All IPs > Memory Controller & PHY > DDR
In the realm of semiconductor IPs, the DDR Memory Controller & PHY category is pivotal in the development of advanced digital electronics. DDR, or Double Data Rate, is a form of synchronous dynamic random-access memory (SDRAM) that is widely used in computing and communication applications. The Memory Controller & PHY (Physical Layer) semiconductor IPs are instrumental in managing the interface between memory modules and processors, ensuring efficient data transfer and system performance.
The DDR Memory Controller is responsible for managing data flow and memory access, optimizing the interaction between the CPU and memory. It oversees tasks such as read/write operations, refresh cycles, and power management. These controllers are critical in applications ranging from high-performance computing and gaming to automotive systems and mobile devices, where speed and reliability are paramount.
Meanwhile, the PHY layer serves as a bridge between the digital domain of the memory controller and the analog world of the physical memory chips. It handles the electrical signaling necessary for data transmission, which includes tasks such as clocking, signaling, and interfaces. The integration of PHY semiconductor IPs ensures that signals are transmitted and received accurately across the memory interface, minimizing errors and maximizing throughput.
Silicon Hub offers an extensive range of DDR Memory Controller & PHY semiconductor IPs, catering to the needs of system designers aiming to enhance data processing speeds and energy efficiency. By implementing these IPs, developers can significantly reduce time-to-market, minimize design risks, and attain higher performance levels in their products. Whether you are developing next-generation consumer electronics, networking devices, or embedded systems, DDR Memory Controller & PHY semiconductor IPs form the backbone of robust and efficient memory systems.
The SPD5 Hub Function IP has been developed to interface I3C/I2C Host Bus and it allows an isolation of local devices like Temperature Sensor(TS), from master host bus. This SPD5 has Two wire serial interface like SCL, SDA
Overview: The DDR5 RCD Controller is a registering clock driver utilized in DDR5 RDIMMs and LRDIMMs. It buffers the Command/Address (CA) bus, chip selects, and clock signals between the host controller and DRAMs. Additionally, it establishes a BCOM bus to control data buffers in LRDIMMs. Key Features: Compliance with JEDEC's JESD82-511 Maximum SCL Operating speed of 12.5MHz in I3C mode DDR5 server speeds up to 4800MT/s Dual-channel configuration with 32-bit data width per channel Support for power-saving mechanisms Rank 0 & rank 1 DIMM configurations Loopback and pass-through modes BCOM sideband bus for LRDIMM data buffer control In-band Interrupt support Packet Error Check (PEC) CCC Packet Error Handling Error log register Parity Error Handling Interrupt Arbitration I2C Fast-mode Plus (FM+) and I3C Basic compatibility Switch between I2C mode and I3C Basic Clearing of Status Registers Compliance with JESD82-511 specification I3C Basic Common Command Codes (CCC) Applications: RDIMM LRDIMM AI (Artificial Intelligence) HPC (High-Performance Computing) Data-intensive applications
At the forefront of memory interfaces, Dolphin Technology’s DDR PHY IPs offer exceptional performance and versatility for modern applications. This IP suite is designed to support DDR4, DDR3, and DDR2 standards, as well as LPDDR series memories. Notably, these DDR PHYs are engineered to reach speeds up to 4266 Mbps, ensuring compatibility with high-performance computing requirements. The DDR PHY IPs include features such as slew rate control, per-bit de-skew, gate training, and built-in self-test (BIST), all contributing to their robustness and adaptability in various system environments. They are compliant with the DFI 4.0 specification, providing seamless integration with DDR memory controllers to deliver comprehensive memory subsystem solutions. With proven reliability in silicon, these PHYs have been designed to efficiently integrate into SoCs, offering a high degree of speed and data integrity for advanced semiconductor applications. This makes them suitable for an array of high-performance tasks in industries ranging from consumer electronics to data center operations.
The Rambus DDR5 Server DIMM chipset is designed to handle high-performance data centers, offering unmatched speed and efficiency. It incorporates Registering Clock Drivers (RCD), Power Management ICs (PMICs), and Temperature Sensors to ensure optimal functioning of DDR5 RDIMMs, significantly boosting data throughput. These components work in harmony to deliver up to 8000 MT/s for RDIMMs and an impressive 12800 MT/s for Multiplexed Rank DIMMs (MRDIMMs), meeting the rigorous demands of next-generation servers. This chipset represents a leap in bandwidth and scalability, allowing data centers to manage larger workloads and advanced analytics seamlessly. By integrating MRT DIMMs and PMICs, the chipset enhances power efficiency while maintaining high-performance levels. Furthermore, its innovative design not only supports the current server configurations but also future-proofs them for technological advancements expected over the coming years. Rambus's DDR5 Server DIMM chipset reflects the company's continued dedication to pushing the envelope in memory technology, making it an ideal choice for enterprises focused on adopting cutting-edge computing infrastructure. With support for high-speed data operations, this chipset plays a crucial role in upgrading server capabilities, enabling faster access times and improved data integrity.
