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SkyeChip's Coherent Network-on-Chip (NOC) is a scalable networking solution aimed at systems where memory coherency is critical. Engineered for many-core setups, it effectively mitigates routing congestion through innovative architectural strategies. This NOC is capable of operating at frequencies up to 2GHz, aligning with high-speed data demands while supporting a range of protocols, including ACE and CHI. Well-suited for partitioned interconnect systems, it surgically meshes with both SkyeChip's Non-Coherent NOC and various proprietary coherence protocols. Its strength in maintaining coherency makes it ideal for applications in computing environments that require seamless communication across cores and memory subsystems.
The Bandgap solution from SkyeChip ensures a stable voltage reference crucial for advanced electronics systems requiring consistent precision despite varying temperature and power conditions. With a precise output voltage of 0.9V, the Bandgap reference maintains exceptional voltage stability across temperatures ranging from -40C to 125C. It incorporates robust buffer capabilities that enable it to sink substantial current loads while consuming minimal power. This IP is tailored for integration within power management systems where unwavering voltage benchmarks are requisite for system performance and reliability, supporting diverse applications from consumer electronics to telecommunications.
For mobile and power-conscious applications, SkyeChip's LPDDR5/5X PHY & Memory Controller provides an exceptionally high-performance and low-power interface solution. Enhancing conventional LPDDR5 capabilities, this controller is in line with JEDEC standards and supports data rates up to 10667 MT/s. The solution offers a range of sophisticated I/O mechanisms, including efficient feedback equalization processes to maintain signal integrity in space-constrained designs. Furthermore, this IP supports extensive customization options and multiple SDRAM configurations, ensuring flexibility and scalability in integrating into diverse electronic systems. It also incorporates additional modules for enhanced RAS and debug functionalities, broadening its applicability across various platforms.
The Die-to-Die (D2D) Interconnect solution from SkyeChip optimizes intra-package communication channels between dies. Tailored for cutting-edge, multi-die applications, this lightweight interconnect solution includes a physical layer and protocol adaptations to seamlessly extend existing NOC capabilities across different die frames. Conforming to the Universal Chiplet Interconnect Express (UCIe) standards, it supports a high throughput of up to 32 Gbps per pin, ensuring efficient data migration across interconnected dies. With built-in self-test and repair functionalities, this D2D interconnect offers not only high performance but also increased reliability and diagnostic capabilities necessary for advanced chiplet designs.
The Non-Coherent Network-on-Chip (NOC) by SkyeChip is a performance-driven interconnect solution, designed to optimize bandwidth and latency while minimizing silicon utilization in high-performance ICs. Primarily targeted at advanced integrated systems, this NOC significantly reduces wire congestion, enhancing power and area efficiency. It employs a variety of protocols like AXI4 and APB, facilitating ease of integration and high-frequency operation up to 2GHz. Its architectural innovations support complex 2.5D and 3D interconnect topologies, enabling versatile application across modern multi-die setups. When combined with SkyeChip's Coherent NOC technologies, it provides seamless integration for partitioned systems demanding diverse interconnect capabilities.
SkyeChip's High-Speed PLL is engineered to provide robust clock generation capabilities in diverse technical environments. Geared for high-frequency applications, this phase-locked loop exhibits a broad input frequency range from 100Mhz to 350Mhz and can achieve an output frequency scaling from 300MHz to 3.2GHz. The design yields significant flexibility, supporting various division and modulation schemes that extend operational range and efficiency. Integral components are engineered for optimal power consumption, ensuring that even at maximum output frequencies, the PLL remains energy-efficient, making it especially suitable for power-sensitive applications across numerous electronic domains.
SkyeChip's Configurable I/O module offers a versatile interface supporting high-speed signaling up to 3.2 GT/s. This component is compatible with several I/O standards including LVDS, HCSL, POD, and various CMOS levels, providing broad application utility in modern digital systems. Tailored for ease of integration into diverse electronic architectures, its configuration capabilities allow for precise adaptation to specific design needs, enhancing system performance and interoperability. This flexibility opens avenues for its utilization across numerous sectors, including telecommunications and general electronic device manufacturers.
The DDR5/4 PHY & Memory Controller from SkyeChip is specifically tailored for high-speed memory interfacing within modern computing environments that require superior power efficiency and minimal area consumption. This versatile IP supports the latest DDR5 and DDR4 standards, offering data rates that can be upgraded to 6400 MT/s for DDR5. By integrating advanced features such as receiver decision feedback equalization (DFE) and transmitter feed forward equalization (FFE), the design ensures optimal signal integrity and performance across various interfaces. Suitable for a variety of system configurations, including multi-rank and multi-channel setups, it offers enhancements for diagnostics and maintenance, such as RAS, Ping-Pong architectures, and comprehensive debugging tools.
SkyeChip's HBM3 PHY & Memory Controller presents an efficient, bandwidth-optimized solution for handling high-speed data transfers in advanced computing applications such as AI and data centers. This product is engineered to align with the JEDEC standards, employing innovations that elevate both performance and power efficiency. Capable of supporting data rates reaching 9600 MT/s, this controller also accommodates a variety of packaging technologies, including 2.5D and 3D designs, ensuring compatibility across a broad range of device configurations. Further, this IP integrates flexible interfaces catering to various customizations, providing robust support for HBM3 DRAM stacks and enabling efficient interconnect and memory repairs. Future-oriented features, including RAS and debug engines, enhance its versatility for complex applications.
The MIPI D-PHY from SkyeChip is a high-speed interface solution adhering to the MIPI D-PHY specification version 2.5. This comprehensive hard macro integrates lane control and interface logic capable of supporting data rates up to 2.5 Gbps per lane. Designed for minimal power consumption, it also incorporates low-power escape and ultra-low-power state modes to cater to power-sensitive applications. With its configurable architecture, this D-PHY is ideal for a variety of devices requiring reliable, high-speed data transmission, making it perfect for camera or display interfaces in modern mobile devices.
SkyeChip's Low Power RISC-V CPU is a highly efficient processor core designed for low power and embedded applications. It implements the RISC-V RV32 instruction set with full support for integer and compressed instructions, and partial support for multiplication, aligning with modern computing needs. This processor is engineered for high reliability with 32 vectorized interrupts and adheres to standard RISC-V debugging protocols. It is tailored for use in resource-constrained environments where power efficiency and performance are key, lending itself to a wide array of applications from IoT devices to mobile computing.
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