The NuLink Die-to-Die PHY for Standard Packaging represents Eliyan's cornerstone technology, engineered to harness the power of standard packaging for die-to-die interconnects. This technology circumvents the limitations of advanced packaging by providing superior performance and power efficiencies traditionally associated only with high-end solutions. Designed to support multiple standards, such as UCIe and BoW, the NuLink D2D PHY is an ideal solution for applications requiring high bandwidth and low latency without the cost and complexity of silicon interposers or silicon bridges.
In practical terms, the NuLink D2D PHY enables chiplets to achieve unprecedented bandwidth and power efficiency, allowing for increased flexibility in chiplet configurations. It supports a diverse range of substrates, providing advantages in thermal management, production cycle, and cost-effectiveness. The technology's ability to split a Network on Chip (NoC) across multiple chiplets, while maintaining performance integrity, makes it invaluable in ASIC designs.
Eliyan's NuLink D2D PHY is particularly beneficial for systems requiring physical separation between high-performance ASICs and heat-sensitive components. By delivering interposer-like bandwidth and power in standard organic or laminate packages, this product ensures optimal system performance across varied applications, including those in AI, data processing, and high-speed computing.
