All IPs > Memory Controller & PHY > SDRAM Controller
The SDRAM Controller semiconductor IP is an integral component in digital electronics, facilitating the interaction between a processor and the SDRAM (Synchronous Dynamic Random Access Memory). At Silicon Hub, our collection of SDRAM Controller IPs is engineered to cater to the diverse demands of modern computing and embedded systems.
SDRAM controllers are essential for managing data flow and maintaining synchronization between the CPU and memory modules. They ensure that the SDRAM can be maximally leveraged to meet the requirements of fast data access and large storage capacities intrinsic to today's technology environments. These controllers play a crucial role in applications that require high-speed data processing and efficient memory utilization, such as in personal computers, servers, mobile devices, and consumer electronics.
In our SDRAM Controller category, you will find IPs that support a variety of SDRAM types, including DDR, DDR2, DDR3, and the latest advancements in DDR technology. Each controller is designed to optimize energy consumption while maximizing data throughput, making them suitable for both high-performance and low-power applications. These semiconductor IPs offer customizable features to support diverse system architectures and operational requirements.
Moreover, our SDRAM Controller IPs are rigorously tested for reliability and compliance with industry standards to ensure seamless integration into electronic products. By utilizing these high-quality IPs, designers and engineers can significantly reduce development time and resources, paving the way for innovative product solutions that are both efficient and competitive in the market. Explore Silicon Hub's SDRAM Controller solutions to bring your electronic designs to the forefront of technology.
The Rambus DDR5 Server DIMM chipset is designed to handle high-performance data centers, offering unmatched speed and efficiency. It incorporates Registering Clock Drivers (RCD), Power Management ICs (PMICs), and Temperature Sensors to ensure optimal functioning of DDR5 RDIMMs, significantly boosting data throughput. These components work in harmony to deliver up to 8000 MT/s for RDIMMs and an impressive 12800 MT/s for Multiplexed Rank DIMMs (MRDIMMs), meeting the rigorous demands of next-generation servers. This chipset represents a leap in bandwidth and scalability, allowing data centers to manage larger workloads and advanced analytics seamlessly. By integrating MRT DIMMs and PMICs, the chipset enhances power efficiency while maintaining high-performance levels. Furthermore, its innovative design not only supports the current server configurations but also future-proofs them for technological advancements expected over the coming years. Rambus's DDR5 Server DIMM chipset reflects the company's continued dedication to pushing the envelope in memory technology, making it an ideal choice for enterprises focused on adopting cutting-edge computing infrastructure. With support for high-speed data operations, this chipset plays a crucial role in upgrading server capabilities, enabling faster access times and improved data integrity.
CrossBar's ReRAM Memory is designed to redefine data storage with its high-density and energy-efficient characteristics. The memory solution can achieve terabyte-scale storage on-chip, significantly surpassing traditional flash memory solutions in both speed and power consumption. Offered in a 3D cross-point architecture, it is capable of providing high performance with minimal layout overhead. Engineered for next-generation applications, this ReRAM technology boasts a performance edge with 20ns read times and 12µs write capabilities, eliminating the usual erase latency. It is significantly faster than traditional NAND flash with its lightning-fast read and write speeds, making it suitable for real-time processing required by cutting-edge applications such as AI and IoT. Security is a key feature, offering tamper-resistant provisions for cryptographic key storage ensuring robust protection against data breaches. The memory solution leverages advanced technology to deliver energy savings of up to 5x compared to eFlash, and up to 40x when compared to BLE, positioning it as an ideal choice for mobile and low-power applications.
The EZiD211, also known as Oxford-2, is a leading-edge demodulator and modulator developed by EASii IC to facilitate advanced satellite communications. It embodies a sophisticated DVB-S2X wideband tuner capable of supporting LEO, MEO, and GEO satellites, integrating proprietary features like Beam Hopping, VLSNR, and Super Frame applications. With EZiD211 at the helm, satellite communications undergo a transformation in efficiency and capacity, addressing both current and future demands for fixed data infrastructures, mobility, IoT, and M2M applications. Its technological forefront facilitates seamless operations in varied European space programs, validated by its full production readiness. EZiD211's design offers a unique capability to manage complex satellite links, enhance performance, and ensure robust and reliable data transmission. EASii IC provides comprehensive support through evaluation boards and samples, allowing smooth integration and testing to meet evolving satellite communication standards.
Digital Blocks' AXI4 DMA Controller is a robust solution designed for transferring data efficiently between systems over the AXI4 interface. Supporting up to 16 independent channels, it excels in high data throughput both for small and large data sets. Its capabilities are extended with advanced DMA features, allowing custom configurations to minimize silicon usage and licensing costs. Precise control over DMA operations is facilitated through its customizable settings, supporting a flexible range of interface buses and addressing modes.
SkyeChip's DDR5/4 PHY & Memory Controller delivers efficient, low-power solutions that comply with DDR5 (JESD79-5) and DDR4 (JESD79-4) JEDEC standards. With support for rates up to 4800 MT/s and upgradeability to 6400 MT/s, this product is engineered for high performance and area efficiency. Its features include flexible PHY with intelligent interface training, receiver DFE, and transmitter FFE for optimal signal processing. It supports a wide range of configurations, including x4, x8, and x16 SDRAMs, and advanced extensions such as 3DS and multiple rank support, making it suitable for diverse applications.
