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iModeler is Xpeedic's powerful solution for process design kit (PDK) model generation—an essential component in semiconductor manufacturing. This tool offers sophisticated capabilities to create accurate, real-time models that reflect the physical and electrical properties of semiconductor processes. Creating these models is crucial for ensuring that design simulations accurately predict real-world behavior. Utilizing iModeler, engineers can generate PDKs that bolster the efficiency of the design process by enabling accurate schematics and layouts before fabrication. The tool minimizes the risk of discrepancies between design intent and production outcomes by providing precise data models that correlate with foundry specifications. Moreover, its flexibility to accommodate different process technologies ensures broad applicability across various semiconductor projects. This utility enhances collaborative workflows by enabling multi-disciplinary teams to access shared, consistent data models. iModeler integrates smoothly with Xpeedic's platform and other industry-standard tools, facilitating a cohesive environment for complex design verification. It ultimately empowers companies striving for innovation in IC design, delivering robust process models that enhance yield and reduce time-to-market.
Hermes X3D, developed by Xpeedic, is tailored for professionals working with power, package, and touch panel modeling. The tool is designed to handle the intricacies associated with the simulation and modeling of multi-component systems in high-tech industries. This tool's primary focus is to refine and optimize the design models that are crucial for the efficient functioning of various electronics. Hermes X3D provides users with the capability to accurately simulate power distributions and package interactions, which in turn ensures that designs meet required specifications for functionality and reliability. Its utility extends to touch panels, where the tool helps in perfecting the electronic responses and overall performance, crucial for consumer electronics thriving on touch interfaces. Moreover, the tool's flexible modeling environment aids in tackling complex thermomechanical challenges, thus enhancing electronic package reliability and longevity. Hermes X3D's integration with the Xpeedic ecosystem further solidifies its position as a go-to solution for power and package simulation professionals looking to innovate within the electronic design space.
SnpExpert specializes in the analysis of S-parameters, a critical aspect of RF and microwave design engineering. This tool gives engineers the ability to meticulously analyze the S-parameters of complex networks, facilitating the understanding and optimization of signal flow in high-frequency circuits. S-parameter analysis is paramount in predicting how RF circuits will behave in the operational environment. By providing accurate transient and AC analyses, SnpExpert aids in refining RF circuit designs to ensure optimal integration and performance. Engineers gain access to a flexible environment that allows for the manipulation of various circuit parameters, enhancing their ability to optimize designs and meet the stringent demands of modern RF applications. The integration of SnpExpert within Xpeedic's broader suite of tools enables comprehensive analysis with improved efficiency. Ensuring consistent communication and compatibility across design disciplines, this tool helps teams maintain focus on achieving high-quality results, reducing the time and cost associated with RF product development.
TmlExpert is a sophisticated tool designed to model transmission lines with high precision. It caters to engineers tasked with simulating and analyzing the performance of transmission lines in varying conditions. The tool leverages cutting-edge algorithms to provide accurate characterizations crucial for designing efficient and reliable communication systems. It is integral in assessing and optimizing line parameters, ensuring signal integrity and effective power delivery in complex electronic systems. TmlExpert's user-friendly interface simplifies the simulation setup, allowing designers and engineers to focus on interpreting results and making informed design decisions. Its advanced modeling capabilities support various types of transmission lines used in modern electronics, from microstrip to coaxial cables. The precision and speed offered by TmlExpert facilitate quick iterations, thus enhancing productivity and reducing time-to-market for innovative electronic products. By integrating seamlessly with other tools in the Xpeedic suite, TmlExpert expands on its utility, enabling comprehensive analysis encompassing multiple domains. Its robust simulation environment offers engineers valuable insights into electrical characteristics and potential issues like reflections and losses, ensuring robust and efficient transmission line designs.
XDS is a cutting-edge simulation tool from Xpeedic specifically engineered for RF and microwave circuit design. Tailored to meet the rigorous demands of the high-frequency domain, XDS helps engineers and researchers overcome challenges associated with RF circuit complexities, ensuring designs achieve the required performance metrics and standards. With XDS, engineers can conduct precise and rapid simulations to assess various aspects of circuit performance, including return loss, insertion loss, and impedance matching. These capabilities are critical in optimizing RF circuits to meet system-level requirements across telecommunications, radar, and satellite communications applications. The tool is distinguished by its user-friendly interface and adept integration capabilities, contributing to a smooth workflow across various stages of circuit development. By facilitating accurate modeling and simulation, XDS empowers designers to innovate effectively and bring high-performance RF components to market swiftly and efficiently.
