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All IPs > Interface Controller & PHY > Interlaken

Interlaken Interface Controller & PHY Semiconductor IP

Interlaken, a hybrid of Interconnect and Ethernet, is a high-speed data communication protocol designed to improve bandwidth efficiency and scalability in data transmission systems. Within the Interface Controller & PHY category, Interlaken semiconductor IPs play a crucial role in facilitating high-speed data interfaces between networking devices for modern data centers and telecommunication systems. This category encompasses a range of specialized IP solutions designed to address the rapidly growing demand for powerful networking communications.

Interlaken Interface Controllers are integral to managing the flow of data packets across the various channels in a network. These semiconductor IPs are designed to optimize the movement of data, ensuring efficient handling of multiple, simultaneous data streams. By employing advanced protocol management techniques, Interlaken controllers help reduce latency and increase throughput, making them ideal for use in high-performance computing environments, cloud infrastructure, and large-scale enterprise networks.

The Physical layer (PHY) IPs for Interlaken are tailored to enhance the physical connection between network devices. These IPs ensure reliable high-speed transmission by implementing state-of-the-art signal processing methods and robust error-correction mechanisms. This not only supports scaling to higher bandwidths but also ensures data integrity across complex networking topologies. As data demands surge, the ability to support rapid and reliable data transfer becomes indispensable, particularly for service providers and data center operators looking to maintain competitive advantages in latency-sensitive applications.

Products in the Interlaken Interface Controller & PHY category are essential for developers aiming to integrate cutting-edge communication technologies into their hardware designs. They provide an efficient solution for scaling performance, supported by proven interoperability in multi-vendor ecosystems. By leveraging these semiconductor IPs, designers can accelerate time-to-market, reduce developmental risks, and deliver solutions that satisfy the high-speed connectivity demands of the modern digital world.

All semiconductor IP

1G to 224G SerDes

The "1G to 224G SerDes" solution from Alphawave Semi offers an extensive range of multi-standard connectivity IPs, designed to deliver optimal high-speed data transfer. These full-featured building blocks can be integrated into various chip designs, providing scalability and reliability across numerous protocols and standards. Supporting data rates from 1 Gbps to 224 Gbps, this SerDes solution accommodates diverse signaling schemes, including PAM2, PAM4, PAM6, and PAM8. Alphawave Semi's SerDes IP is engineered to meet the demands of modern communication systems, ensuring connectivity across a wide spectrum of applications. These include data centers, telecom networks, and advanced networking systems where high data transfer speeds are a necessity. This solution is crafted with energy efficiency in mind, helping reduce power consumption while maintaining a robust data connection. The SerDes solutions come equipped with advanced features like low latency and noise resilience, which are crucial for maintaining signal integrity over various transmission distances. This facilitates seamless integration into enterprises looking to boost their processing capabilities while minimizing downtime and operational inefficiencies. These capabilities make Alphawave Semi's SerDes IP a vital component in the evolving landscape of technology connectivity applications.

Alphawave Semi
GLOBALFOUNDRIES, TSMC
4nm, 5nm, 7nm
AMBA AHB / APB/ AXI, D2D, DSP Core, Ethernet, Interlaken, PCI, USB, Wireless Processor
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AHB-Lite APB4 Bridge

The AHB-Lite APB4 Bridge serves as a crucial interconnect that facilitates communication between the AMBA 3 AHB-Lite and AMBA APB bus protocols. As a parameterized soft IP, it offers flexibility and adaptability in managing system interconnections, bridging the gap between high-speed and low-speed peripherals with efficiency. The bridge's architecture is designed to maintain data integrity while transferring information across different protocol tiers. This bridge supports the implementation of a seamless transition for data exchanges, ensuring data packets are transmitted with minimal latency. It is ideal for systems that require stable connectivity across multiple peripheral interfaces, delivering a cohesive platform for system designers to enhance operational uniformity. By enabling efficient bus conversion, it supports broader system architectures, contributing to the overall efficiency of embedded designs. With its open-architecture design, the AHB-Lite APB4 Bridge caters to a wide range of applications, providing necessary adaptability to meet the unique demands of each project. Its robust design ensures that it can accommodate the complex architectures of modern embedded systems, enhancing both performance and reliability.

