Is this your business? Claim it to manage your IP and profile
The E-DIP Integrated Diplexer represents a cutting-edge advance in the miniaturization of E-band communication components. It is crafted to provide high performance in a small footprint, notably being recognized as the world's smallest commercially available E-band diplexer. Its design, which is executed on a BT laminate substrate and compatible with plastic IC packaging, reflects Multifractal Semiconductors' expertise in merging high performance with economic manufacturing processes. This diplexer is equipped with impressive out-of-band suppression capabilities exceeding 60 dB, and features an attractive insertion loss of 3.5 dB, including transitions, making it a powerful component for systems where efficiency and signal integrity are critical. Its compact form-factor, measuring just 3.8 x 4.5 mm, ensures easy integration into modern packaging forms like FCCSP, BGA, CSP, and SiP, reinforcing its practicality for widespread deployment. Incorporating the E-DIP into communication systems promises enhanced signal processing and separation, facilitating superior system performance and reliability. This makes it indispensable for advanced communication applications seeking to leverage innovative diplexer technology in compact and efficient modules.
The E-TRX-LP Low Power Front-End is meticulously engineered to cater to applications where power efficiency is paramount, within the competitive E-band mmWave spectrum. This solution complements systems requiring minimal energy consumption, fitting seamlessly into sophisticated network architectures such as MIMO arrays. It highlights a blend of reduced power usage with high-performance metrics, offering an advantageous trade-off for network fluidity and sustainability. Built to align with 28 nm Bulk CMOS technology, the front-end is optimized for compatibility and integration ease, providing a reliable option for developers targeting efficient, scalable deployments in modern communication networks. Its compact design underlines Multifractal Semiconductors' commitment to providing solutions that maintain performance without considerable size and cost penalties. Further enhancing its allure is the front-end's capacity to offer substantial reduction in operational costs while ensuring robust data throughput. This efficiency makes it an attractive component for emerging telecommunications environments that prioritize energy conservation without sacrificing performance standards.
RFCell Framework by Multifractal Semiconductors is an advanced solution for generating parameterized cells (PCELLs) with a specific emphasis on RF and mmWave applications within CMOS technology nodes. This Python-based framework empowers users to efficiently create and manipulate RF PCELLs using a high-level coding approach. The framework supports not just CMOS but also GaAs and GaN technologies, broadening its applicability across different semiconductor platforms. Designed to streamline the development process, RFCell allows for rapid development using a '1D wire-frame' mode, with the tool automatically translating these into 3D designs. This simplifies the creation of complex structures with minimal coding, significantly reducing the development timelines from months to weeks. The framework is DRC clean and process agnostic, which allows for adaptability across various technology parameters. Additionally, RFCell's integration with industry-standard flows such as Keysight ADS AEL, Synopsys PyCell, and Cadence, makes it a versatile choice for developers aiming to innovate in RF and mmWave domain efficiently. The framework thus stands as a cornerstone tool for accelerating RF design and prototyping, fostering a new wave of innovative semiconductor solutions.
The E-TRX-HP High Power Front-End offers robust solutions for high power applications in the E-band spectrum. Designed with modularity and efficiency in mind, this front-end ensures optimal performance for demanding mmWave communication systems. It integrates seamlessly with MIMO architectures, enhancing their capability and operational range. Furthermore, the front-end's design prioritizes minimized power consumption, without compromising on power handling capabilities. Technically sophisticated, the front-end's architecture is ideally suited for bulk CMOS processes, ensuring high compatibility with existing systems and providing a path toward cost-effective manufacturing. The integration within compact form factors allows for simplified deployment in various networking environments, supporting enhanced data throughput and connectivity. With its significant power efficiency and architectural precision, the E-TRX-HP High Power Front-End stands as a critical component within the arsenal of sophisticated telecommunication solutions, ready to meet the growing demands of modern data transmission applications.
Join the world's most advanced semiconductor IP marketplace!
It's free, and you'll get all the tools you need to discover IP, meet vendors and manage your IP workflow!
Join the world's most advanced AI-powered semiconductor IP marketplace!
It's free, and you'll get all the tools you need to advertise and discover semiconductor IP, keep up-to-date with the latest semiconductor news and more!
Plus we'll send you our free weekly report on the semiconductor industry and the latest IP launches!
To evaluate IP you need to be logged into a buyer profile. Select a profile below, or create a new buyer profile for your company.
