The NuLink Die-to-Die PHY for Standard Packaging by Eliyan offers an innovative solution for high-performance interconnects between die on the same package. This technology significantly boosts bandwidth and energy efficiency, using industry-standard organic/laminate substrates to simplify design and reduce costs. It leverages a unique implementation that negates the need for more expensive silicon interposers or silicon bridges while maintaining exceptional signal integrity and compact form factors.
With conventional bump pitches ranging from 100um to 130um, these PHY units support various industry standards such as UCIe, BoW, UMI, and SBD, delivering a versatile platform suitable for a wide array of applications. This flexibility ensures it meets the rigorous demands of data-centric and performance-oriented computing needs, with optimal performance observed at advanced process nodes like 5nm and below.
Eliyan's NuLink PHY further breaks technological barriers by delivering synchronous unidirectional and bidirectional communication capabilities, achieving data rates up to 64 Gbps. Its design supports 32 transmission and receiving lanes to ensure robust data management in complex systems, making it an ideal solution for today's and future's data-heavy applications.