The Ultra-Low Latency 10G Ethernet MAC from Chevin Technology is designed for FPGA applications that prioritize speed and efficiency. This IP core achieves exceptional data transfer rates with minimized latency, making it ideal for projects where time-sensitive communication is critical. Its design focuses on reducing the complexity and power consumption typical of high-speed Ethernet solutions. A key advantage of this ultra-low latency MAC is its ability to operate without the need for additional CPUs or software, thanks to its all-logic architecture. This not only simplifies integration but also reduces the overall footprint of the design, allowing more space for other functionalities within the FPGA. Targeting industries such as defense and data storage, this Ethernet MAC ensures high reliability and performance. It allows for seamless implementation into various FPGA platforms, demonstrating Chevin Technology's commitment to versatile and adaptable design solutions that meet specific industry needs.
The ReRAM IP Cores for Embedded Non-Volatile Memory are crafted to seamlessly integrate into microcontrollers (MCUs) and systems on chips (SOCs), addressing the enduring need for efficient and scalable storage. These IP cores leverage CrossBar's signature 3D ReRAM technology to provide unparalleled performance in both speed and density, tailored specifically for embedded systems. Designed to offer superior integration capabilities, this ReRAM technology reduces traditional bottlenecks witnessed with embedded flash memory solutions. It allows for rapid data access and storage, making it a superior choice for applications requiring frequent read/write operations. By offering robust tamper-resistance for secure key storage, these IP cores also add an additional layer of security critical for modern embedded systems. They enable cost-effective scalability and flexibility for manufacturers looking to enhance their products with cutting-edge memory technology.
The 10G Ethernet MAC and PCS from Chevin Technology offers a high-performance solution for FPGA-based applications requiring efficient data transfer. Designed to maximize link utilization, this IP core provides sustained high throughput with minimal latency, utilizing a compact architecture that saves space and power. The core is suitable for environments that demand reliable Ethernet connectivity, ensuring optimal performance in FPGA designs. This IP core is particularly beneficial for energy-conscious applications as it operates with lower power consumption compared to solutions requiring additional CPU or software components. The design is optimized for both Intel and AMD FPGAs, providing a versatile solution that is easy to integrate into existing projects. By providing robust data transfer capabilities, the 10G Ethernet MAC and PCS core supports cutting-edge applications in fields such as industrial imaging, data storage, and scientific research. Its design ensures that users can implement multiple cores within a single FPGA, offering flexibility and scalability for a range of Ethernet needs.
TwinBit Gen-1 stands as a cutting-edge, logic-based non-volatile memory suitable for 180nm to 55nm process nodes. It prides itself on remarkable endurance, capable of performing over 10,000 programming cycles. This IP macro is designed for integration into CMOS logic processes without extra masking steps, easing the implementation in advanced technology nodes. The TwinBit Gen-1 series is well-adapted for a diverse range of applications, including IoT devices, microcontrollers, FPGAs, and ASICs with embedded NOR FLASH, offering memory sizes from 64 bits to 512K bits. It provides a high-density, small-area solution, which is particularly beneficial for applications requiring field-rewritable firmware or secure data storage. This memory technology ensures low-voltage and low-power operations, accommodating automotive industry standards through compliance with AEC-Q100. TwinBit Gen-1 includes built-in test circuits that allow for stress-free testing, ensuring reliability in diverse operating conditions. The technology also supports low-cost manufacturing and faster development turnaround times.
EverOn is sureCore's revolutionary Single Port Ultra Low Voltage (ULV) SRAM, offering significant power reductions. Proven on the 40ULP BULK CMOS process, it provides up to 80% dynamic power savings and 75% static power reduction. This memory operates across an impressive voltage range, from 0.6V to 1.21V, allowing it to support applications demanding extreme energy efficiency. The ULV compiler accommodates memory capacities from 8Kbytes to 576Kbytes and sustains a wide operational voltage spectrum. Architecturally, EverOn supports dynamic voltage and frequency scaling, using a single supply rail to simplify integration. SMART-Assist technology ensures reliable operation even at retention voltages, with architectural innovations that enhance system flexibility. By supporting various power-down states and bank control options, EverOn allows designs to be tailored specifically to varying operational conditions, making it ideal for wearable technology and IoT products. With its groundbreaking power-saving features and robust operational profile, EverOn stands as an ideal choice for developers aiming to extend battery life without compromising SRAM performance.
Dolphin Technology offers a comprehensive range of memory IP products, catering to diverse requirements in semiconductor design. These products include a variety of memory compilers, specialty memory, and robust memory test and repair solutions such as Memory BIST. Designed to meet the demands of contemporary low-power and high-density applications, these IPs are built to work across a broad spectrum of process technologies. Advanced power management features, like light and deep sleep modes and dual rails, enable these products to tackle even the toughest low-leakage challenges. What sets these products apart is their flexibility and adaptability, evident in the support for different memory types and process nodes. Dolphin Technology’s memory IPs benefit from seasoned design teams that have proven their mettle in silicon across several generations. Thus, these IPs are not only versatile but also reliable in serving a wide variety of industry needs for technology firms worldwide. Clients can expect memory solutions that are fine-tuned for both power efficiency and performance. Additional capabilities such as power gating cater to ultra-low power devices while achieving a high level of device integration and compatibility. The specialized focus on low noise and rapid cycle times makes these memory solutions highly effective for performance-driven applications. These features collectively make Dolphin Technology’s memory IP an invaluable asset for semiconductor designers striving for innovation and excellence.
