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Blue Cheetah Analog Design, Inc.

Blue Cheetah Analog Design, Inc. specializes in delivering cutting-edge semiconductor IP solutions, focused primarily on the chiplet interconnect space. They excel in providing customizable, standards-based solutions that significantly enhance area and power efficiency for various chiplet interconnect needs. Blue Cheetah's technology is designed to cater to specialized customer requirements across a range of advanced and standard packaging applications while supporting leading open standards like the Open Compute Project (OCP) and Universal Chiplet Interconnect Express (UCIe).\n\nThe company's flagship product, BlueLynx, features both physical (PHY) and optional link-layer chiplet interfaces that seamlessly integrate with on-die buses and Networks-on-Chip (NoCs) using widely recognized standards such as AMBA AXI and others. This adaptability enables customers to transition from traditional System-on-Chips (SoCs) to chiplet architectures efficiently, allowing for innovative design, reduced time-to-market, and minimized risk through a compiler-like development process.\n\nBlue Cheetah stands out by offering a comprehensive suite of solutions optimized for artificial intelligence, high-performance computing, and mobile markets. Their solutions support cutting-edge packaging techniques, boasting impressive performance metrics like up to 40+ Gbps/line and 15+ Tbps/mm for 2D, 2.5D, and 3D packaging solutions. By leveraging multiple process nodes and foundries, Blue Cheetah ensures broad applicability and cost-effectiveness, reinforcing their position as a leader in the semiconductor IP design market.\n\nBased in Sunnyvale, California, Blue Cheetah leverages a team of talented engineers and industry leaders committed to transforming chiplet technology. The company's customer-centric approach and robust technological offerings make it an invaluable partner for developing next-generation semiconductor solutions that require specialized, high-performance interconnect technologies. Read more

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BlueLynx Chiplet Interconnect

The BlueLynx Chiplet Interconnect is a sophisticated die-to-die interconnect solution that offers industry-leading performance and flexibility for both advanced and conventional packaging applications. As an adaptable subsystem, BlueLynx supports the integration of Universal Chiplet Interconnect Express (UCIe) as well as Bunch of Wires (BoW) standards, facilitating high bandwidth capabilities essential for contemporary chip designs.\n\nBlueLynx IP emphasizes seamless connectivity to on-die buses and network-on-chip (NoCs) using standards such as AMBA, AXI, and ACE among others, thereby accelerating the design process from system-on-chip (SoC) architectures to chiplet-based designs. This innovative approach not only allows for faster deployment but also mitigates development risks through a predictable and silicon-friendly design process with comprehensive support for rapid first-pass silicon success.\n\nWith BlueLynx, designers can take advantage of a highly optimized performance per watt, offering customizable configurations tailored to specific application needs across various markets like AI, high-performance computing, and mobile technologies. The IP is crafted to deliver outstanding bandwidth density and energy efficiency, bridging the requirements of advanced nodal technologies with compatibility across several foundries, ensuring extensive applicability and cost-effectiveness for diverse semiconductor solutions.

Blue Cheetah Analog Design, Inc.
TSMC
4nm, 7nm, 10nm, 12nm, 16nm
AMBA AHB / APB/ AXI, Clock Synthesizer, D2D, Gen-Z, IEEE1588, Interlaken, MIPI, Modulation/Demodulation, Network on Chip, PCI, Processor Core Independent, VESA, VGA
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