Chip Talk > STMicroelectronics Ventures into Panel-Level Packaging to Revolutionize Manufacturing Efficiency
Published September 19, 2025
In a significant move within the semiconductor industry, STMicroelectronics has announced its foray into panel-level packaging (PLP) technology with a dedicated pilot line set to launch in 2026 in Tours, France. The company joins a rapidly growing segment that includes giants like TSMC and ASE, marking a new chapter in advanced semiconductor packaging.
PLP technology offers a paradigm shift from traditional circular wafer methods by utilizing larger rectangular carriers. This approach allows more chips to be fabricated on a single panel, dramatically enhancing manufacturing efficiency and reducing costs. This is particularly advantageous as the demand for miniaturization and increased computational power drives innovation in consumer electronics, automotive, and industrial applications.
STMicroelectronics has identified these sectors as target markets for its PLP technology, leveraging the advanced Direct Copper Interconnect (DCI) process, which is expected to provide significant improvements in performance. Read more about STMicroelectronics' venture into PLP.
The move by STMicroelectronics is part of a broader strategy to optimize its global manufacturing operations. This initiative includes significant investment exceeding $60 million in the new pilot line, which is anticipated to ripple throughout their operational footprint globally. In this context, STMicroelectronics aims to expand its technological reach and influence by focusing on efficiency and reliability enhancements in its manufacturing processes.
The introduction of this pilot line comes against the backdrop of strategic job restructuring efforts by STMicroelectronics. Earlier this year, the company announced voluntary departures aimed at aligning its workforce with evolving operational requirements. However, the French expansion underscores the importance of the region in ST's corporate strategy, balancing workforce optimizations with technology advancements. Despite these changes, no layoffs are expected in Italy, where further expansion is on the horizon post-2027.
As STMicroelectronics strides into the advanced packaging sector, its new PLP operations in Tours could catalyze broader industry adoption, serving as a crucial step in supporting next-generation applications with heightened power density and efficiency. This development further aligns with global semiconductor trends prioritizing more sustainable and efficient manufacturing technologies.
Join the conversation about the impact of panel-level packaging on semiconductor manufacturing by visiting our blog for more details and insights.
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