All IPs > Memory Controller & PHY > HBM
In the world of high-performance computing and advanced data processing applications, HBM (High Bandwidth Memory) has become a pivotal technology. This category in our Silicon Hub encompasses Memory Controller & PHY semiconductor IPs specifically designed for HBM. Such semiconductor IPs are essential for connecting memory systems that require exceptionally high bandwidth with reduced power consumption, facilitating next-generation computing tasks.
HBM Memory Controller & PHY IP cores are utilized to interface between System on Chip (SoC) processors and HBM stacks, ensuring efficient data transmission and processing. These IPs are crucial in various applications, including graphics processing units (GPUs), network devices, and data centers, where performance and speed are critical. With the integration of HBM technology, products achieve increased memory throughput, which significantly enhances overall system performance.
The Memory Controller within these semiconductor IPs handles the flow of data to and from the HBM, ensuring optimal usage of bandwidth and managing multiple requests effortlessly. The PHY (Physical Layer) component, on the other hand, serves as the critical physical interface, translating digital data into signals that the memory can recognize and process. Together, these components enable high-speed data applications to leverage HBM's full potential while minimizing power usage.
By adopting HBM Memory Controller & PHY semiconductor IPs from our Silicon Hub, designers and developers gain access to state-of-the-art solutions that provide unmatched efficiency and speed for memory-intensive operations. Whether developing cutting-edge AI applications or high-resolution gaming systems, integrating these advanced IPs into your designs will provide the competitive edge needed to meet modern technology demands. Explore our selection to find the perfect IP to enhance your high-bandwidth projects.
The Aries fgOTN processor family is engineered according to the ITU-T G.709.20 fgOTN standard. This line of processors handles a variety of signals, including E1/T1, FE/GE, and STM1/STM4, effectively monitoring and managing alarms and performance metrics. Aries processors excel at fine-grain traffic aggregation, efficiently channeling fgODUflex traffic across OTN lines to support Ethernet, SDH, PDH client services. Their capacity to map signals to fgODUflex containers, which are then multiplexed into higher order OTN signals, demonstrates their versatility and efficiency. By allowing cascaded configurations with other Aries devices or Apodis processors, Aries products optimize traffic routes through OTN infrastructures, positioning them as essential components in optical networking and next-generation access scenarios.
The Apodis family of Optical Transport Network processors adheres to ITU-T standards, offering a comprehensive suite for signal termination, processing, and multiplexing. Designed to handle both SONET/SDH and Ethernet client services, these processors map signals to Optical Transport Network (OTN), empowering versatile any-port, any-service configurations. Apodis processors are notable for their capacity to support up to 16 client ports and four 10G OTN line ports, delivering bandwidth scalability up to 40G, crucial for wireless backhaul and fronthaul deployments. With a robust, non-blocking OTN switching fabric, Apodis facilitates seamless client-to-line and line-to-line connections while optimally managing network bandwidth. This adaptability makes the Apodis processors an ideal choice for next-generation access networks and optical infrastructures.
The Orion MFH IP Cores are designed for optimal performance in 4G mobile fronthaul networks, compliant with the ITU-T specifications for CPRI signal multiplexing. They adeptly handle various CPRI options, ranging from 2.4576 Gbps to 12.16512 Gbps, ensuring high compatibility and performance. Featuring both muxponder and transponder configurations, Orion cores facilitate the efficient mapping and transport of CPRI signals via Optical Transport Network infrastructures, ideal for modern telecommunications frameworks. Their advanced capabilities enable telecommunications providers to enhance their network reliability and service delivery, adapting seamlessly to different fronthaul scenarios.