The NuLink Die-to-Die PHY for Standard Packaging by Eliyan is engineered to facilitate superior die-to-die interconnectivity on standard organic/laminate package substrates. This innovative PHY IP supports key industry standards such as UCIe and BoW, and includes proprietary technologies like UMI and SBD. The NuLink PHY delivers leading performance and power efficiency, comparable to advanced packaging technologies, but at a fraction of the cost. It features configurations with up to 64 data lanes, supporting a data rate per lane of up to 64Gbps, making it ideal for applications demanding high bandwidth and low latency. The implementation enhances system design while reducing the necessary area and thermal load, which significantly eases integration into existing hardware ecosystems.
The HBM3 PHY & Memory Controller by SkyeChip offers a high-performance, low-power memory interface solution tailored for AI, HPC data centers, and networking applications. This product conforms to HBM3 (JESD238A) JEDEC standards, supporting up to 6400 MT/s for HBM3 and 9600 MT/s for HBM3E. Notably, it offers a flexible PHY with programmable intelligent interface training sequences and supports major 2.5D/3D packaging technologies, enhancing versatility. The solution guarantees compatibility with DFI 5.1 interfaces and supports high-density configurations, making it ideal for advanced semiconductor manufacturing.
SkyeChip's DDR5/4 PHY & Memory Controller delivers efficient, low-power solutions that comply with DDR5 (JESD79-5) and DDR4 (JESD79-4) JEDEC standards. With support for rates up to 4800 MT/s and upgradeability to 6400 MT/s, this product is engineered for high performance and area efficiency. Its features include flexible PHY with intelligent interface training, receiver DFE, and transmitter FFE for optimal signal processing. It supports a wide range of configurations, including x4, x8, and x16 SDRAMs, and advanced extensions such as 3DS and multiple rank support, making it suitable for diverse applications.
This product offers an extensive range of high-speed interface IP solutions developed using an array of process technologies from 28nm to 90nm nodes. It supports various technology needs and provides tailored services for IP customization and transfer, enhancing adaptability for state-of-the-art processes or more mature ones ranging from 90-180nm. These encompass technologies like USB, DDR, and MIPI, ensuring robust solutions for advanced data communication requirements.
TwinBit Gen-1 stands as a cutting-edge, logic-based non-volatile memory suitable for 180nm to 55nm process nodes. It prides itself on remarkable endurance, capable of performing over 10,000 programming cycles. This IP macro is designed for integration into CMOS logic processes without extra masking steps, easing the implementation in advanced technology nodes. The TwinBit Gen-1 series is well-adapted for a diverse range of applications, including IoT devices, microcontrollers, FPGAs, and ASICs with embedded NOR FLASH, offering memory sizes from 64 bits to 512K bits. It provides a high-density, small-area solution, which is particularly beneficial for applications requiring field-rewritable firmware or secure data storage. This memory technology ensures low-voltage and low-power operations, accommodating automotive industry standards through compliance with AEC-Q100. TwinBit Gen-1 includes built-in test circuits that allow for stress-free testing, ensuring reliability in diverse operating conditions. The technology also supports low-cost manufacturing and faster development turnaround times.
The AST 500 and AST GNSS-RF represent cutting-edge semiconductor solutions in the realm of GNSS technology. These chips are meticulously designed to enhance the performance of Global Navigation Satellite Systems, allowing them to function with heightened accuracy and reliability. With advanced RF front-end technologies, these ICs efficiently handle GNSS signals across multiple satellite systems, ensuring robust connectivity and precise location tracking. Leveraging state-of-the-art process technology, AST 500 and AST GNSS-RF chips are fabricated in leading semiconductor foundries, providing superior signal integrity and low noise performance. These ICs are engineered to perform optimally under various environmental conditions, making them suitable for both commercial and defence applications. Their compatibility with systems such as GPS, GLONASS, and Galileo ensures versatility and global applicability. By integrating these chips, devices can achieve improved positioning accuracy and faster time-to-first-fix, making them an ideal choice for navigation-centric products across multiple industries, including automotive and aerospace.
The LPDDR5/5X PHY & Memory Controller from SkyeChip is engineered to provide high-performance, power-efficient memory interfaces that adhere to the LPDDR5/5X (JESD209-5C) JEDEC standards. This solution supports data rates up to 6400 MT/s with an option to upgrade to 10667 MT/s, ensuring high-speed operations. Designed for flexibility, it accommodates various SDRAM configurations, supporting up to 32Gb addressing with back functionalities like RAS and Debug available. This product is meticulously crafted for applications demanding advanced memory solutions in various technology sectors.
The RISCV SoC - Quad Core Server Class is engineered for high-performance applications requiring robust processing capabilities. Designed around the RISC-V architecture, this SoC integrates four cores to offer substantial computing power. It's ideal for server-class operations, providing both performance efficiency and scalability. The RISCV architecture allows for open-source compatibility and flexible customization, making it an excellent choice for users who demand both power and adaptability. This SoC is engineered to handle demanding workloads efficiently, making it suitable for various server applications.
