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Eliyan

Eliyan is a leading force in the semiconductor industry, known for its innovation in chiplet interconnect technology. The company has revolutionized the creation of super large System in Packages (SiPs) using its proprietary PHY technology, NuLink™, allowing for significant enhancements in AI performance by breaking down The Memory Wall. Eliyan's approach not only optimizes power and bandwidth but also provides a viable alternative to advanced packaging through standard packaging methods, facilitating superior performance without the accompanying complexities and costs. John Lorenz, a Senior Analyst at Yole Intelligence, has recognized Eliyan's technology as a game-changer for multi-die configurations, particularly for designs eager to maximize power efficiency and bandwidth. Eliyan's commitment to advancing semiconductor technology is further evidenced by the strategic financial support it has secured from key players in the AI chip ecosystem, underscoring the trust and potential seen in its novel solutions. Eliyan's technological advancements have also caught the attention of global media and industry analysts. Through collaborations with major foundries like Samsung, the company has achieved groundbreaking results, such as attaining up to 40 Gbps bandwidth with their UCIe-compliant Chiplet Interconnect Technology. Such innovations have positioned Eliyan at the forefront of the market, offering advanced solutions that address critical performance and energy efficiency challenges in semiconductor design. Read more

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NuLink Die-to-Die PHY for Standard Packaging

The NuLink Die-to-Die PHY for Standard Packaging represents Eliyan's cornerstone technology, engineered to harness the power of standard packaging for die-to-die interconnects. This technology circumvents the limitations of advanced packaging by providing superior performance and power efficiencies traditionally associated only with high-end solutions. Designed to support multiple standards, such as UCIe and BoW, the NuLink D2D PHY is an ideal solution for applications requiring high bandwidth and low latency without the cost and complexity of silicon interposers or silicon bridges. In practical terms, the NuLink D2D PHY enables chiplets to achieve unprecedented bandwidth and power efficiency, allowing for increased flexibility in chiplet configurations. It supports a diverse range of substrates, providing advantages in thermal management, production cycle, and cost-effectiveness. The technology's ability to split a Network on Chip (NoC) across multiple chiplets, while maintaining performance integrity, makes it invaluable in ASIC designs. Eliyan's NuLink D2D PHY is particularly beneficial for systems requiring physical separation between high-performance ASICs and heat-sensitive components. By delivering interposer-like bandwidth and power in standard organic or laminate packages, this product ensures optimal system performance across varied applications, including those in AI, data processing, and high-speed computing.

AMBA AHB / APB/ AXI, CXL, D2D, MIPI, Network on Chip, Processor Core Dependent

NuLink Die-to-Memory PHY Products

Eliyan's NuLink Die-to-Memory PHY Products are designed to push the boundaries of memory connectivity, offering solutions that operate with high efficiency and superior performance. These products challenge the traditional die-to-memory connectivity paradigms by delivering low-power, high-performance interconnects. Unlike unidirectional die-to-die solutions, Eliyan's die-to-memory solutions are engineered to be flexible and bidirectional, offering dynamic adaptability to changing demands. This capability ensures that systems maintain optimal performance under varying operational conditions, making them ideal for applications where bandwidth efficiency and power management are critical. The technology stands out for its ability to integrate seamlessly with industry-standard and advanced packaging solutions. By providing memory interfaces that match or surpass the performance of more costly advanced technologies, Eliyan's NuLink D2M solutions are at the cutting edge of memory connectivity innovation, contributing significantly to streamlined designs and enhanced computing architectures.

Latest News About Eliyan

Navigating the Complex Maze of Die-to-Die Interconnect Standards

Exploring the nuances of UCIe 2.0, its optional features, and the evolving chiplet marketplace. Read more