The DDR5/4 PHY & Memory Controller from SkyeChip is specifically tailored for high-speed memory interfacing within modern computing environments that require superior power efficiency and minimal area consumption. This versatile IP supports the latest DDR5 and DDR4 standards, offering data rates that can be upgraded to 6400 MT/s for DDR5. By integrating advanced features such as receiver decision feedback equalization (DFE) and transmitter feed forward equalization (FFE), the design ensures optimal signal integrity and performance across various interfaces. Suitable for a variety of system configurations, including multi-rank and multi-channel setups, it offers enhancements for diagnostics and maintenance, such as RAS, Ping-Pong architectures, and comprehensive debugging tools.
SkyeChip's HBM3 PHY & Memory Controller presents an efficient, bandwidth-optimized solution for handling high-speed data transfers in advanced computing applications such as AI and data centers. This product is engineered to align with the JEDEC standards, employing innovations that elevate both performance and power efficiency. Capable of supporting data rates reaching 9600 MT/s, this controller also accommodates a variety of packaging technologies, including 2.5D and 3D designs, ensuring compatibility across a broad range of device configurations. Further, this IP integrates flexible interfaces catering to various customizations, providing robust support for HBM3 DRAM stacks and enabling efficient interconnect and memory repairs. Future-oriented features, including RAS and debug engines, enhance its versatility for complex applications.
The RWM6050 Baseband Modem from Blu Wireless is integral to their high bandwidth, high capacity mmWave solutions. Designed for cost-effectiveness and power efficiency, this modem forms a central component of multi-gigabit radio interfaces. It provides robust connectivity for access and backhaul markets through its notable flexibility and high performance. Partnering with mmWave RF chipsets, the RWM6050 delivers flexible channelisation modes and modulation coding capabilities, enabling it to handle extensive bandwidth requirements and achieve multi-gigabit data rates. This is supported by dual modems that include a mixed-signal front-end, enhancing its adaptability across a vast range of communications environments. Key technical features include integrated network synchronization and a programmable real-time scheduler. These features, combined with advanced beam forming support and digital front-end processing, make the RWM6050 a versatile tool in optimizing connectivity solutions. The modem's specifications ensure high efficiency in various network topologies, highlighting its role as a crucial asset in contemporary telecommunications settings.
MEMTECH's D-Series DDR5/4/3 PHY is engineered to deliver exceptional performance in data-driven applications with a focus on reliability and high operational bandwidth. Designed for systems requiring robust DDR5/4/3 interfaces, it achieves data rates of up to 6400 Mbps. This IP solution is especially suited for configurations where registered and load-reduced memory modules are deployed, providing ample support for varied physical ranks and usage conditions. The D-Series PHY is available as a hard macro, primarily delivered in GDSII format, tailored to integrate seamlessly into existing systems. It comes replete with 150+ customizable features, affording users the flexibility to meet specific design requirements and ensure optimal data management. Moreover, its robust digital and analog calibration support ensures consistency and precision in data handling, which is critical for maintaining system stability. This PHY is also remarkable for its ability to adjust dynamically to varying operational states, offering support for a myriad of interfaces that enhance its utility across different market segments, from consumer electronics to data-intensive commercial applications. By balancing these cutting-edge features with user-friendly flexibility, MEMTECH’s D-Series stands as a leading choice for businesses requiring reliable, high-speed memory solutions.
The MVDP2000 series from MEMS Vision consists of leading-edge differential pressure sensors attributed with capacitive sensing technology for outstanding sensitivity and stability. Particularly fashioned for accurate pressure and temperature calibration, these sensors are the epitome of low-power-consumption models suited for high-demand OEM and portable applications. These sensors are vital in industries where precision in differential pressure detection is necessary, such as respiratory medical devices, gas flow machines, and HVAC systems. Their configurability makes them versatile for adaptation into existing frameworks, ensuring swift performance with incredibly low error margins. With a 7 x 7 mm DFN packaging size, the sensors are adept for applications where space is at a premium, yet accurate readings are paramount. They support digital I2C and Analog output, enhancing their applicability across varied usage scopes in sectors demanding the highest standard reliability.