YouDDR is a comprehensive technology encompassing not only the DDR controller, PHY, and I/O but also features specially developed tuning and testing software. It provides a complete subsystem solution to address the complex needs of DDR memory interfaces. The integrated approach allows for cohesive synchronization between the controller and PHY, optimizing performance and reliability. The YouDDR technology ensures seamless integration into a variety of platforms, supporting a broad range of applications from simple consumer electronics to advanced computing systems. By offering enhanced tuning capabilities, it allows developers to fine-tune performance metrics, ensuring that systems can operate within their optimal performance windows. Developers utilizing YouDDR benefit from a thoroughly tested and verified subsystem that significantly simplifies the design cycle. This not only reduces development time but also enhances the likelihood of first-pass success, providing a competitive edge in manufacturing efficiency and product launch speed.
TwinBit Gen-2 builds upon the foundation of its predecessor by supporting more advanced process nodes from 40nm to 22nm. Like the Gen-1 version, it is integrated into CMOS processes without necessitating additional masks or processing steps. This technology incorporates the novel Pch Schottky Non-Volatile Memory Cell, facilitating ultra-low-power operation. With the Gen-2, users gain access to a memory solution that handles both programming and erasing effectively through controlled hot carrier injection. This is achieved through intelligent cell bias manipulation, ensuring optimal performance. The process of hot-hole and hot-electron generation is finely distributed to maintain integrity during both program and erase operations. TwinBit Gen-2 is specifically advantageous for applications that demand ultra-low-power memory solutions. Its structure caters well to IoT and automotive applications where energy efficiency and reliability are paramount. Maintaining compactness and efficiency, this IP further enhances NSCore's portfolio in serving advanced technological requirements.
This Secondary/Slave PHY is intended for the memory side, offering high-speed, low-power protocols for data transfer. Following the JEDEC standards for LPDDR4/4X/5, it promotes efficient communication in various devices, especially AI and memory-intensive solutions. Although designed for TSMC's 7nm technology, its flexible architecture allows adaptation across different processes and memory configurations.
The DDR solutions by PRSsemicon offer advanced design and verification IPs tailored to meet the demands of high-speed data processing. Supporting various DDR standards, these solutions ensure efficient and reliable data transmission for broad applications, from consumer electronics to sophisticated computing platforms.\n\nThese solutions include support for DDR, DDR2, DDR3, DDR4, and DDR5, as well as GDDR and LPDDR versions through LPDDR5X. This diversity allows them to cater to requirements of different bandwidths and power efficiencies. They also feature DFI interfaces and PHY options for seamless integration and enhanced performance.\n\nBy providing flexible and adaptable solutions, PRSsemicon empowers clients to develop memory systems optimized for speed, power efficiency, and overall reliability. These IPs are vital for applications demanding high-data throughput and efficient power consumption, ensuring the flawless operation of today's high-tech devices and systems.
DRAM memory modules from Avant Technology are engineered to meet the demands of applications requiring both speed and large capacity. Known for their rapid data access and storage capabilities, DRAM modules are indispensable in gaming, point-of-sale systems, and medical equipment where quick data retrieval is essential. Avant's DRAM modules adhere to JEDEC standards and offer a variety of configurations like UDIMM, SODIMM, and ECC DIMM, catering to both industrial and consumer requirements. These modules are designed for high performance, supporting interfaces like DDR3, DDR4, and DDR5, which are critical for maintaining system efficiency and reliability. Designed to operate in diverse temperature ranges, Avant’s DRAM solutions can handle both industrial and commercial environments. Whether for gaming consoles or medical devices, these memory modules provide the necessary bandwidth and low power consumption needed for high-demand tasks.
The AHB-Lite Memory module is a fully parameterized component tailored for integration in AHB-Lite based designs. As a soft IP, it provides flexible and efficient on-chip memory access, offering a simple integration path into various system architectures. This memory module is crafted to support a wide array of applications that require dependable and swift data storage solutions. Roa Logic has designed this component to embody high reliability and operational efficiency. The memory’s design is optimized for quick data retrieval and storage, making it a critical component for applications that demand immediate access to data. Its adaptability accommodates different data storage requirements, ensuring that it aligns with the performance demands of contemporary embedded systems. The AHB-Lite Memory module guarantees seamless integration and stable operational capacity, reinforcing Roa Logic's dedication to offering solutions that drive system performance. Its configurable design ensures it's well-suited to both small-scale and expansive architectures, maintaining efficiency across diverse computing environments.
