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Chip Talk > Pioneering Photonics at FBH: A Glimpse into the Future

Pioneering Photonics at FBH: A Glimpse into the Future

Published June 13, 2025

The Ferdinand-Braun-Institut (FBH) stands at the forefront of innovation as they prepare for their presentation at the Laser World of Photonics in Munich. Spanning from June 24 to 27, 2025, the event will showcase FBH’s significant contributions to semiconductor lasers, quantum technologies, and more. Read more about the event here.

Revolutionary Developments in Semiconductor Lasers

Laser technology is pivotal to numerous modern applications, from space exploration to medical diagnostics. FBH, based in Berlin, is recognized worldwide, particularly in designing and fabricating GaAs-based diode lasers. This year’s main highlight is a novel GaAs-based photonic integrated circuit (PIC) platform. This innovation merges on-chip amplification with flat and deep-etched waveguides, resulting in ring resonator-coupled lasers with an output of up to 14 mW at around 1050 nm.

The ambition doesn't stop there. FBH will unveil heterogeneous GaAs amplifier chiplets for integration onto passive waveguide platforms via transfer printing. These advancements are crucial for the upcoming APECS pilot line under the EU Chips Act, promising to align GaAs-based laser and amplifier chiplets with silicon nitride waveguides.

Quantum Light Sources: A New Dawn for Medical Applications

Perhaps one of the most exciting developments is FBH’s progress in quantum light sources, aiming primarily at medical applications, especially cancer diagnostics. With high-power diode lasers at 720 nm, FBH has crafted technology capable of hyperspectral imaging, a non-invasive way to scrutinize tissue samples. The key here is the 'measurement by undetected photons' technique, where MIR photons examine samples but the imaging data is captured via NIR photons. This innovation offers enhanced diagnostics while minimizing costs and complexities involved with MIR sensors.

LiDAR Systems Redefined with High-Power Lasers

Gone are the days when LiDAR systems suffered from suboptimal performance over long distances. FBH’s grating-stabilized diode lasers, tailored for time-of-flight (ToF) applications, promise substantial enhancements. These lasers, featuring various emitter designs, not only achieve impressive pulse powers (up to 420 W) for medium and long-range scanning but also maintain excellent lateral beam quality.

The synergy of performance and integration is evident in FBH’s latest laser bars and drivers. Compact butterfly housings encase components such as micro-optics and driver electronics, simplifying integration and operation through a user-friendly interface.

A Broad Spectrum of Applications: Diode Lasers’ evolving Role

High-power diode lasers from FBH extend their reach well beyond traditional applications. At CLEO Europe, the institute will showcase the SAMBA laser system, pivotal for additive manufacturing and energy generation via inertial fusion. Notably, space-based power beaming collaborations are on the rise, with FBH's single-mode diode lasers leading the charge in wireless energy transmission.

Conclusion

The advancements FBH will present at the Laser World of Photonics illustrate a future where quantum technology, semiconductor lasers, and integrated circuits reshape industries from healthcare to manufacturing. The potential implications for how we capture data, generate energy, and build products point to a more integrated and efficient technological landscape. For those invested in the semiconductor industry’s future, FBH’s contributions represent a significant leap forward in both innovation and application.

In a rapidly advancing field, the Ferdinand-Braun-Institut is not just keeping pace; it's leading the charge. You can follow their developments and dive deeper into their innovative projects by visiting related sites and publications to stay informed about the next big leap in photonics and semiconductor technology.

Read more about their breakthrough technologies and future plans in their press release.

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