Episode 10 explores the challenges facing Moore’s Law as the semiconductor industry approaches the physical limits of miniaturization. For decades, shrinking transistors led to faster, cheaper, and more efficient chips. But today, as we reach the sub-5nm scale, further scaling introduces major issues: quantum tunneling, heat dissipation, variability, and manufacturing complexity.

We discuss how chipmakers are responding—not by relying solely on smaller transistors, but by rethinking chip design entirely. Innovations like FinFETs, EUV lithography, 3D stacking, and chiplets are helping extend performance gains despite Moore’s Law slowing down.

This episode marks a turning point in the series—where the industry shifts from raw scaling to architectural creativity, advanced packaging, and domain-specific solutions. Moore’s Law may be slowing, but semiconductor innovation is far from over.

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