Chip Talk > Black Sesame Technologies Powers Up Next-Gen Vehicles: A Glimpse from Hong Kong Auto Expo 2025
Published June 14, 2025
The automotive world is rapidly evolving, as we witness a significant shift towards smarter, more intelligent vehicles. One key player at the forefront of this movement is Black Sesame Technologies, which made a striking debut at the 2025 Hong Kong Auto Expo. Renowned for its computing SoCs suitable for autonomous driving, Black Sesame Technologies is facilitating the exponential growth in the development of smart vehicles with its cutting-edge products.
In an event brimming with innovation, Black Sesame Technologies stood out with its Huashan and Wudang series chips. These chips were a centerpiece at the Auto Expo's Automotive Technology and Supply Chain Exhibition Area. The premise of the event was to showcase innovations in new automobiles, serving as a bridge between Chinese and global markets. Their presence as part of Hong Kong's strategic initiatives underlines Hong Kong's role not just as a city of commerce but also as a growing technology hub in the region.
The Huashan A2000 chip, which was unveiled during the expo, demonstrated the prowess of Black Sesame Technologies in creating high-performance computing solutions. It supports next-level artificial intelligence models and advanced driver assistance systems (ADAS). What makes the A2000 truly stand out is its "Jiushao," the largest NPU core, making it apt for complex applications across industries.
On the other hand, the Wudang C1200 targets multi-domain integration, enhancing not only driving experiences but also vehicle-to-everything (V2X) communication, crucial for the autonomous vehicle ecosystem. The C1236 chip, for example, provides high-speed assisted driving capabilities, showcasing the integration possibilities for future-ready automotive tech.
Black Sesame Technologies is not just limiting its innovations to local collaborations. The partnerships with big names like FAW, Dongfeng, and Geely, amongst others, underline its global strategic outlook. They are delivering scalable and reliable chip solutions that are essential for mass production and adoption.
Additionally, their commitment to expand with an R&D center in Hong Kong, in collaboration with the Hong Kong Science and Technology Parks Corporation, signals their keen intent to bolster innovation. The company’s listing on the Main Board of the Hong Kong Stock Exchange further accelerates their trajectory and paves the way for future growth in emerging domains like robotics and embodied intelligence.
Black Sesame Technologies is setting the benchmark high as it steers the course for the future of intelligent vehicles. Their latest advancements showcased at the 2025 Hong Kong Auto Expo are a testament to their enduring focus on fostering an enriched ecosystem facilitating the creation and deployment of smarter, more efficient automotive solutions. As the automotive industry continues its transformation, Black Sesame Technologies remains a pivotal force driving change and innovation in this thrilling new era.
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