Roa Logic BV
AMBA AHB / APB/ AXI, Embedded Security Modules, I2C, Input/Output Controller, Interlaken, Smart Card
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SerDes PHY

The SerDes PHY is a high-performance solution designed to facilitate high-speed data transmission within sophisticated data infrastructures. Offering support for various signaling options from 28G to 224G, this PHY is engineered to provide reliable, high-bandwidth communication required by next-generation AI and data centers. With the highly adaptable architecture, it ensures seamless integration into multiple designs including those that require long reach and very short reach plus options. Its design emphasis is on achieving low latency and high reliability, making it indispensable in environments demanding maximum uptime and efficiency. Incorporating cutting-edge mixed signal DSP technology, the SerDes PHY can effectively manage high data rates, making it ideal for switch fabric ASICs, AI ASICs, and machine learning applications. The underlying technology is manufactured on advanced process nodes, which enhances both the performance and power efficiency of the solutions. Through its innovative design, the SerDes PHY supports a range of applications that include interconnecting AI clusters, supporting cloud infrastructures, and enhancing hyperscale networking systems. It stands out for its ability to support seamless operation at various data rates, ensuring future-proofing for scaling AI and data center demands. Utilizing this PHY can enable the development of high-performance, optimized solutions that push the boundaries of current technological capabilities.

Credo Semiconductor
TSMC
3nm, 7nm
AMBA AHB / APB/ AXI, D2D, Ethernet, Gen-Z, IEEE1588, Interlaken, Multi-Protocol PHY, PCI
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Multi-Protocol SerDes

The Multi-Protocol SerDes provided by Silicon Creations serves as an essential component for high-speed data interfaces across multiple industry protocols. This SerDes portfolio accommodates a vast array of protocols such as PCIe, JESD204, XAUI, and many more, facilitating broad compatibility with industry standards. Operating across 12nm to 180nm processes, these interfaces support data rates from 100 Mbps to an impressive 32.75 Gbps. Incorporating advanced features like programmable de-serialization widths and adaptive equalization, the Multi-Protocol SerDes ensures optimal signal integrity and performance even in demanding environments. The design includes jitter cleaner functions and employs low-latency optimized PMAs, delivering high precision and speed across various operational scenarios. This comprehensive adaptability ensures seamless integration into a wide range of applications from communications to high-performance computing. Supported by robust architectures, the SerDes enables enhanced efficiency and reliability, featuring low power consumption and reduced area overheads. With a commitment to customer satisfaction, Silicon Creations offers complete solutions through partnerships with leading controller vendors, cementing its products as high-value choices for modern electronic systems.

Premium Vendor
Silicon Creations
TSMC
40nm, 180nm
AMBA AHB / APB/ AXI, Interlaken, MIPI, Multi-Protocol PHY, PCI, USB, V-by-One
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Multi-Protocol SERDES

The Multi-Protocol SERDES offered by Pico Semiconductor is a versatile solution capable of handling a variety of communication protocols. This series of SERDES includes a 4-channel configuration that supports data rates up to 32Gbps, designed for integration with XAUI, RXAUI, and SGMII. It is compatible with multiple process nodes provided by foundries like TSMC and GF, offering robust performance across different semiconductor environments. These SERDES are crafted to meet high-performance metrics, capturing speeds up to 16Gbps and 6.5Gbps across various models, with advanced versions reaching up to 32Gbps. This exceptional range not only ensures compatibility with current technologies but also prepares systems for future updates, sustaining high data throughput. By delivering reliable high-speed data transmission capabilities, the Multi-Protocol SERDES from Pico Semiconductor is integral for networking, high-speed computing, and data storage applications, where efficient and speedy data transfer is paramount.

Pico Semiconductor, Inc.
GLOBALFOUNDRIES, TSMC
16nm, 45nm, 65nm
AMBA AHB / APB/ AXI, Interlaken, MIPI, Multi-Protocol PHY, PCI
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BlueLynx Chiplet Interconnect

The BlueLynx Chiplet Interconnect system provides an advanced die-to-die connectivity solution designed to meet the demanding needs of diverse packaging configurations. This interconnect solution stands out for its compliance with recognized industry standards like UCIe and BoW, while offering unparalleled customization to fit specific applications and workloads. By enabling seamless connection to on-die buses and Networks-on-Chip (NoCs) through standards such as AMBA, AXI, ACE, and CHI, BlueLynx facilitates faster and cost-effective integration processes. The BlueLynx system is distinguished by its adaptive architecture that maximizes silicon utilization, ensuring high bandwidth along with low latency and power efficiency. Designed for scalability, the system supports a remarkable range of data rates from 2 to 40+ Gb/s, with an impressive bandwidth density of 15+ Tbps/mm. It also provides support for multiple serialization and deserialization ratios, ensuring flexibility for various packaging methods, from 2D to 3D applications. Compatible with numerous process nodes, including today’s most advanced nodes like 3nm and 4nm, BlueLynx offers a progressive pathway for chiplet designers aiming to streamline transitions from traditional SoCs to advanced chiplet architectures.

