All IPs > Interface Controller & PHY > Gen-Z
In the rapidly evolving world of data-intensive computing, Gen-Z semiconductor IPs play a crucial role in enhancing the performance and scalability of computing architectures. As part of the Interface Controller & PHY category, these IPs are engineered to support high-speed, low-latency communication between components in a compute system. Gen-Z is an open-systems interconnect, developed to meet the demands of modern workloads, such as data analytics, machine learning, and artificial intelligence. By providing a framework that features memory-semantic access to data, these semiconductor IPs enable seamless communication across multiple system components, optimizing both cost and performance.
Gen-Z interface controller and PHY semiconductor IPs are essential for developing interoperable and efficient data center solutions. They enable the seamless integration of resources such as memory, storage, and processors, reducing bottlenecks and enhancing data transfer efficiency. These IPs offer a scalable solution that allows for the dynamic sharing of these resources, resulting in improved utilization and flexibility. As workloads become increasingly complex, the ability to efficiently harness and manage resources becomes critical, and Gen-Z IPs are at the forefront, facilitating this capability through their innovative design.
These semiconductor IPs are leveraged in a broad range of applications where high throughput and low latency are essential. Data centers, high-performance computing environments, and enterprise networks can significantly benefit from the capabilities that Gen-Z IPs provide. They are instrumental in building infrastructures that require the rapid exchange of large volumes of data across various components, such as CPUs, GPUs, and storage devices. This makes them a vital component in the development of next-generation data centers and cloud computing architectures.
Inclusion of Gen-Z IP in the Interface Controller & PHY category promises continued advancement and improvement in computing capabilities, matching industry demands for more efficient, scalable, and powerful electronic systems. By addressing the communication challenges inherent in modern computing tasks, these semiconductor IPs promote innovation and provide a robust foundation for future developments in technology. Businesses and developers looking to stay ahead in the technology race can significantly benefit from incorporating these solutions into their products and systems, ensuring enhanced performance and competitiveness in a dynamic market.
Panmnesia's CXL 3.1 Switch is an integral component designed to facilitate high-speed, low-latency data transfers across multiple connected devices. It is architected to manage resource allocation seamlessly in AI and high-performance computing environments, supporting broad bandwidth, robust data throughput, and efficient power consumption, creating a cohesive foundation for scalable AI infrastructures. Its integration with advanced protocols ensures high system compatibility.
EXTOLL's Universal Chiplet Interconnect Express (UCIe) is a cutting-edge solution designed to meet the evolving needs of chip-to-chip communication. UCIe enables seamless data exchange between chiplets, fostering a new era of modular and scalable processor designs. This technology is especially vital for applications requiring high bandwidth and low latency in data transfer between different chip components. Built to support heterogeneous integration, UCIe offers superior scalability and is compatible with a variety of process nodes, enabling easy adaptation to different technological requirements. This ensures that system architects can achieve optimal performance without compromising on design flexibility or efficiency. Furthermore, UCIe's design philosophy is centered around maintaining ultra-low power consumption, aligning with modern demands for energy-efficient technology. Through EXTOLL’s UCIe, developers have the capability to build versatile and multi-functional platforms that are more robust than ever. This interconnect technology not only facilitates communications between chips but enhances the overall architecture, paving the way for future innovations in chiplet systems.
eSi-Connect offers an extensive suite of AMBA-compliant peripheral IPs designed to streamline SoC integration. This suite encompasses versatile memory controllers, standard off-chip interface support, and essential control functions. Its configurability and compatibility with low-level software drivers make it suitable for real-time deployment in complex system architectures, promoting reliable connectivity across various applications.
