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The Andromeda RFSoC TE0835 by Trenz Electronic is a carrier board supporting the Zynq™ UltraScale+™ module, well-suited for advanced high-speed applications. This board is designed to accommodate 4 x 5 cm module dimensions, providing an optimal platform for the integration and testing of complex systems. Equipped with a Zynq UltraScale+ RFSoC, the TE0835 delivers superior processing power and versatility. It is engineered to meet the demands of modern telecommunications and data processing, allowing users to implement sophisticated features within a compact form factor. The module integrates high-speed analog converters, making it ideal for applications involving signal processing and the Internet of Things (IoT). This carrier board provides seamless connectivity options and supports diverse configurations, ensuring compatibility with specific customer requirements. Built to support extensive data handling and processing, the TE0835 is a cornerstone for projects that demand robust computational abilities and flexible adaptation to varied application scenarios.
The MPSoC-Modul ZU5EV-1I from Trenz Electronic features the powerful AMD Zynq™ UltraScale+™ XCZU5EV. This module incorporates 4 GByte of DDR4 RAM and 128 MByte of QSPI Flash, offering efficient data management and processing capabilities for high-performance applications. Designed with a size of 5.2 x 7.6 cm, it provides an efficient layout for integrating the UltraScale+ technology into versatile applications, particularly those that require robust processing power and extensive data handling. The integration of high-speed transceivers further enhances its data throughput, making it suitable for demanding computational tasks in telecommunications and industrial automation. Moreover, this module is engineered for reliability and long-term operation, making it an ideal choice for applications requiring stable performance under varying conditions. Its design is optimized to support extensive connectivity options, facilitating seamless communication and integration with other system components.
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