Chip Talk > A New Era in Semiconductor Packaging: Insights from Semicon Taiwan
Published September 08, 2025
As traditional semiconductor scaling hits its physical limits, alternate technological solutions like heterogeneous integration and advanced packaging technologies have become vital. At the helm of this revolution is Semicon Taiwan, set to run from September 6-8, which draws global attention to the forefront of semiconductor innovation. Featuring cutting-edge advancements such as chip-on-wafer-on-substrate (CoWoS) and 3D ICs, this year's event promises to redefine the packaging landscape.
The increase in complex applications such as artificial intelligence (AI), high-performance computing (HPC), and high-bandwidth memory (HBM) has driven the need for advanced packaging solutions. Companies are shifting from traditional methods and exploring innovative techniques like chip-on-wafer-on-substrate (CoWoS) and integrated fan-out (InFO) packaging. As reported by Taipei Times, Taiwan Semiconductor Manufacturing Co (TSMC) is aggressively expanding its packaging facilities both domestically and internationally.
Significantly, TSMC is already operating multiple advanced packaging facilities in Taiwan and the US. The company aims to double its CoWoS output to meet booming demand. It’s a strategic move not only to address current challenges but also to maintain its competitive edge and mirror Taiwan's rising stature in the semiconductor industries.
The Taiwanese semiconductor industry isn't resting on its laurels either. Companies such as ASE Technology Holding, Powertech Technology Inc, and Innolux Corp are investing extensively in advanced packaging like fan-out panel-level packaging (FOPLP). On the global stage, giants like AMD, Qualcomm, and NXP Semiconductors showcase similar interests, all motivated by the potential for AI applications.
More than just a showcase, Semicon Taiwan 2025 bridges the gap between innovation and collaboration. This year, more than 1,200 enterprises from 56 countries are slated to present their advancements across 4,100 booths. This confluence is not just technical but also geopolitical, marking the attendance of formidable figures from the global semiconductor industry.
The event will also act as a collaborative platform, facilitating CEO summits, international forums, and staging critical discussions on the future and robustness of semiconductor supply chains, especially against the backdrop of global uncertainties.
The road to successful, scalable advanced packaging solutions is paved with collaboration. This makes events like Semicon Taiwan invaluable, as they cultivate innovation and strategic alliances that propel the industry forward. As debates around AI and HPC further intensify, it is these advanced interfaces and methodologies in 3D ICs and Fan-Out Panel-Level Packaging that will enable manufacturers worldwide to meet higher data processing demands.
Thus, Semicon Taiwan serves not just as a trade show but as a bellwether for the semiconductor industry's future direction. With institutions facing greater pressure to innovate and improve, advanced packaging will become a fundamental pillar to constructing next-generation electronics.
For those eager to delve into the expansive universe of advanced packaging check out this comprehensive report from Taipei Times.
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