Designed for the intricate task of cable harness simulation, CableExpert by Xpeedic facilitates the design and testing of cable harnesses within electronic systems. It serves engineers and designers in industries ranging from automotive to aerospace, where precision in cable harness design can significantly impact performance and reliability. Leveraging advanced computational techniques, CableExpert provides simulations that help predict the behavior of complex cable structures subject to various electrical parameters. The tool excels in modeling various types of interference and coupling within cable assemblies, providing insights into the impact of electromagnetic interference on system performance. This allows engineers to improve harness designs to mitigate electromagnetic compatibility issues, ensuring that devices not only meet design specifications but also comply with international standards. CableExpert's comprehensive approach to harness simulation aids in refining designs for better performance in high-speed systems. Its compatibility with other design tools in the Xpeedic ecosystem enhances its utility, offering a seamless experience in managing and optimizing cable designs. This results in more efficient, timely development processes and supports quicker resolution of potential design challenges.
Hermes Layered is a specialized tool developed by Xpeedic for three-dimensional finite element method (FEM) simulations. It caters to the needs of engineers and researchers who require detailed analysis and modeling of complex structures in various industries, including electronics and materials science. By using Hermes Layered, users gain insights into the electromagnetic behavior of multi-layered structures, allowing them to optimize designs for better performance and efficiency. Thanks to its advanced simulation capabilities, Hermes Layered enables accurate prediction of electromagnetic interference and compatibility in layered configurations, which is crucial for modern high-frequency applications. The tool's precision enhances its ability to handle complex geometries and material properties, making it indispensable for projects that demand high fidelity in modeling and analysis. Hermes Layered's compatibility with other Xpeedic software extends its utility, providing a comprehensive multi-physics simulation platform. It supports a range of use cases, from antenna design to PCB analysis, ensuring that engineers can manage all aspects of their designs from a single, integrated environment. This integration is key for developers looking to maintain competitive advantages through innovative, high-performing electronic designs.
Genesis stands out as a comprehensive suite tailored for package and PCB design, addressing the intricacies involved in modern electronic design processes. Embodying a variety of functionalities, Genesis supports the full design cycle—from conceptualization to verification—ensuring that complex electronic systems are optimized for performance and manufacturability. Its robust platform includes design, analysis, and integration capabilities that cater to the diverse needs of the electronics industry. A key aspect of Genesis is its ability to streamline the integration of components in multilayer PCBs and advanced semiconductor packages. This reduces design cycles and enhances the reliability of final products, crucial in high-stakes fields like telecommunications and computing. The suite's powerful analysis tools provide engineers with insights into electromagnetic compatibility, signal integrity, and thermal performance, facilitating early-stage problem detection and correction. The Genesis suite collaborates effectively with other Xpeedic tools, creating a cohesive ecosystem for electronic designers. Its advanced simulation capabilities ensure that products are ready for today's demanding markets, emphasizing electrical performance and compliance with stringent industry standards. Genesis exemplifies Xpeedic's commitment to delivering superior design solutions that meet the rapidly evolving needs of technology innovators.
ViaExpert is an essential tool for engineers dealing with via modeling tasks in PCB design and semiconductor applications. This tool is tailored to model vias—conductive pathways through the board substrates—ensuring they meet critical signal integrity and performance standards. Accurate via modeling is paramount in the design of high-frequency PCBs and multilayer boards where parasitic inductance and capacitance can significantly impact functionality. With ViaExpert, users benefit from an enhanced simulation environment that delivers precise characterizations of via structures under various operating conditions. This capability is particularly beneficial in anticipating and mitigating potential issues such as signal distortion and cross-talk between layers. By simulating real-world conditions, engineers can optimize the via design to meet stringent design specifications and reliability standards. This tool's integration capacity with other simulation platforms allows for a holistic approach to electronic design, where via performance is evaluated alongside other components in a system. This ensures that all aspects of electrical performance are considered, thus contributing to the quicker development of robust and efficient electronic designs.
IRIS is Xpeedic's specialized platform dedicated to the simulation of RF and analog IC designs, providing robust support for engineers working with radio frequency components. Recognized for its high precision and speed, IRIS enables users to conduct thorough analyses, ensuring that their designs adhere to functional and performance specifications essential for modern communication systems. This tool targets the unique challenges posed by RF and analog circuitry, offering simulation results that account for non-linear dynamics and frequency-dependent behaviors inherent in these domains. Its high-fidelity models help designers optimize layout and component selection, ultimately improving device efficiency and performance across various applications. The IRIS simulation suite contributes to reduced time-to-market by streamlining the design validation process, allowing for early detection of potential issues. Engineers benefit from its integration capabilities with other Xpeedic offerings, facilitating a holistic design approach that encompasses various stages of product development. With IRIS, companies can stay ahead in the rapidly changing RF landscape, ensuring resilient designs that meet industry standards for quality and performance.
Notus by Xpeedic is a versatile tool engineered for signal integrity (SI), power integrity (PI), thermal, and stress analysis. It's specifically crafted for advanced electronic design applications requiring comprehensive multi-physics simulations. Notus integrates these crucial analyses, enabling engineers to solve complex interaction challenges within high-density and high-speed digital systems. Engineers using Notus benefit from an all-inclusive environment where SI, PI, thermal, and stress factors are considered, providing insights that help mitigate risks and enhance design quality. The tool's intuitive interface facilitates the rapid configuration of simulations, which is vital for maintaining the pace of today's fast-moving tech development cycles. With its robust simulation framework, Notus supports the development of products that are both high-performing and reliable, meeting industry standards and customer expectations. Its compatibility with other Xpeedic offerings enables a comprehensive project lifecycle approach, encompassing everything from initial design through to final validation and optimization, ensuring robust systems that can withstand operational stresses.
