Chip Talk > Revolutionizing AI Chiplet Designs: Arteris' FlexGen NoC Joins AMD's Innovation Force
Published August 04, 2025
As artificial intelligence (AI) continues to reshape the tech landscape, semiconductor leaders are pushing the boundaries to deliver enhanced computing solutions. A recent development in this domain is the collaboration between Arteris and AMD in utilizing Arteris' innovative FlexGen smart Network-on-Chip (NoC) IP for AMD's next-generation AI chiplet designs.
Arteris, renowned for its cutting-edge semiconductor system IP, introduces FlexGen—a smart NoC IP tailored to revolutionize SoC designs through optimized performance and efficiency. This technology caters to the sophisticated needs of contemporary chiplet-based architectures, especially as the demand for high-performance interconnect solutions grows in diverse electronic systems.
AMD, with its leadership in high-performance computing, has licensed Arteris' FlexGen NoC to enhance its AI chiplet designs. This collaboration underscores a strategic integration of Arteris' NoC technology with AMD's own Infinity Fabric™ interconnects, aiming for superior scalability and data transport across the entire AMD product portfolio spectrum—from data centers to edge devices.
AMD’s focus on scaling AI capabilities from the cloud to client devices aligns with this collaboration. By incorporating Arteris’ NoC into its designs, AMD can automate interconnect configuration, ensuring seamless connectivity among SoC components. This move not only enhances AMD’s AI compute portfolio but also sets a new standard in AI infrastructure.
Modern chiplets demand the ability to handle high volumes of data transport efficiently. FlexGen, designed by Arteris, steps up by optimizing wire length, reducing latency, and boosting power efficiency. These factors are crucial as multi-die and chiplet-based designs become the norm in cutting-edge semiconductor innovations.
The strategic use of FlexGen as a standalone interconnect solution or in synergy with existing proprietary technologies opens the doors for accelerated design iterations and reduced time-to-market schedules. Such capabilities are vital for maintaining competitive advantage in the fast-paced tech industry.
By adopting Arteris’ FlexGen NoC technology, AMD positions itself at the forefront of the AI revolution, creating next-gen silicon solutions for a plethora of markets. The integration of AI automation into design processes exemplifies Arteris’ commitment to enhancing design productivity and addressing the complexities of modern computing systems.
Notably, the collaboration with AMD is a testament to Arteris’ influential role in shaping the future of AI chiplets. As companies dream up the next technological breakthroughs, having robust, efficient, and scalable interconnect solutions will be indispensable.
It's clear that the partnership between Arteris and AMD is more than just a strategic business move. It represents a significant leap towards smarter, more efficient chiplet designs that will power the future of AI applications. As the tech industry continues to evolve, such collaborations will be pivotal in determining new standards and capabilities in semiconductor design.
For more on Arteris’ trailblazing technologies, visit their official page. As we watch these developments unfold, one thing is certain—the future of AI in semiconductors is looking bright and promising.
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