Credo's SerDes PHY solutions are pivotal in enabling high-performance interconnects for custom ASICs and advanced signal processing applications. Specifically engineered to balance performance with power efficiency, these solutions leverage unique, patented DSP architectures that can be implemented using mature process nodes, thereby maintaining cost efficiency without compromising on quality. The design flexibility allows the seamless integration of SerDes PHY into various ASIC platforms, making it ideal for complex digital signal processing and AI tasks. Credo’s SerDes PHYs are available as both licensed IP and chiplets to cater to a broad spectrum of customer needs. These solutions are also adaptable, capable of accommodating a range of signaling, from 112G to 56G, in various modes like PAM4 and NRZ. The architecture is further configured to support diverse operating conditions, ensuring compatibility across different fabrication technologies and design scenarios. The adaptability of SerDes PHY makes it highly suitable for integration into multiple platforms such as Multi-Chip Modules (MCM) and 2.5D interposers. This characteristic simplifies the design process for high-speed interconnects and assists in overcoming conventional barriers associated with the same-process logic and SerDes integration. As a result, Credo enables more accessible and economically viable solutions for pioneering ASIC designs that demand robust performance and scalability.
The DisplayPort/eDP by Silicon Library is designed to provide high-performance interfaces capable of delivering exceptional video clarity and fidelity. Supporting DisplayPort 1.4 standards, this module is ideal for high-resolution displays, ensuring sharp and fluid visual output. This IP ensures seamless data transfer for video signals with high bandwidth efficiency, making it extremely suitable for advanced multimedia applications. It supports a range of resolutions, including Ultra HD, and facilitates excellent color depth and dynamic range in visual displays. Silicon Library's DisplayPort/eDP module offers exceptional flexibility in integration across a plethora of consumer electronic devices, enhancing their visual performance. With features optimized for energy efficiency and reduced latency, this product is perfect for modern applications that demand the pinnacle of video output technology.
The AST 500 and AST GNSS-RF are multifaceted SOC and RF solutions designed for GNSS applications. They support a wide array of constellations such as GPS, GLONASS, NavIC, and others, in multiple frequency bands, enhancing navigation performance. These ICs integrate features like secure boots and data encryption, facilitating robust security measures crucial for sensitive data. The AST GNSS-RF is equipped with capabilities for L1, L2, L5, and S band reception, catering to high-fidelity signal requirements across various applications. The support for dual-band reception ensures that ionosphere errors are minimized, offering exceptional positioning accuracy.
A trailblazer in high-speed rail connectivity, LightningBlu offers a groundbreaking, track-to-train multi-gigabit mmWave solution. This technology is renowned for its seamless integration with train networks, providing stable and fast connections crucial for high-speed transport. LightningBlu operates efficiently over a rail-friendly frequency range from 57-71 GHz and delivers an impressive data throughput of up to 3.5 Gbps. The system comprises both trackside and train-top nodes, each featuring innovative two-sector radios to ensure continuous, dynamic connection between the train and the trackside infrastructure. The design includes components qualified for rugged rail environments, promising extended service life and low maintenance needs. The solution significantly boosts operational efficiency for rail networks, being deployed in key infrastructures like South Western Railways and Caltrain in Silicon Valley. Versatile and resilient, LightningBlu adapts to varied complexities found in high-speed transport contexts. It communicates data faster than 5G while maintaining lower power consumption than traditional mobile networks, ensuring a superior commuter experience through its reliability and speed.
Under its eSi-Comms brand, EnSilica delivers a suite of highly parameterized communications IP solutions that play a crucial role in supporting modern communication standards such as 4G, 5G, Wi-Fi, and DVB. These IP blocks are designed to streamline the development of ASIC designs by providing a robust platform for OFDM-based modem solutions. The IP suite features advanced DSP algorithms for synchronization, equalization, demodulation, and channel decoding, ensuring robust communication links. It's optimized for integration into systems requiring flexibility and high performance.
The BlueLynx Chiplet Interconnect is a sophisticated die-to-die interconnect solution that offers industry-leading performance and flexibility for both advanced and conventional packaging applications. As an adaptable subsystem, BlueLynx supports the integration of Universal Chiplet Interconnect Express (UCIe) as well as Bunch of Wires (BoW) standards, facilitating high bandwidth capabilities essential for contemporary chip designs.\n\nBlueLynx IP emphasizes seamless connectivity to on-die buses and network-on-chip (NoCs) using standards such as AMBA, AXI, and ACE among others, thereby accelerating the design process from system-on-chip (SoC) architectures to chiplet-based designs. This innovative approach not only allows for faster deployment but also mitigates development risks through a predictable and silicon-friendly design process with comprehensive support for rapid first-pass silicon success.\n\nWith BlueLynx, designers can take advantage of a highly optimized performance per watt, offering customizable configurations tailored to specific application needs across various markets like AI, high-performance computing, and mobile technologies. The IP is crafted to deliver outstanding bandwidth density and energy efficiency, bridging the requirements of advanced nodal technologies with compatibility across several foundries, ensuring extensive applicability and cost-effectiveness for diverse semiconductor solutions.
