The NuLink Die-to-Die PHY for Standard Packaging is a cutting-edge interconnect solution that bridges multiple dies on a single standard package substrate. This technology supports numerous industry standards, including UCIe and BoW, and adapts to both advanced and conventional packaging setups. It enables low-power, high-performance interconnections that are instrumental in the design of multi-die systems like SiPs, facilitating bandwidth and power efficiencies comparable to that of more costly packaging technologies.
Eliyan's PHY technology, distinctive for its innovative implementation methods, offers similar performance attributes as advanced packaging alternatives but at a fraction of the thermal, cost, and production time expenditures. This design approach effectively utilizes standard packages, circumventing the complexities associated with silicon interposers, while still delivering robust data handling capabilities essential for sophisticated ASIC designs.
With up to 64 data lanes, and operating at data rates that reach 32Gbps per lane, the NuLink Die-to-Die interconnect elements ensure consistent performance. Such specifications make them suitable for high-demand applications requiring reliable, efficient data transmission across multiple processing elements, reinforcing their role as a fundamental building block in the semiconductor landscape.