Optimized for precision and speed, the MVDP2000 series sensors feature a capacitive sensing technology. These pressure sensors are digitally calibrated for temperature and pressure, offering low power consumption and fast readings. Perfect for applications where reliable and precise pressure measurements are critical, these sensors support a variety of industrial uses, including gas flow instruments and filter monitoring.
The AST 500 and AST GNSS-RF represent cutting-edge semiconductor solutions in the realm of GNSS technology. These chips are meticulously designed to enhance the performance of Global Navigation Satellite Systems, allowing them to function with heightened accuracy and reliability. With advanced RF front-end technologies, these ICs efficiently handle GNSS signals across multiple satellite systems, ensuring robust connectivity and precise location tracking. Leveraging state-of-the-art process technology, AST 500 and AST GNSS-RF chips are fabricated in leading semiconductor foundries, providing superior signal integrity and low noise performance. These ICs are engineered to perform optimally under various environmental conditions, making them suitable for both commercial and defence applications. Their compatibility with systems such as GPS, GLONASS, and Galileo ensures versatility and global applicability. By integrating these chips, devices can achieve improved positioning accuracy and faster time-to-first-fix, making them an ideal choice for navigation-centric products across multiple industries, including automotive and aerospace.
The High Speed Data Bus (HSDB) IP Core is engineered to provide a seamless PHY and Mac layer implementation that is fully compatible with the HSDB standard. It is specifically designed for easy integration, offering a user-friendly interface that can be incorporated into a variety of systems without a hitch. Known for its exceptional throughput, this core ensures F-22 aircraft compatibility, making it a robust choice in demanding avionics applications. This IP core excels in establishing reliable high-speed communication links, crucial for applications where data integrity and timing are paramount. By facilitating streamlined data flow with minimized latency, the HSDB IP Core enhances operational efficiency significantly. It is an ideal solution for environments requiring stringent adherence to high data rates and precise timing protocols.
Designed to ensure reliable communication in automotive networks, the TSN Switch for Automotive Ethernet orchestrates robust timing and synchronization across multiple network components. It leverages Time-Sensitive Networking (TSN) standards to guarantee real-time performance and low latency, which are critical in vehicular communication systems. This switch is pivotal for managing complex data flows in automobiles, supporting advancements in autonomous vehicle technologies by enabling the seamless integration of various data streams. The switch is engineered to align with the increasing demands for high-speed connectivity in modern automobiles. With a focus on enhancing safety and operational efficiency, it allows for precise control over packet transmission, minimizing the risk of data collisions and ensuring that high-priority information is accurately transmitted through the network. This focus on precise data management makes the TSN Switch vital for deploying advanced driver-assistance systems (ADAS) and infotainment solutions. By incorporating TSN protocols, this switch enhances the reliability of vehicle networks, thereby facilitating a safer and more interconnected driving experience. It supports the integration and coordination of sensors, processors, and communication networks within the vehicle, making it an indispensable component in the development of next-generation smart transportation solutions.
Certus Semiconductor's Digital I/O solutions are engineered to meet various GPIO/ODIO standards. These versatile libraries offer support for standards such as I2C, I3C, SPI, JEDEC CMOS, and more. Designed to withstand extreme conditions, these I/Os incorporate features like ultra-low power consumption, multiple drive strengths, and high levels of ESD protection. These attributes make them suitable for applications requiring resilient performance under harsh conditions. Certus Semiconductor’s offerings also include a variety of advanced features like RGMII-compliant IO cells, offering flexibility for different project needs.
The Bipolar-CMOS-DMOS (BCD) technology is purpose-built for power management applications requiring superior efficiency and control. By merging bipolar, CMOS, and DMOS transistors, this technology supports the development of integrated circuits capable of handling high voltages and currents. Its integrated nature enables compact design and high performance, particularly ideal for use in consumer electronics where space and heat dissipation are critical considerations. The BCD process excels in providing reliable performance in power switching and regulation tasks, vital for extending battery life in portable devices. This technology perfectly suits applications in the automotive and industrial sectors where robust power management is critical. Its ability to withstand high current loads and environmental stresses contributes to its selection in designing durable and efficient power systems.
YouDDR is a comprehensive technology encompassing not only the DDR controller, PHY, and I/O but also features specially developed tuning and testing software. It provides a complete subsystem solution to address the complex needs of DDR memory interfaces. The integrated approach allows for cohesive synchronization between the controller and PHY, optimizing performance and reliability. The YouDDR technology ensures seamless integration into a variety of platforms, supporting a broad range of applications from simple consumer electronics to advanced computing systems. By offering enhanced tuning capabilities, it allows developers to fine-tune performance metrics, ensuring that systems can operate within their optimal performance windows. Developers utilizing YouDDR benefit from a thoroughly tested and verified subsystem that significantly simplifies the design cycle. This not only reduces development time but also enhances the likelihood of first-pass success, providing a competitive edge in manufacturing efficiency and product launch speed.