Blue Cheetah Analog Design, Inc.
GLOBALFOUNDRIES, TSMC
10nm, 20nm, 28nm, 65nm, 90nm, 90nm S90LN
AMBA AHB / APB/ AXI, Analog Front Ends, Clock Synthesizer, D2D, Gen-Z, IEEE1588, Interlaken, MIPI, Modulation/Demodulation, Network on Chip, PCI, PLL, Processor Core Independent, VESA, VGA
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10G TCP Offload Engine (TOE)

The 10G TCP Offload Engine from Intilop brings a transformative approach to network protocol processing. Designed to handle TCP processing tasks, this engine ensures efficient data transmission by offloading TCP processing from the CPU, thus optimizing the resources available for other critical computing tasks. With features focused on reducing latency and increasing throughput, the 10G TOE is ideal for high-performance computing environments and data centers where speed and efficiency are paramount. The engine showcases Intilop's core expertise in delivering ultra-reliable and rapid networking solutions, providing support for multiple concurrent sessions with consistent low latency. Professionals in cloud services and enterprise networking will find the integration capabilities of the 10G TOE highly beneficial, as it supports a comprehensive suite of features that extend beyond traditional TCP processing, reinforcing security and operational efficiency.

Intilop Corporation
AMBA AHB / APB/ AXI, Error Correction/Detection, Ethernet, Interlaken, PCI, SAS, SATA, USB
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I/O

Analog Bits provides robust I/O solutions that are essential for the efficient transfer of signals between semiconductor devices and their external environment. These input/output interfaces are designed to meet the most demanding performance criteria, ensuring fast data rates and minimal signal distortion. Their I/O IP solutions can accommodate a variety of protocols, including high-speed digital interfaces and analog conversions, offering versatility and support for applications such as networking, data processing, and consumer electronics. By optimizing the signal integrity and electromagnetic compatibility, these I/Os enhance the overall system performance. Equipped with advanced features for low power consumption, these I/Os contribute to reducing the overall energy footprint of semiconductor devices, making them ideal for battery-operated devices and environmentally sensitive applications. Analog Bits' I/Os are comprehensively integrated to function seamlessly within mixed-signal environments, further broadening their application range.

Analog Bits
Samsung, TSMC
16nm, 20nm
AMBA AHB / APB/ AXI, Analog Multiplexer, D2D, Embedded Memories, I/O Library, Input/Output Controller, Interlaken, MIPI, Multi-Protocol PHY, Peripheral Controller, Receiver/Transmitter, USB
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AresCORE UCIe Die-to-Die PHY

The "AresCORE UCIe Die-to-Die PHY" by Alphawave Semi represents a leading-edge solution for low-power, low-latency die-to-die connectivity. It is designed to support high-bandwidth links between two dies within the same package, ensuring fast and efficient communication essential for modern microchip architectures. Alphawave's AresCORE PHY is pivotal for applications requiring tight coupling between chiplets, without compromising on energy efficiency or speed. This makes it ideal for emerging applications in high-performance computing and artificial intelligence, where minimizing transmission delay is crucial for performance. Optimized for universal chiplet interconnect, AresCORE supports the latest industry standards, providing flexibility and forward compatibility for evolving technology landscapes. The solution is also characterized by its simple integration into existing architectures, facilitating a smoother transition to advanced chip designs while maximizing the benefits of inter-die communication across complex computing environments.

Alphawave Semi
GLOBALFOUNDRIES, TSMC
4nm, 5nm, 7nm
AI Processor, Audio Processor, D2D, Interlaken, Wireless Processor
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Cyclone V FPGA with Integrated PQC Processor

The Cyclone V FPGA with Integrated PQC Processor by ResQuant is a specialized product that comes pre-equipped with a comprehensive NIST PQC cryptography suite. This FPGA is tailored for applications requiring a robust proof-of-concept for quantum-safe implementations. It ensures seamless integration into existing systems, providing a practical platform for testing and deployment in quantum-secure environments. This product is available at a competitive price and represents an ideal starting point for entities looking to explore and adopt quantum-resilient technologies. Its configuration allows for straightforward implementation in diverse hardware infrastructures while offering a reliable option for organizations aiming to stay ahead in the evolving cyber security landscape. By incorporating the latest in cryptographic standards and ensuring vendor independence, the Cyclone V FPGA with Integrated PQC Processor by ResQuant effectively bridges current hardware technologies and future-proof security needs. It supports industry-wide applications, from IoT and ICT to automotive and military sectors, underscoring ResQuant's versatility in hardware security solutions.

