SkyeChip's Die-to-Die (D2D) Interconnect provides streamlined connectivity solutions for chips utilizing advanced packaging techniques. It offers lightweight, high-performance links that comply with the latest UCIe standards, supporting myriad protocols including PCIe and CXL.
The D2D Interconnect emphasizes optimal performance with minimal power and area overhead by integrating built-in self-test and repair functionalities to ensure yield preservation. Its architecture is designed for high-speed data transfer rates up to 32 Gbps/pin, crucial for applications involved in intensive data throughput.
The solution supports 2.5D and standard packaging technologies, allowing broad applicability in various modern semiconductor architectures. This interconnect is essential for system designers focusing on maximizing communication efficiency across ICs in sophisticated multi-die designs.