TwinBit Gen-2 builds upon the foundation of its predecessor by supporting more advanced process nodes from 40nm to 22nm. Like the Gen-1 version, it is integrated into CMOS processes without necessitating additional masks or processing steps. This technology incorporates the novel Pch Schottky Non-Volatile Memory Cell, facilitating ultra-low-power operation. With the Gen-2, users gain access to a memory solution that handles both programming and erasing effectively through controlled hot carrier injection. This is achieved through intelligent cell bias manipulation, ensuring optimal performance. The process of hot-hole and hot-electron generation is finely distributed to maintain integrity during both program and erase operations. TwinBit Gen-2 is specifically advantageous for applications that demand ultra-low-power memory solutions. Its structure caters well to IoT and automotive applications where energy efficiency and reliability are paramount. Maintaining compactness and efficiency, this IP further enhances NSCore's portfolio in serving advanced technological requirements.
The Aeonic Integrated Droop Response System sets a new standard in addressing voltage droop issues within integrated circuits through its advanced droop detection and response capabilities. It is uniquely engineered to provide rapid, fine-grained DVFS capabilities, allowing significant reductions in system power requirements. With multi-threshold detection features and support for remote/local droop detection, this system effectively facilitates monitoring and management of critical silicon health metrics. The robust observability and programmability features make it an indispensable asset for adapting to silicon aging and optimizing lifecycle analytics.
The LEE Flash G2 transcends traditional flash memory with its advanced features and innovative use of SONOS technology. Constructed to redefine the potential of non-volatile memory (NVM) systems, G2 stands out with its ability to perform read operations at standard VDD levels. By minimizing high voltage areas within the memory block, G2 enables seamless connectivity between memory cells and logic circuits, fostering the direct integration of NV-SRAM functionality within larger systems. This unique capability stems from G2's design, which integrates SONOS transistors with advanced switching elements to offer unprecedented functionality. The low programming current, in picometric amplitude, mirrors a fraction of what is required for floating-gate technologies, presenting designers with extensive flexibility in chip architecture. The extended feature set of G2 further elevates its value, particularly for applications needing rapid data transfer, such as MCU and SoC developments. G2's proprietary NV-SRAM design allows for efficient data transfer between SRAM and non-volatile memory, providing a robust solution for applications requiring swift power cycling without data loss. It eliminates the need for separate flash blocks and interconnect interfaces, thereby streamlining design processes and reducing material costs. This makes the G2 particularly suitable for high-performance embedded systems, facilitating quicker startups and power-responsive operations.
T-Head Semiconductor's Zhenyue 510 is a high-performance SSD controller tailored for enterprise-grade solid-state drives. This controller is intricately engineered to handle large-scale data processing with enhanced reliability and speed. It integrates innovative memory management techniques that maximize the effectiveness of storage solutions, thereby supporting modern data-driven applications in various industries. The Zhenyue 510 boasts advanced error correction mechanisms and efficient power mode management, which together ensure robust data integrity and energy efficiency. Its architecture allows for seamless integration with existing server infrastructures and supports an extensive set of storage interfaces, facilitating versatile deployment options for enterprise users. These features combine to deliver a balance of speed and dependability essential for sustaining the performance demands of high-end applications. With its focus on optimizing NAND performance, the Zhenyue 510 excels in sequencing large datasets, making it indispensable for workloads that thrive on quick data access and manipulation such as databases and real-time analytics. Its design underpins T-Head Semiconductor's mission to deliver components that not only meet but exceed the rigorous expectations of contemporary technology landscapes.
This Secondary/Slave PHY is intended for the memory side, offering high-speed, low-power protocols for data transfer. Following the JEDEC standards for LPDDR4/4X/5, it promotes efficient communication in various devices, especially AI and memory-intensive solutions. Although designed for TSMC's 7nm technology, its flexible architecture allows adaptation across different processes and memory configurations.
PermSRAM offers a flexible non-volatile memory solution designed for seamless integration with standard CMOS processes from 180nm to 28nm and potentially beyond. Its key features include one-time programmable and pseudo multi-time capabilities with a variety of memory configurations, ranging from 64 bits to 512K bits. Notably, PermSRAM incorporates a non-rewritable hardware safety lock, which is ideal for secure storage of codes. This memory macro caters to applications requiring high security and reliability such as security code storage and program management. It provides a robust solution with stable yield performance, making it an excellent choice for various security-sensitive uses. Furthermore, it eliminates the need for additional charging circuits by operating with a typical system board voltage of 5V, which leads to significant savings in silicon area. PermSRAM is structured to handle stress-free testing environments thanks to its built-in self-test circuits, maintaining efficiency even under demanding conditions. Its small silicon footprint and highly secure data storage make it suitable for a comprehensive set of applications, including analog trimming, gamma correction, and chip identification solutions.
