An Intriguing Partnership in Semiconductors

Sofics, a pioneer in semiconductor IP focused on the power-performance-area (PPA) metrics for integrated circuits, has announced an exciting new partnership with GlobalFoundries (GF). By joining GF’s GlobalSolutions ecosystem, Sofics is set to enhance the robustness, performance, and design efficiency of chips across various technology platforms.

The collaboration targets companies looking to streamline their design process and amplify their chip performance using Sofics' silicon-proven ESD (Electrostatic Discharge) and I/O solutions. This initiative will be particularly beneficial for IC designers aiming for high robustness, lower capacitance, and leakage without the need for process modifications.

Read the full release from Sofics.

Boosting Chip Performance and Design Efficiency

In their announcement, Sofics described how their technology has already been validated on multiple GF process technologies, including 22FDX SOI, 130nm SOI, and CMOS processes. These achievements are not theoretical; they are already employed in commercial products from various industry leaders, facilitating advancements in Bluetooth communication, high-speed interfaces, and optical modules functioning at speeds up to 224Gbps.

Koen Verhaege, CEO of Sofics, emphasized how the partnership with GlobalFoundries will ease access to silicon across a range of process technologies. The collaborative approach enables designers to implement Sofics’ ESD protection and custom I/O IP, thus boosting reliability and reducing development time and costs.

Ecosystem Benefits

The GlobalSolutions ecosystem, spearheaded by GF, is crafted to nurture productive partnerships with leading design and IP entities. Over the past five years, it has successfully delivered over 2,200 unique customer designs. Through their new role in the ecosystem, Sofics will provide GF customers with advanced solutions, particularly in high-voltage interface design and fail-safe operation in compact silicon areas.

Ziv Hammer, GF’s senior vice president of design platforms, highlighted how Sofics’ participation will advance GF’s ability to offer sophisticated semiconductor solutions. By aiding customers in accelerating design cycles and improving reliability, Sofics complements GF’s existing platforms which cater to demanding design requirements without necessitating any process alterations.

Implications for the Wider Industry

This partnership not only strengthens Sofics’ standing within the semiconductor IP industry but also reinforces the effectiveness and resilience of Sofics’ existing IP, which has been successfully deployed in over 5000 IC designs. Their impact spans diverse applications such as automotive, data centers, and mobile imaging.

For semiconductor professionals, the integration of Sofics' solutions into GF’s ecosystem will likely enable faster time-to-market products, addressing long-standing challenges in chip design while enhancing the robustness and efficiency of electronic devices worldwide.

The ongoing collaboration between these two semiconductor leaders highlights the growing trend towards partnerships aimed at pooling resources and expertise to drive innovation and efficiency across the industry. With Sofics' proven track record and GF’s broad market reach, this alliance could serve as a model for future industry collaborations.

By tapping into these innovations, IC designers and companies are positioned well to tackle the demands of current and future technologies. As this trend continues, it could significantly reshape the landscape of semiconductor design, potentially leading to breakthroughs in how we think about and develop integrated circuits.