Terecircuits Corporation

Terefilm Photopolymer

Terefilm Photopolymer is a groundbreaking innovation in addressing key challenges in the semiconductor industry, such as precision mass transfer, high-resolution photolithography, and the need for efficient temporary bonding-debonding systems. This advanced photopolymer excels with its unique balance of precise patternability, clean decomposition, and low activation energy, making it ideal for high-throughput semiconductor applications demanding strict precision and cleanliness standards. The Terefilm Photopolymer showcases exceptional thermal stability up to nearly 180°C before UV exposure, allowing for its seamless integration into manufacturing processes that include elevated temperature stages. Upon application of low-energy UV irradiation, its decomposition temperature significantly drops by over 100°C, thus requiring minimal energy for vaporization. The decomposition process can be enhanced through acid catalysis using a photoacid generator, a technique reminiscent of those employed in photoresists for years. Unlike conventional systems, where exposure and development may take minutes or hours, Terefilm's reaction completes within sub-milliseconds, achieving complete vaporization of the activated region to gaseous products. The exceptional properties of Terefilm do not end there. Its remarkably low activation energy initiates vaporization at approximately 60°C, ensuring reduced power consumption, prolonged optical component life, and large-area processing capabilities. With activation energies below the ablation threshold of most mask materials, it supports applications requiring selective component release, exemplified by microLED mass transfer. This not only diminishes costs but also extends the functional lifespan of lasers and optics within LIFT systems, offering lower Cost of Ownership (COO) than ablation-reliant systems. The photopolymer's residue-free decomposition and precise patterning capability further highlight its superiority by removing the need for extensive cleaning and ensuring exact component placement and spatial control.