Chip Talk > Incize and Atomera Forge New Paths in RF GaN-on-Si Technologies
Published July 11, 2025
In the rapidly evolving landscape of semiconductor materials, collaboration is often key to driving innovation. The recent alliance between Incize and Atomera aims to do just that by enhancing GaN-on-Si technologies for next-generation RF and power devices.
Incize, based in Belgium, is known for its prowess in semiconductor characterization and modeling, while Atomera, headquartered in the US, specializes in semiconductor materials. By joining forces, these two companies are leveraging their unique strengths to push the boundaries of what's possible in GaN-on-Si technology.
Atomera's proprietary MST technology—a thin silicon film—plays a pivotal role in this partnership. MST is designed to improve transistor performance, energy efficiency, and reliability. When combined with Incize’s advanced characterization platforms, which include substrate trap analysis, noise, linearity, thermal effects, and RF performance from DC to mmWave, the potential for groundbreaking advancements becomes apparent.
GaN-on-Si (Gallium Nitride on Silicon) has gained attention for its ability to offer cost-effective solutions in RF and power applications. Unlike traditional RF technologies, GaN-on-Si can achieve higher power density and efficiency, making it ideal for demanding applications in telecommunications, automotive, and even consumer electronics.
The integration of Atomera’s MST could significantly enhance these benefits. MST helps in reducing resistance and increasing the mobility of charge carriers in the semiconductor, which leads to improved overall device performance. Scott Bibaud, CEO of Atomera, highlights the collaborative potential in exploring how MST might drive compound semiconductor devices forward.
With Incize’s capabilities in GaN-on-Si, their role in this collaboration is to provide the sophisticated measurement and modeling necessary to fully exploit MST’s potential. Mostafa Emam, CEO of Incize, underscores the importance of this synergy, emphasizing the shared ambition to push new frontiers of performance and reliability in GaN-on-Si platforms.
The success of this collaboration could set a new benchmark in the semiconductor industry. By focusing on enhancing the capabilities of GaN-on-Si, the partnership addresses a growing need for more efficient and powerful RF devices—especially critical as applications like 5G, satellite communications, and electric vehicles continue to expand.
For more information on this partnership, visit the Incize announcement.
While the collaboration is still in its early stages, the roadmap is promising. With the combined resources and expertise of Incize and Atomera, the industry can anticipate innovative developments in GaN-on-Si technology that could be revolutionary. This partnership highlights the importance of cross-border and cross-disciplinary collaborations in propelling the future of technology.
As the industry continues to evolve, such collaborations will likely become more frequent, serving as a catalyst for future innovations in semiconductor technologies that meet the growing demands of a digital world.
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