ISPido on VIP Board is a customized runtime solution tailored for Lattice Semiconductors’ Video Interface Platform (VIP) board. This setup enables real-time image processing and provides flexibility for both automated configuration and manual control through a menu interface. Users can adjust settings via histogram readings, select gamma tables, and apply convolutional filters to achieve optimal image quality. Equipped with key components like the CrossLink VIP input bridge board and ECP5 VIP Processor with ECP5-85 FPGA, this solution supports dual image sensors to produce a 1920x1080p HDMI output. The platform enables dynamic runtime calibration, providing users with interface options for active parameter adjustments, ensuring that image settings are fine-tuned for various applications. This system is particularly advantageous for developers and engineers looking to integrate sophisticated image processing capabilities into their devices. Its runtime flexibility and comprehensive set of features make it a valuable tool for prototyping and deploying scalable imaging solutions.
The Cyclone V FPGA with Integrated PQC Processor by ResQuant is a specialized product that comes pre-equipped with a comprehensive NIST PQC cryptography suite. This FPGA is tailored for applications requiring a robust proof-of-concept for quantum-safe implementations. It ensures seamless integration into existing systems, providing a practical platform for testing and deployment in quantum-secure environments. This product is available at a competitive price and represents an ideal starting point for entities looking to explore and adopt quantum-resilient technologies. Its configuration allows for straightforward implementation in diverse hardware infrastructures while offering a reliable option for organizations aiming to stay ahead in the evolving cyber security landscape. By incorporating the latest in cryptographic standards and ensuring vendor independence, the Cyclone V FPGA with Integrated PQC Processor by ResQuant effectively bridges current hardware technologies and future-proof security needs. It supports industry-wide applications, from IoT and ICT to automotive and military sectors, underscoring ResQuant's versatility in hardware security solutions.
The Universal High-Speed SERDES from 1G to 12.5G is a flexible interface solution for high-speed data transfer applications. This SERDES is engineered to handle a broad range of data rates, providing versatility across numerous high-performance digital systems. Its design accommodates multiple data protocol standards such as RapidIO, FC, and XAUI, allowing seamless integration across diverse technological ecosystems. One of the standout features of this SERDES is its parameterizable data width options, offering bit widths like 16-bit, 20-bit, 32-bit, and 40-bit. This adaptability ensures it can cater to specific data handling requirements, enhancing the efficiency of electronic systems. Its programmable front-end equalizers and adaptive receiver equalizers further its robustness in dealing with varying signal integrity challenges. The SERDES maintains functionality independent of crystal oscillators, eliminating the need for additional external components, which simplifies system design and reduces costs. It supports various packaging modes and channel configurations, underpinning its flexibility in diverse application scenarios.
The NB-IoT (LTE Cat NB1) Transceiver is a versatile module built to adhere to the 3GPP Release 13 standard, with additional capability for Release 14 compliance. Its design offers high performance for both transmitter and receiver functions, meeting stringent 3GPP specifications with margin for enhanced reliability.\n\nOperating predominantly within cellular bands, the transceiver utilizes a low-power profile to ensure efficiency, offering analog interfaces for straightforward integration and testing. Its programmability via an SPI interface makes it suitable for a wide range of applications and testing environments.\n\nEngineered to interface effortlessly with baseband and MAC layers, this transceiver is an optimal solution for IoT implementations where long battery life and reliable connection quality are paramount. The NB-IoT module provides the necessary signal control for correcting DC offsets, ensuring consistent performance and facilitating integration across various IoT applications.
