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Racyics GmbH

Racyics GmbH, a front-runner in the European semiconductor industry, was founded in 2009 as an independent design service provider. Initially a collaboration between experts from the Technische Universität Dresden, the company quickly rose to prominence by working with leading global semiconductor firms. Their core strength lies in advanced node mixed-signal system-on-chip (SoC) design services, offering both analog and digital integrated circuit (IC) solutions. The company's headquarters is situated in Dresden, a city central to Europe's largest semiconductor ecosystem, Silicon Saxony. Over the years, Racyics has built a reputation for excellence, taking part in numerous award-winning projects focused on ultra-low power, high-performance designs. Their partnerships extend to major players like Infineon and Intel, benefiting from the proximity to Technische Universität Dresden’s research resources. This collaboration led to successful tape-outs, such as the first 28nm design in 2012. Racyics has continued to expand their operation, opening new offices in Duisburg and Frankfurt/Main to accommodate a growing team now numbering over 120 dedicated professionals. As a key design partner for GlobalFoundries, Racyics offers extensive foundry access spanning numerous advanced technology nodes. Whether for turnkey ASIC solutions or custom IP designs, their services ensure short development cycles and cutting-edge performance. In addition to their expertise in design, they provide packaging services to facilitate the co-design and verification of IC packages, ensuring that projects, whether low or high volume, meet the exact needs of their clientele. Read more

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Racyics® ABX Platform

The Racyics® ABX Platform leverages Adaptive Body Biasing (ABB) technology to ensure reliable ultra-low voltage operation down to 0.4V. This platform is specifically designed to compensate for variations in process, supply voltage, and temperature, ensuring high yield in different environmental conditions. An ideal choice for automotive applications, it affords a substantial 76% reduction in leakage power for systems enduring ambient temperatures up to 150°C. Moreover, the use of Forward Body Biasing (FBB) technology augments performance up to 10.3 times even at low voltages of 0.5V. The platform is extensive, offering components like ABB generators, standard cells, and SRAM IP, suited for both ultra-low-power (ULP) and high-performance applications. Ensuring corner tightening and implementation awareness, it optimizes Power-Performance Area (PPA) metrics, delivering consistent performance and power efficiency. As part of a standard design flow, it integrates easily, offering a transparent improvement in PPA at the design phase. This silicon-proven platform includes several additional components for ease of integration, such as the ULV Clock Generator ranging from 20MHz to 1GHz, and specialized IP for glueless interfacing. It supports applications requiring stringent automotive ISO26262 safety standards, providing a well-rounded solution for demanding IC design projects.

Racyics GmbH
GLOBALFOUNDARIES
28nm
Content Protection Software, Embedded Memories, Input/Output Controller, Other, PLL, Processor Core Independent, Processor Cores, Standard cell
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