Rockley Photonics' Multi-Channel Silicon Photonic Chipset is engineered for high-speed data transmission applications. The chipset integrates hybrid III-V DFB lasers and electro-absorption modulators into a silicon photonics framework, allowing it to support 4×106Gb/s 400 GBASE-DR4 data rates over multiple channels. This highly efficient setup delivers significant optical modulation amplitude (OMA) and maintains a low TDECQ penalty, fully complying with IEEE standards. This chipset is particularly suited for optical communications, providing the robustness and speed necessary for demanding data centers and telecommunication infrastructures.