The Scorpion family of processors offers support for OSU containers as per the CCSA and IEEE standards, particularly the OSUflex standard. These processors accommodate various client-side signals, including E1/T1, FE/GE, and STM1/STM4, ensuring robust performance monitoring and optional Ethernet rate limitation. Scorpion processors can adeptly map these client signals to OSU or ODU containers, which are subsequently multiplexed to OTU-1 lines. Known for their flexibility and efficiency in handling diverse traffic types, Scorpion processors serve as foundational elements for advancements in access networks and optical service units, ensuring sustained performance in increasingly complex networking environments.
Terefilm Photopolymer is a groundbreaking innovation in addressing key challenges in the semiconductor industry, such as precision mass transfer, high-resolution photolithography, and the need for efficient temporary bonding-debonding systems. This advanced photopolymer excels with its unique balance of precise patternability, clean decomposition, and low activation energy, making it ideal for high-throughput semiconductor applications demanding strict precision and cleanliness standards. The Terefilm Photopolymer showcases exceptional thermal stability up to nearly 180°C before UV exposure, allowing for its seamless integration into manufacturing processes that include elevated temperature stages. Upon application of low-energy UV irradiation, its decomposition temperature significantly drops by over 100°C, thus requiring minimal energy for vaporization. The decomposition process can be enhanced through acid catalysis using a photoacid generator, a technique reminiscent of those employed in photoresists for years. Unlike conventional systems, where exposure and development may take minutes or hours, Terefilm's reaction completes within sub-milliseconds, achieving complete vaporization of the activated region to gaseous products. The exceptional properties of Terefilm do not end there. Its remarkably low activation energy initiates vaporization at approximately 60°C, ensuring reduced power consumption, prolonged optical component life, and large-area processing capabilities. With activation energies below the ablation threshold of most mask materials, it supports applications requiring selective component release, exemplified by microLED mass transfer. This not only diminishes costs but also extends the functional lifespan of lasers and optics within LIFT systems, offering lower Cost of Ownership (COO) than ablation-reliant systems. The photopolymer's residue-free decomposition and precise patterning capability further highlight its superiority by removing the need for extensive cleaning and ensuring exact component placement and spatial control.
The GDDR7 PHY and Controller by InnoSilicon is designed to meet the escalating demand for high-speed memory interfaces in advanced computing applications. GDDR7, being the next evolutionary step from GDDR6X, offers significant improvements in data rate and power efficiency, supporting speeds from 20Gbps to 36Gbps. It is particularly suited for graphics card manufacturers, game consoles, and other data-intensive devices. InnoSilicon's GDDR7 solution is engineered to offer exceptional bandwidth and scalable architecture, which enhances the throughput and performance of GPUs and accelerators. The PHY layer optimizes signal integrity and electromagnetic compatibility to ensure reliable high-speed data transmission. It incorporates advanced error correction techniques and is seamlessly integrated with InnoSilicon's memory controller for optimal command and data scheduling. This solution benefits from InnoSilicon's deep silicon validation expertise, offering a robust and tested IP that can be customized for client-specific requirements. Moreover, it ensures a seamless shift to higher memory configurations, facilitating the design and development of cutting-edge graphics and AI systems.
Tower Semiconductor's Non-Volatile Memory (NVM) solutions provide enhanced functionalities within high levels of integration for system-on-chip (SoC) designs. These solutions focus on delivering low power consumption and high endurance, essential for modern electronic systems that require reliable and efficient memory storage.\n\nThe NVM technologies encompass various memory modules catering to fast programming speeds and secure data retention, advantageous for numerous applications within automotive and consumer electronics. Adaptability and high-quality integration are enabled by Tower's robust design support and their partnerships with leading IP vendors.\n\nTailored to support a wide array of design configurations, these NVM solutions provide tremendous flexibility for product development, improving time-to-market for innovative solutions. The strong emphasis on performance, retention capabilities, and efficiency makes them a preferred choice for advanced memory applications across different industries.