Thermal oxide, often referred to as SiO2, is an essential film used in creating various semiconductor devices, ranging from simple to complex structures. This dielectric film is created by oxidizing silicon wafers under controlled conditions using high-purity, low-defect silicon substrates. This process produces a high-quality oxide layer that serves two main purposes: it acts as a field oxide to electrically insulate different layers, such as polysilicon or metal, from the silicon substrate, and as a gate oxide essential for device function. The thermal oxidation process occurs in furnaces set between 800°C to 1050°C. Utilizing high-purity steam and oxygen, the growth of thermal oxide is meticulously controlled, offering batch thickness uniformity of ±5% and within-wafer uniformity of ±3%. With different techniques used for growth, dry oxidation results in slower growth, higher density, and increased breakdown voltage, whereas wet oxidation allows faster growth, even at lower temperatures, facilitating the formation of thicker oxides. NanoSILICON, Inc. is equipped with state-of-the-art horizontal furnaces that manage such high-precision oxidation processes. These furnaces, due to their durable quartz construction, ensure stability and defect-free production. Additionally, the processing equipment, like the Nanometrics 210, inspects film thickness and uniformity using advanced optical reflection techniques, guaranteeing a high standard of production. With these capabilities, NanoSILICON Inc. supports a diverse range of wafer sizes and materials, ensuring superior quality oxide films that meet specific needs for your semiconductor designs.
The IPM-NVMe Device is crafted to empower developers to build custom hardware accelerators and SSD-like applications. Offering a high degree of customization, it acts as a foundation upon which cutting-edge applications can be realized. With its NVMe compliance, developers can integrate this IP to create high-performance storage solutions that are both adaptable and efficient. This module's versatility is exemplified by its support for enhanced data transfer rates, making it a suitable choice for environments demanding rapid data processing. The IPM-NVMe Device can be deployed in scenarios that require robust data handling capabilities while maintaining performance integrity. Designed with modularity in mind, the IPM-NVMe Device IP allows for the implementation of custom features, facilitating innovations such as new data management protocols, hardware accelerations, and more. Its deployment simplifies the challenging task of creating bespoke SSD solutions tailored to specific market needs and technological advancements.
Featuring G15, this IP is optimized for 2KB correction blocks, suitable for NAND devices with larger page sizes, such as 8KB. The design is aligned with methods seen in the G14X, but it extends its reach with longer codewords for comprehensive coverage of high-density NAND. The design supports a wide array of block sizes and configurational setups, making it highly adaptable to varying design needs. Additional error correction capabilities can be integrated based on client requirements, reinforcing its bespoke delivery.
Designed for aiding seamless integration with memory systems, Eliyan's NuLink Die-to-Memory PHY products provide robust solutions for breaking the memory wall in high-performance computing and AI systems. These PHY products advocate the use of simultaneous bidirectional (SBD) signaling, improving efficiency by allowing data to be transmitted and received simultaneously, doubling the bandwidth capacity instantly. NuLink technology excels in configuring lanes for unidirectional and half-duplex bidirectional signaling, all on standard organic packaging with bump pitches starting at 90um. Eliyan's NuLink PHY expands memory bandwidth without necessitating advanced packaging like silicon interposers, making it a cost-effective solution for implementing universal memory interfaces. These interfaces further enhance interoperability across various memory types and settings, ensuring superior performance and flexibility.
The G13/G13X series is tailored for 512B correction blocks, particularly used in NAND setups with 2KB to 4KB page sizes. While both variants are crafted to manage the demands of SLC NAND transitions to finer geometries, the G13X allows for correction of a higher number of errors. Designed to fit seamlessly into existing controller architectures, it enables extensions of current hardware and software capabilities without extensive new investments. It offers area optimization through parameter adjustments and supports a range of channel configurations for broad applicability.
The NuRAM Low Power Memory represents a state-of-the-art memory solution utilizing advanced MRAM technology. Engineered to provide rapid access times and extremely low leakage power, NuRAM is significantly more efficient in terms of cell area compared to traditional SRAM, being up to 2.5 times smaller. This makes it an ideal replacement for on-chip SRAM or embedded Flash, particularly in power-sensitive environments like AI or edge applications. The emphasis on optimizing power consumption makes NuRAM an attractive choice for enhancing the performance of xPU or ASIC designs. As modern applications demand higher efficiency, NuRAM stands out by offering crucial improvements in power management without sacrificing speed or stability. The technology offers a compelling choice for those seeking to upgrade their current systems with memory solutions that extend battery life and deliver impressive performance. NuRAM is particularly beneficial in environments where minimizing power usage is critical while maintaining high-speed operations. This makes it a preferred choice for applications ranging from wearables to high-performance computing at the edge.
The SMPTE ST 2059 IP core serves an essential role in synchronizing audio and video systems across networks, centered around the generation of deterministic timing signals as outlined in SMPTE standards. This IP provides alignment of video and audio signals to a shared time base, achieved through the use of precise timing protocols like IEEE 1588 Precision Time Protocol (PTP). In the realm of professional AV and broadcasting, accurate timing is critical, and the ST 2059 IP core is designed to integrate seamlessly within existing infrastructures, supporting 1G, 10G, 25G, and even 100G Ethernet networks, ensuring high compatibility across various data speeds. The core comes equipped with capabilities for multiple output reference clock generation and customizable synchronization setups, aligning with network speed independency across different environments. The AIP-ST2059 allows for the integration of genlocked SDI equipment with newer IP-based media technology. By supporting both PTP-aware and non-PTP network devices, it ensures versatility and simplifies deployment within mixed network environments. This adaptability is reinforced by the support for multiple programmable outputs and the ability to operate independently of network speeds, thus broadening its application scope in diverse setups.
