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The Universal Chiplet Interconnect Express (UCIe) by Extoll exemplifies a transformative approach towards interconnect technology, underpinning the age of chiplets with a robust framework for high-speed data exchange. This innovative solution caters to the growing demands of heterogeneous integration, providing a standardized protocol that empowers seamless communication between various chiplet designs. UCIe stands out by offering unparalleled connectivity and interoperability, ensuring that diverse chiplet systems function cohesively. This interconnect solution is tailored to the needs of modern digital architectures, emphasizing adaptability and performance across different tech nodes. With Extoll’s mastery in digital-centric design, the UCIe provides an efficient gateway for integrating multiple technological processes into a singular framework. The development of UCIe is also driven by the need for solutions that are both energy and cost-efficient. By leveraging Extoll’s low power architecture, UCIe facilitates energy savings without compromising on speed and data integrity. This makes it an indispensable tool for entities that prioritize scalable, high-performance interconnection solutions, aligning with the semiconductor industry's move toward more modular and sustainable system architectures.
The High-Speed SerDes solution by Extoll is engineered to propel chiplet-based technologies into the future. This interconnect technology is integral for creating scalable systems that boast low power consumption and high-speed data transfer, essential for modern ASIC designs. Its architecture leverages digital-oriented design principles to optimize performance and energy efficiency, making it an ideal choice for heterogeneous integration applications. The collaboration with industry leaders like BeammWave and GlobalFoundries underscores its reliability and industry relevance, particularly in addressing the demands for minimal power expenditure in high-speed applications. Built on top-tier process technologies, Extoll’s High-Speed SerDes offers an unparalleled level of integration, ensuring rapid and efficient data communication between chiplets. This product is pivotal for the development of next-generation systems that require seamless interaction and data throughput at various integration scales. Moreover, its design accommodates a flexible range of tech nodes, enhancing its applicability across various platforms and products. Beyond its core function in high-speed data transfer, the High-Speed SerDes is also equipped to handle rigorous demands made by modern networks. It addresses the growing need for interconnect solutions capable of maintaining integrity and performance under high-load conditions, cementing its role as a foundational element in the semiconductor industry's shift towards innovative interconnection models.
Network on Chip (NOC-X) by Extoll represents a critical advancement in the interconnect domain, designed to manage the complexities of chiplet-based architectures. NOC-X is tailored to facilitate efficient communication within multi-core systems, providing a scalable and robust solution that addresses the intricate demands of modern processing units. This technology is engineered to optimize data flow across chiplets, ensuring low latency and high throughput. Its architecture is rooted in advanced digital design principles that support the seamless integration of various processing elements, enhancing system performance and reliability. This interconnect framework caters to the broad application spectrum in contemporary digital systems, from enterprise-level solutions to consumer electronics. The NOC-X not only improves interchip communication but also enhances overall energy efficiency, aligning with Extoll’s commitment to ultra-low power solutions. By providing a flexible and adaptable interconnect option, NOC-X supports the creation of expandable systems that can evolve alongside advancing technologies, thus meeting the long-term goals of cost-effectiveness and sustainability in the semiconductor space.
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