The NuLink Die-to-Memory PHY products are exemplars of Eliyan’s innovative approach to overcoming traditional memory bandwidth limitations. These solutions provide critical interconnectivity between die and memory components within standard packaging frameworks, promoting both low power consumption and high throughput. These PHYs are strategically designed to complement diverse memory configurations, thereby enhancing overall system performance. Unlike fixed-direction interconnect options, Eliyan's NuLink technology supports dynamic communication with bidirectional capabilities. This allows an efficient balance between power savings and robust performance outcomes, while seamlessly integrating into existing package formats to maintain standardization and economic efficiencies. An alignment with industry standards, such as UCIe, underscores the NuLink Die-to-Memory solutions' versatility and adaptability across different sectors. Their dynamic capabilities make them ideal for applications that demand high-density, speed-sensitive memory interactions, providing an essential tool in the engineering of powerful, multi-die assemblies with optimized thermal and cost profiles.
The SMS OC-3/12 Transceiver Core addresses the demanding specifications of SONET/SDH networks, supporting data rates of 622.08 Mbit/s (OC-12) and 2.4 Gbit/s (OC-48) with selectable reference frequencies. It boasts a deep sub-micron CMOS implementation for effective system-on-chip integration. The core features integrated clock synthesis and recovery, wave shaping, and low-jitter LVPECL interfaces, compliant with rigorous industry standards such as ANSI, Bellcore, and ITU. This ensures it meets essential jitter tolerance, transfer, and generation specifications, crucial for reliable data transmission over SONET networks. Patented signal processing techniques enhance clock recovery capabilities, providing immunity to external and PCB noise. This makes the transceiver a robust solution for high-frequency applications requiring secure data transmission across optical networks and supports multiple integrations on a single IC, catering to scalable system designs.
DDR Solutions by PRSsemicon encompass a comprehensive range of memory interface technologies supporting various generations of DDR standards, including DDR2/3/4/5 and LPDDR variants. With a strong focus on enhancing data handling efficiency and speed, these solutions also integrate support for GDDR, ensuring adaptability across various memory applications. Additionally, offerings like DFI and HBM components bolster connectivity and throughput, catering to high-performance computing needs and dense memory architectures.
The H-Series PHY from MEMTECH is a pivotal solution for those in need of high bandwidth and low latency for intensive computing applications. This PHY core stands out thanks to its optimization for compact form factors without sacrificing performance, making it ideal for AI and machine learning tasks. It supports data rates up to 3200 MB/sec, featuring a design that accommodates up to 8 independent memory channels per 8H stack of HBM2E, thus delivering a robust bandwidth ideal for graphics and networking needs. Notably, the H-Series PHY offers versatile support across various performance enhancements, balancing power and space to fit diverse system requirements. Its pseudo-channel architecture allows for extensive customization, leading to optimal configurations tailored for high-performance computing and advanced graphics tasks. Additionally, the PHY is available as a hard macro, incorporating sophisticated interfaces and clock ratio support to streamline integration into different system architectures. The PHY's capacity for high-performance data processing makes it an invaluable asset for enterprises aiming to maximize their compute efficiency. With a focus on reducing the power whilst maintaining the speed, the H-Series PHY is well-suited for industries that prioritize compact, powerful computing solutions.
HermesCORE HBM3 Controller is designed to complement the cutting-edge HBM3 memory technologies, facilitating swift and efficient memory operations. This controller is optimized for high-bandwidth, low-latency operations that are essential for fields such as graphics rendering, high-performance computing, and advanced communication technologies. With the HermesCORE HBM3 Controller, technology developers gain access to advanced data management features that ensure high-performance consistency and operational integrity under demanding conditions. Its architecture supports substantial memory transactions per second, ensuring that it aligns with next-generation data processing needs. This controller's main advantage lies in its ability to fine-tune operations, providing flexibility and reliability in managing intensive data loads. As system demands evolve, the HermesCORE HBM3 Controller remains adept at meeting high-bandwidth needs without compromising system efficiency.
