Yorchip Inc

Yorchip Inc. focuses on pushing the boundaries of semiconductor IP through innovations in chiplet technology. Situated at the forefront of the evolving physical AI landscape, the company boasts its unique 100% Digital Universal PHY, which is specifically optimized to achieve minimal power consumption and physical footprint. This technology enables seamless interoperability, promising 20 times smaller areas compared to traditional UCIe implementations and less than 0.1 picojoules per bit power usage. The company's solutions are tailored to the needs of developers seeking cost-efficient, low-power chiplets that accelerate time to market. Yorchip's PHY technology is designed with broad compatibility in mind, supporting various processes from 28nm to FinFet nodes. This flexibility ensures that chiplets can be developed with confidence in their market viability and connectivity success, integrating smoothly with third-party components. Yorchip further enhances cost-effectiveness through its innovative use of Packaging & Known Good Die (KGD) technology. Its Universal PHY reduces the need for interposers with 1-5 layers RDL, minimizing non-recurring engineering costs and packaging expenses. The built-in self-test features support high-speed testing, ensuring reliability and reducing risks, thereby facilitating faster market entry for its clients. Read more