The TS5111 and TS5110 device incorporate thermal sensing capability which is controlled and read over two wire bus. These device operate on I2C and I3C two wire serial bus interface. The TS5 designed for Memory Module Applications. The TS5 device intended to operate up to 12.5 MHz on a I3C Basic Bus or up to 1 MHz on a I2C Bus. All TS5 devices respond to specific pre-defined device select code on the I2C/I3C Bus Note: **JESD302-1A** and also we have **JESD302-1**
The DDR Memory Controller by OPENEDGES acts as the central management hub for memory operations, coordinating transactions, and optimizing data flow between the processor and memory. This component is critical for managing memory access in multicore systems, optimizing latency and throughput for complex computing tasks. With its advanced scheduling and pre-fetch algorithms, the DDR Memory Controller enhances data access times significantly, reducing bottlenecks and improving overall system throughput. Its intelligent control mechanisms allow for seamless transitions between active and idle states, further promoting efficiency in energy consumption. The controller is engineered to support a wide range of DDR standards, ensuring flexible compatibility with various DRAMs. Its architecture inherently improves system performance through tight integration with other subsystems, particularly within memory-intensive applications where efficiency and speed are paramount.
The MGNSS IP Core is an essential component for integrating GNSS capabilities into a wide range of devices. Designed to be highly adaptable, it provides a comprehensive solution for implementing satellite navigation features in electronic systems, offering seamless integration across different platforms. This IP Core supports all major navigation systems, including GPS, GLONASS, and BeiDou, to provide a globally unified navigational experience. Utilizing advanced algorithms, the MGNSS IP Core enhances the positioning accuracy and efficiency of host devices, thereby supporting real-time navigation applications. Optimal for use in various markets, such as automotive, industrial, and mobile technologies, the MGNSS IP Core ensures devices can perform accurate and reliable navigation operations. It comes with configurable design options, allowing designers to tailor its functionalities according to specific application needs.
The DDR PHY from OPENEDGES Technology is designed to optimize the interface between the memory controller and DRAM, ensuring high-speed data transfer and efficient power usage. This PHY layer is instrumental in achieving exceptional performance in modern computing environments. By focusing on reduction of power consumption while maintaining peak efficiency, this solution is ideal for manufacturers seeking to enhance the performance of their channeled data systems. Its robust architecture makes it an essential component for systems requiring rapid data movement and synchronization, crucial for sustaining the high demands of computing applications. The design of the DDR PHY emphasizes DRAM optimization, ensuring that the memory subsystem operates at its highest potential while providing significant improvements in speed and bandwidth management. This adaptability means it effectively meets the diverse needs of various semiconductor project requirements. Built with scalability in mind, the DDR PHY supports a range of DRAM technologies and ensures seamless integration with the memory controller. Its design facilitates synergy with other IP solutions, enhancing the overall performance of the memory subsystem and providing a cohesive interface for streamlined functionality.
The GDDR7 PHY and Controller from Innosilicon is designed to meet the high-performance needs of modern graphics and computing environments. It offers impressive bandwidth efficiency and speed, providing an ideal solution for high-end graphics cards and systems requiring vast data throughput. Innosilicon’s GDDR7 solution is a testament to their commitment to innovation, incorporating advanced technical features for optimized performance. Built to be compatible with various technological interfaces, this GDDR7 solution ensures seamless integration into existing systems. It has been engineered for enhanced signal integrity and lower power consumption, helping to reduce the operational cost while providing peak performance consistency. The forward-thinking design anticipates future industry trends, providing scalable capabilities to handle increased data demands. As one of Innosilicon's flagship products, the GDDR7 PHY and Controller represents a fusion of technological excellence and practical functionality. This solution operates within rigorous quality standards, guaranteeing reliability and efficiency in real-world applications. It supports numerous process nodes catering to a wide array of industrial needs while maintaining stringent compliance with industry protocols.
Synopsys' DDR Memory Interface is specifically crafted to support high-speed memory applications, crucial for optimizing computational performance and efficiency. This memory interface IP is designed to meet the demands of modern, data-intensive environments by facilitating rapid access to memory storage, thus enhancing data throughput and system performance. The DDR Memory Interface IP offers support for various DDR standards, providing flexibility and future-proofing for advanced computing needs. It ensures reliable communication between processors and memory modules, a critical component in achieving seamless data retrieval and execution. Such interoperability is essential for maintaining the high performance expected in contemporary electronic systems. This IP's ability to adapt to the latest DDR protocols ensures compatibility with both current and upcoming memory technologies, offering developers the assurance of scalability and integration ease. By integrating with Synopsys’ high-quality design flows, the DDR Memory Interface IP allows for smooth transitions and implementation in diverse technological architectures.
