SkyeChip's Die-to-Die Interconnect technology provides a lightweight, efficient solution for die-to-die communication, conforming to the Universal Chiplet Interconnect Express (UCIe) 2.0 specifications. This system offers high performance with minimal power and area requirements, supporting transfer rates up to 32 Gbps per pin and die edge bandwidth up to 10.5 Tbps/mm. It accommodates various protocols, offering flexibility for seamless integration with existing chip designs, ensuring broad applicability across different technology platforms.
