All IPs > Memory & Logic Library > Embedded Memories
Embedded memories play a crucial role in the architecture of modern electronic devices, offering storage and retrieval capabilities that are integral to processor function and data management. In Silicon Hub's Memory & Logic Library, the Embedded Memories category encompasses a wide variety of semiconductor IPs designed to meet these needs in diverse applications, from consumer electronics to industrial systems.
The primary function of embedded memories is to store and manage data internally within a device, which is essential for efficient processing and quick data access. These semiconductor IPs are typically integrated within a system on chip (SoC) to optimize performance and minimize latency compared to off-chip memory solutions. This integration helps improve overall device performance, reduce power consumption, and enhance the speed of data processing.
Common types of embedded memories available in this category include SRAM (Static Random Access Memory), DRAM (Dynamic Random Access Memory), MRAM (Magnetic Random Access Memory), and non-volatile memory types like Flash and EEPROM. Each type offers distinct advantages, such as high speed in SRAM, lower power consumption in DRAM, or the ability to retain data without power in non-volatile memories. These memory IPs are utilized in a plethora of products from smartphones and tablets to automotive systems and IoT devices, where compact, reliable, and efficient memory solutions are paramount.
Developers seeking to enhance computational efficiency and data handling capabilities in their designs will find this category indispensable. By choosing the right embedded memory IP from our Memory & Logic Library, manufacturers can create products that meet the demanding requirements of modern applications, ensuring reliability and excellent performance in a competitive market.
The NVMe Host Controller from iWave Global offers an advanced solution for managing NVMe drive interfaces in computing systems. This controller is designed to facilitate the high-speed data exchange that NVMe drives demand, streamlining operations across data-centric applications. Engineered for scalability and performance, the NVMe Host Controller supports high data throughput, ensuring quick access and transfer of data between storage devices and host systems. Its design caters to the demands of modern computational environments where rapid data retrieval and storage are critical. The controller is integral in systems requiring high-performance storage solutions, and its support for multiple interfaces underscores its adaptability and broad applicability in data-intensive industries such as enterprise storage and high-performance computing.
NRAM Technology by Nantero represents a significant leap forward in memory technology, utilizing carbon nanotubes to create non-volatile memory that outperforms traditional solutions. This technology is designed to combine the speed and durability of DRAM with the non-volatility of flash, providing a much-needed enhancement in performance and efficiency. One of the core strengths of NRAM is its ability to function in extreme conditions, maintaining data integrity without the need for constant power. Its low power requirements make it an ideal choice for a variety of applications, ranging from consumer electronics to high-performance computing infrastructures. Furthermore, NRAM's inherent scalability ensures that it can be seamlessly integrated into existing manufacturing processes with minimal disruption, offering a path forward for industries looking to enhance their memory capabilities without prohibitive costs. Its versatility and robustness continue to make it a highly attractive alternative to current memory technologies.
YouDDR technology is a sophisticated suite that includes a DDR controller, PHY, and I/O, coupled with specially developed tuning and testing software. This complete subsystem not only manages data access but also enhances system reliability through meticulously crafted software solutions, ensuring efficient operation under varying conditions.
iModeler is a robust tool for creating PDKs by modeling on-chip passive devices using parametric models and 3D electromagnetic simulations. This supports rapid PDK development across various process nodes, using a comprehensive library of templates for devices such as inductors and capacitors. Integrated with Cadence Virtuoso, it facilitates efficient design through seamless model parameter customization and high-precision simulation technology.
The AndeShape Platforms are designed to streamline system development by providing a diverse suite of IP solutions for SoC architecture. These platforms encompass a variety of product categories, including the AE210P for microcontroller applications, AE300 and AE350 AXI fabric packages for scalable SoCs, and AE250 AHB platform IP. These solutions facilitate efficient system integration with Andes processors. Furthermore, AndeShape offers a sophisticated range of development platforms and debugging tools, such as ADP-XC7K160/410, which reinforce the system design and verification processes, providing a comprehensive environment for the innovative realization of IoT and other embedded applications.
Dolphin Technology offers a comprehensive range of memory IP products, catering to diverse requirements in semiconductor design. These products include a variety of memory compilers, specialty memory, and robust memory test and repair solutions such as Memory BIST. Designed to meet the demands of contemporary low-power and high-density applications, these IPs are built to work across a broad spectrum of process technologies. Advanced power management features, like light and deep sleep modes and dual rails, enable these products to tackle even the toughest low-leakage challenges. What sets these products apart is their flexibility and adaptability, evident in the support for different memory types and process nodes. Dolphin Technology’s memory IPs benefit from seasoned design teams that have proven their mettle in silicon across several generations. Thus, these IPs are not only versatile but also reliable in serving a wide variety of industry needs for technology firms worldwide. Clients can expect memory solutions that are fine-tuned for both power efficiency and performance. Additional capabilities such as power gating cater to ultra-low power devices while achieving a high level of device integration and compatibility. The specialized focus on low noise and rapid cycle times makes these memory solutions highly effective for performance-driven applications. These features collectively make Dolphin Technology’s memory IP an invaluable asset for semiconductor designers striving for innovation and excellence.