Green Mountain Semiconductor introduces its LPDDR5X PHY, designed to meet the demanding standards of JEDEC for high-performance, low-power data transfers. This memory-side PHY can adhere to a variety of memory types beyond the LPDDR5X standard, making it suitable for both established and evolving memory technologies such as DRAM and SRAM. Initially configured for TSMC's 7nm technology, its design is adaptable to different processes to suit a broad range of device requirements.
Specially designed for 1KB correction blocks, the G14/G14X series caters to NAND devices with 8KB page sizes. Its versatility allows support for both 512B and 1024B blocks, accommodating SLC and MLC flash requirements effectively. It enhances controller performance with provisions for extended wear leveling and robust error correction across various generations of flash technology. The series also offers customization possibilities to meet diverse latency, bandwidth, or spatial demands.
The DVB-S2-LDPC-BCH decoder is pivotal for digital video broadcasting applications, particularly in satellite transmissions requiring robust FEC subsystems. The IP employs LDPC codes integrated with BCH codes to deliver a near-error-free operation closely approaching the Shannon limit. Key technologies supporting this include the irregular parity check matrix for enhanced correction, layered decoding for improved efficiency, and the minimum sum algorithm allowing for soft decision processing. This sophisticated decoding approach ensures high-performance data transmission, adhering to stringent industry standards.
The LPDDR5 PHY by Green Mountain Semiconductor is a high-speed, low-power memory-side interface. It supports the latest JEDEC LPDDR5 standards, facilitating efficient data communication between memory products and AI processors. Initially developed for 7nm process technology at TSMC, the PHY is versatile, supporting adaptation to other logical processes. This adaptability promotes broad utility across various memory technologies, from traditional DRAM and SRAM to cutting-edge non-volatile memories.
NAND memory subassemblies are essential components for various digital devices like flash drives and MP3 players. This non-volatile memory type offers the ability to store significant amounts of data due to its compact size, energy efficiency, and reliability. Being smaller and more durable than traditional hard drives, NAND memory is preferred for portable electronics. NAND memory is prized for its ability to be erased and rewritten many times without losing data integrity, making it ideal for devices like USB drives, where data storage and quick access are crucial. The different form factors in which NAND can be packaged, such as MO-300, 2.5 inches, or M.2 modules, provide flexibility for diverse applications. This memory type supports interfaces like SATA, PCIe NVMe GEN 3, and PCIe NVMe GEN 4, allowing for high-speed data transfer. This feature makes it suitable for client, industrial, and consumer markets, ensuring that a wide range of devices can benefit from its capabilities.
Aragio Solutions’ Memory Interfaces support a wide variety of DDR standards, including DDR, DDR2, DDR3, and DDR4. The SSTL I/O pads are crafted to facilitate robust performance with fully compliant JEDEC standards, offering flexibility with selectable drive strength and termination options to suit various system needs. Capable of high-speed operations, the memory interfaces easily manage bandwidth-intensive applications, facilitating seamless integration and smooth communication between the processor and memory. The SSTL_2, SSTL_18, and SSTL_15 interfaces include all necessary I/O, power, calibration, and spacer cells required for efficiently assembling a padring by abutment. These pad sets are designed with isolated power domains to eliminate interference, ensuring clean signaling and effective power management. By offering variations in the drive strength and frequency, these memory interfaces cater to diverse application requirements such as graphics, network processors, and sophisticated embedded systems. Additionally, the DDR combo libraries support dynamic PVT calibration and imbue the system with superior flexibility. Whether working with DDR2 to DDR3 transitions or integrating LPDDR standards, the libraries ensure high compatibility and up-to-date compliance with industry standards, making them essential for next-gen memory applications demanding reliability and precision.
Designed for energy metering applications, the 24-bit 128Ksps Sigma Delta ADC provides high-precision analog-to-digital conversion with superior accuracy. This ADC is an analog front end (AFE) component integrated into systems that require meticulous data acquisition from varying energy systems or smart metering solutions. In essence, this converter aims to facilitate accurate and efficient signal conversion, ensuring that output reflects real-world input with minimal distortion or noise. The high level of precision ensures that even the smallest discrepancies in energy measurements are captured, making it an essential interface for advanced metering solutions. Utilizing cutting-edge technology, it is adaptable to various conditions, offering a blend of durability and high performance. The ADC also integrates self-calibration features to maintain accuracy over extended periods and harsh environmental conditions.
Designed to bridge existing architectures with high-speed storage technology, the IPM-NVMe Host module offers a streamlined pathway to leverage PCIe NVMe SSDs. This IP component facilitates the direct control of NVMe SSDs as easily as traditional non-volatile memory, rendering it an invaluable tool in high-performance computing environments. The main attribute of the IPM-NVMe Host is its ability to manage the interface intricacies of NVMe technology, thereby enabling system architects to focus on achieving optimal system performance. Its architecture ensures minimal latency, maximizing throughput which is essential in data center and enterprise storage solutions. Tailored for integration into larger systems, the IPM-NVMe Host ensures compatibility across diverse platforms. It supports rapid prototyping and deployment, allowing developers to expedite their solution delivery and achieve high-speed data processing capabilities without substantial effort in integration.