MeasureExpert is a sophisticated tool engineered for carrying out automated testing within sophisticated electronic systems. Aimed at ensuring quality and performance standards, this tool simplifies the otherwise complex testing protocols required in modern electronic developments. Engineers in sectors such as consumer electronics, automotive, and telecommunications will find MeasureExpert invaluable for reducing testing time and increasing product reliability. The tool is specifically tailored to handle a wide array of testing scenarios, from initial product verification through to final performance assessments, providing reliable data that ensures compliance with industry standards. This comprehensive testing approach identifies potential failures before mass production, minimizing costly recalls and customer dissatisfaction. With its full integration into Xpeedic's comprehensive toolset, MeasureExpert supports seamless transitions between design, simulation, and testing phases. This integration ensures consistency in workflow and facilitates proactive adjustments based on test outcomes, reinforcing the integrity of electronic products from conception through to market deployment.
Hermes 3D is a powerful tool from Xpeedic designed for simulating arbitrary structures. It targets engineers and scientists who require highly detailed analysis of complex designs, including irregular geometries often encountered in advanced electronic applications. This tool enables users to conduct thorough electromagnetic simulations, offering insights that guide the design and optimization of these unique structures. The software provides substantial efficiency in modeling tasks, harnessing sophisticated algorithms to deliver fast and accurate simulations. By allowing for the exploration of different design variations, Hermes 3D accelerates the development timeline, empowering engineers to achieve optimal configurations that meet or exceed functional requirements. One of the standout features of Hermes 3D is its ability to integrate seamlessly with other Xpeedic solutions, creating an adaptable and cohesive design and simulation environment. This interconnected framework is a strategic advantage for engineers seeking to streamline workflows and enhance cross-disciplinary collaboration within their projects, ultimately leading to innovations that push the boundaries of what current technologies can achieve.
ChannelExpert is a specialized tool optimally supporting engineers tackling the design of high-speed systems. This tool is integral for optimizing the signal integrity and performance of high-speed data transmission channels found in cutting-edge technology applications. It provides a rich set of features for analyzing and enhancing the electrical characteristics of intricate, high-speed interconnects. ChannelExpert excels in delivering precise simulations that identify potential issues such as signal degradation and latency, ensuring engineers can preemptively address these challenges. This tool significantly reduces the time required for diagnosis and enhancements, thereby expediting the development pipeline for high-speed communication systems. The integration of ChannelExpert within Xpeedic's wider range of simulation solutions allows effective cross-analysis and validation processes, enabling a holistic approach to system design. By improving the reliability and speed of data transmission, ChannelExpert plays a critical role in meeting the demands of modern telecommunication and computing infrastructures.
Metis is an innovative solution by Xpeedic focusing on the challenges of 2.5D and 3D IC packaging, two critical technology fronts in modern semiconductor manufacturing. This tool addresses the complexities involved in these advanced packaging techniques, facilitating the design and analysis processes to ensure products meet high-performance and reliability standards. As semiconductor devices become increasingly complex, Metis supports the intricate interconnect and integration solutions required by today's cutting-edge electronics. By leveraging Metis, engineers can simulate the thermal, mechanical, and electrical behaviors of IC packages, identifying potential issues early in the design phase. This capability is vital in maintaining the integrity and functionality of densely packed chips. Furthermore, the tool supports co-design efforts, allowing teams to synchronize their work on various design aspects, leading to more efficient and innovative end products. Metis' seamless integration with other Xpeedic tools enables it to play a pivotal role in the multiscale simulation ecosystem. The collaborative environment it fosters helps minimize iterations and enhances the integration quality of semiconductor packages, ensuring that products are robust and performant. This positions Metis as a cornerstone solution for companies looking to advance their 2.5D and 3D packaging capabilities.
XPLM is Xpeedic's advanced platform for data management, tailored for electronic design environments that demand robust and efficient handling of design data. This tool helps companies maintain seamless project workflows by providing sophisticated data management and collaboration capabilities essential in modern EDA landscapes. By leveraging XPLM, engineering teams can manage design data efficiently across diverse projects, ensuring consistency and traceability from initial concept through to final product. The platform's powerful integration capabilities mean it can be used alongside Xpeedic’s suite of simulation tools to enhance data-driven design processes, ensuring that changes and updates are well-documented and easily accessible. XPLM's role in streamlining communication and collaboration makes it a strategic asset in teams working across multiple disciplines and geographical locations. Its capacity to handle complex datasets helps reduce errors and accelerates the development process, supporting faster innovation and time to market. With XPLM, teams are empowered to focus on creating high-quality electronic designs while maintaining robust control of project data and documentation.
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