All IPs > Network on Chip > Network on Chip
Network on Chip (NoC) semiconductor IPs play a crucial role in modern electronic design, offering advanced solutions for efficient data communication within integrated circuits. As devices become more complex, traditional bus systems struggle to meet the demand for fast, reliable data transfer. This is where NoC technology comes into play, enhancing the scalability and performance of electronic devices from smartphones to data centers.
At its core, a Network on Chip provides a sophisticated, packet-switched network capable of linking various IP cores in a System on Chip (SoC). This architecture not only boosts communication efficiency but also facilitates easier design of high-performance systems. By implementing NoC semiconductor IPs, designers can effectively manage bandwidth, reduce latency, and improve overall chip performance. These improvements are essential for applications demanding high-speed processing, such as artificial intelligence, machine learning, and real-time data analysis.
Products in the Network on Chip category include a diverse range of solutions, from basic routers and switches to complex network architectures supporting multichip modules. These IPs are tailored to address different design requirements, offering customizable topologies that support varied performance needs. Whether you are building a simple communication channel for a small device or a robust network for a large data center, Silicon Hub provides the semiconductor IPs you need to optimize your design.
In summary, exploring the Network on Chip category at Silicon Hub opens the door to innovative solutions for next-generation electronic systems. With these semiconductor IPs, designers gain the tools necessary to overcome traditional constraints, ultimately achieving faster, more efficient, and scalable devices. Whether your focus is low-power IoT devices or high-performance computing systems, Network on Chip technology is key to unlocking enhanced communication capabilities across your products.
Building on the principles of its predecessor, the Akida 2nd Generation IP further enhances AI processing at the edge by integrating additional capabilities tailored for spatio-temporal and temporal event-based neural networks. This second iteration doubles down on programmability and includes expanded activation functions and enhanced Skip Connections, offering significant flexibility for complex applications involving dynamic data streams. A key feature of the Akida 2nd Generation is its innovative approach to sparsity, optimizing the AI model's overall efficiency. The scalable fabric of nodes in this version can adeptly handle various weights and activation bit depths, adapting the computational requirements to suit the application needs effectively. This capability ensures that the Akida 2nd Generation can manage sophisticated algorithms with a heightened level of precision and power efficiency. Furthermore, this IP iteration embraces fully digital neuromorphic implementations, allowing for predictable, cost-effective design and deployment. It minimizes the computational demands and bandwidth consumption of traditional AI models by focusing compute power precisely where needed, ensuring a seamless experience with lower latency and enhanced processing accuracy. Its flexibility in configuration and scalability at the post-silicon stage makes it an essential tool for future-ready AI applications, particularly those that require real-time interaction and decision-making capabilities.
SkyeChip's Coherent Network-on-Chip (NOC) is specifically tailored for memory coherent systems, ensuring scalable and efficient interconnect solutions. It operates at frequencies up to 2GHz and supports protocols such as ACE4 and ACE5. This NOC plays a pivotal role in reducing routing congestion in multi-core systems. It integrates easily with SkyeChip’s non-coherent NOC to support partitioned interconnect implementations, leveraging source synchronous and synchronous clocking methodologies.
The NuLink Die-to-Die PHY for Standard Packaging represents Eliyan's cornerstone technology, engineered to harness the power of standard packaging for die-to-die interconnects. This technology circumvents the limitations of advanced packaging by providing superior performance and power efficiencies traditionally associated only with high-end solutions. Designed to support multiple standards, such as UCIe and BoW, the NuLink D2D PHY is an ideal solution for applications requiring high bandwidth and low latency without the cost and complexity of silicon interposers or silicon bridges. In practical terms, the NuLink D2D PHY enables chiplets to achieve unprecedented bandwidth and power efficiency, allowing for increased flexibility in chiplet configurations. It supports a diverse range of substrates, providing advantages in thermal management, production cycle, and cost-effectiveness. The technology's ability to split a Network on Chip (NoC) across multiple chiplets, while maintaining performance integrity, makes it invaluable in ASIC designs. Eliyan's NuLink D2D PHY is particularly beneficial for systems requiring physical separation between high-performance ASICs and heat-sensitive components. By delivering interposer-like bandwidth and power in standard organic or laminate packages, this product ensures optimal system performance across varied applications, including those in AI, data processing, and high-speed computing.