Innosilicon’s HBM3E/4 PHY and Controller is at the forefront of next-generation memory solutions, addressing the increasing demands for high-speed and high-density memory interfaces. This IP is tailored for applications that require substantial bandwidth, such as artificial intelligence, cloud computing, and advanced graphics. The solution stands out for its ability to provide high data rates with an energy-efficient profile, making it an appealing choice for enterprises looking to enhance performance without escalating power consumption. Its sophisticated architecture enables seamless integration into a variety of systems, providing flexibility in both design and application. With its robust error-correcting codes and advanced signaling technology, Innosilicon ensures that the HBM3E/4 Controller delivers consistent performance even under strenuous conditions. This IP aligns with the latest industry standards, assuring compatibility and reliability while supporting a range of process nodes and foundry technologies to meet global manufacturing requirements.
The G12 module is engineered for 256B correction blocks and provides support for error corrections up to 16 bits. This unique capability is valuable for specialized applications where smaller block sizes are crucial. The design features optimized ECC dynamics, allowing for an adaptable block size range from 2 to 450 bytes. It is further customizable to maximize area efficiency by tailoring the maximum ECC level with set parameters. Additionally, it supports various configuration modes, catering to both single and multi-channel setups.
MEMTECH’s D-Series DDR5/4/3 Controller is meticulously crafted for high-performance environments, driving its stature as a leading controller for diverse DDR memory systems. Fitted with adept command scheduling and error-correcting capabilities, it excels in optimizing operational latency, bandwidth, and silicon area. Enabling multi-channel support and conforming to the latest industry protocols like DFI 5.0, the D-Series Controller thrives in various systems from data centers to consumer electronics. It introduces over 300 customizable options, allowing partners to fine-tune functionalities to meet distinct implementation scenarios. Designed to bolster processor capabilities, it ensures seamless data handling and precise communication between various components. The company's comprehensive support ecosystem backs the controller, promising effective integration and alignment with ever-evolving technological standards, assuring stakeholders of its long-term viability and functionality.
The DDR5RCD01 is a registering clock driver used on DDR5 RDIMMs and LRDIMMs. Its primary function is to buffer the Command/Address (CA) bus, chip selects, and clock between the host controller and the DRAMs. It also creates a BCOM bus which controls the data buffers for LRDIMMs.
SLL's Modular PHY Type 01 Suite is a PVT aware, foundry and process agnostic, PHY for use with most single-ended LVCMOS protocols up to 400 MHz DDR. The PHY has a highly modular architecture that supports x1, x4, x8, and x16 data paths. Its has process-voltage-temperature (PVT) controls that are suitable for use in hard realtime systems (zero timing interference on PVT adjustments). The PHY includes a full standard cell library abstraction. The PHY also offers >1000 configurable options at compile time, enabling coarse grain capabilities such as pin-level deskew to be enabled/disabled, along with precise fine-grain control of mapping of RTL to gates through various data paths. It supports a range of protocols such as SPI, QSPI, xSPI, eMMC, .. and allows run-time configuration via an APB3 control port. It is designed to support easy place-and-route in a broad range of customer designs.
The D-Series DDR5/4/3 PHY from MEMTECH is an advanced memory interfacing solution designed to enhance systems demanding high data throughput and energy efficiency. Its robust architecture supports diverse memory modules, including RDIMMs and LRDIMMs, making it adaptable to various sectors such as high-performance computing, consumer electronics, and network systems. With operational capabilities reaching up to 6400 Mbps, this PHY is fashioned to deliver both speed and reliability. It offers 150+ customizable features that enable system developers to align specific attributes to their unique product requirements, fostering innovation and product differentiation in competitive markets. As a complete Physical Layer (PHY) solution, MEMTECH ensures that the D-Series DDR PHY maintains superior integration and functionality with standard DDR interfaces. This promotes a streamlined design process, accented by extensive design guides and post-integration support that guarantees product performance and success across different application environments.
Creonic's LDPC encoder and decoder cores deliver impressive throughput and scalability, catering to applications in DVB-S2X, 5G-NR, and Wi-Fi environments. These cores are architecturally optimized for both ASIC and FPGA implementations, offering minimal bit error rates and efficient resource usage. Despite their high performance, the cores maintain low latency, crucial for real-time communication systems. The cores support a range of communication protocols, ensuring robust error correction for high-speed data transmission. Their design enhances connectivity by maintaining short block lengths and allowing straightforward deployment across various hardware platforms. Through integrating these LDPC cores, users can achieve cutting-edge connectivity and signal integrity. Engineered for flexibility, the cores allow for easy customization based on client-specific requirements. They are particularly well-suited for telecom infrastructure where precision and efficiency are paramount. Explore Creonic's LDPC offerings for reliable and highly efficient communication solutions.
