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Designed to optimize performance, power, area, and reliability, Aragio's GPIO solutions offer a comprehensive range of general-purpose I/Os suited for integrated circuit design. These circuits are equipped with a complete set of power pads, corner and spacer pad cells, and breakers, ensuring a seamless implementation in varying design contexts. With specific considerations for power supply sequencing, these IPs utilize Distributed Power-on-Control (POC) during the power-up and power-down phases of systems. Their adaptable voltage range enables versatility across different system requirements, and they support the creation of isolated power domains to enhance design flexibility. This suite offers programmable GPIO and fault-tolerant configurations, ensuring robust input-output interfacing. Alongside this, support for isolated analog power supplies and a full complement of pads are provided, facilitating a wide range of electronic applications. The recommended operational conditions cover diverse voltage scenarios and operating temperatures, making these solutions viable for rigorous application environments. Moreover, the broad foundry support ensures that Aragio's GPIO solutions can be implemented across various manufacturing technologies, ranging from older nodes like 130nm to cutting-edge nodes like 7nm, thereby reaffirming the adaptability and long-term applicability of these IPs.
Built for robust performance, Aragio's high-speed LVDS solutions address the needs for low power, high data rate communication interfaces in semiconductor designs. Featuring a three-module design—comprising input, output, and reference blocks—these LVDS I/Os cater to operations up to 1 GHz for drivers and 1.2 GHz for receivers, supporting finer technologies for optimal performance. The design operates efficiently with I/O powered at 1.8V and core supply levels from 1.0V to 1.1V, ensuring low power consumption while achieving high-speed operation. The LVDS meets the IEEE standard 1596.3-1996 for low voltage differential signaling, a testament to its reliability and robustness in communication protocols. Furthermore, these designs offer low power consumption with low differential skew and high common mode voltage ranges, critical for maintaining signal integrity. Supporting nodes from 130nm down to advanced nodes like 16nm, this solution guarantees broader applicability and integration into numerous system architectures, offering designers flexibility and scalability in high-speed data processing tasks.
Aragio Solutions provides comprehensive memory interface solutions supporting a range of DDR standards from DDR to DDR5, including compatible sets for each variant's unique power and signaling requirements. Their DDR interfaces include a full complement of I/O, power, and spacer cells needed for efficient padring assembly, capable of operating with isolated power domains to optimize performance while reducing interference. Specific pad sets are tailored to meet industrial requirements, ensuring compliance with JEDEC standards and accommodating configurable options for different operation classes. Additional support includes rail-splitter cells for powering flexibility, allowing intricate power distribution that ensures VDD and VSS continuity in integrated designs. Operating optimally at high frequencies, these interfaces provide resilient performance even at max frequency limits specified for each DDR class. Aragio's DDR solutions extend compatibility across multiple technology nodes, ensuring they meet the stringent criteria set by leading foundries. With extensive support for JEDEC standards, the interfaces reliably function across various nodes from 130nm to cutting-edge 7nm, ensuring adaptability for evolving semiconductor processes and high-speed computing applications.
Aragio Solutions offers advanced ESD protection tailored for USB 2.0 and RF applications. Their solutions are crafted to meet stringent ESD requirements, aiming to pass a 4KV ESD threshold using the Human Body Model (HBM). A significant element of this library is its 5-Volt tolerance, designed to deliver high current capacity while maintaining minimal capacitance; this is crucial for demanding data paths and power pads which need to handle over 30mA of DC current at elevated temperatures of up to 125°C. This ESD solution is essential for safeguarding the integrity of high-speed data transfer and power integrity in modern electronic devices. It utilizes sophisticated ESD protection devices like clamp diodes and Silicon-Controlled Rectifiers (SCRs) that offer ample protection with significantly reduced capacitance. These components work together to ensure robust protection for RF input/output paths and critical data lines, adapting well to varying design specifications. Beyond its primary focus area, this library is versatile across several technology nodes, supporting implementations from 180nm down to advanced 16nm. This broad compatibility ensures that it can be seamlessly integrated into a wide variety of semiconductor manufacturing processes worldwide.
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