3.0. Equipped with a built-in switch, the CXL Host Adapter is designed to seamlessly integrate into complex data center environments, offering flexibility in routing and cascading configurations. The card's design considers high-speed connectivity, equipping it with four 25Gbps connections for an aggregate throughput of 400Gbps. This feature supports efficient memory integration and enhances data throughput capabilities, catering to the increasing demand for seamless, high-speed data operations in modern computing environments.
IntelliProp's Omega Fabric aims to revolutionize memory economics by providing an innovative CXL-based system that extends memory capacity within servers and facilitates connectivity to external pooled memory. Utilizing FPGA-based technology, the Omega Fabric system enables significant advancements in memory expansion capabilities and infrastructure flexibility for AI and hyperscale computing applications. The Omega Fabric creates advanced memory tiers by integrating multiple servers with a Network Attached Memory (NAM) system, connecting through 6m to 30m cables which support extensive pod and rack-scale deployments. This model supports the combination of different components such as EDSFF CXL memory, IntelliProp memory, and EDSFF CXL GPUs, thereby transforming memory performance and capacity. Designed to enhance existing memory architectures, Omega Fabric makes use of advanced host adapters, enabling seamless CXL integration, thereby enhancing local memory for real-time applications and distributing memory resources more efficiently. This refined approach to memory resource management drives significant improvements in data processing speed within the NUMA domain, tailored for in-memory database applications.
The GTS PMA/FEC Direct PHY is an advanced high-speed physical layer interface developed by Altera. Supporting next-generation serial protocols, it integrates forward error correction (FEC), which is essential for maintaining superior signal integrity. This product is engineered to deliver exceptional performance in terms of speed and reliability, making it a vital component for cutting-edge communication systems. Its design focuses on achieving superior signal processing, a requisite for modern telecommunication infrastructures that demand both precision and robustness. The integration of FEC enhances its efficiency by correcting errors in data transmission, thus ensuring continuous and error-free communications even in challenging environments. Altera's GTS PMA/FEC Direct PHY stands out in its category by providing high adaptability in various applications. It can be utilized in sectors such as data communication and networking, where high-speed data transfer and minimal data loss are critical. This PHY demonstrates Altera's excellence in offering products that meet the rigorous demands of cutting-edge digital communication technology.
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