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The Mixed-Signal Front-End IP from GUC offers comprehensive solutions for interfacing analog signals with SoC systems. These IPs handle a broad range of bandwidth needs, supporting applications from wireless communications to high-speed data acquisition systems. They incorporate advanced features such as built-in calibration, amplifiers, filters, and high-performance PLLs, optimizing Performance, Power, and Area (PPA) for diverse electronic systems. They enable easy integration through interfaces like APB, I2C, and JTAG.
GUC's TCAM Compiler is an essential IP for data network communications, offering high-speed pattern matching necessary for large data scenarios. It provides significant enhancement for switch/router applications, combining speed with efficiency in memory operations. The compiler is designed to handle redundant configurations, optimizing performance while maintaining a reasonable power footprint. It is particularly beneficial for high-speed networks where fast data retrieval and pattern recognition are vital.
High Bandwidth Memory IPs from GUC are tailored for high-bandwidth application needs in AI, HPC, and networking. They are fully compliant with JEDEC standards and optimized for performance on TSMC's advanced process technologies. The IPs support data rates of 8.6Gbps for HBM3E and 3.6Gbps for HBM2E, balancing performance, power, and area efficiently. GUC's expertise in TSMC's CoWoS and design implementation ensures their IPs are both silicon-proven and production-ready in real 2.5D IC system applications.
The 32G UCIe PHY from GUC supports the UCIe 2.0 specification, achieving top speeds of 32Gbps per lane with high bandwidth density. Designed for advanced applications in AI, HPC, and complex networking environments, it utilizes TSMC's N3P process and CoWoS technology to interconnect multiple dies in a unified package. It features advanced monitoring and self-healing capabilities to ensure continuous, optimum performance. The IP supports dynamic voltage and frequency scaling and advanced preventive monitoring, enhancing system reliability.
GUC’s Die-to-Die IP solutions, including GLink and UCIe, lead the industry in high-bandwidth, low-power, multi-channel connection technologies within a package. These interfacing IPs are designed to excel in high-performance computing contexts, leveraging signals with massive bandwidth capacities. With GLink-2.5D IP, they utilize advanced signaling technologies on TSMC's RDL-based InFO and CoWoS, achieving bandwidths up to 4Tbps, tailored for advanced multi-die integration needs.
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