The Chimera GPNPU from Quadric stands as a versatile processing unit designed to accelerate machine learning models across a wide range of applications. Uniquely integrating the strengths of neural processing units and digital signal processors, the Chimera GPNPU simplifies heterogeneous workloads by running traditional C++ code and complex AI networks such as large language models and vision transformers in a unified processor architecture. This scalability, tailored from 1 to 864 TOPs, allows it to meet the diverse requirements of markets, including automotive and network edge computing.\n\nA key feature of the Chimera GPNPU is its ability to handle matrix and vector operations alongside scalar control code within a single pipeline. Its fully software-driven nature enables developers to fine-tune model performance over the processor's lifecycle, adapting to evolving AI techniques without needing hardware updates. The system's design minimizes off-chip memory access, thereby enhancing efficiency through its L2 memory management and compiler-driven optimizations.\n\nMoreover, the Chimera GPNPU provides an extensive instruction set, finely tuned for AI inference tasks with intelligent memory management, reducing power consumption and maximizing processing efficiency. Its ability to maintain high performance with deterministic execution across various processes underlines its standing as a leading choice for AI-focused chip design.
The ePHY-5616 delivers data rates from 1 to 56Gbps across technology nodes of 16nm and 12nm. Designed for a diverse range of applications, this product offers superior BER and low latency, making it ideal for enterprise equipment like routers, switches, and network interface cards. The ePHY-5616 employs a highly configurable DSP-based receiver architecture designed to manage various insertion loss scenarios, from 10dB up to over 35dB. This ensures robust and reliable data transfer across multiple setups.
Dillon Engineering's 2D FFT core is specifically engineered for two-dimensional digital signal processing, offering critical enhancements in data throughput and resource efficiency. This core is crafted to process two-dimensional data inputs efficiently, making it a perfect fit for image processing and other applications requiring extensive multidimensional data manipulation. The design capitalizes on medium speed and resource usage, using internal or external memory between FFT engines to optimize the data-flow pipeline. This configuration allows the core to handle complex data structures with precision, crucial for industries relying on heavy data processing, such as image analysis and computational graphics. Backed by Dillon’s innovative ParaCore Architect™ technology, the 2D FFT IP ensures adaptable and precise implementation in various FPGA or ASIC contexts. It offers users the flexibility to efficiently address complex data processing challenges, cementing Dillon Engineering's reputation as a leader in advanced signal processing solutions.
The Non-Coherent Network-on-Chip (NOC) by SkyeChip is optimized for bandwidth and latency, making it ideal for reducing silicon wire utilization. Its design significantly enhances power and area efficiency of integrated circuits. It supports various protocols, including AXI4 and AXI5, and is architected to minimize routing congestion. This NOC facilitates high frequency timing closure and supports up to 2GHz operating frequencies, offering seamless integration with coherent NOC systems for partitioned interconnect applications.
Imec's Hyperspectral Imaging System is designed for advanced optical sensing applications. This system integrates state-of-the-art sensors that can capture high-resolution spectral data across a wide range of wavelengths. Utilizing Imec's expertise in compact chip design, the system is engineered to be both portable and efficient, making it suitable for industries such as agriculture, food safety, and environmental monitoring. Its sophisticated image processing algorithms and user-friendly interface allow for seamless integration into existing workflows, providing comprehensive data analysis and reporting capabilities.
Packetcraft's Bluetooth LE Audio Solutions offer a full suite of host, controller, and LC3 components optimized for seamless transition to Bluetooth LE Audio. The platform supports Auracast broadcast audio and True Wireless Stereo (TWS), making it adaptable to prevalent chipsets and providing flexibility to product companies. The modular design facilitates simplified integration, ensuring companies can leverage advanced audio capabilities in a variety of applications. As Bluetooth audio technology evolves, Packetcraft remains at the leading edge, offering industry-leading solutions that cater to modern audio requirements.
UTTUNGA is a high-performance PCIe accelerator card, purpose-built to amplify HPC and AI tasks through its integration with the TUNGA SoC. It effectively harnesses the power of multi-core RISC-V technology combined with Posit arithmetic, offering significant enhancements in computation efficiency and memory optimization. Designed to be compatible with a broad range of server architectures, including x86, ARM, and PowerPC, UTTUNGA elevates system capabilities, particularly in precision computing applications. The UTTUNGA card operates by implementing foundational arithmetic operations in Posit configurations, supporting multiple bit-width formats for diverse processing needs. This flexibility is further complemented by a pool of programmable FPGA gates, optimized for scenarios demanding real-time adaptability and cloud computing acceleration. These gates facilitate the acceleration of complex tasks and aid in the effortless management of non-standard data types essential for advanced AI processing and cryptographic applications. By leveraging a seamless integration process, UTTUNGA eliminates the need for data copying in host memory, thus ensuring efficient utilization of resources. It also provides support for well-known scientific libraries, enabling easy adoption for legacy systems while fostering a modern computing environment. UTTUNGA stands as a testament to the profound impact of advancing arithmetic standards like Posit, paving the way for a transformation in computational practices across industries.