MidasCORE HBM3 PHY is engineered to support applications that demand high memory bandwidth, such as graphics, high-performance computing, and communication systems. Emphasizing speed and efficiency, this PHY IP manages to deliver unparalleled memory bandwidth alongside minimized latency and augmented data density capabilities. This HBM3 PHY solution showcases enhanced interactivity with interface standards, assuring seamless connectivity within complex system assemblies. The innovation in its design allows for maximized data transfers, responding adeptly to the increasing memory demands seen in technological advancements across multiple fields. MidasCORE capitalizes on improved design techniques to minimize power consumption while maximizing data throughput, making it an exceptional choice for modern data centers and enterprise-grade solutions. Its adaptability and superior performance metrics cement its importance in environments where data access speed and processing efficiency are crucial.
High-Speed Interface Technology by VeriSyno is engineered to leverage advanced node processes ranging from 28nm to 90nm. This technology meticulously caters to the critical need for fast data transfer in modern computing environments. Designed with precision, these IPs support a variety of interfaces including USB, DDR, MIPI, HDMI, PCle, and SATA among others, highlighting the versatility of their engineering. The core strength of this high-speed solution lies in its adaptability to multiple process nodes, meeting customer demands for scalable solutions. Trusted by numerous clients, this technology enhances device compatibility and interoperability, crucial for today’s high-performance electronics. With capabilities to provide tailored IP porting services, VeriSyno ensures that their products align with both state-of-the-art and traditional processes. Further, the company provides dedicated support to ensure seamless integration and maximal performance. Their expertise in the domain makes these high-speed interfaces a reliable choice for next-generation consumer electronics, telecommunications, and data processing sectors.
The LPDDR4/4X from M31 is a memory controller designed to support both LPDDR4 and LPDDR4X memory interfaces, achieving speeds up to 4267 Mbps. It is crafted for high-speed and efficient data handling, making it perfect for devices that demand high performance coupled with low power consumption. This dual compatibility ensures flexibility and broadened application across various modern electronic devices. This memory IP is engineered to meet the rigorous standards of high-speed data transactions and is particularly well-suited to mobile applications and battery-powered devices. The design incorporates power-saving technologies while maximizing the data throughput, enabling devices to operate efficiently without draining excessive power. M31's LPDDR4/4X IP addresses the growing need for high bandwidth and scalable memory solutions in today's tech landscape, meeting the demands of applications in smartphones, tablets, and high-end computing environments.
LogicFlash Pro® eFlash is a cornerstone of Actt's high-performance and high-reliability eFlash technology lineup. This offering is crafted to deliver large-capacity storage with robust operational characteristics, aligning closely with the demands for reliable and efficient data retention in a wide array of technological applications. It's well-suited for industries that prioritize storage solution performance and reliability.
High Bandwidth Memory IPs from GUC are tailored for high-bandwidth application needs in AI, HPC, and networking. They are fully compliant with JEDEC standards and optimized for performance on TSMC's advanced process technologies. The IPs support data rates of 8.6Gbps for HBM3E and 3.6Gbps for HBM2E, balancing performance, power, and area efficiently. GUC's expertise in TSMC's CoWoS and design implementation ensures their IPs are both silicon-proven and production-ready in real 2.5D IC system applications.
The XpressGX S10-FH800G is a full-height PCIe Network Processing board built around the Intel® Stratix® 10 GX FPGA. It's engineered for applications demanding high transceiver bandwidth and core fabric performance. This board supports up to 800 GB Ethernet, making it an excellent choice for data centers, cloud computing, and high-performance computing environments. In addition to on-board memory options, it also supports external memory cards, such as DDR4 or QDRII, for enhanced flexibility in memory management. This FPGA board is tailored for embedded applications, optimized for low power consumption, and comes with a reliable passive heatsink for efficient thermal performance. The included 100G Ethernet packet processing reference design is invaluable for developers looking to explore complex networking solutions.
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