The NuLink Die-to-Die PHY for Standard Packaging by Eliyan is engineered to facilitate superior die-to-die interconnectivity on standard organic/laminate package substrates. This innovative PHY IP supports key industry standards such as UCIe and BoW, and includes proprietary technologies like UMI and SBD. The NuLink PHY delivers leading performance and power efficiency, comparable to advanced packaging technologies, but at a fraction of the cost. It features configurations with up to 64 data lanes, supporting a data rate per lane of up to 64Gbps, making it ideal for applications demanding high bandwidth and low latency. The implementation enhances system design while reducing the necessary area and thermal load, which significantly eases integration into existing hardware ecosystems.