ResQuant
All Foundries
All Process Nodes
13 Categories
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JESD204B Multi-Channel PHY

The JESD204B Multi-Channel PHY from Naneng Microelectronics is designed to meet the rigorous demands of high-speed data transmission. Featuring a data rate capability of up to 12.5Gbps, this physical layer multi-channel interface supports a wide array of applications requiring reliable and efficient data transfer. Its versatile architecture ensures seamless integration into complex systems, providing robust performance benefits in the field of data communications. A comprehensive design enhances usability and flexibility, allowing customization for specific industrial needs. This PHY is particularly adept in high-density environments, ensuring precision synchronization across multiple channels, critical for signal integrity in today's intricate electronic ecosystems. Furthermore, the solution's efficient layout allows for ease of interoperability with existing infrastructure, reducing integration costs and time-to-market for end-users. This makes the JESD204B Multi-Channel PHY an attractive choice for enterprises aiming for optimal performance in digital communication systems without compromising efficiency.

Naneng Microelectronics
AMBA AHB / APB/ AXI, D2D, IEEE1588, Interlaken, JESD 204A / JESD 204B, MIPI, Multi-Protocol PHY, PLL, Receiver/Transmitter, USB
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Chiplet Interface UCIe PHY & D2D Adapter

The Chiplet Interface solutions provided by Neuron IP include cutting-edge PHY & D2D Adapter IP for chiplet products. These solutions are built around the latest UCIe v1.1 specification and are designed to support a wide range of application verticals. They are well-known for their unparalleled PPA-differentiated architecture, which includes 32Gbps UCIe-Advanced and Standard cores. These interfaces are set to revolutionize the way microprocessors work in ultra-low latency environments, enhancing both performance and efficiency.

Neuron IP Inc.
D2D, Interlaken
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CAN 2.0/CAN FD Controller

The CAN 2.0/CAN FD Controller offered by Synective Labs is a comprehensive CAN controller suitable for integration into both FPGAs and ASICs. This controller is fully compliant with the ISO 11898-1:2015 standard, supporting both traditional CAN and the more advanced CAN FD protocols. The CAN FD protocol enhances the original CAN capabilities by transmitting payloads at increased bitrates up to 10 Mbit/s and accommodating longer payloads of up to 64 bytes compared to the standard 8 bytes. This controller integrates seamlessly with a variety of FPGA devices from leading manufacturers such as Xilinx, Altera, Lattice, and Microsemi. It supports native bus interfaces including AXI, Avalon, and APB, making it versatile and highly compatible with various processing environments. For those deploying System on Chip (SOC) type FPGAs, the controller offers robust processor integration options, making it an ideal choice for complex applications. A standout feature of this IP is its focus on diagnostics and CAN bus debugging, which makes it particularly beneficial for applications like data loggers. These diagnostic features can be selectively disabled during the build process to reduce the controller's footprint for more traditional uses. With its low-latency DMA, interrupt rate adaptation, and configurable hardware buffer size, this CAN controller is engineered for high efficiency and flexibility across different applications.

Synective Labs AB
AMBA AHB / APB/ AXI, CAN, CAN-FD, Interlaken, Receiver/Transmitter
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Photowave Optical Communications Hardware

Photowave optical communications hardware is expertly crafted for the emerging needs of AI memory applications requiring disaggregated resources. Specifically engineered to be compatible with PCIe 5.0/6.0 and CXL 2.0/3.0, Photowave capitalizes on photonics to provide superior latency and energy efficiency. This technology is a game-changer for data centers, offering managers the ability to scale resources flexibly either within individual racks or across multiple server racks, paving the way for more adaptive and powerful data management solutions. By embracing the fundamental strengths of photonics, Photowave empowers large-scale computing systems to achieve previously unattainable levels of efficiency and responsiveness. This optical communication solution ensures seamless integration with state-of-the-art computing infrastructure, thus facilitating the shift towards more intelligent and modular computing environments which underpin the growth of AI-driven applications. The Photowave hardware is meticulously designed to uphold the highest standards in optical communication, ensuring fast data transfer capabilities that drastically reduce latency and improve the overall performance of computing tasks. In environments where swift and reliable data processing is paramount, Photowave stands out as a crucial component, helping optimize technological investments and boost the performance of AI and machine learning workloads.

Lightelligence
CXL, D2D, Ethernet, I2C, Interlaken, Modulation/Demodulation, Photonics, RapidIO, SATA, USB, VESA
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56G SerDes Solution

InnoSilicon's 56G SerDes Solution offers a remarkable balance of high data rates and power efficiency, making it a go-to choice for state-of-the-art digital communication systems. This high-speed serial interface is designed to meet the increasing demand for bandwidth in data-intensive applications, ensuring robust performance in networking and data transmission. This SerDes solution supports multiple protocols, providing versatile usage across different platforms and architectures. It is engineered to handle high-speed data processing, essential for modern telecommunication systems and advanced networking solutions, delivering minimal jitter and power consumption. The solution provides exceptional flexibility in integration, effectively supporting a variety of higher-end systems for optimized data delivery. InnoSilicon has structured this product to aid in the seamless transition of telecommunication infrastructures to newer, more demanding protocols, ensuring future-proofing and long-term viability.