Designed for efficient application in IoT devices and microcontrollers, the FlexWay Interconnect delivers cost-effective connectivity solutions. Its support for ISO26262 ensures reliability in edge devices while its low-power characteristics make it ideal for small-scale integrations. FlexWay provides essential NoC solutions tailored to compact designs with minimal power consumption.
ISPido represents a fully configurable RTL Image Signal Processing Pipeline, adhering to the AMBA AXI4 standards and tailored through the AXI4-LITE protocol for seamless integration with systems such as RISC-V. This advanced pipeline supports a variety of image processing functions like defective pixel correction, color filter interpolation using the Malvar-Cutler algorithm, and auto-white balance, among others. Designed to handle resolutions up to 7680x7680, ISPido provides compatibility for both 4K and 8K video systems, with support for 8, 10, or 12-bit depth inputs. Each module within this pipeline can be fine-tuned to fit specific requirements, making it a versatile choice for adapting to various imaging needs. The architecture's compatibility with flexible standards ensures robust performance and adaptability in diverse applications, from consumer electronics to professional-grade imaging solutions. Through its compact design, ISPido optimizes area and energy efficiency, providing high-quality image processing while keeping hardware demands low. This makes it suitable for battery-operated devices where power efficiency is crucial, without sacrificing the processing power needed for high-resolution outputs.
The Ncore Cache Coherent Interconnect is designed to address the complexities associated with multicore system designs. It ensures efficient data consistency and coherence throughout systems, enhancing the reliability and performance of SoCs. Ncore's coherent interconnect solutions are particularly adept at handling heterogeneous multicore challenges, ensuring high throughput and robust data management necessary for high-performance applications.
Our UHS-II solution is engineered to optimize data transfers under low-voltage conditions, supporting the transmission of high-definition content as demanded by modern mobile devices. This solution caters to environments where power efficiency is as crucial as speed, making it ideal for smartphones and tablets that require rapid data throughput without compromising energy conservation.
The BlueLynx Chiplet Interconnect is a sophisticated die-to-die interconnect solution that offers industry-leading performance and flexibility for both advanced and conventional packaging applications. As an adaptable subsystem, BlueLynx supports the integration of Universal Chiplet Interconnect Express (UCIe) as well as Bunch of Wires (BoW) standards, facilitating high bandwidth capabilities essential for contemporary chip designs.\n\nBlueLynx IP emphasizes seamless connectivity to on-die buses and network-on-chip (NoCs) using standards such as AMBA, AXI, and ACE among others, thereby accelerating the design process from system-on-chip (SoC) architectures to chiplet-based designs. This innovative approach not only allows for faster deployment but also mitigates development risks through a predictable and silicon-friendly design process with comprehensive support for rapid first-pass silicon success.\n\nWith BlueLynx, designers can take advantage of a highly optimized performance per watt, offering customizable configurations tailored to specific application needs across various markets like AI, high-performance computing, and mobile technologies. The IP is crafted to deliver outstanding bandwidth density and energy efficiency, bridging the requirements of advanced nodal technologies with compatibility across several foundries, ensuring extensive applicability and cost-effectiveness for diverse semiconductor solutions.
The UltraLong FFT core from Dillon Engineering is engineered for high-performance digital signal processing in FPGAs and ASICs, leveraging extended lengths for versatile applications. Known for its medium speed and high usage of external memory, this IP accommodates complex data processing demands by using dual FFT engines, optimizing throughput relative to memory bandwidth constraints. Its architecture is ideal for applications extending beyond the limitations of simple radix-2 structures. This IP is adept at balancing workload between hardware resources with medium logic and memory usage. Such balance ensures efficient processing, especially advantageous in applications necessitating extensive data transformations while maintaining resource efficiency. Dillon’s UltraLong FFT is strategically crafted to fit within FPGA architectures like Xilinx, enabling effortless integration and customization to meet bespoke industry requirements. The UltraLong FFT core benefits significantly from Dillon’s ParaCore Architect™ utility, making it highly adaptable to varied processing speeds and performance needs. Engineers can seamlessly retarget this core across different platforms, ensuring flexibility in deployment and implementation success, crucial for next-generation signal processing solutions.
EXTOLL’s Network on Chip (NOC-X) is a versatile solution that addresses the communication needs within sophisticated chiplet designs. The NOC-X is designed to provide a structured network interface that facilitates smooth data flow between different processing units within a chip, ensuring high throughput and minimized data congestion. Its innovative architecture supports high scalability and ensures adaptability with varying tech nodes, making it ideal for integration into diverse semiconductor projects. With emphasis on both performance and efficiency, NOC-X complements chiplet systems by enabling a flexible and robust communication framework. The NOC-X is optimized for low power operation, maximizing performance within constrained power budgets. This makes it suitable for applications that demand heavy data processing and efficient energy utilization, providing key advantages in both consumer electronics and large-scale industrial devices.
