Global Unichip Corp.'s Die-to-Die (2.5D/3D) IP offers a sophisticated solution for high-speed interconnects between dies in both 2.5D and 3D configurations. This technology is key to enhancing the performance of complex systems by providing high-bandwidth, low-latency communications between chips. Integrating seamlessly with existing CoWoS(R) and similar packaging technologies, the Die-to-Die IP is optimized for xPU applications and high-performance computing. Its design ensures signal integrity and efficient power delivery, which are crucial for advanced computing solutions relying on multiple chip interconnects.
