All IPs > Interface Controller & PHY > VESA > Die-to-Die (2.5D/3D) Interface
GUC’s Die-to-Die IP solutions, including GLink and UCIe, lead the industry in high-bandwidth, low-power, multi-channel connection technologies within a package. These interfacing IPs are designed to excel in high-performance computing contexts, leveraging signals with massive bandwidth capacities. With GLink-2.5D IP, they utilize advanced signaling technologies on TSMC's RDL-based InFO and CoWoS, achieving bandwidths up to 4Tbps, tailored for advanced multi-die integration needs.
| Foundry | Process Nodes |
|---|---|
| TSMC |
4nm 12nm 16nm |
| Class | Value |
|---|---|
| Categories |
Interface Controller & PHY > VESA Interface Controller & PHY > MIPI |
| Availability | All Countries & Regions |
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