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Chip Talk > Driving Into the Future: NXP and Rimac's Next-Gen Vehicle Architecture

Driving Into the Future: NXP and Rimac's Next-Gen Vehicle Architecture

Published June 12, 2025

As the automotive industry continues to evolve, the spotlight shines brighter on the role of efficient electronics in shaping the future of vehicles. Two titans, NXP Semiconductors and Rimac Technology, are at the helm of a fascinating development that is set to transform vehicle architecture profoundly.

A Partnership for Innovation

NXP Semiconductors, renowned for their automotive processing solutions, has announced an exciting collaboration with Rimac Technology, a leader in high-performance control systems. This partnership aims to push the frontier of centralized vehicle architectures, vital for the ever-evolving software-defined vehicles (SDVs).

The official press release describes this initiative as a response to the growing demands for connectivity, security, and safety in automobiles. The new architecture will leverage NXP's S32E2 processors, offering a platform that simplifies the integration of numerous applications across a vehicle's structure.

Understanding Centralized Vehicle Architectures

Centralized vehicle architectures are becoming an essential infrastructure within modern vehicles. They address the complexity brought by the myriad of electronic control units (ECUs) that conventional cars deploy. By centralizing control, fewer ECUs are needed, reducing both the weight and the intricacy of vehicles, leading to more efficient design and operation.

At the core of this innovation is NXP's S32E2 processor, an integral part of their broader automotive processing platform. This high-performance multi-application processor integrates 8 Arm Cortex-R52 cores, supporting real-time operations crucial for domain and zonal control needs. Its architecture enables developers to employ various vehicle applications easily and efficiently—ranging from vehicle dynamics to energy management.

The Technology Behind the Transformation

NXP's commitment to robust and versatile solutions is reflected in the S32E2's design. Capable of supporting up to 64MB of non-volatile memory, the processor offers significant computational power within a multi-application environment.

One of the standout features is its compliance with ISO 26262 ASIL D, one of the highest safety integrity levels in automotive standards. This ensures that the S32E2 maintains stringent safety and security measures, including task isolation, fault recovery, and secure booting mechanisms. This makes it ideal for the diverse and demanding requirements of automotive original equipment manufacturers (OEMs).

Rethinking Automotive Applications

The NXP-Rimac collaboration aims to streamline the software integration process. The S32E2 processor allows significant innovations in vehicle architecture, such as reducing the typical number of ECUs from over 20 down to just three centralized units. According to Ana Martinčić Špoljarić, Business Unit Director for Powertrain and Electronics at Rimac, this reduction simplifies the overall vehicle structure and minimizes material costs while boosting computational capabilities.

Looking Ahead

While Rimac Technology initially leverages this new ECU platform for hyper cars, there are ambitions to scale the infrastructure to various vehicle segments and even alternative mobility sectors. As we look toward a greener and smarter future, the importance of such collaborations cannot be overstated.

The integration doesn't stop at NXP's processors. Supplementing the S32E2, the broader platform encompasses system support solutions like the FS86 ASIL D safety system basis chip, the PF5030 power management IC, and enhanced networking components such as Ethernet switches and CAN transceivers.

Conclusion

NXP Semiconductors and Rimac Technology have embarked on a journey to redefine the electronics paradigm in the automotive industry. By harnessing the power of centralized processing and reducing complexity, they are paving the way for smarter, more efficient vehicles.

For those in the semiconductor industry or anyone interested in automotive technology developments, keeping an eye on this partnership could provide valuable insights into the future trends and standards shaping the vehicles of tomorrow. This is more than a technological advancement; it is a glimpse into the future of automotive innovation.

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