InnoSilicon Technology Ltd.
TSMC
12nm, 14nm, 22nm, 28nm
AMBA AHB / APB/ AXI, ATM / Utopia, D2D, Ethernet, Fibre Channel, IEEE1588, Interlaken, PCI, RapidIO, SAS, USB
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USB Solutions for High-speed Data Transfer

LTTS's USB solutions provide a comprehensive range of high-speed data transfer capabilities, supporting up to 10 Gbps. As a leader in USB technology innovation, our solutions encompass the latest USB standards, facilitating swift and seamless data exchange across various devices. This suite of USB solutions is essential for devices that prioritize high data transfer rates to optimize user interactions with technology. These solutions are designed to support USB 3.0, 3.1, and 3.2 standards, allowing both backward compatibility and future-proofing for devices. Consequently, manufacturers can ensure ongoing support for a wide array of peripherals, from legacy USB components to the latest high-speed interfaces. This versatility positions LTTS’s USB technology at the forefront of connectivity innovations. Impressive in its adaptability, LTTS's USB solutions cater to a broad range of electronic components, including portable devices, computers, and peripherals that demand efficient and rapid data processing. By enabling such dynamic connectivity, LTTS aids in building comprehensive ecosystems that align with users' intricate, fast-paced digital requirements.

L&T Technology Services (LTTS)
AMBA AHB / APB/ AXI, Cell / Packet, Interlaken, USB, V-by-One
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RapidIO VIP

Mobiveil's RapidIO Verification IP (VIP) provides a robust compliance verification solution for the RapidIO protocol. It is structured on System Verilog and compatible with the Universal Verification Methodology (UVM), allowing seamless integration with other verification environments. This IP achieves comprehensive protocol validation through logical, transport, and physical layers, employing protocol monitors for accurate checks and coverage hooks. Its extensive compliance testing ensures that designs pass all protocol scenarios, facilitating verification efforts at IP, system-on-chip, or full system levels.

Mobiveil, Inc.
AMBA AHB / APB/ AXI, Audio Controller, Interlaken, MIPI, Network on Chip, PCI, RapidIO
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PCIe Gen3 to SRIO Gen3 Bridge (FPGA)

This high-performance bridge IP from Mobiveil leverages FPGA technology to facilitate communication between PCI Express and Serial RapidIO systems. By integrating PCIe versatility with SRIO's low-latency, high-throughput capabilities, this bridge enables line-rate data transfers, ideal for environments requiring robust data communication such as telecommunications and medical imaging. It features sophisticated DMA and messaging engines that efficiently manage data processing while minimizing power requirements, making it perfect for a range of embedded systems.

Mobiveil, Inc.
AMBA AHB / APB/ AXI, Interlaken, PCI, RapidIO
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Interlaken PHY Solution

The Interlaken PHY Solution by StreamDSP serves as a high-performance interface solution designed for high-speed data systems. It employs the Interlaken protocol, which is specialized in managing chip-to-chip communications at high data rates while ensuring minimal overhead. The solution is optimized to provide a balance between performance and resource utilization, supporting a wide range of operating environments and requirements. Its versatility makes it ideal for networking, data center, and high-performance computing applications, where reliable and rapid data transmission is crucial.

StreamDSP LLC
AMBA AHB / APB/ AXI, Error Correction/Detection, Ethernet, Interlaken
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RapidIO-AXI Bridge

The RapidIO to AXI Bridge offered by Mobiveil acts as a versatile protocol converter between RapidIO and AXI systems. It supports flexible configurations tailored to host or device roles, employing multi-channel DMA and messaging controllers for bandwidth alignment between RapidIO and system requirements. This adaptability provides significant advantages for high-performance computing settings, including defense and aerospace applications.

Mobiveil, Inc.
AMBA AHB / APB/ AXI, Interlaken, MIPI, Network on Chip, PCI, RapidIO
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FireTrac AS5643 Interface Card

FireTrac is an advanced AS5643 interface card that represents DapTechnology's prowess in handling Mil1394 data processing. It is engineered to be the industry-standard platform for simulation and testing solutions, providing sophisticated tools for developers in the aerospace sector. This product is highly valued for its simulation capabilities, which are critical in developing robust aerospace communication systems. The card supports advanced data encapsulation and decapsulation processes, which are vital for high-fidelity signal integrity in modern avionics. Its integration into systems allows for seamless IEEE-1394 communication, proving indispensable in testing and simulation environments. FireTrac cards also feature a variety of connectivity options, helping to ensure compatibility across different hardware setups. DapTechnology's FireTrac offers a comprehensive testing framework and is integral to projects where high-quality and reliable Mil1394 implementations are required. Its global recognition stems from its flexibility and powerful processing capabilities, making it a go-to choice for aerospace and defense projects around the world.

