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iModeler is a groundbreaking tool focused on automated Process Design Kit (PDK) model generation, essential for modern semiconductor design processes. This tool streamlines the creation and verification of PDKs, ensuring high accuracy and speed in model generation. Through iModeler, engineers can automate the tedious task of PDK development, vastly improving productivity and reducing time-to-market. The tool supports multiple design technology nodes, making it versatile and applicable across various semiconductor manufacturing processes. With robust analytical capabilities, iModeler allows users to maintain model consistency and reliability across different project phases. The accuracy and efficiency offered by iModeler make it invaluable for companies aiming to maintain competitive advantage in the fast-paced semiconductor industry.
Hermes X3D is a sophisticated tool designed for quick RLGC extraction in power, package, and touch panel modeling. This software is instrumental in high-speed modeling environments where detailed parasitic extraction is critical to design success. The tool's advanced algorithms allow it to efficiently compute resistance, inductance, capacitance, and conductance (RLGC) parameters, which are essential in optimizing signal integrity and minimizing losses in complex systems. Its use is pivotal in scenarios demanding rapid modeling and accurate simulations. Hermes X3D empowers designers by providing the precision needed to refine designs and improve performance metrics. Its ability to handle various design complexities makes it a versatile tool for engineers focusing on the intricate aspects of semiconductor design.
SnpExpert is a sophisticated software solution for S-parameter analysis, tailored for engineers focused on understanding and optimizing electromagnetic performance in circuits and systems. This tool allows for comprehensive analysis of S-parameters, which are essential for evaluating network performance and signal integrity. With SnpExpert, engineers can simulate various interconnect scenarios, obtaining critical insights into loss characteristics, noise performance, and network behavior. These capabilities are crucial for designing systems that adhere to rigorous electromagnetic compliance standards. The analysis provided by SnpExpert aids in optimizing design parameters, thus enhancing product performance and reliability. Its utility in ensuring high levels of precision within electromagnetic designs makes it an invaluable asset in advanced circuit and system design processes.
TmlExpert is a specialized tool designed to aid engineers in the modeling and simulation of transmission lines. This product provides precise and efficient solutions for the analysis of high-speed signal transmission, ensuring optimal signal integrity across various interfaces. By utilizing advanced algorithms, TmlExpert enhances the reliability and performance of complex circuits, making it indispensable in high-frequency design environments. The tool is engineered to integrate seamlessly within existing workflows, offering users the capability to model intricate transmission line structures with accuracy. It supports a broad range of process technologies and provides insights through detailed simulations that help in understanding potential signal degradation and noise issues. Engineers can utilize TmlExpert's capabilities to optimize designs for better performance metrics, including impedance matching, reflection analysis, and crosstalk predictions. This adaptability and precision make TmlExpert a key resource for semiconductor companies focused on cutting-edge electronic designs.
XDS is a premium solution designed for the rigorous demands of RF and microwave circuit design and simulation. It caters to engineers seeking precision in high-frequency circuit applications, where small deviations can significantly impact overall system performance. This tool streamlines the design process by providing capabilities for simulating complex RF and microwave circuits, helping engineers refine their designs with greater accuracy. XDS supports a variety of circuit topologies and includes advanced algorithms for analyzing S-parameters, crucial for maintaining signal integrity. XDS also excels in optimizing network performance, ensuring that circuits meet the stringent requirements of modern RF applications. Its integration in design workflows guarantees reduced iterative cycles and promotes a more efficient path to market for high-performance RF products.
CableExpert is an advanced tool crafted for the simulation and modeling of cable harnesses in complex systems. This tool performs comprehensive electromagnetic analysis to ensure that cable assemblies meet required specifications for communication and power delivery. The software excels in predicting and mitigating electromagnetic interference between cables, especially in high-density configurations. This predictive capability aids in the design of cabling that minimizes signal loss and maximizes data integrity and speed. Engineers can effectively use CableExpert to optimize design layouts, ensuring that cable harnesses contribute positively to the overall system performance. The tool's simulation results aid in refining design choices, potentially reducing material costs and enhancing system reliability.
Hermes Layered provides exhaustive 3D finite element method (FEM) simulation capabilities tailored for IC, package, and PCB designs. This tool enables designers to analyze and optimize electromagnetic behavior across complex 3D structures, which is vital for maintaining system integrity in high-performance applications. The tool's robust simulations allow for realistic modeling of electromagnetic phenomena, aiding in the identification and mitigation of potential issues such as signal loss, interference, and thermal stress. By supporting detailed geometric representations, Hermes Layered offers unparalleled insights that enhance design accuracy and reliability. With Hermes Layered, designers can confidently tackle the challenges posed by intricate 3D structures, facilitating the transition from theoretical modeling to practical application with minimal risk. This makes it an indispensable resource for ensuring the success of advanced electronic components and systems.
Genesis is a holistic design platform specializing in PCB and advanced packaging design. It offers a suite of features to assist designers in managing device libraries, schematic designs, and layout generation, tailored for sophisticated electronics applications. This versatile solution enhances productivity by providing a unified environment where multiple design disciplines can collaborate effectively. Genesis supports a wide range of packages, enabling complex design configurations that are critical in today's electronics manufacturing landscape. By incorporating tools for library management and schematic capture, Genesis ensures a smooth transition from design concept to physical realization, mitigating common design challenges and optimizing resources throughout the development process.
