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Eliyan

Eliyan is a trailblazer in the semiconductor IP industry, focused on delivering cutting-edge chiplet interconnect technology that is pivotal for the next generation of data centers and advanced computing applications. The company's flagship technology, NuLink, has been designed to offer unprecedented performance improvements by pushing the boundaries of what is achievable in both standard and advanced packaging. Eliyan's innovations are acclaimed for significantly enhancing power efficiency and reducing the total cost of ownership (TCO) in data-driven environments, making them indispensable in the era of generative AI.\n\nNuLink technology serves as the backbone of Eliyan's die-to-die and chip-to-chip IP core products, which are crucial for increasing performance and improving cost management in semiconductor manufacturing. The company's pioneering efforts in simultaneous bidirectional signaling and universal memory interfaces have earned it a place among the most innovative startups in the semiconductor industry. Backed by major high-bandwidth memory (HBM) providers and foundries, Eliyan is recognized for transforming interconnect capabilities with solutions like NuLink-X, which broadens the possibilities for industry standards and proprietary enhancements.\n\nAs a company, Eliyan is deeply integrated into various industry standards and ecosystems, including the Arm Total Design environment, which aims to foster a robust chiplet economy. Their focus extends to breaking through the traditional barriers of memory and I/O bandwidth limitations in high-performance computing (HPC) and AI applications. Eliyan's commitment to innovation and excellence in IP design is reflected in its active participation and leadership within global semiconductor forums and events. Read more

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NuLink Die-to-Die PHY for Standard Packaging

The NuLink Die-to-Die PHY for Standard Packaging by Eliyan is engineered to facilitate superior die-to-die interconnectivity on standard organic/laminate package substrates. This innovative PHY IP supports key industry standards such as UCIe and BoW, and includes proprietary technologies like UMI and SBD. The NuLink PHY delivers leading performance and power efficiency, comparable to advanced packaging technologies, but at a fraction of the cost. It features configurations with up to 64 data lanes, supporting a data rate per lane of up to 64Gbps, making it ideal for applications demanding high bandwidth and low latency. The implementation enhances system design while reducing the necessary area and thermal load, which significantly eases integration into existing hardware ecosystems.

Eliyan
TSMC
3nm, 10nm, 16nm
AMBA AHB / APB/ AXI, CXL, D2D, DDR, MIPI, Network on Chip, Processor Core Dependent, V-by-One
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NuLink Die-to-Memory PHY Products

Designed for aiding seamless integration with memory systems, Eliyan's NuLink Die-to-Memory PHY products provide robust solutions for breaking the memory wall in high-performance computing and AI systems. These PHY products advocate the use of simultaneous bidirectional (SBD) signaling, improving efficiency by allowing data to be transmitted and received simultaneously, doubling the bandwidth capacity instantly. NuLink technology excels in configuring lanes for unidirectional and half-duplex bidirectional signaling, all on standard organic packaging with bump pitches starting at 90um. Eliyan's NuLink PHY expands memory bandwidth without necessitating advanced packaging like silicon interposers, making it a cost-effective solution for implementing universal memory interfaces. These interfaces further enhance interoperability across various memory types and settings, ensuring superior performance and flexibility.

Eliyan
TSMC
10nm, 16nm
DDR, Flash Controller, HBM, SDRAM Controller
View Details

Latest News About Eliyan

Navigating the Complex Maze of Die-to-Die Interconnect Standards

Exploring the nuances of UCIe 2.0, its optional features, and the evolving chiplet marketplace. Read more

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