Chip Talk > ERS Electronic Powers Panel-Level Packaging Revolution in Taiwan
Published May 08, 2025
ERS electronic, a prominent force in thermal management for the semiconductor industry, has unveiled a new demonstration center in Zhubei, Taiwan. This move places ERS at the forefront of the burgeoning panel-level packaging (PLP) trend that's taking hold in Taiwan and beyond.
Read more about this development on PR Newswire.
Panel-level packaging is rapidly advancing due to its efficiencies and scalability, making it a preferred choice over traditional wafer-level packaging (WLP). Unlike WLP, which typically supports package sizes up to the wafer's diameter, PLP offers solutions that can dramatically improve carrier area efficiency beyond the reticle size limit. This capability is particularly advantageous with the rise of high-performance computing (HPC) and artificial intelligence (AI) applications.
At the heart of ERS's drive is the LUM600S1, a PhotoThermal debonding machine that simplifies wafer and panel processing. This equipment stands out by offering a high-yield, cost-effective solution tailored for the high-volume production needs characteristic of AI chips.
Sébastien Perino, the Managing Director of ERS Taiwan, emphasizes the importance of this technology: "With the LUM600S1, we are providing a high-yield solution tailored for high-volume manufacturing of complex AI chips."
The establishment of the demonstration center is a strategic response to the predicted growth of the PLP sector, expected by Yole Group to swell from $160 million in 2024 to an impressive $600 million by 2030. The continued development of chiplet and heterogeneous integration technologies underscores this growth trajectory.
ERS has been a pioneer in the PLP arena, being among the first to market PLP equipment back in 2018. Their current offerings include both semi- and fully-automatic systems that manage temporary bonding and debonding processes, essential for handling the ultra-thin substrates demanded by advanced technologies like CoWoS and HBM.
With its expansive range of debonding and thermal management systems, ERS electronic is at the cutting edge of the semiconductor industry. Their advancements in panel-level packaging technology signify a significant shift towards more efficient, scalable, and cost-effective processes in semiconductor manufacturing. The newly opened demonstration center in Zhubei not only cements ERS's commitment to innovation but also positions Taiwan as a pivotal player in the next wave of semiconductor advancements.
For more about ERS electronic and their innovations, one can explore the ERS website or visit the Zhubei center for hands-on demonstrations.
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