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Designed for memory-coherent systems, the Coherent Network-on-Chip (NOC) by SkyeChip is a scalable, efficient interconnect solution that minimizes routing congestion in large-scale designs. It supports ACE4, ACE5, and CHI protocols, providing robust interconnect options that enhance many-core system performance. Moreover, it is built to support up to 2GHz operating frequencies and seamlessly integrates with non-coherent NOC setups, enhancing connectivity in diverse semiconductor applications.
SkyeChip's Non-Coherent Network-on-Chip (NOC) is tailored to enhance bandwidth and latency performance, ideal for optimizing silicon area and power usage in integrated circuits. The NOC architecture efficiently reduces routing congestion, supporting protocols such as AXI4, AXI5, and others, with operation frequencies up to 2GHz. It integrates seamlessly with coherent NOC systems and supports advanced die-to-die bridging, offering a comprehensive solution for high-frequency, partitioned interconnect systems in modern semiconductor designs.
The HBM3 PHY & Memory Controller by SkyeChip offers a high-performance, low-power memory interface solution tailored for AI, HPC data centers, and networking applications. This product conforms to HBM3 (JESD238A) JEDEC standards, supporting up to 6400 MT/s for HBM3 and 9600 MT/s for HBM3E. Notably, it offers a flexible PHY with programmable intelligent interface training sequences and supports major 2.5D/3D packaging technologies, enhancing versatility. The solution guarantees compatibility with DFI 5.1 interfaces and supports high-density configurations, making it ideal for advanced semiconductor manufacturing.
SkyeChip's DDR5/4 PHY & Memory Controller delivers efficient, low-power solutions that comply with DDR5 (JESD79-5) and DDR4 (JESD79-4) JEDEC standards. With support for rates up to 4800 MT/s and upgradeability to 6400 MT/s, this product is engineered for high performance and area efficiency. Its features include flexible PHY with intelligent interface training, receiver DFE, and transmitter FFE for optimal signal processing. It supports a wide range of configurations, including x4, x8, and x16 SDRAMs, and advanced extensions such as 3DS and multiple rank support, making it suitable for diverse applications.
The Bandgap solution from SkyeChip offers stable voltage reference options vital for consistent performance across various temperature ranges in electronic designs. SkyeChip's Bandgap solutions ensure minimal temperature dependence and offer reliable performance, essential for precise electronic measurements and stable power supply operations in semiconductor devices.
High-Speed PLL by SkyeChip provides robust phase-locked loop solutions, crucial in maintaining clock stability across a variety of semiconductor applications. This product focuses on delivering high precision and stability, accommodating diverse frequency ranges and supporting advanced clocking strategies, ensuring reliability in complex system on chip (SoC) environments.
The LPDDR5/5X PHY & Memory Controller from SkyeChip is engineered to provide high-performance, power-efficient memory interfaces that adhere to the LPDDR5/5X (JESD209-5C) JEDEC standards. This solution supports data rates up to 6400 MT/s with an option to upgrade to 10667 MT/s, ensuring high-speed operations. Designed for flexibility, it accommodates various SDRAM configurations, supporting up to 32Gb addressing with back functionalities like RAS and Debug available. This product is meticulously crafted for applications demanding advanced memory solutions in various technology sectors.
The Die-to-Die (D2D) Interconnect solution from SkyeChip provides a lightweight, efficient inter-die communication channel. This solution includes a Physical Layer, Die-to-Die Layer, and Protocol Layer, optimized for high performance with minimal power and area overhead, compliant with UCIe 2.0 specification. It supports high transfer rates and multiple protocols including PCIe, CXL, and streaming, making it adaptable across several semiconductor industry applications.
The MIPI D-PHY offering by SkyeChip enhances high-speed data communication between chips, supporting image sensors, display panels, and camera designs. This PHY layer is tailored to provide efficient data transfer mechanisms while maintaining low power consumption, suited for mobile and multimedia electronics where high bandwidth and energy efficiency are critical.
SkyeChip's Configurable I/O solutions offer adaptability in interfacing with various semiconductor devices, enabling customizable connectivity options. The I/O designs are crafted to cater to a broad range of applications, supporting diverse operating conditions and providing enhanced flexibility in chip-to-chip communication, thus enhancing overall device interoperability.
The Low Power RISC-V CPU IP from SkyeChip is engineered for applications necessitating efficient power usage without compromising performance. By leveraging the open-source RISC-V architecture, this CPU IP provides modular growth potential and customization to meet the specific demands of embedded and IoT systems. SkyeChip's design emphasizes scalability and power efficiency, making it an optimal choice for modern electronics.
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