The N5186A MXG Vector Signal Generator is a versatile and sophisticated solution designed for generating signals across a comprehensive range of frequencies. Ideal for a wide array of testing scenarios, this signal generator can emulate complex signal environments, which is essential for evaluating device performance under realistic conditions. Its robust design not only enhances reliability but also ensures high precision in measurements, crucial for applications in advanced research and development. This vector signal generator caters to high-performance requirements, offering exceptional performance with its wide bandwidth and flexibility. These attributes make it a preferred choice for professionals involved in designing and testing next-generation wireless communication systems. Its user-friendly interface allows for easy setup and operation, making it suitable even for users who may not have extensive experience in signal generation. Equipped with the latest technology, the N5186A MXG ensures accurate and repeatable results, critically supporting the validation of new protocols and devices. By leveraging this tool, engineers can accelerate the development cycle, reducing the time-to-market for innovative products, and ensuring they comply with industry standards and customer expectations.
The MERA Compiler and Framework by EdgeCortix streamlines the deployment of neural network models across varied hardware architectures while maintaining efficiency and performance. MERA acts as a platform-agnostic toolset, featuring comprehensive APIs, code-generation capabilities, and runtime support, which facilitate the deployment of pre-trained deep neural networks. This compiler supports the integration of advanced AI applications in vision, audio, and language processing, helping developers optimize deployment workflows using familiar platforms. MERA uniquely enhances integration ease across AMD, Intel, Arm, and RISC-V processors with built-in heterogeneous support, simplifying EdgeCortix AI platform assimilation into existing systems. Pre-defined models from Hugging Face or EdgeCortix Model Library are optimized through post-training calibration and quantization, making MERA an invaluable resource for AI inference development. Beyond its software stack, MERA's contributions span comprehensive toolkits that include runtime configuration and simulation capabilities. This compiler empowers developers to scale AI inference from modeling to deployment effortlessly while achieving market-leading energy efficiencies when used alongside SAKURA-II modules.
This innovative system is designed to enhance the user experience of wireless power transfer applications by ensuring precise alignment and compatibility between power transmitters and receivers. It includes mechanisms for detecting the positioning of a device relative to a charging source, optimizing the alignment process to ensure efficient energy transfer. The system's compatibility detection capabilities allow it to recognize and adapt to various device specifications and charging standards, reducing the risk of charging errors and improving overall system reliability. With this system, users can achieve optimal alignment automatically, making the process of wireless charging simpler and more intuitive. The technology is particularly beneficial in scenarios where positioning is critical for energy transfer efficiency, such as in automotive or portable device applications. It addresses common challenges in wireless power systems, such as alignment drift and signal path obstructions, ensuring that power is delivered smoothly and consistently.
UCIe, designed by XtremeSilica, revolutionizes the way disparate computing components interconnect, addressing the need for an advanced, unified chiplet-based architecture. This IP allows multiple chiplets from different vendors to work together seamlessly, offering incredible flexibility in system design, particularly in high-performance computing applications.\n\nThe UCIe standard focuses on enabling direct, high-speed connections between individual chiplets, minimizing latency and maximizing throughput. This is paramount for applications that require massive parallel processing capabilities, such as artificial intelligence and data analytics.\n\nBy adopting UCIe, developers can build modular systems tailored to specific needs, facilitating easier upgrades and innovation. XtremeSilica's UCIe solution thus empowers designers to achieve unprecedented levels in customization and performance enhancement for the next generation of electronic systems.
Our PCIe Gen6 with CXL 3.0 integration stands at the forefront of next-generation interfaces, delivering massive bandwidth and minimal latency for demanding computational tasks. Reaching data rates up to 64 GT/s, it offers profound improvements in speed and connectivity for cutting-edge technology deployments. This integration allows for dramatic enhancements in coherent memory sharing capabilities and efficient resource utilization across accelerator and server environments. The Gen6 PCIe, combined with CXL 3.0, supports increased scalability and bandwidth, making it ideal for everything from data-centric computing to high-frequency trading platforms. Security remains a priority, with added layers of data protection to ensure safe transfer processes, underscoring its suitability for sensitive applications requiring absolute reliability.