The RecAccel N3000 AI Inference Chip is specifically crafted for accelerating DLRM (Deep Learning Recommendation Model) workloads in data centers. This cutting-edge accelerator boasts the ability to perform one million DLRM inferences per joule of energy, showcasing its high power efficiency and sustainability. What truly sets the RecAccel apart is its ability to maintain top-tier inference accuracy, achieving INT8 DLRM accuracies close to that of FP32 at 99.97%. Power consumption efficiency stands at the heart of the RecAccel N3000's design philosophy, running models with minimal energy input, which is crucial for modern AI applications demanding sustainable infrastructure. Particularly in today's data-driven landscape, this chip's ability to sustain high recommendation inferences while minimizing power consumption addresses a critical challenge faced by many enterprises. Strategically developed for the AI inference landscape, the RecAccel N3000 aligns with Neuchips' vision of delivering solutions that not only drive performance but also emphasize environmental stewardship through energy-efficient technologies. Its role extends beyond product offerings, contributing significantly to Neuchips' reputation for innovation in AI-specific integrated circuits.
ISPido is a powerful and flexible image signal processing pipeline tailored for high-resolution image processing and tuning. It supports a comprehensive pipeline of image enhancement features such as defect correction, color filter array interpolation, and various color space conversions, all configurable via the AXI4-LITE protocol. Designed to handle input depths of 8, 10, or 12 bits, ISPido excels in processing high-definition resolutions up to 7680x7680 pixels, making it highly suitable for a variety of advanced vision applications. The architecture of ISPido is built to be highly compatible with AMBA AXI4 standards, ensuring that it can be seamlessly integrated into existing systems. Each module in the pipeline is individually configurable, allowing for extensive customization to optimize performance. Features such as auto-white balance, gamma correction, and HDR chroma resampling empower developers to produce precise and visually accurate outputs in complex environments. ISPido's modular and versatile design makes it an ideal choice for deploying in heterogeneous processing environments, ranging from low-power battery-operated devices to sophisticated vision systems capable of handling resolutions higher than 8K. This adaptability makes it a prime solution for developers working across various sectors demanding high-quality image processing.
SuperFlash® Technology stands out as a cost-effective and high-performance solution, utilizing a proprietary split-gate Flash memory cell. It provides exceptional programmability for System-on-Chip (SoC) applications. Renowned for its reliability, SuperFlash® technology has been in production for over two decades, ensuring robust solutions for industries such as automotive, IoT, AI, and secure smart cards. Its impressive endurance, excellent data retention, and resilience to high temperatures make it an optimal choice for demanding environments. The architecture simplifies the design process while maintaining compatibility with standard silicon CMOS processes, extending scalability from larger nodes down to 110 nm technology. Its immunity to Stress-induced Leakage Current (SILC) enhances its reliability further. Available through flexible licensing options, SuperFlash® technology is employed by leading foundries and Integrated Device Manufacturers worldwide. This technology's availability spans a broad range of process nodes, from 28 nm to 500 nm, ensuring wide applicability in next-generation memory solutions. SuperFlash®'s impressive track record with over 90 billion units shipped underscores its innovation and reliability in the market.
DRAM memory modules from Avant Technology are engineered to meet the demands of applications requiring both speed and large capacity. Known for their rapid data access and storage capabilities, DRAM modules are indispensable in gaming, point-of-sale systems, and medical equipment where quick data retrieval is essential. Avant's DRAM modules adhere to JEDEC standards and offer a variety of configurations like UDIMM, SODIMM, and ECC DIMM, catering to both industrial and consumer requirements. These modules are designed for high performance, supporting interfaces like DDR3, DDR4, and DDR5, which are critical for maintaining system efficiency and reliability. Designed to operate in diverse temperature ranges, Avant’s DRAM solutions can handle both industrial and commercial environments. Whether for gaming consoles or medical devices, these memory modules provide the necessary bandwidth and low power consumption needed for high-demand tasks.
Designed to address the evolving power needs of integrated circuits, Xenergic's High-Speed Low-Power SRAM emerges as a leading solution for energy-conscious applications. By optimizing both dynamic power and leakage, this SRAM offers a 70% to 90% reduction in power usage, making it ideal for sensors, wearables, and other low-power devices. Its architecture allows for high efficiency in edge computing applications, minimizing latency while bringing computation closer to the data source.\n\nWith critical features like reduced leakage and dynamic power consumption, this SRAM ensures that your SoC stays competitive in terms of power efficiency. By enabling the SoC to serve multiple features without significant energy drain, it becomes a perfect match for always-on mobile and IoT applications, enhancing user convenience and experience. The SRAM integrates seamlessly into existing designs, aided by comprehensive memory interface views and support for a range of standard optional memory features.
The AHB-Lite Memory module is a fully parameterized component tailored for integration in AHB-Lite based designs. As a soft IP, it provides flexible and efficient on-chip memory access, offering a simple integration path into various system architectures. This memory module is crafted to support a wide array of applications that require dependable and swift data storage solutions. Roa Logic has designed this component to embody high reliability and operational efficiency. The memory’s design is optimized for quick data retrieval and storage, making it a critical component for applications that demand immediate access to data. Its adaptability accommodates different data storage requirements, ensuring that it aligns with the performance demands of contemporary embedded systems. The AHB-Lite Memory module guarantees seamless integration and stable operational capacity, reinforcing Roa Logic's dedication to offering solutions that drive system performance. Its configurable design ensures it's well-suited to both small-scale and expansive architectures, maintaining efficiency across diverse computing environments.