DapTechnology B.V.
AMBA AHB / APB/ AXI, CAN-FD, Ethernet, FlexRay, IEEE 1394, IEEE1588, Interlaken, MIL-STD-1553, MIPI, PowerPC, V-by-One
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10GBASE-KR Ethernet IP

The 10GBASE-KR Ethernet IP is crafted to meet the needs of backplane Ethernet networking, offering a reliable solution for 10Gbps data transmission over a wide variety of network conditions. This IP ensures compliance with the 10GBASE-KR standard, supporting adaptive equalization to maintain data integrity across diverse cable lengths and network architectures. Optimized for high-performance and low-latency operation, it is suited for enterprise networking environments where data integrity and speed are paramount. Whether deployed within data centers or integrated into high-end routers and switches, this IP addresses the critical demands of modern Ethernet packets. Featuring advanced signal conditioning techniques, the 10GBASE-KR Ethernet IP provides flexible configuration options and is built to be compatible across a range of existing infrastructure, ensuring smooth deployment and high interoperability with other network components.

eTopus Technology Inc.
All Foundries
65nm, 250nm
AMBA AHB / APB/ AXI, D2D, Ethernet, Interlaken, PCI, USB
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Wormhole

The Wormhole series from Tenstorrent is specifically engineered to elevate AI processing through its unique Tensix architecture, featuring extensive scalability and flexibility. With a focus on high-speed data handling, Wormhole products enable developers to optimize the performance of AI workloads significantly. The architectural design supports seamless interoperability, enhancing the exchange and management of data across various computing units. Wormhole’s architecture is built to cater to the critical requirements of modern AI applications. Leveraging the power of RISC-V cores, these products offer sophisticated data processing capabilities that can adapt dynamically to the challenging demands of AI. The Wormhole series facilitates a robust computational framework that is ideal for both single-user and multi-user environments, ensuring a balanced distribution of processing tasks without compromising on efficiency. The high-bandwidth mesh topology integrated within Wormhole IP allows for expansive memory pooling and resource allocation, making it particularly advantageous for deep learning models and applications that necessitate substantial computational power. This feature holds significant benefits in data-rich environments, particularly in autonomous systems and advanced robotics where real-time processing is pivotal. By aligning seamlessly with Tenstorrent's open-source software ecosystem, Wormhole ensures that developers can manage and optimize their implementations freely. It's designed for integration into a wide range of systems, providing the versatility needed for specialized AI interventions and expansive computational tasks.

Tenstorrent
TSMC
7nm LPP, 28nm
AI Processor, CPU, CXL, D2D, Interlaken, IoT Processor, Multiprocessor / DSP, Network on Chip, Processor Core Dependent, Processor Core Independent, Processor Cores
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PCIe Gen6/CXL 3.0

Our PCIe Gen6 with CXL 3.0 integration stands at the forefront of next-generation interfaces, delivering massive bandwidth and minimal latency for demanding computational tasks. Reaching data rates up to 64 GT/s, it offers profound improvements in speed and connectivity for cutting-edge technology deployments. This integration allows for dramatic enhancements in coherent memory sharing capabilities and efficient resource utilization across accelerator and server environments. The Gen6 PCIe, combined with CXL 3.0, supports increased scalability and bandwidth, making it ideal for everything from data-centric computing to high-frequency trading platforms. Security remains a priority, with added layers of data protection to ensure safe transfer processes, underscoring its suitability for sensitive applications requiring absolute reliability.

PrimeSOC Technologies
Samsung, TSMC
28nm, 55nm
CXL, Gen-Z, Interlaken, PCI, Processor Core Independent, RapidIO
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Arkville Data Mover

Arkville is a formidable FPGA Gen5 PCIe DMA IP solution engineered to facilitate seamless data transfer between FPGA logic and host memory at remarkable speeds of up to 60 GBytes/s (480 Gbps) bidirectionally. This high-efficiency conduit substantially reduces CPU core utilization, obliterates the need for memory copies, and ultimately refines overall system efficiency. The IP core supports widespread industry-standard APIs for zero-copy user space memory handling, catering extensively to both hardware and software engineers involved in data production and consumption. This advanced data mover offers trusted and reliable PCIe DMA offload capabilities, facilitating rapid market deployment of FPGA-based packet processing solutions. By embracing modern standards such as DPDK and AXI, Arkville ensures compatibility across a broad spectrum of use cases. Vendor agnostic in its RTL support, Arkville caters to both Intel/PSG and AMD/Xilinx FPGA devices, further extending its versatility. Beyond its intrinsic features, the Arkville solution comes with a comprehensive suite of example designs, providing users with a solid foundation upon which they can build customized solutions. These examples showcase various network configurations, from multi-port scenarios to high-speed single-port operations, highlighting Arkville's adaptability to evolving packet processing requirements.

