The Die-to-Die (2.5D/3D) Interface is an advanced solution designed to facilitate seamless interaction between multiple die in an integrated system. This product caters to the growing industry need for high-bandwidth, low-latency connections in complex multi-die configurations found in modern computing systems.
Supporting communicative bandwidth while minimizing power consumption, this interface is engineered for applications requiring high-speed interconnects across 2.5D and 3D package structures. It transforms traditional system integrations by offering superior scalability, accommodating the burgeoning complexity of data management in edge computing, AI, and high-performance data centers.
With a commitment to enhancing system connectivity, this interface allows for efficient power management and signal integrity, which are essential for maintaining performance standards in high-demand environments. The Die-to-Die (2.5D/3D) Interface paves the way for innovative semiconductor designs, enabling efficient and flexible advancements in technology integration.