Non-Volatile Memory (NVM) Solutions are engineered for reliability and long-term data retention, crucial for devices requiring memory persistence even in power-off conditions. This technology underpins key storage applications across various sectors, including automotive and industrial markets. Tower Semiconductor's NVM solutions offer a variety of cell structures tailored to meet specific high-performance criteria, including low power consumption and high density. These attributes make them suitable for both consumer electronics and embedded systems where consistent memory access is vital. Enhanced by proprietary technologies like Y-Flash and e-Fuse, these NVM solutions provide customizable options for tailored memory designs, allowing for significant improvements in device functionality and security. The adaptability of these solutions ensures their relevance in an ever-growing technological landscape.
Spectral CustomIP features silicon-proven specialty memory architectures perfect for diverse IC applications. Renowned for its wide range of memory architectures, CustomIP provides designers with options that include Binary and Ternary CAMs, multi-port memories, and cache, among others. These architectures are built on high-density, low-power designs, emphasizing performance while minimizing power usage. CustomIP, part of Spectral's Memory Development Platform, comes in source code format, enabling users to modify and extend design capabilities as necessary. CustomIP integrates SpectralTrak technology, offering PVT monitoring that dynamically adjusts memory timing in response to environmental factors. This ensures stability and high performance across various conditions. CustomIP's flexibility sees it employed in networking via SpectralTCAMs, graphics through SpectralMPorts, and low voltage applications like consumer electronics and healthcare devices with unique options like SpectralLVSRAM and SpectralHRAM. Broad configurations are available, facilitating integration into complex systems. With options for depth reaching 16K Words and data widths extending to 288 bits, the CustomIP suite supports myriad application requirements. Architectures include multiple bank setups and read/write port options, providing versatility for advanced chip designs. The platform's support of BIST, ECC, and test modes, alongside optional rights to modify, offers users a comprehensive set of tools to achieve their desired outcomes.
Designed to provide comprehensive weather monitoring, the MVWS4000 series integrates humidity, pressure, and temperature sensors into a single compact package. Utilizing Silicon Carbide technology, these sensors are fine-tuned for durability and an ultra-low power footprint, making them suitable for sensitive and energy-efficient applications in various environments.
CrossBar's ReRAM IP Cores for High-Density Data Storage are tailored to enhance the memory capacity of various devices beyond current possibilities. These cores are designed with CrossBar's advanced ReRAM architecture which enables stacking technology to achieve ultra-dense data storage solutions. This level of memory sophistication is ideal for applications requiring massive data archiving and real-time data analytics, delivering energy-efficient storage at a fraction of the power needed by traditional HDD or SSD solutions. The ReRAM architecture provides rapid read/write cycles, catering to applications demanding high throughput and low latency. Incorporating CrossBar’s secure storage capability, this core ensures data integrity and security are maintained without sacrificing performance. It is an optimal choice for data-driven sectors striving to manage vast pools of information rapidly and effectively, setting a benchmark for future storage solutions.
The IPM-NVMe Device is crafted to empower developers to build custom hardware accelerators and SSD-like applications. Offering a high degree of customization, it acts as a foundation upon which cutting-edge applications can be realized. With its NVMe compliance, developers can integrate this IP to create high-performance storage solutions that are both adaptable and efficient. This module's versatility is exemplified by its support for enhanced data transfer rates, making it a suitable choice for environments demanding rapid data processing. The IPM-NVMe Device can be deployed in scenarios that require robust data handling capabilities while maintaining performance integrity. Designed with modularity in mind, the IPM-NVMe Device IP allows for the implementation of custom features, facilitating innovations such as new data management protocols, hardware accelerations, and more. Its deployment simplifies the challenging task of creating bespoke SSD solutions tailored to specific market needs and technological advancements.
Featuring G15, this IP is optimized for 2KB correction blocks, suitable for NAND devices with larger page sizes, such as 8KB. The design is aligned with methods seen in the G14X, but it extends its reach with longer codewords for comprehensive coverage of high-density NAND. The design supports a wide array of block sizes and configurational setups, making it highly adaptable to varying design needs. Additional error correction capabilities can be integrated based on client requirements, reinforcing its bespoke delivery.
Ziptilion BW significantly boosts bandwidth, offering an increase of up to 25% in (LP)DDR bandwidth without requiring additional power. This enhancement allows for more efficient and robust system operations, critical for systems relying on high data throughput. The Ziptilion BW solution embeds advanced compression techniques to dynamically manage bandwidth, ensuring data moves faster and network performance remains consistent. Particularly useful in systems requiring seamless data transfer and high efficiency, Ziptilion BW stands out by reducing power demands even as data throughput increases. It uses intelligent compression to facilitate rapid data exchanges, a crucial component for applications needing constant high-speed data access, such as streaming services, online gaming, and large-scale server applications. By enhancing bandwidth efficiency, Ziptilion BW also contributes to reducing latency, a crucial aspect in high-performance computing where timing and speed are of the essence. This can significantly improve user experience in both consumer-grade and enterprise-level applications, ensuring that data flow remains uninterrupted and efficient under load.
