At Silicon Hub, we constantly track the breakthroughs that shape the future of semiconductor design—and M31 Technology’s latest achievement in partnership with TSMC is a standout. The successful development and silicon validation of the world’s first 2nm embedded USB 2.0 (eUSB2) PHY IP mark a significant leap in interface IP innovation. This accomplishment not only showcases M31’s technical excellence but also reflects the growing importance of deep foundry-IP collaboration in the era of advanced nodes.

Breaking Barriers at 2nm: Why It Matters

As the industry advances toward 2nm and beyond, traditional design paradigms are being fundamentally redefined. Transistor behavior changes significantly at this scale, and analog IP—particularly PHYs like USB—face immense design challenges due to reduced voltage margins, increased process variability, and tighter area constraints. Despite these hurdles, M31 has delivered a fully USB 2.0-compliant PHY IP that meets the stringent requirements of TSMC’s 2nm process.

Key technical highlights include:

1. Ultra-Low Power Design: The eUSB2 PHY supports low-voltage operation, making it highly suitable for SoCs in mobile, wearables, AIoT, and automotive applications where energy efficiency is critical.
2. Optimized for TSMC’s 2nm Node: Built with TSMC’s 2nm process technology, this IP demonstrates excellent performance and robustness, validated through silicon results.
3. High Integration Value: With integrated ESD protection, on-chip PLL, and advanced electrostatic discharge resilience, the IP reduces external components and system complexity.
4. Broad Applicability: The eUSB2 PHY can be deployed across a variety of use cases—from MCUs and PMICs to edge AI chips—delivering reliable USB connectivity even in constrained form factors.

Strategic Impact: Strengthening the IP-Foundry Ecosystem

This achievement is not just about performance metrics; it’s about what it signals for the semiconductor industry at large:

1. Foundry-Vendor Co-Optimization: As nodes shrink, interface IP must be deeply co-developed with the foundry to optimize for layout-dependent effects, power rails, substrate noise, and signal integrity. M31’s alignment with TSMC on 2nm shows the strength of this collaborative model.
2. First-Mover Advantage: By being first to market with 2nm eUSB2 IP, M31 positions itself as a go-to partner for chip designers working at the leading edge. Early access to proven IP accelerates tape-out schedules and reduces risk.
3. Foundation for AI-Driven Design: At Silicon Hub, we believe the future of chip design is AI-assisted and platform-driven. For AI to effectively recommend IP solutions, the market needs process-ready, silicon-proven, and power-aware IP blocks. M31’s work fulfills these criteria and elevates the ecosystem.

Why We Applaud M31

M31 continues to demonstrate why it's one of the most trusted names in the semiconductor IP space. Their ability to consistently deliver cutting-edge interface and foundation IP for the most advanced process nodes reinforces the value they bring to both emerging startups and global chipmakers.

From a platform perspective, M31’s 2nm eUSB2 PHY will be a valuable addition to any portfolio seeking to address power-sensitive markets while pushing performance boundaries. As more companies explore chiplets, multi-die architectures, and edge AI, having reliable, compact, and efficient interface IP is critical—and M31 is meeting that demand head-on.

Final Thoughts from Silicon Hub

We congratulate the M31 team on this remarkable milestone and commend their collaborative approach with TSMC. At Silicon Hub, our mission is to make the discovery and deployment of semiconductor IP faster, smarter, and more transparent. The kind of innovation M31 is driving gives platforms like ours the building blocks to empower the next generation of chip designers.

We look forward to supporting the adoption of cutting-edge IP like this through AI-driven discovery, seamless NDA workflows, and 24/7 AI assistance for buyers and sellers alike.

The 2nm era is here—and M31 is helping lead the way.

details: https://www.m31tech.com/m31-collaborates-with-tsmc-to-advance-2nm-eusb2-ip-innovation/