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Yorchip Inc.

Yorchip Inc. is a pioneering force in the semiconductor industry, acclaimed for its advanced Chiplet IP solutions and chiplets tailored for mass market applications. The company excels in optimizing cost and power while offering innovative solutions that meet industry standards. Yorchip's proprietary Universal PHY offers exceptional versatility with support for both cutting-edge and traditional packaging methodologies, designed to achieve ultra-fine pitches as small as 20 microns. This emphasis on flexibility allows them to cater to a wide range of semiconductor needs. The company is committed to delivering lower costs, reduced power consumption, and accelerated market timelines for System on Chip (SoC) developments. Through its innovative technology, Yorchip provides silicon-proven, cost-efficient chiplets that can be re-used to streamline SoC solutions. Apart from licensing its PHY IP, Yorchip also delivers turnkey SoC solutions that are built upon their reusable chiplet technology. This approach offers clients the advantage of utilizing efficient technologies without the extensive time and cost usually associated with custom semiconductor designs. Yorchip places a strong emphasis on packaging innovation and Known Good Die (KGD) technologies. The Universal PHY is engineered to accommodate multiple RDL layers, significantly reducing NRE (non-recurring engineering) and packaging expenses. This includes built-in self-test capabilities to ensure the performance and reliability of the PHY at its operational speeds, enabling companies to leverage cost-effective manufacturing processes with minimal risk. Yorchip's comprehensive expertise in chiplet and PHY technologies is designed to help clients outpace their competitors in cost-efficiency, energy consumption, and time-to-market. Read more

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Universal PHY Technology

Universal PHY Technology is a groundbreaking solution from Yorchip Inc., designed to revolutionize the semiconductor packaging sector. This PHY is engineered to accommodate both advanced packaging pitches down to 20 microns and conventional options, providing a versatile solution for various industry applications. With a unique design that reduces area usage by twenty times compared to standard UCIe SP PHYs, it efficiently manages power consumption to less than 0.1 picojoules per bit. This universal approach ensures broad foundry compatibility, covering nodes from 28nm to FinFET, allowing for seamless integration into multiple manufacturing processes. The PHY's robustness is highlighted by its support for up to five layers of redistribution layers (RDL), which drastically cuts non-recurring engineering costs and simplifies the packaging process. The built-in self-test feature guarantees high-quality known good die, bolstering confidence in the final semiconductor product. Yorchip's Universal PHY Technology stands out as an essential tool for those looking to enhance their semiconductor packaging practices. It offers a substantial competitive advantage by enabling rapid deployment and reducing the risks associated with chiplet design. By utilizing Yorchip's patented technology, companies not only benefit from cost savings and energy efficiency but also accelerate their time-to-market, ensuring they remain ahead in a fast-paced technological landscape.

Yorchip Inc.
TSMC
12nm FinFET, 14nm FinFET, 16nm, 28nm
MIPI, Multi-Protocol PHY
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