Atomic Rules LLC
AMBA AHB / APB/ AXI, CXL, D2D, Ethernet, IEEE1588, Interlaken, PCI, RapidIO
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ChipBridge AXI4 Connectivity

ChipBridge facilitates AXI4 protocol communication, extending it to external FPGAs for improved peripheral management. The simplicity of using only two signal pairs for connectivity allows for efficient use of space and resources, making it well-suited for complex systems looking to separate control and processing logic across chips. This IP enables seamless integration with various FPGA families, offering flexible and scalable system design options for high-performance applications that demand robust connectivity solutions without comprising on speed or efficiency.

ALSE Advanced Logic Synthesis for Electronics
AMBA AHB / APB/ AXI, D2D, Interlaken
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Interface IP

Key ASIC's suite of Interface IPs is designed to enable seamless integration of communication features in high-performance systems. Among the key offerings are USB 2.0 and 3.0 PHYs which include host, device, and OTG capabilities, enabling robust external device connectivity crucial for modern electronics. The Ethernet MAC/PHY interfaces provide 10/100 connectivity, extending devices' network capabilities. They also offer PCI and PCIe PHY for high-speed data transfer applications essential in computing and communication sectors. The MIPI interfaces cater to high-speed mobile and display applications, ensuring data integrity and speed. In addition to these, Key ASIC's portfolio includes support for a wide range of high-speed serial links like LVDS, SATA, and RapidIO, making their Interface IP well-suited for complex multi-channel communication systems and ensuring streamlined data bus management. These interfaces support cutting-edge applications including consumer electronics, telecommunications infrastructure, and industrial control systems.

Key ASIC, Inc.
AMBA AHB / APB/ AXI, DDR, Ethernet, Interlaken, PCI, RapidIO, SAS, SATA, SDRAM Controller, USB
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GammaCORE UCIe Die-to-Die Controller

Alphawave Semi's "GammaCORE UCIe Die-to-Die Controller" is a sophisticated controller IP solution implementing the latest UCIe 2.0 specification. This controller is designed to manage extensive data transmission needs across dies situated within the same package, effectively supporting UCIe streaming protocol applications. Leveraging customizable architecture, GammaCORE ensures optimal performance by adapting to specific application requirements, offering low latency and efficient data flow management. It provides dynamic configurations to maintain performance across varying conditions, adaptable to a wide range of data-intensive environments. This controller serves critical roles in applications like AI and HPC that require synchronized data exchange between chiplets, ensuring seamless interoperability across diverse technological infrastructures. Its robust architecture supports the intricate demands of modern system-on-chip designs, placing it at the heart of innovative chiplet-based systems.

Alphawave Semi
GLOBALFOUNDRIES, TSMC
4nm, 5nm, 7nm
D2D, Interlaken
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CXL 2.0

The CXL 2.0 product line offers cutting-edge performance features that make it ideal for modern high-performance computing tasks. This IP enables coherent memory access in heterogenous compute systems, efficiently supporting multi-tiered memory architectures and decoupling memory from compute resources to optimize system performance. CXL 2.0 is engineered to enhance bandwidth and reduce latency between CPUs and accelerators, operating efficiently across different computational environments. It delivers distinct advantages in workload distribution and improved data management capabilities, essential for advanced computing tasks in AI and machine learning. The architecture further includes advanced security features, facilitating safe and reliable processing in complex data environments. Its seamless memory pooling and management capabilities make it indispensable for edge computing and cloud data management systems.

PrimeSOC Technologies
Samsung, TSMC, VIS
28nm, 55nm, 500nm
CXL, Gen-Z, Interlaken, Processor Core Independent
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Aurora 8B/10B IP Core

The Aurora 8B/10B IP Core is a versatile serial protocol core that supports up to 6.6 Gbps per lane, providing an efficient solution for inter-FPGA communication or as an alternative to high-speed serial interfaces like PCI Express. This IP is compatible with various FPGA vendors, ensuring broad interoperability and application flexibility. It offers low latency and reliable data integrity through robust error-checking mechanisms, making it ideal for high-performance applications that require stable, fast data transfer, such as in telecommunications and high-speed computing.