The SoC Platform by SEMIFIVE is designed to streamline the system-on-chip (SoC) development process, boasting rapid creation capabilities with minimal effort. Developed using silicon-proven IPs, the platform is attuned to specific domain applications and incorporates optimized design methodologies. This results in reduced costs, minimized risks, and faster design cycles. Fundamental features include a domain-specific architecture, pre-verified IP components, and hardware/software bring-up tools ready for activation, ensuring seamless integration and high performance. Distinct attributes of the SoC Platform involve leveraging a pre-configured and thoroughly validated IP pool. This preparation fosters swift adaptation to varying requirements and presents customers with rapid time-to-market opportunities. Additionally, users can benefit from a reduction in engineering risk, supported by silicon-proven elements integrated into the platform's design. Whether it's achieving lower development costs or maximizing component reusability, the platform ensures a comprehensive and tailored engagement model for diverse project needs. Capabilities such as dynamic configuration choices and integration of non-platform IPs further enhance flexibility, accommodating specialized customer requirements. Target applications range from AI inference systems and AIoT environments to high-performance computing (HPC) uses. By managing every aspect of the design and manufacturing lifecycle, the platform positions SEMIFIVE as a one-stop partner for achieving innovative semiconductor breakthrough.
OPENEDGES’ NoC Bus Interconnect solution is engineered to enhance communication between various components in a chip, ensuring efficient data transfer and resource sharing. It addresses the increasing demands for higher bandwidth and lower latency in complex integrated circuits, making it ideal for applications in AI, data centers, and high-performance computing. The NoC Bus Interconnect optimizes traffic flow within the system architecture, eliminating bottlenecks and enhancing data path efficiency. It supports multi-core configurations, providing a scalable solution to cater to the growing complexity of digital systems. By offering customizable network configurations, this solution allows engineers to optimize data paths tailored to specific application requirements. Moreover, its robust design provides fault tolerance and adaptability, ensuring high reliability in critical applications. This interconnect system reduces latency and improves throughput, making it essential for developers aiming to build advanced, high-performance computing architectures.
aiSim 5 stands as the world's first simulator for automotive applications to achieve ISO26262 ASIL-D certification, ensuring that it meets rigorous safety and reliability standards. This advanced simulator enables high-fidelity simulation for ADAS and autonomous driving systems, helping engineers validate automotive technologies in a virtual setting. A key feature of aiSim 5 is its use of a proprietary rendering engine that handles both the physics-based simulation of environments and exhaustive sensor animatics, presenting a nuanced representation of real-world conditions including varied weather and complex sensor setups. The simulator offers a modular architecture that integrates effortlessly with existing automotive toolchains through open APIs in C++ and Python. Extensive 3D asset libraries and aiFab scenario randomization functionalities add further versatility, allowing developers to simulate a multitude of roadway conditions and events to rigorously test autonomous capabilities. By utilizing AI-based rendering, aiSim 5 optimizes computing resources for efficient operation across multi-sensor configurations, providing unparalleled utility in scenarios extending from highways to urban environments. This tool is being adopted in high-mileage testing setups to enable a new standard of safety in automotive simulation, effectively reducing the reliance on costly real-road trials. Through its advanced simulation capabilities, aiSim 5 minimizes development time and yields a more streamlined and reliable validation process.
The Satellite Navigation SoC Integration solution offers a seamless method to embed satellite navigation capabilities within a System on Chip (SoC). This solution effectively integrates GPS, GLONASS, SBAS, and Galileo channels, along with independent fast search engines for each navigation system, enabling a robust and comprehensive navigation system. Because of its silicon-verified nature and VHDL library-based design, it ensures ease of integration and compatibility with various platforms. Notably, this IP was among the first to be integrated with open hardware architecture such as RISC-V, bolstering its adaptability and performance. The navigation IP features advanced signal processing capabilities that are platform independent, supporting a high update rate that can reach up to 1000 Hz. This high performance is complemented by a user-friendly API, making it accessible for developers to implement in various applications. Its versatility is further demonstrated through the support of a wide range of communication protocols and its ability to work seamlessly with other software services like OpenStreetMaps. This solution is optimal for developers looking to enhance their SoC with precise and reliable satellite navigation functionalities. It is particularly beneficial in modern applications requiring high accuracy and reliability, offering comprehensive features that facilitate a range of applications beyond traditional GPS functions. The integration of this technology enables devices to perform at unprecedented levels of efficiency and accuracy in location-based applications.