The EPC Gen2/ISO 18000-6 Digital Protocol Engine is a robust solution designed to address the comprehensive needs of RFID systems. It efficiently processes communication protocols, ensuring seamless integration and operation within RFID networks. This Digital Protocol Engine is specially tailored for the EPC Gen2 Class 1 protocol, version 1.2, guaranteeing high compatibility and performance. This protocol engine focuses on enabling efficient data transactions between RFID tags and readers. It supports numerous operations, including tag reading, inventory management, and data encoding, optimizing efficiency in RFID deployments. Engineered for high-speed processing, the Protocol Engine ensures that communication errors are minimized, and data integrity is maintained. Particularly useful in environments that rely on extensive RFID systems, this engine is a crucial component in supply chain management, retail inventory control, and other similar industry applications. Its comprehensive design ensures reliable performance across varied operational conditions, making it a versatile choice for businesses aiming to leverage RFID technology to its fullest potential.
The CXL Controller by Panmnesia is engineered to allow hardware devices to communicate effectively over the CXL network. This IP offers minimal roundtrip latency, enhancing performance for demanding AI and cloud-based applications. With support for the latest CXL protocols, the controller ensures compliance and integration with diverse hardware designs, optimizing power consumption and efficient data handling.
The Universal Chiplet Interconnect Express (UCIe) offers a transformative approach to inter-chiplet communication, designed to elevate chiplet-based system designs. This interconnect facilitates high-speed, low-latency links crucial for the efficient operating of chiplets in sophisticated computing environments. With support for versions 1.x and 2.x, UCIe ensures robust connection integrity, offering bandwidths up to 32 Gbps. It is engineered for high scalability, supporting extensive chiplet configurations needed in next-gen processors and server designs. UCIe's architecture promotes seamless integration into complex system setups, enhancing performance in high-demand areas such as AI processing, server applications, and large-scale parallel computing systems.
The CXL 2.0 product line offers cutting-edge performance features that make it ideal for modern high-performance computing tasks. This IP enables coherent memory access in heterogenous compute systems, efficiently supporting multi-tiered memory architectures and decoupling memory from compute resources to optimize system performance. CXL 2.0 is engineered to enhance bandwidth and reduce latency between CPUs and accelerators, operating efficiently across different computational environments. It delivers distinct advantages in workload distribution and improved data management capabilities, essential for advanced computing tasks in AI and machine learning. The architecture further includes advanced security features, facilitating safe and reliable processing in complex data environments. Its seamless memory pooling and management capabilities make it indispensable for edge computing and cloud data management systems.
The IMG DXD is a feature-rich GPU designed for versatile applications across data centers, desktops, and laptops. It supports DirectX 11, 12, Vulkan 1.4, OpenGL 4.6, and OpenCL 3.0, offering a comprehensive platform for graphic-intensive tasks. Highly suitable for gaming and content creation, the DXD supports real-time graphics rendering with exceptional visual fidelity. Its architecture focuses on maximizing performance while maintaining a balance with energy consumption, which is crucial for applications in environments where both high throughput and efficiency are required. Its multi-screen capability and support for a broad range of graphical interfaces make the DXD an ideal choice for professional applications requiring complex graphic tools or environments where multiple displays provide a strategic advantage.
FlexGen Smart Network-on-Chip (NoC) leverages advanced AI-driven heuristics to revolutionize SoC design by automating NoC topology generation, significantly enhancing productivity. This innovative IP aims to maximize engineering efficiency through minimal manual intervention, achieving a tenfold increase in productivity compared to traditional methods. Dedicated to large-scale automotive, data center, and industrial electronics, FlexGen utilizes intelligent algorithms to optimize wire length and power efficiency, enabling faster design iterations and greater design exploration for complex systems. The AI-based insights facilitate automatic timing closure assistance, ensuring that designs are both accurate and optimal. FlexGen enhances performance by employing streamlined network interfaces, reducing latency, and improving power efficiency, all critical in the fast-paced SoC environment. By promoting faster product cycles and higher yield, it empowers developers to navigate design complexities effectively, ensuring a competitive advantage in the rapidly evolving semiconductor landscape.
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