Chip Talk > Navigating the Metrology Landscape in Semiconductor Packaging
Published May 08, 2025
The rapid evolution of AI applications has accelerated the demand for small, powerful chips with increased functionality, challenging manufacturers to innovate beyond traditional 2D scaling. The transition to 3D integration and advanced packaging facilitates the stacking of chips, maximizing capability per unit area. However, achieving this integration requires precise control over various parameters, including overlay, critical dimension (CD), and Z-height, to maintain reliability and performance.
For a detailed breakdown of overlay, CD, and Z-height metrology solutions in semiconductor packaging, the article by SemiEngineering provides extensive insights, especially relevant for engineers grappling with production challenges.
As manufacturers continue to embrace 3D heterogeneous integration, the role of precise metrology becomes even more critical. This innovation allows for the combination of multiple technologies and functionalities within a single package, offering substantial gains in processing power and reduced energy consumption.
One of the keystones of this approach is high bandwidth memory (HBM), which emphasizes metrology precision. Devices like microbumps need intricate attention to their step height and CD for optimal signal integrity, further complicated by the additional redistribution layers (RDLs) which enable die-to-die connections. Any variance can lead to performance degradation, emphasizing the necessity for stringent metrology.
Manufacturers implement precision metrology solutions to keep variations within permissible limits. Current processes require microbumps with pitches as small as 18μm and diameters of approximately 9μm, alongside over 200 million bumps on a 300mm wafer. These numbers are expected to grow, increasing the complexity for metrology solutions.
The transition towards these finer geometries necessitates solutions capable of handling advanced measurements, such as employing specialized microscopes to mitigate signal-to-noise issues, complemented by AI-driven analyses ensuring rapid, accurate results.
To maintain productivity and cost-effectiveness, the right metrology solution provides manufacturers with comprehensive tools to measure overlay, CD, and Z-height simultaneously. This approach enhances total cost ownership, delivering reliable measurements vital for keeping semiconductor production lines efficient.
More information can be found here.
With the semiconductor industry pushing towards higher integration, the need for accurate and reliable metrology solutions becomes evident. By leveraging advanced tools and technologies, manufacturers are better equipped to meet the complex requirements of modern semiconductor packaging, thus ensuring device reliability and maintaining competitive advantage in the burgeoning electronics market.
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