The Complete 5G NR Physical Layer solution by AccelerComm is designed to provide exceptional performance for demanding applications in O-RAN and satellite networks. This all-encompassing solution integrates high-accuracy signal processing technology, ensuring optimal link performance and efficient power usage. The physical layer is inherently flexible, allowing performance optimizations tailored to meet specific requirements of specialized network applications. This solution navigates the complex real-world dynamics involved in high-performance network scenarios, including both terrestrial and space-based communications. By leveraging advanced algorithms and architectures, the 5G physical layer supports customizable configurations, leading to power and area efficiency improvements. Through interoperability with multiple hardware platforms, it maximizes the performance of 5G networks, enhancing the user experience by minimizing latency and maximizing throughput. Delivered as openly-licensable intellectual property, the 5G NR Physical Layer can function across a wide range of platforms, such as ARM software and FPGA, ensuring broad compatibility. This strategic approach facilitates quicker project advancements through seamless integration and testing processes on multiple development boards, thereby reducing project risks effectively.
The Xinglian-500 is a sophisticated interconnect fabric developed by StarFive, designed to provide coherent memory consistency and support for multi-core CPUs and SoCs. This IP is instrumental in creating efficient interconnect networks that ensure data consistency across processors, an essential component for building high-performance computing systems. With advanced coherence protocols, the Xinglian-500 simplifies the integration of multiple processing units, optimizing communication pathways and improving system throughput. This makes it particularly suitable for use in data centers and enterprise computing environments, where the demand for zero-latency data exchange and processing is high. This interconnect fabric not only enhances performance but also scales efficiently to support future-proof computing infrastructures. StarFive's innovative approach in its design allows enterprises to build complex computing systems that are both scalable and optimized for maximum performance.
FlexNoC Interconnect enhances timing closure efficiency and reduces wire count in designs, characterized by its capability to provide end-to-end quality of service (QoS). Suitable for complex SoCs, it supports dynamic priority management and congestion control, facilitating effective integration. This interconnect IP can notably shorten turnaround times when compared to manual methods, optimizing power and space without compromising on performance.
Dillon Engineering's Pipelined FFT core is tailored to meet the demands of continuous-stream, efficient signal processing with minimal memory use. This architecture is optimized for applications demanding low-latency data streams with a one-butterfly-per-rank configuration that offers considerable efficiency improvements over traditional FFT methods. This core represents a balance between logic utilization and operational speed, capitalizing on a pipelined layout that ensures continuous data processing flow – a feature highly sought after in real-time applications. Such a layout is ideal for industries where consistent throughput is essential, significantly enhancing operational performance in dense processing environments. The Pipelined FFT's design is supported by Dillon’s ParaCore Architect™ utility, ensuring that it can be effectively integrated into different digital logic platforms quickly. Its configuration supports both fixed and floating-point datasets, broadening its applicability across diverse computational scenarios while minimizing the overhead usually associated with high-speed data transformations.
Designed to enhance infrastructure monitoring, the Concrete Surface Layer Degradation Detection System offers a robust solution for identifying material wear and tear in concrete structures. Using advanced sensor technology, this system provides real-time data on the condition of concrete surfaces, crucial for maintenance and safety assessments. The system enables early detection of potential structural issues, allowing for timely interventions and repairs. This preemptive approach not only extends the lifespan of infrastructure but also reduces the costs associated with unexpected damages. By integrating with existing monitoring frameworks, it ensures seamless upgrades to infrastructure management practices. With applications spanning civil engineering, construction, and urban planning, this detection system is a vital tool for improving safety standards. Its adaptability to various environmental conditions enhances its efficacy across diverse geographical settings, making it an indispensable asset for modern infrastructure projects.
The Mixed Radix FFT core developed by Dillon Engineering offers enhanced versatility for FFT calculations, especially when dealing with non-radix-2 lengths. This core combines various radix configurations, including radix-2, 3, 5, and 7, to accommodate a broader spectrum of input signal lengths, thereby enhancing computational flexibility in diverse applications. Its architecture supports medium speed and memory usage, with medium logic utilization, making it well-suited for processes requiring adaptive data transformation capabilities. This capability is particularly beneficial for applications where data input does not conform to standard length constraints, offering engineers a tailored solution for complex signal processing needs. The Mixed Radix FFT employs Dillon's innovative ParaCore Architect™ technology, enabling swift adaptation to varying hardware settings. A valuable contribution to the array of FFT solutions, this IP stands at the forefront of flexibility, providing a robust platform for engineers to implement advanced digital signal processing tasks with ease and precision.
