The Die-to-Die (2.5D/3D) interface by Global Unichip Corp. (GUC) is engineered to facilitate inter-die communication across vertical and horizontal planes within an integrated system. This interface accommodates high bandwidth data transfer between dies, essential for modern multi-die package configurations. Ideal for applications that require complex integration of multiple silicon dies, it simplifies the architecture of advanced systems.
Supporting both 2.5D and 3D packaging technologies, this product is designed to deliver optimal performance by reducing latency and power consumption. It enables seamless connectivity between dies through advanced interconnect techniques, ensuring that data is transmitted efficiently across the entire system. These features are particularly beneficial in maximizing computational resources in AI and high-performance computing environments.
The advanced technology used in GUC’s Die-to-Die interface ensures robust data integrity while maintaining low power usage. With its capability to support a variety of package configurations, this solution is pivotal in advancing semiconductor technologies that require efficient inter-die connectivity. As industries continue to leverage multi-die systems, the Die-to-Die (2.5D/3D) interface remains integral to optimizing performance and energy efficiency across semiconductor applications.
