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Chip Talk Semiconductor News & Announcements

China's Ambitious Goal: Tripling AI Chip Output in Rivalry Against the US

China aims to triple AI chip production, challenging US dominance and offering alternatives to Nvidia in a concerted push towards tech self-reliance. Read more

OpenLight's Strategic Leap Forward in Integrated Photonics

OpenLight's $34M Series A funding milestone elevates integrated photonics for AI data centers, marking a significant stride in communications technology. Read more

Rebellions Challenges Nvidia with Breakthrough AI Chiplet Technology

Rebellions launches its REBEL-Quad chiplet, challenging Nvidia's dominance in the AI accelerator market with innovative design and performance. Read more

Securing the Future: TSMC's 2-nm Trade Secret Protection and its Implications on the Semiconductor Industry

A recent case of attempted intellectual property theft of TSMC's 2-nm technology highlights the challenges of safeguarding innovations in the semiconductor industry. Read more

Taiwan's New Economy Minister: Steering the Semiconductor Powerhouse Amid Global Challenges

Newly appointed minister Kung Ming-hsin to guide Taiwan's economic strategy, focusing on strengthening its vital semiconductor industry and navigating global trade. Read more

QuickLogic and the New Frontier of Customizable eFPGA Solutions

Explore QuickLogic's eFPGA IP and its integration with GlobalFoundries 22FDX platform, offering adaptable, low-risk solutions for diverse applications. Read more

NVIDIA RTX PRO: Empowering AI-Driven Data Centers

Explore how NVIDIA's RTX PRO servers are revolutionizing enterprise data centers with the power of AI, enhancing performance without complete overhauls. Read more

Toshiba and SICC Partner to Advance SiC Wafer Technology

Toshiba and SICC's MOU aims to enhance SiC wafer quality and expand their supply, marking a pivotal move for SiC power semiconductors. Read more

Strategic Moves: Presto Engineering's New Leadership in ASIC Services

Presto Engineering's new VP of Sales & Marketing, Frédéric Valentin, aims to expand their ASIC services and redefine industry standards. Read more

TSMC's U.S. Ambitions: A Leap Forward in Chip Packaging

TSMC accelerates its U.S. packaging plant development, promising production by 2028 with advanced SoIC and CoPoS technologies. Read more

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