The Crest Factor Reduction (CFR) technology from Systems4Silicon is designed to optimize power amplifier efficiency by managing the peaks of signal envelopes. Known as FlexCFR, this IP core solution works independently of communication standards, making it adaptable to any target ASIC, FPGA, or SoC. This highly configurable technology is particularly effective at increasing power efficiency in complex RF systems, such as those found within multi-carrier and multi-user environments. By focusing on tailoring the signal envelope, FlexCFR ensures robust performance and system efficiency.
Designed for aiding seamless integration with memory systems, Eliyan's NuLink Die-to-Memory PHY products provide robust solutions for breaking the memory wall in high-performance computing and AI systems. These PHY products advocate the use of simultaneous bidirectional (SBD) signaling, improving efficiency by allowing data to be transmitted and received simultaneously, doubling the bandwidth capacity instantly. NuLink technology excels in configuring lanes for unidirectional and half-duplex bidirectional signaling, all on standard organic packaging with bump pitches starting at 90um. Eliyan's NuLink PHY expands memory bandwidth without necessitating advanced packaging like silicon interposers, making it a cost-effective solution for implementing universal memory interfaces. These interfaces further enhance interoperability across various memory types and settings, ensuring superior performance and flexibility.
The G13/G13X series is tailored for 512B correction blocks, particularly used in NAND setups with 2KB to 4KB page sizes. While both variants are crafted to manage the demands of SLC NAND transitions to finer geometries, the G13X allows for correction of a higher number of errors. Designed to fit seamlessly into existing controller architectures, it enables extensions of current hardware and software capabilities without extensive new investments. It offers area optimization through parameter adjustments and supports a range of channel configurations for broad applicability.
The NuRAM Low Power Memory represents a state-of-the-art memory solution utilizing advanced MRAM technology. Engineered to provide rapid access times and extremely low leakage power, NuRAM is significantly more efficient in terms of cell area compared to traditional SRAM, being up to 2.5 times smaller. This makes it an ideal replacement for on-chip SRAM or embedded Flash, particularly in power-sensitive environments like AI or edge applications. The emphasis on optimizing power consumption makes NuRAM an attractive choice for enhancing the performance of xPU or ASIC designs. As modern applications demand higher efficiency, NuRAM stands out by offering crucial improvements in power management without sacrificing speed or stability. The technology offers a compelling choice for those seeking to upgrade their current systems with memory solutions that extend battery life and deliver impressive performance. NuRAM is particularly beneficial in environments where minimizing power usage is critical while maintaining high-speed operations. This makes it a preferred choice for applications ranging from wearables to high-performance computing at the edge.
The TimeServoPTP is an advanced system timer designed for FPGAs that enhances the capabilities laid out by the standard TimeServo, incorporating an IEEE 1588v2 PTP compliant ordinary clock implementation directly into the FPGA hardware. This solution enables both 1-step and 2-step synchronization with external network time masters, facilitating precise timekeeping with minimal drift. This single-component solution operates independently, providing accurate synchronized time across different network applications. It supports a variety of output configurations, adapted for unique user requirements, each capable of outputting a distinct pulse per second at designated times according to user-supplied clocks. Operating with atomic resolution, the TimeServoPTP is equipped with sophisticated logical controls and a Gardner Type-2 Digital Phase Locked Loop, making it ideal for distributed systems where precise timekeeping is essential. Designed with high compatibility, it functions across leading FPGA devices from Intel and Xilinx, ensuring wide feasibile deployment across technological environments.
The DDR Memory Controller by OPENEDGES acts as the central management hub for memory operations, coordinating transactions, and optimizing data flow between the processor and memory. This component is critical for managing memory access in multicore systems, optimizing latency and throughput for complex computing tasks. With its advanced scheduling and pre-fetch algorithms, the DDR Memory Controller enhances data access times significantly, reducing bottlenecks and improving overall system throughput. Its intelligent control mechanisms allow for seamless transitions between active and idle states, further promoting efficiency in energy consumption. The controller is engineered to support a wide range of DDR standards, ensuring flexible compatibility with various DRAMs. Its architecture inherently improves system performance through tight integration with other subsystems, particularly within memory-intensive applications where efficiency and speed are paramount.
The MGNSS IP Core is an essential component for integrating GNSS capabilities into a wide range of devices. Designed to be highly adaptable, it provides a comprehensive solution for implementing satellite navigation features in electronic systems, offering seamless integration across different platforms. This IP Core supports all major navigation systems, including GPS, GLONASS, and BeiDou, to provide a globally unified navigational experience. Utilizing advanced algorithms, the MGNSS IP Core enhances the positioning accuracy and efficiency of host devices, thereby supporting real-time navigation applications. Optimal for use in various markets, such as automotive, industrial, and mobile technologies, the MGNSS IP Core ensures devices can perform accurate and reliable navigation operations. It comes with configurable design options, allowing designers to tailor its functionalities according to specific application needs.
The Fast Access Controller is a sophisticated IP solution aimed at enhancing Design-for-Test capabilities and increasing support for Flash programming in production environments. The FAC bridges crucial components such as microcontrollers, ASICs, and SoCs with the flash memory, facilitating accelerated programming over the 1149.1 bus. Its key innovation is in supporting rapid reconfiguration and sophisticated debugging, lowering the barriers to efficient product development cycles.
