The Die-to-Die (D2D) Interconnect solution from SkyeChip optimizes intra-package communication channels between dies. Tailored for cutting-edge, multi-die applications, this lightweight interconnect solution includes a physical layer and protocol adaptations to seamlessly extend existing NOC capabilities across different die frames. Conforming to the Universal Chiplet Interconnect Express (UCIe) standards, it supports a high throughput of up to 32 Gbps per pin, ensuring efficient data migration across interconnected dies. With built-in self-test and repair functionalities, this D2D interconnect offers not only high performance but also increased reliability and diagnostic capabilities necessary for advanced chiplet designs.