Marquee Semiconductor specializes in crafting Network-on-Chip (NoC) based systems, focusing on scaling through coherent and non-coherent subsystems and platforms. Their expertise allows them to integrate these systems effectively, creating robust chiplets for scalable solutions. This specialization plays a crucial role in the efficient performance of complex Systems-on-Chip (SoCs), where such integration is necessary to manage the flow of data across various circuits efficiently. These NoC-based architectures facilitate streamlined data communication within the SoC, optimizing bandwidth and reducing latency. This optimization is essential for high-performance computing applications where data must move seamlessly across different components. Marquee’s approach ensures that their NoC systems support both the present and future needs of customers, as their designs are built to accommodate advancements in technology and increased data processing demands. By employing advanced methodologies and a disciplined engineering culture, Marquee creates SoC integrations that are not only effective but also adaptable to diverse application needs. The flexibility and efficiency of these NoC systems are complimented by Marquee's commitment to supporting a wide range of applications, from AI/ML acceleration to complex data management tasks, making them a valuable partner in the development of next-generation semiconductor solutions.
The IMG B-Series GPU encompasses a wide spectrum of performance configurations, catering to diverse market needs from economical set-top boxes to high-end desktop solutions. Its standout feature is the multi-core technology which significantly boosts performance and provides flexibility in multitasking, crucial for handling complex workloads efficiently. The B-Series is crafted to support smooth and sustainable frame rates even under intensive operations, ensuring robust performance across different applications. Its adaptability extends to numerous setups, making it a versatile choice for a range of consumer electronics and computing solutions.
iNoCulator is an innovative solution designed to expedite the development of flexible and configurable Network-on-Chips (NoCs). This comprehensive platform supports NoC creation from initial concepts to system architecture, culminating in RTL simulation, emulation, and implementation. Notable for its user-friendly editing tools, iNoCulator offers complete configuration flexibility and integrates fully with existing EDA environments. This makes it an ideal choice for designers needing seamless and efficient NoC development processes. Its adaptability not only enhances the speed and efficiency of SoC architectures but also significantly reduces time-to-market.
Dillon Engineering's Load Unload FFT core stands out with its focused utility in fast data throughput scenarios within FPGA and ASIC applications. It features a streamlined process for loading and unloading data efficiently, vital for maintaining high processing speeds in dense data environments. This architecture offers improved input/output handling, ensuring minimal latency and supporting intricate signal processing applications. Designed to excel in scenarios where rapid data manipulation is crucial, the Load Unload FFT offers a comprehensive solution to FFT data management, enhancing overall system performance. By integrating high-speed buffer management and optimizing data flow, this core effectively handles vast quantities of data with precision, serving industries that depend on real-time data analytics. The core is engineered for flexibility, compliant with Dillon's advanced design processes that ensure reliable performance across a spectrum of technological applications. The Load Unload FFT’s design is a testament to Dillon's commitment to providing adaptable, high-quality solutions that significantly enhance digital signal processing efficiency.
StarFive's Xinglian-700 represents a leap in interconnect technology, featuring high scalability and performance suitable for advanced SoC and CPU integrations. This IP incorporates cutting-edge coherence protocols and is engineered to support high bandwidth and low latency data communications. Its architecture is optimized to serve multi-core processor arrays and sophisticated system designs, making it an ideal choice for sectors requiring impeccable hardware synchronization and speed. The Xinglian-700 provides reliable, high-performance solutions for next-generation computing needs in a wide array of applications, from server infrastructures to advanced IoT systems. With its capacity to scale and adapt, the Xinglian-700 ensures efficient connectivity and processing power across systems, reinforcing StarFive's reputation for delivering dependable and superior semiconductor solutions.
The Parallel FFT core from Dillon Engineering exemplifies a robust solution for high-performance signal processing tasks, designed with an architecture conducive to maximizing data throughput. Utilizing a full parallel configuration, this core minimizes memory usage while achieving fast data processing speeds, ideally suited for scenarios demanding rapid FFT computations, even exceeding 25 GSPS under optimal conditions. This core’s architecture is particularly beneficial for implementations where consistent speed and memory efficiency are essential. It achieves this by employing constant twiddle factors to simplify multipliers and reduce logic usage, thereby enhancing processing efficiency. This makes the Parallel FFT core an ideal candidate for shorter length FFT operations, typically up to 128 points. Engineers benefit from its seamless integration into numerically intensive applications, where speed and resource utilization are critical. The Parallel FFT’s ability to manage high-speed calculations efficiently makes it a valuable asset for sectors relying on clear, rapid data transformations, ensuring consistent and high-fidelity signal processing capabilities.
The 40G MAC/PCS core exemplifies cutting-edge performance in high-speed network applications. Built to handle 40 Gigabit Ethernet operations, this IP core provides unparalleled ultra-low latency, making it a vital component for enterprises demanding the highest levels of performance in their financial trading platforms. By optimizing MAC and PCS functionalities, this core achieves exceptional data handling capabilities, ensuring efficient and precise data flow even during peak network load conditions. Architecturally, the 40G MAC/PCS core is engineered to seamlessly integrate into existing network infrastructures without significant modifications. It supports a variety of networking protocols and configurations, providing developers the flexibility to tailor its use to specific network requirements. This adaptability is crucial for high-frequency trading environments where network conditions can fluctuate rapidly and unpredictably. Technical advancements incorporated into this IP core include reduced power consumption and enhanced throughput efficiency. It employs sophisticated design techniques to ensure minimal energy use while maintaining peak operational performance, aligning with the industry's increasing focus on sustainable technology solutions. The 40G MAC/PCS not only meets the rigorous demands of current high-speed data environments but also sets a benchmark for future developments in low-latency networking technology.