Xenergic's Ultra-High-Speed SRAM is a game-changer in the domain of high-performance applications. This memory solution excels at delivering speeds approximately 30% faster than the competition, while maintaining or reducing power consumption and area footprint. It is crafted to meet the rigorous demands of high-speed communications, data-intensive AI, and other big data applications where real-time data processing is crucial.\n\nThe standout feature of this SRAM is its ability to prevent bottlenecks in memory, ensuring that high-performance computing applications maintain peak efficiency. This is particularly advantageous in environments that handle extensive data throughput, such as HPC and autonomous systems, where rapid data access and transfer are essential to system performance.\n\nBy providing cutting-edge frequencies, the Ultra-High-Speed SRAM supports the growing need for high-speed data processing and transfer, setting a higher benchmark for speed and efficiency. Its robust design is structured to seamlessly integrate with existing infrastructures, providing a comprehensive solution for diverse industrial requirements.
The SmartMem Subsystem is designed to enhance memory functionality through a synthesisable and configurable architecture. This memory subsystem significantly boosts power efficiencies and improves both performance and endurance. Not limited to just Numem's own products, it can easily interface with other high-performance MRAMs, RRAM, and Flash technologies, offering versatility across different hardware needs. Built with Numem's thorough memory expertise and innovative patents, the SmartMem Subsystem delivers MRAM performance that rivals SRAM, characterized by much lower standby power. Its intelligent power management system controls MRAM’s non-volatile nature for ultra-efficient operation, making it robust against endurance challenges while seamlessly integrating into varied systems, whether in edge devices or expansive data centers. The subsystem supports software-defined scalability, which negates the necessity for new hardware designs. This makes it an excellent choice for future-proofing memory solutions in AI workloads, ensuring agility and adaptability across rapid advancements in AI applications.
The SRAM provided by DXCorr stands as a highly efficient and tailored solution, designed to address the demands of modern data storage. Known for its high-speed performance, this memory technology is pivotal in applications requiring rapid data access. SRAMS offer lower latency and power consumption compared to alternatives, making them ideal for high-performance computing and processing tasks. The customizability of DXCorr's SRAM allows for adaptations that suit specific requirements, reinforcing its use in a variety of technological domains. These memory components play an essential role in embedded systems, enhancing their operational capacity through rapid data retrieval and storage capabilities. With a focus on improving the speed and efficiency of these systems, DXCorr's SRAM offerings cater to the needs of sectors ranging from consumer electronics to industrial applications. Through meticulous design, DXCorr ensures that their SRAM modules maintain consistency and reliability under various operational conditions. The SRAM solutions are born from DXCorr's innovative approach to memory design, further facilitating integration into complex chip architectures. This customization potential means that each SRAM unit delivered can be fine-tuned to meet the power, performance, and area (PPA) requirements unique to its intended application, thereby optimizing the end-user experience across numerous platforms.
Spectral's MemoryIP offers a wide array of silicon-proven, high-density, and low-power static random-access memories (SRAMs). This library includes six fundamental architectures: Single Port & Dual Port SRAMs, ROM, and Register Files (1 Port, 2 Port, and Pseudo-2 Port). Employing uniquely tailored bit cells, Spectral's compilers ensure robust functionality and optimal performance with minimal power usage. This customization is part of the broader Memory Development Platform, which allows users to tailor designs and extend capabilities easily. The MemoryIP is meticulously architected for high efficiency and supports advanced process nodes, compatibility with any standard CMOS technology, and even offers source code options for greater flexibility. Spectral MemoryIP distinguishes itself with its inclusion of proprietary SpectralTrak technology, a specialized PVT (Process, Voltage, Temperature) monitoring system that enhances reliability by adjusting internal memory timing to environmental variations. Its compilers, such as SpectralSPSRAM, SpectralPS2PSRAM, and SpectralDPSRAM, cater to high-capacity instances, while options like Spectral1PRF and Spectral2PRF are suited for tasks like scratchpad memories and FIFO applications. With expandable configurations ranging from 8 Words to 16K Words in depth and data widths from 4 to 144 bits, MemoryIP can meet diverse implementation needs. These features, alongside multi-bank architecture and low dynamic power, make MemoryIP a flexible choice for both foundries and fabless semiconductor companies pursuing effective memory solutions. Enhanced by Sleep and Power options, it supports BIST and ECC, safeguarding data integrity while promoting energy efficiency.
The DDR PHY from OPENEDGES Technology is designed to optimize the interface between the memory controller and DRAM, ensuring high-speed data transfer and efficient power usage. This PHY layer is instrumental in achieving exceptional performance in modern computing environments. By focusing on reduction of power consumption while maintaining peak efficiency, this solution is ideal for manufacturers seeking to enhance the performance of their channeled data systems. Its robust architecture makes it an essential component for systems requiring rapid data movement and synchronization, crucial for sustaining the high demands of computing applications. The design of the DDR PHY emphasizes DRAM optimization, ensuring that the memory subsystem operates at its highest potential while providing significant improvements in speed and bandwidth management. This adaptability means it effectively meets the diverse needs of various semiconductor project requirements. Built with scalability in mind, the DDR PHY supports a range of DRAM technologies and ensures seamless integration with the memory controller. Its design facilitates synergy with other IP solutions, enhancing the overall performance of the memory subsystem and providing a cohesive interface for streamlined functionality.
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