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The Universal Chiplet Interconnect Express (UCIe) by EXTOLL is a cutting-edge interconnect framework designed to revolutionize chip-to-chip communication within heterogeneous systems. This product exemplifies the shift towards chiplet architecture, a modular approach enabling enhanced performance and flexibility in semiconductor designs. UCIe offers an open and customizable platform that supports a wide range of technology nodes, particularly excelling in the 12nm to 28nm range. This adaptability ensures it can meet the diverse needs of modern semiconductor applications, providing a bridge that enhances integration across various chiplet components. Such capabilities make it ideal for applications requiring high bandwidth and low latency. The design of UCIe focuses on minimizing power consumption while maximizing data throughput, aligning with EXTOLL’s objective of delivering eco-efficient technology. It empowers manufacturers to forge robust connections between chiplets, allowing optimized performance and scalability in data-intensive environments like data centers and advanced consumer electronics.
EXTOLL's High-Speed SerDes for Chiplets is a pioneering connectivity solution crafted for seamless integration in chiplet-based systems. It serves as a core technology in facilitating swift data transfer across different chiplets, ensuring robust and efficient performance. This SerDes excels in maintaining low power consumption to optimize energy efficiency, crucial for modern computing needs. By leveraging innovative design principles, this SerDes supports mainstream technology nodes ranging from 12nm to 28nm. The flexibility provided by such support makes it a versatile choice for various high-speed data applications, ensuring adaptability to future technological advances. This capability underscores its role in facilitating heterogeneous integration, a crucial aspect in cutting-edge semiconductor environments. Furthermore, the High-Speed SerDes is crafted to cater to applications requiring reduced latency and enhanced bandwidth capabilities. Ideal for systems such as data centers and communications infrastructure, it empowers device manufacturers to implement scalable and sustainable solutions efficiently.
The Network on Chip (NOC-X) from EXTOLL is an advanced interconnect network designed for chiplet architectures. It serves as an integral component in facilitating on-chip communication, offering high-speed data exchange between various processing units within a semiconductor device. NOC-X is engineered to provide scalable and efficient routing paths, essential for managing complex data flows in sophisticated computing environments. By reducing congestion and optimizing bandwidth usage, it ensures that high-performance applications can execute seamlessly without bottlenecks, facilitating improved overall system efficiency. With a focus on maintaining low power consumption, NOC-X is suitable for integration within systems using standard nodes between 12nm and 28nm. Its robust design and versatility make it an ideal choice for a wide range of applications, including data center operations and high-performance computing sectors where reliability and scalability are paramount.
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