The 5G ORAN Base Station is designed to revolutionize mobile networking by significantly increasing wireless data capacity. This opens new avenues for various wireless applications and facilitates the integration of advanced technologies into everyday connectivity solutions. Its development is aligned with the latest industry standards to ensure future-proofing of networking capabilities. The ORAN architecture emphasizes open and intelligent wireless technologies, enhancing its functionality and deployment flexibility. The Base Station supports multi-vendor interoperability, which is critical for creating ecosystems where device diversity and customer preferences dictate wireless connectivity. This adaptability leads to reduced costs and enhanced innovation, creating environments that can swiftly adapt to technological change and market demands. Incorporating this base station into a network provides a transformative experience by improving data throughput and network reliability. It operates on a spectrum that supports high-speed data transfers, ensuring that the requirements for emerging data-hungry applications are met efficiently. Moreover, its energy efficiency and support for various deployment scenarios make it an ideal choice for modern telecommunications infrastructures.
The 10G MAC/PCS solution is a high-performance IP core designed for use in FPGA platforms. It provides ultra-low latency for 10 Gigabit Ethernet operations, making it ideal for applications in the financial sector where every nanosecond counts. The 10G MAC/PCS solution focuses on efficient data throughput and minimal latency, ensuring that real-time data processing and high-frequency trading operations perform smoothly and without delays. It utilizes advanced techniques to manage data packets effectively, maintaining consistent performance even during high data traffic scenarios. Its integration capabilities with existing systems make it a flexible choice for developers looking to upgrade network infrastructures without extensive overhauls. Functionally, the core handles Media Access Control (MAC) and Physical Coding Sublayer (PCS) operations, delivering outstanding performance across both layers. Its design ensures seamless interoperability with other networking components, streamlining data exchanges and offering high reliability. The IP core's architecture supports various configurations and adaptability for custom implementations, making it a preferred choice for financial trading systems that require robust performance solutions. On the technical front, the 10G MAC/PCS leverages advanced FPGA frameworks to minimize power consumption and maximize system efficiency. It integrates seamlessly into high-speed networks, offering throughput optimization and deterministic operations. The technical prowess of this core enables financial institutions to achieve greater operational efficiency and enhanced trading algorithm responses, reinforcing Enyx's commitment to pioneering low-latency solutions in the technology space.
The Stellar Packet Classification Platform is a sophisticated technology crafted to handle complex data environments where rapid data packet classification is required. It is capable of managing ultra-high search performances by leveraging extensive rule-based lookups, suitable for Access Control List (ACL) and Longest Prefix Match (LPM) scenarios. The platform processes hundreds of millions of lookups per second, which is vital for maintaining seamless operations in high-speed networks.\n\nStellar's capacity to handle data flows ranging from 25Gbps to over 1Tbps, with support for millions of complex rules and keys up to 480 bits long, marks it as a robust solution for diverse applications. It offers live updates and a seamless integration experience for IPV4/6 address lookups, network routing, and anti-DDos operations, ensuring that it meets the stringent demands of modern network security and communication tasks.\n\nProfessional network environments benefit immensely from Stellar's capabilities, enabling high reliability and performance for tasks such as user plane function (UPF) and border network gateway (BNG) offloads in 5G networks. Its ability to support the rapid adaptation and deployment of network firewalls and DDoS prevention systems places it at the helm of network security infrastructure solutions.
Channel Sounding is the latest advancement in Bluetooth technology, offering high-precision distance measurement and location capabilities. This innovative technology provides a wide range of applications and competitive use cases, suited for environments requiring accurate spatial awareness. With Channel Sounding, users can achieve enhanced accuracy in measuring distances, making it ideal for automotive, industrial, and consumer electronics applications. Available as part of Packetcraft's suite, this solution represents the future of Bluetooth’s role in distance-based measurement technologies.
The Ares Embedded Module is a high-performance system-on-module (SoM) using the Intel Agilex 7 SoC F-Series FPGA. This advanced module provides flexibility and efficiency in executing complex algorithms while integrating numerous functional aspects onto a single chip, leading to reduced power consumption and enhanced system performance. It features an active heatsink tailored specifically for embedded applications, ensuring optimal cooling. The Ares Module is ideal for a wide array of industries, including bioscience, instrumentation, radar systems, and electronic warfare, offering quick design cycles and reducing time to market with its pre-validated components.
