All IPs > Multimedia > WMA
The WMA category within our Multimedia section boasts a comprehensive collection of semiconductor IPs designed for superior audio streaming and playback. Short for Windows Media Audio, WMA is an audio format that offers users the ability to enjoy high-quality sound in a compact file size, perfect for modern mobile devices, streaming services, and consumer electronics.
WMA semiconductor IPs are integral to developing advanced multimedia solutions that require efficient audio compression, decompression, and rendering capabilities. These IPs enable designers and developers to integrate robust audio playback functionalities into a variety of consumer electronics, such as smartphones, tablets, portable media players, and home entertainment systems. The IPs in this category facilitate high-performance audio applications, ensuring that devices can deliver a premium listening experience while managing power consumption effectively.
In today’s digitally connected environment, the demand for seamless audio experiences is paramount. By leveraging WMA semiconductor IPs, manufacturers can create devices that support a wide range of audio formats and deliver crystal clear audio to the end-user. These semiconductor IP solutions are engineered to provide exceptional audio quality and reliable performance, ideal for both high-end audio systems and everyday media gadgets.
Moreover, our WMA IPs are optimized for interoperability and ease of integration into existing systems, making them a versatile choice for developers aiming to advance their multimedia offerings. These solutions support a wide array of applications, from streaming audio over wireless networks to enhancing digital broadcasts, providing you with the building blocks necessary for cutting-edge audio products.
The BAT Audio Platform represents a leading-edge audio IP solution developed for battery-powered System-on-Chip (SoC) applications. Intelligently designed to offer unparalleled audio fidelity, this platform significantly enhances auditory features in SoCs, accommodating uses from active noise cancellation and beamforming to voice user interfaces. With a focus on low energy consumption, BAT ensures extended battery life, optimizing devices for efficient operations. Offering an expansive array of off-the-shelf solutions combined with numerous customization options, BAT enables rapid market readiness and risk reduction by building upon top-tier, silicon-proven IPs. This platform not only accelerates project timelines but also decreases development costs, freeing clients to focus on their core competencies while leveraging Dolphin's audio expertise. Incorporating features like WhisperTrigger for ultra-low-power voice activity detection and WhisperExtractor for energy-saving analog feature extraction, BAT represents a holistic approach to advancing audio technology. The platform’s digital and mixed-signal solutions provide seamless integration and configuration, ensuring high fidelity and low power consumption across a spectrum of applications from consumer electronics to IoT devices.
Avispado is an in-order 64-bit RISC-V core, optimized for high-efficiency and low-power operation, making it an exemplary choice for edge AI and embedded applications. This core excels in environments where energy efficiency is paramount, leveraging its in-order execution pathway while remaining power conscious. Avispado is fitted with RISC-V Vector Specification 1.0, enabling advanced acceleration for AI workloads. Adaptable to multi-core setups, Avispado facilitates multiprocessing and offers compatibility with Linux, ensuring a seamless integration into diverse computational environments. The high bandwidth access enabled by Gazzillion Misses™ technology supports efficient handling of multiple memory requests, thereby enhancing performance. Customization options for Avispado include varied cache sizes and the integration of a branch predictor, ensuring a tailored performance that meets unique computing requirements. Whether applied in IoT contexts, machine learning tasks, or edge computing scenarios, Avispado’s reliable and flexible architecture stands out for its integration and scalability.
Atrevido is a versatile 64-bit out-of-order execution RISC-V processor core known for its high performance in demanding AI and HPC applications. The core is capable of handling a wide range of tasks with a design that supports 2/3/4-wide execution paths, ensuring optimal throughput. Included within Atrevido's capabilities are integrated vector and tensor units, which deliver comprehensive acceleration for AI and machine learning tasks without latency penalties. Equipped with Gazzillion Misses™ technology, Atrevido efficiently manages memory bottlenecks, supporting up to 128 simultaneous memory requests. This enhancement is critical for handling large datasets typical in AI and high-performance computing. Designed for Linux environments, it supports multiprocessing with extensive interfaces such as AXI and CHI for high-bandwidth requirements. With customizable elements including vector specifications and cache configurations, Atrevido is engineered for precision and flexibility. Whether you are developing key-value stores, engaging in AI inference, or conducting complex data analysis, Atrevido's robust architecture is designed to provide highly efficient and rapid computational capabilities.
The UCIe Chiplet Interconnect solution is a high-speed interface designed for efficient chip-to-chip and die-to-die communications within a SoC platform. This innovative interconnect adopts state-of-the-art technology to offer cross-chip bridging with support for AXI and CHI interfaces, ensuring seamless data transfer and integration between different chiplets. With the ever-growing complexity of SoC designs, the UCIe Chiplet Interconnect ensures scalability and flexibility, adapting to a range of system configurations and technical requirements. It allows for a higher degree of customization, enabling developers to tailor the interconnect to fit specific design goals and application demands. Beyond mere connectivity, the UCIe solution provides enhancements in power efficiency, reducing system power requirements while maintaining high data throughput. This solution is ideal for a wide range of applications, including high-performance computing and data centers, where it significantly optimizes the performance and connectivity of multi-chip systems.
The Opus Encoder/Decoder from Techno Mathematical Co., Ltd. is engineered to provide robust audio compression features that maintain high sound quality irrespective of low latency demands. Recognizing Opus as a leading audio codec, it's particularly suitable for real-time audio streaming applications, such as online gaming and voice-over-IP (VoIP) communication, while showing versatility in accommodating various audio bandwidths. This flexible codec is designed to support both highly demanding real-time interactions and static audio playback environments, maintaining clarity and fidelity across different uses.
Enhancing the processing capabilities directly at the edge of networks, these application-specific integrated circuits (ASICs) are engineered with precision, intelligent sensors, and low-power actuators. Designed to meet the demand for real-time, low-latency insights, CSEM's systems-on-chips include advanced features such as sensor interfaces and machine learning hardware accelerators. These ASICs deploy ultra-low-power design strategies, encapsulating wireless communication and power management units to create energy-autonomous, intelligent sensing systems. They cater to a broad array of applications by integrating low-noise analog front ends and employing machine learning-derived accelerators that dramatically reduce power consumption. CSEM's specialization in ultra-low-power Bluetooth technology ensures that their solutions support cutting-edge portable devices, providing secure and efficient ranging. The systems-on-chip developed here incorporate CMOS imagers and robust design flows that empower complex integrations without diminishing performance. The focus on ULP design and co-design of MEMS and IC microsystems further enhances their capabilities.
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