The NuLink Die-to-Die PHY is a state-of-the-art IP solution designed to facilitate efficient die-to-die communication on standard organic/laminate packaging. It supports multiple industry standards, including UCIe and Bunch of Wires (BoW) protocols, and features advanced bidirectional signaling capabilities to enhance data transfer rates. The NuLink technology enables exceptional performance, power economy, and reduced area footprint, which elevates its utility in AI applications and complex chiplet systems.
A unique feature of this PHY is its simultaneous bidirectional signaling (SBD), that allows data to be sent and received simultaneously on the same physical line, effectively doubling the available bandwidth. This capacity is crucial for applications needing high interconnect performance, such as AI training or inference workloads, without requiring advanced packaging techniques like silicon interposers.
The PHY's design supports 64 data lanes configured for optimal placement and bump map layout. With a focus on power efficiency, the NuLink achieves competitive performance metrics even in standard packaging, making it particularly suitable for high-density systems-in-package solutions.
