Chip Talk > Paving the Path for the Future of Semiconductor Manufacturing: Tariffs, Visa Fees, and Global Collaborations
Published September 26, 2025
The semiconductor industry, a linchpin of the modern economy, is currently navigating shifting geopolitical landscapes. Recently, Southeast Asian semiconductor manufacturers have faced increased pressure to shift their production bases to the United States to avoid punitive tariffs. According to a South China Morning Post report, U.S. Trade Representative Jamieson Greer emphasized that failing to comply might lead to hefty tariffs similar to those that were previously considered. This could have far-reaching implications not just for the countries involved but also for the global semiconductor supply chain.
Malaysia, a key player in global semiconductor production, along with other regional economies, has responded by offering concessions and promises of U.S. imports in an effort to negotiate terms that would avert these tariffs. How this situation unfolds could serve as a bellwether for future trade negotiations concerning semiconductors and other vital industries.
In another significant development impacting the semiconductor landscape, the U.S. has announced a new $100,000 fee for H1-B visas, as reported by Reuters. This fee poses a new challenge for Silicon Valley companies that rely heavily on high-skilled immigrant labor to drive innovation in technology fields, including semiconductors. Concerns have arisen that this fee might lead companies to relocate positions overseas to mitigate costs, potentially impacting the U.S. tech industry and visa holders alike.
SEMI Americas President Joe Stockunas remarked on this development, underscoring the potential for significant shifts in how companies approach talent acquisition and location strategies.
Amid these challenges, collaborative efforts continue to advance semiconductor technology. The European Union has selected the STARLight consortium, led by STMicroelectronics, to spearhead advancements in 300mm silicon photonics technology by 2028. Working alongside 24 companies and universities across 11 countries, this initiative aims to establish high-volume manufacturing and develop photonic integrated circuits targeting sectors such as data centers, AI clusters, telecommunications, and automotive applications.
This long-term investment demonstrates the EU's commitment to maintaining its competitive edge in the semiconductor space, emphasizing the strategic importance of photonics in future technology sectors.
Simultaneously, breakthroughs in extreme ultraviolet (EUV) lithography have been achieved by imec. Their recent work in single-patterning high-NA EUV lithography has enabled the creation of 20nm pitch line structures with remarkable precision, demonstrating potential for sub-2nm logic nodes - a crucial bit of progress as the industry pushes towards increasingly smaller and more efficient microprocessors.
These innovations were highlighted prominently during the SPIE Photomask Technology + EUV Lithography Conference, where display of a 100% electrical test yield for the 20nm pitch direct metal etch (DME) structures marked significant progress in the field.
In summary, while geopolitical and economic challenges currently test the semiconductor industry, collaborations and innovations are paving a path forward. From Southeast Asia’s response to tariff pressures to the EU’s strategic investments in photonics, and advancements in EUV lithography, the industry is poised at an interesting juncture that combines political strategy with technological evolution.
As these developments unfold, Silicon Hub will continue to monitor and report on the impacts across the semiconductor ecosystem, offering insights and analyses that will help navigate this dynamic, challenging landscape. Stay connected with us for more updates and expert opinions from industry insiders.
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