In September 2025, Japanese semiconductor manufacturer ROHM unveiled a pioneering innovation that is set to reshape the landscape of power electronics: the DOT-247, a 2-in-1 silicon carbide (SiC) molded module. This cutting-edge module is meticulously designed to cater to industrial applications that demand high performance and efficiency, such as photovoltaic (PV) inverters, uninterruptible power supply (UPS) systems, and semiconductor relays. Read more.

The DOT-247 Design Advantage

The hallmark of the DOT-247 module lies in its novel design, which retains the flexibility of the universally adopted TO-247 package while pushing the boundaries of design and power density. It achieves this through an ingenious combination of two TO-247 packages into a single module. This architecture accommodates larger silicon carbide chips, which were previously hard to fit in standard TO-247 packages, thereby enabling a lower on-resistance thanks to its unique internal configuration.

Moreover, the optimized structural design of the DOT-247 module significantly reduces thermal resistance by approximately 15% and inductance by a notable 50% in comparison to its TO-247 predecessor. These enhancements allow the module to deliver a power density that is 2.3 times greater than that of traditional TO-247 modules when used in a half-bridge configuration.

Industrial Implications and Topologies

ROHM's DOT-247 caters to the burgeoning demand for multi-level circuit configurations in PV inverters, such as the three-level NPC and five-level ANPC circuits, which facilitate higher voltage applications. Conventionally, these circuits necessitate custom SiC modules due to the mixed use of half-bridge and common-source topologies. The 2-in-1 module approach of the DOT-247 addresses these complexity challenges, offering the essential building blocks for higher level circuits in a streamlined format.

Minimizing Design Complexity

One of the standout benefits of the DOT-247 is its contribution to reducing the overall component count and the associated PCB footprint. By integrating two topologies into one module, it supports diverse configurations like NPC circuits and DC-DC converters, enabling significant circuit miniaturization. This leads to simplified design processes, which is a boon for engineers looking to optimize space and efficiency in industrial applications.

Automated and Automotive Applications

ROHM extends its commitment to quality with plans to ship AEC-Q101 certified samples, which are a standard for automotive-grade reliability, starting in October. This expansion ensures that the DOT-247 module is fit for automotive applications that require stringent performance metrics and reliability.

Support and Resources for Implementation

To ease the adoption of the DOT-247 module, ROHM is providing substantial application-level support, which includes access to their in-house motor testing facilities. The company is also offering a suite of supporting materials, including simulation tools and thermal design resources, to facilitate a seamless transition for design engineers looking to leverage the benefits of the DOT-247 module.

Evaluation boards are also becoming available to aid in design evaluation. Notably, an evaluation kit for double-pulse testing has already been released, and a kit for 3-phase inverters is underway with reference designs expected to become available in November.

A Step Forward in Semiconductor Innovation

As ROHM unleashes this technological advancement, it sets a new benchmark in the realm of SiC modules, providing a versatile, high-density solution that caters to the dynamic demands of today’s industrial and automotive applications. Engineers and designers can look forward to harnessing the power of the DOT-247 for more efficient and compact designs, marking a significant leap forward in semiconductor technology. For more information and detailed specifications, visit the ROHM product page.