Chip Talk > Siemens and Intel Forge New Path in Semiconductor Design
Published April 30, 2025
The semiconductor industry is no stranger to strategic collaborations, but when giants like Siemens and Intel Foundry come together, the implications are far-reaching. Their latest announcement marks an exciting step forward in advancing semiconductor design, with Siemens Digital Industries Software unveiling multiple certifications and updates in collaboration with Intel Foundry source.
At the heart of this collaboration lies the certification of Siemens’ Calibre® nmPlatform tool for Intel’s latest 18A production Process Design Kit (PDK). Intel 18A, a beacon of innovation, flaunts groundbreaking RibbonFET and PowerVia technologies that promise to redefine integrated circuit performance. This certification not only confirms the capabilities of Siemens’ tools but also ensures that mutual customers can harness their benefits for accelerated, next-generation chip designs.
Moreover, Siemens' Solido™ SPICE and Analog FastSPICE (AFS) tools have secured certification for the 18A process as well. Part of the broader Solido™ Simulation Suite, these tools are pivotal for intelligent IC design and verification, especially in complex domains like analog, mixed-signal, and 3D IC designs.
The collaboration also emphasizes Siemens’ status as a founding member of the Intel Foundry Accelerator Chiplet Alliance. This initiative is set to drive the chiplet design infrastructure forward, leveraging Siemens’ simulation and sign-off flows particularly through their Calibre® and Solido™ tools across various innovative process nodes like 18A-P and 14A-E source.
One of the most compelling dimensions of this partnership is the forward momentum in advanced packaging solutions, highlighted by the certification of a reference workflow for Intel's Embedded Multi-die Interconnect Bridge-T (EMIB-T). With Siemens’ Innovator3D™ IC solution at the helm, this workflow enables comprehensive design planning, prototyping, and predictive analysis, effectively supporting detailed implementations and thermal analyses.
As Suk Lee, VP & GM of Ecosystem Technology Office at Intel Foundry, notes, this collaboration facilitates streamlined design workflows and accelerates market innovations. The certified verification tools are engineered to extract the full potential of Intel’s advanced process nodes, delivering unparalleled design solutions to customers.
In essence, Siemens and Intel Foundry’s alliance not only strengthens each company’s technological prowess but also offers a robust pathway for customers to bring revolutionary semiconductor innovations to fruition faster and more efficiently.
The enhanced cooperation between Siemens and Intel Foundry signifies a crucial development in the semiconductor landscape. By integrating advanced simulation and design verification tools with Intel’s cutting-edge process technologies, this collaboration paves a promising path for future semiconductor advancements that could answer the growing demand across various industry verticals.
Looking ahead, it will be fascinating to witness how this partnership evolves and continues to shape the semiconductor industry. For further details on this story, you can access the full article on Semiconductor Digest.
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