The Processor System offering from Akeana combines a suite of advanced IP blocks designed to streamline and accelerate the development of processor systems. Central to this offering are components such as compute coherence blocks, interconnect systems both coherent and non-coherent, and input-output memory management units (IOMMUs). These sophisticated components allow for constructing complete, versatile solutions suitable for a range of technology applications. With capabilities like the Compute Coherence Block (CCB), systems can manage several cores within a cluster, leveraging shared caches and coherent interconnects for optimal data management and performance. The AkeanaMesh provides a CHI-compatible interconnect fabric, essential for building coherent many-core configurations, ensuring seamless data exchange among components. Additionally, the advanced interrupt architecture facilitates control and management over the integrated systems, ensuring reliable performance across embedded and complex environments. By leveraging these IP solutions, developers are equipped to build highly customized processor systems that meet varying computational and operational demands effectively.
FlexGen Smart Network-on-Chip automates the creation of high-performance NoC designs that significantly improve productivity. It features tools to reduce wire length and latency while managing power consumption efficiently. FlexGen accommodates dynamic scaling to handle various complexities and sizes of SoC deployments, ensuring optimized network configurations tailored to specific needs.
The 32G UCIe PHY is engineered to achieve data rates of 32 Gbps per lane, targeting AI, HPC, xPU, and networking applications. Using TSMC's N3P process and CoWoS® packaging, this IP offers bandwidth densities of up to 10 Tbps per 1 mm of die edge. It supports Dynamic Voltage and Frequency Scaling (DVFS) for optimized power consumption and integrates preventive monitoring for sustained reliability in mission-critical environments. These capabilities position it as a leading solution for evolving chiplet-based systems that demand high-speed data transmission and robust system performance.
The NC-NoC offers an advanced, configurable NoC solution that is both scalable and physically aware. It is designed to accommodate multiple clocking schemes, making it suitable for a wide range of applications not requiring coherency. This solution is compatible with various protocols such as AXI4/3, AHB, APB, and AXI-lite, with bus widths ranging from 32 to 2048 bits. Its layered architecture facilitates seamless integration into diverse SoC environments, providing a robust framework for efficient data routing and high system performance. The NC-NoC stands out for its capacity to support complex, multi-protocol operations, delivering reliable and high-speed interconnectivity within SoCs.
The MIPS Sense Data Movement Engines are specifically engineered to handle and process data efficiently within autonomous systems. Designed for applications requiring rapid data processing, such as autonomous vehicles and smart industrial platforms, these engines provide the backbone for effective data transfer and integration. Utilizing state-of-the-art technology, the Sense Data Movement Engines are structured to support vast data streams, enabling devices to interpret and act on collected information in real-time. This feature is crucial for applications that rely heavily on real-time data, such as robotics and automotive platforms, where timing is of the essence. The engines support various protocols to improve communication within systems, fostering enhanced performance and operational consistency. Their implementation within physical AI applications is aligned with the need for high-speed processing and data transfer capabilities, solidifying MIPS’s commitment to pioneering industry-leading solutions that enhance efficiency and intelligence.
Chiplet Solutions by Analogue Insight are pioneering elements in the realm of advanced chip design. These Chiplets act as primary structures supporting assorted systems, enabling high levels of performance and integrative flexibility within complex environments. Serving as core components for sophisticated communication systems, these Chiplets enhance computational capacities, data processing speeds, and connectivity potential. Designed with scalability in mind, these Chiplets facilitate seamless integration into various communication networks. The technology is characterized by its adaptable architecture, supporting versatile applications across different platforms. This ensures that clients can tailor their systems to meet specific requirements without sacrificing performance or compromising on efficiency. Moreover, the system coherency achieved with these Chiplets provides a robust infrastructure. By optimizing processor clusters and enhancing cache functionalities, they aid in reducing processing latency, while seamlessly accommodating specialized co-processors. The Chiplets have proven to be an indispensable asset in delivering efficient energy consumption without compromising on performance, making them ideal for modern systems-on-chip (SoC) applications.
C-NoC represents a major advancement in coherent NoC technology, scheduled for release in the second half of 2023. It supports an array of topologies, including mesh, grid, and torus, and incorporates on-chip L3 cache to reduce latency significantly. This solution is engineered to support multiple protocols such as CHI, AXI4/3, AXI-lite, ACE, and ACE-lite, with adaptability to bus widths from 32 to 2048 bits. C-NoC's versatile design makes it a powerful option for systems that require coherence and high-speed data processing. The integration of robust caching mechanisms ensures optimized data flow and enhanced system efficiency, making it a valuable addition for sophisticated SoC designs.
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