ALSE Advanced Logic Synthesis for Electronics
Cell / Packet, D2D, DSP Core, Interlaken
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Aurora 64B/66B IP Core

The Aurora 64B/66B IP Core supports high-speed serial communication protocols, serving as a reliable link for chip-to-chip and board-to-board data transmission. Its compact design allows for efficient use of resources, making it suitable for demanding applications across multiple FPGA platforms and even ASIC implementations. The core is engineered to maintain high throughput and low latency, essential for applications like video data transfer or high-speed networking, due to its 97% bandwidth efficiency compared to other standards. Additionally, it ensures compatibility with Xilinx Aurora cores, allowing seamless integration in existing setups.

ALSE Advanced Logic Synthesis for Electronics
Cell / Packet, D2D, DSP Core, Interlaken
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JESD204 IP

The JESD204 IP is crafted for interfacing FPGAs with high-speed ADCs and DACs, facilitating efficient data conversion and processing. This IP supports multiple JESD204 standards, including the latest JESD204C, and is equipped to manage the complexities of high-speed serial data transfers reliably. Its design focuses on minimizing latency and ensuring precise synchronization, crucial for applications involving multiple converters. The IP's adaptability across various FPGA platforms makes it a critical component for high-bandwidth data acquisition systems prevalent in industries like communications and advanced instrumentation.

ALSE Advanced Logic Synthesis for Electronics
Analog Front Ends, Cell / Packet, DSP Core, Interlaken, MIPI
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50G/40G/25G TCP/UDP Offload Engine Series

This series of TCP/UDP offload engines from Intilop is engineered to support an impressive range of session handling capabilities - with the capacity for over 1000 sessions. Tailored for high-performance network applications, this series maintains the hallmark of ultra-low latency offloading, significantly reducing the processing load on the host CPU. By effectively offloading TCP and UDP protocols, these engines facilitate faster data processing and transfer rates, which are crucial for real-time applications and demanding network environments. They are particularly beneficial for systems requiring high throughput and low power consumption, such as large enterprise networks and high-frequency trading systems. The series integrates seamlessly into existing FPGA setups, enabling designers to leverage its robust architecture for enhanced performance. Each engine in this series ensures consistent high-speed data handling, which maximizes network bandwidth usage and reduces overall system costs.

Intilop Corporation
AMBA AHB / APB/ AXI, Error Correction/Detection, Ethernet, Interlaken, SAS, SATA, USB
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Die-to-Die (2.5D/3D) Interface

The Die-to-Die (2.5D/3D) Interface is an advanced solution designed to facilitate seamless interaction between multiple die in an integrated system. This product caters to the growing industry need for high-bandwidth, low-latency connections in complex multi-die configurations found in modern computing systems. Supporting communicative bandwidth while minimizing power consumption, this interface is engineered for applications requiring high-speed interconnects across 2.5D and 3D package structures. It transforms traditional system integrations by offering superior scalability, accommodating the burgeoning complexity of data management in edge computing, AI, and high-performance data centers. With a commitment to enhancing system connectivity, this interface allows for efficient power management and signal integrity, which are essential for maintaining performance standards in high-demand environments. The Die-to-Die (2.5D/3D) Interface paves the way for innovative semiconductor designs, enabling efficient and flexible advancements in technology integration.

Global Unichip Corp.
TSMC
3nm, 5nm
AMBA AHB / APB/ AXI, D2D, Interlaken, MIPI, VESA
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JESD204 Interface for High-Speed Data Converters

Altera's JESD204 FPGA core is designed to simplify the integration of high-speed data converters with digital processing systems. This core efficiently manages the complexities of high-speed serial interfaces, complying with the JEDEC's JESD204 standard which is pivotal for connecting JESD204A, B, and C converters to an FPGA design. It ensures seamless data flow and synchronization essential for applications that demand rapid data conversion and processing, like signal processing, communications, and industrial automation. This interface IP provides robust support for lane synchronization, and deterministic latency, which are crucial for maintaining data integrity across multiple channels. By facilitating easy integration, it reduces the development time and helps in achieving rapid prototyping and deployment in advanced digital systems. Users benefit from the reduced complexity in managing high-speed analog-digital converter interfaces, which is a critical requirement in high-performance applications. Moreover, the JESD204 IP core is tailored to ensure easy adaptability and flexibility to different system requirements, thanks to its parameterizable architecture. Its scalable design supports a range of configurations, allowing designers to meet specific bandwidth and channel requirements effectively. This enhances the ease of designing systems for complex signal and data processing tasks, thereby increasing productivity and system efficiency.

Altera
Intel Foundry, TSMC
10nm, 16nm
Interlaken
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