SkyeChip offers a Die-to-Die Interconnect designed for effective communications between dies using minimal power and area. This solution supports lightweight, high-performance interconnections compliant with the Universal Chiplet Interconnect Express (UCIe) 2.0 specification, which ensures high-speed data transfers at low energy costs.
The D2D Interconnect allows transfer rates up to 32 Gbps per pin, supporting bandwidth up to 8Tbps, conducive to expanding communication protocols such as PCIe and CXL across multiple dies. It's compatible with key packaging technologies and includes support for PHY-to-PHY loopback tests, enhancing inter-system verification.
Crucially, this interconnected solution incorporates built-in self-test and repair functionalities to maximize yield, thereby reducing post-package repairs and ensuring robust performance over an extended lifecycle. The capability to integrate seamlessly with existing UCIe systems further emphasizes its utility in multi-die integration strategies.