The DDR5RCD03 is a registering clock driver used on DDR5 RDIMMs and LRDIMMs. Its primary function is to buffer the Command/Address (CA) bus, chip selects, and clock between the host controller and the DRAMs. It also creates a BCOM bus which controls the data buffers for LRDIMMs.
The xT CDx is a sophisticated genomic profiling platform designed to enhance personalized therapeutic opportunities for cancer patients. It integrates extensive molecular profiling with clinical data, optimizing targeted therapies and identifying potential clinical trials. This platform is superior in its ability to conduct paired tumor and normal sequencing, augmented by transcriptome sequencing, which surpasses tumor-only DNA panel tests in accuracy and comprehensiveness. With its robust capabilities, the xT CDx enables the identification of actionable genetic variants that might be overlooked if only traditional solid tumor or liquid biopsy testing methods were employed. This comprehensive approach allows clinicians to make more informed treatment decisions, offering patients tailored therapeutic options and improving their clinical outcomes. The system’s compatibility with various clinical settings is further underscored by its ease of integration into existing workflows, making it a versatile tool for medical professionals aiming to implement precision medicine in oncology practice efficiently.
SLL’s unified xSPI Memory Controller (xSPI MBMC) supports all the major JEDEC xSPI and xSPI-like protocols, including: - JEDEC xSPI Profile 1.0 and 2.0 - HyperBus 1.0, 2.0 and 3.0 - OctaBus, Octal Bus; and - Xccela Bus. SLL's xSPI Memory Controller core has been physically qualified for use with all the major memory device variants: - AP Memory (x8 Xccela PSRAM, x4/x8/x16 IoT memory) - Everspin (xSPI Profile 1.0 STT-MRAM) - GigaDevice (xSPI Profile 1.0 NOR Flash) - Infineon (HyperRAM 2.0, HyperRAM 3.0, xSPI Profile 1.0 SemperFlash, xSPI Profile 2.0 SemperFlash) - ISSI (Octal RAM, Octal Flash) - Macronix (OctaFlash) - Micron (Xccela Flash) - Winbond (HyperRAM 2.0, HyperRAM 3.0) - SLL can also add support on request for: - Micron Serial NAND (8D-8D-8D DS) - Winbond Serial NAND (8D-8D-8D DS) - Winbond Octal NOR Flash (8D-8D-8D DS) SLL’s has officially partnered with all the above memory vendors. SLL’s xSPI Controller also has been extensively tested using an end-to-end test bench that achieve near 100% code coverage. -- JEDEC xSPI and xSPI-like memories offer good performance with lower hardware and power costs. Memory device variants offer up to up to 128 Mbit STT-MRAM, 512 Mbit PSRAM, up to 2 Gigabit NOR Flash, up to 4 Gigabit NAND Flash, up to 333 MHz DDR clock speeds, with x4, x8 and x16 data path widths, and a wide range of package options including 4mm x 4mm BGA49 and tiny WLCSP footprints. Some PRSAM devices are now also available with internal ECC. SLL’s small xSPI Memory Controller core enables you to easily evaluate, select and adopt the benefits of the latest xSPI-style memories in your projects and products. SLL provides world class pre-sales and post-sales technical support for all the major memory vendors and FPGA vendors, helping you navigate the rapidly evolving market, on the platform of your choice. SLL also offers a high performance PVT-aware xSPI PHY along with an integration support package for ASIC customers seeking to support their specific {Foundry, Process Node} of choice. Get to market faster, with lower power consumption, lower pin count, lower cost, and far lower project risk by using SLL’s memory controller in your project/s.
KeyASIC's Interface IP portfolio is engineered for high-speed, efficient data transfer across various technologies and platforms, ensuring seamless connectivity and communication. Among its offerings is a comprehensive USB suite that includes USB 2.0 Host, Device, and OTG configurations, along with PHY options, setting a robust foundation for peripherals and embedded systems demanding reliable data exchange. The USB 3.0 PHY extends these capabilities, providing high-speed data transfer for modern applications requiring quick access to large data sets. In the realm of networking, KeyASIC delivers a 10/100 Ethernet MAC/PHY solution, essential for reliable and efficient network connectivity. LVDS offerings, including a WUXGA Receiver and Controller, cater to graphics-intensive applications demanding high-definition video display capabilities. Further enhancing the interface portfolio are sophisticated PHY options for Serial and Rapid IO, SATA, PCI, and PCIe standards, providing comprehensive support for advanced data transmission needs across various platforms. KeyASIC also focuses on emerging standards such as MIPI and JESD204, reflecting their commitment to supporting next-generation connectivity solutions. The integration of such high-performance interface IP plays a crucial role in enabling efficient communication across integrated circuits, making KeyASIC a trusted partner in semiconductor development for applications spanning consumer electronics, automotive, and industrial sectors.
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