IRIS is a state-of-the-art simulation platform engineered to facilitate rapid and accurate electromagnetic simulations for RF and analog IC designs. This tool is crucial for designers focusing on high-frequency applications where precision is paramount. With its high-speed computational capabilities, IRIS helps reduce design cycles by enabling quick iterations and validations, ensuring that designs perform optimally under real-world conditions. The tool's ability to provide detailed insights into electromagnetic behavior allows designers to address potential signal integrity issues early in the design process. IRIS supports a variety of design nodes and technology models, making it adaptable to the specific needs of RF and analog circuit designers. Its role in improving design accuracy and reducing developmental risks makes IRIS an indispensable tool in the semiconductor design arsenal.
ViaExpert is a sophisticated simulation tool tailored for via modeling in PCB and IC package designs. This software provides comprehensive solutions for the intricate process of via design, addressing challenges such as impedance mismatches and electromagnetic interference. ViaExpert facilitates an enhanced understanding of signal pathways through vias, ensuring superior design optimization and system integrity. The tool's advanced computational models enable precise simulations of current flow and heat dissipation across via structures, vital for maintaining signal integrity in multilayer designs. It aids engineers by providing insightful analysis that contributes to minimizing potential signal loss and improving transmission efficiency. ViaExpert is essential for engineers seeking to ensure that their designs meet stringent performance criteria while adhering to manufacturing constraints. Its application extends beyond basic modeling to play a critical role in the holistic improvement of PCB and IC package design methodologies.
MeasureExpert offers a streamlined approach to automated measurement and analysis, critical for the efficient testing of electronic components. This tool is designed to manage vast measurement datasets, facilitating high-level analysis and validation processes. By integrating automated test capabilities, MeasureExpert reduces manual intervention, thus increasing productivity and minimizing the potential for human error. Its robust processing capabilities ensure accurate result interpretation, which is vital for verifying compliance with industry standards. Engineers benefit from the insightful data provided by MeasureExpert, which aids in swift decision-making and precise adjustments within design cycles. The capability of handling complex evaluation scenarios makes it an indispensable tool in an array of testing environments.
Notus offers a comprehensive platform for simulation and analysis of signal integrity, power integrity, thermal effects, and stress reliability within electronic systems. This tool encompasses a wide range of analysis capabilities crucial for ensuring optimal performance in sophisticated electronic designs. By evaluating a system's robustness across various domains, Notus helps in identifying potential failure points and provides insights crucial for extending device longevity. Its blend of SI/PI analysis with thermal and mechanical stress simulations makes it a trusted asset for tackling modern electronic challenges. The systematic approach provided by Notus aids engineers in reconciling the often conflicting demands of thermal management, electrical performance, and mechanical reliability, ensuring a balanced and optimized design process. Its utility extends across numerous sectors where high-performance and reliability are paramount.
Hermes 3D offers unparalleled simulation capabilities for arbitrary 3D structures, enabling designers to perform detailed finite element analysis (FEM) for a wide range of applications. This tool is designed to tackle challenges associated with electromagnetic modeling in complex environments, including novel antennas and innovative structure designs. With Hermes 3D, engineers gain the ability to intuitively configure and simulate intricate structures, thereby obtaining critical insights into electromagnetic behavior. This is essential for applications requiring precision modeling to meet high performance and safety standards. The tool's powerful simulation capabilities ensure that potential issues related to signal integrity, thermal management, and electromagnetic interference are identified and addressed in the early stages of design, reducing the risk of costly redesigns and enhancing product reliability.
ChannelExpert is tailored specifically for high-speed system simulations, focusing on both signal and power integrity. This tool provides essential insights for engineers working on cutting-edge technologies where system speed is a critical determinant of performance. Equipped with advanced simulation algorithms, ChannelExpert enables accurate modeling of interconnects and channel effects, vital for maintaining signal quality in high-frequency environments. It also supports comprehensive analysis of power delivery networks, ensuring seamless power distribution across systems. The ability to simulate complex channel interactions makes ChannelExpert indispensable for developers aiming to optimize their designs for enhanced performance and reliability. This tool is particularly beneficial in industries where data rate and signal fidelity are pivotal to success.
XPLM is a comprehensive data management platform specifically designed for managing simulation processes and data in EDA environments. This tool offers robust capabilities for organizing and retrieving large amounts of simulation data, streamlining workflows and improving productivity. Engineers can leverage XPLM's capabilities to ensure that design data is consistent and accessible across teams and projects. This is particularly beneficial for maintaining project continuity and facilitating collaboration in large and complex development environments. The platform's intuitive interface and advanced data handling features allow users to focus more on design innovation rather than data logistics, making XPLM an essential tool in the arsenal of today's high-tech design teams.
Metis stands at the forefront of IC packaging innovation, specializing in electromagnetic solutions for multi-die 2.5D/3D designs. This tool addresses the growing complexity in IC packaging by offering exhaustive capabilities for signal integrity and power integrity analysis. It supports large-scale simulations that are crucial for modern semiconductor applications, where multi-die configurations are becoming increasingly common. By facilitating comprehensive electromagnetic analysis, Metis ensures that designers can efficiently manage signal pathways and mitigate interference effects. Metis is equipped with advanced simulation engines that can handle the demanding computational requirements of large IC packages, offering designers the precision needed to optimize performance across a range of scenarios. Its utility in complex design environments makes it a vital component in broader development strategies for cutting-edge semiconductor technology.
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