The Titanium Ti375 FPGA is a high-density, low-power solution featuring Efinix’s Quantum® compute fabric. This state-of-the-art FPGA is equipped with a range of advanced features including a hardened RISC-V block, SerDes transceiver, and an LPDDR4 DRAM controller. It is designed to meet the demands of applications requiring high computational efficiency and low power consumption, making it ideal for rapid application development and deployment. This FPGA offers exceptional processing capabilities and flexibility, helping to reduce design complexity while optimizing performance for data-intensive applications. Its small package footprint is suitable for highly integrated systems, providing seamless compliance with existing protocols such as MIPI D-PHY. This combination of features makes it suitable for use in edge computing devices, advanced automotive systems, and next-generation IoT applications. Additionally, the Titanium Ti375 allows developers to exploit its high-speed I/O capabilities, facilitating robust peripheral interfacing and data transfer. The device also benefits from bitstream authentication and encryption to secure the intellectual property embedded within. As part of its wide-ranging applicability, it suits industrial environments that require solid reliability and long-term product lifecycles.
The Topaz FPGA family by Efinix is crafted for high-performance, cost-efficient production volumes. Topaz FPGAs combine an advanced architecture with a low-power, high-volume design, suitable for mainstream applications. These devices integrate seamlessly into systems requiring robust protocol support, including PCIe Gen3, LVDS, and MIPI, making them ideal for machine vision, industrial automation, and wireless communications. These FPGAs are designed to pack more logic into a compact area, allowing for enhanced innovation and feature addition. The architecture facilitates seamless migration to higher performance Titanium FPGAs, making Topaz a flexible and future-proof choice for developers. With support for various BGAs, these units are easy to integrate, thus enhancing system design efficiency. Topaz FPGAs ensure product longevity and a stable supply chain, integral for applications characterized by long life cycles. This ensures systems maintain high efficiency and functionality over extended periods, aligning with Efinix’s commitment to offering durable and reliable semiconductor solutions for diverse market needs.
Secure OTP is a cutting-edge non-volatile memory solution designed to safeguard key, data, and secret storage with enhanced protection against hardware attacks. It features a combination of physical macros and digital RTL, offering robust anti-tamper and integrated protection mechanisms. This solution is specifically architected for integration in CMOS technologies and is compatible across numerous IC and ASIC applications. By incorporating a 1024-bit PUF for scrambling and I/O shuffling, Secure OTP significantly elevates stored data security, effectively making it tamperproof. As digital security challenges mount, Secure OTP provides a modernized answer, ensuring the safekeeping of critical information across its lifecycle. Its adoption addresses prevalent security gaps in legacy e-fuse solutions and is instrumental in extending robust defense systems within SoC environments, acting as a cornerstone for comprehensive hardware security strategies.
The AHB-Lite Memory module from Roa Logic is a sophisticated, fully parameterized memory solution for systems deploying the AHB-Lite protocol. This IP provides on-chip memory capabilities to AHB-Lite based master devices, ensuring seamless and rapid data access. Its parameterized nature allows for a high degree of customization, enabling it to cater to a broad spectrum of design needs and application requirements. With the AHB-Lite Memory module, system architects can efficiently integrate memory resources within their designs, enhancing both speed and accessibility. The memory is designed to handle high-speed transactions, ensuring that performance remains consistent even in demanding situations, which is critical for applications requiring fast memory transactions. Roa Logic supports the integration of the memory module with comprehensive documentation and testbenches, facilitating smoother implementation into system architectures. By offering robust support, developers can ensure that their systems capitalize on the module's capabilities for optimized data handling and processing. The AHB-Lite Memory stands as a testament to Roa Logic's dedication to providing high-quality, adaptable memory solutions for complex digital environments.
CodaCache delivers high efficiency in SoC environments by serving as a highly configurable last-level cache. It addresses design challenges related to performance and power use by effectively managing data access and system scalability. Supporting flexible configurations, the IP adapts seamlessly into various SoC layouts, optimizing memory latency and power consumption. The strategic use of CodaCache in tandem with Arteris's NoC solutions enhances overall system performance, allowing for smoother data flow and faster processing speeds while mitigating bottlenecks.
DenseMem technology allows for the doubling of memory capacity connected via CXL, which facilitates efficient scaling of memory beyond traditional limits. This expansion capability is critical as demand for larger memory resources grows, particularly in data-heavy applications like AI, machine learning, and high-performance computing. By significantly increasing available memory without augmenting physical memory size, DenseMem seamlessly extends existing hardware capabilities, reducing the need for costly and time-consuming infrastructure upgrades. This adaptive approach to memory expansion enables better utilization of current resources, leading to enhanced performance at lower capital and operational costs. DenseMem is particularly ideal for environments where memory demands are rapidly increasing, ensuring systems are scalable and capable of accommodating growth in data processing requirements. Its influence extends across numerous sectors, aiding in the development and deployment of next-generation applications and technological solutions.
Everspin's Toggle MRAM stands as a leading non-volatile memory solution, emphasizing simplicity and reliability. It utilizes a one transistor, one magnetic tunnel junction cell design, ensuring high durability and data integrity over 20 years. The patented Toggle MRAM cell employs a magnetic tunnel junction (MTJ) composed of a fixed magnetic layer, a dielectric tunnel barrier, and a free magnetic layer. This architecture allows data to be stored in a manner that combines the endurance of SRAM with the long-term reliability of Flash.\n\nToggle MRAM is fundamentally different from traditional volatile memory technologies. During read processes, the device activates the pass transistor, comparing the cell's resistance to a reference device to retrieve data, while write operations are conducted through magnetic field interactions, ensuring precision without disturbing adjacent cells. This unique setup offers 'instant-on' capabilities, providing reliable operation across a wide temperature range.\n\nThis technology is not only valued for its high performance but also for its versatility. With applications spanning from industrial control systems to consumer electronics, Toggle MRAM ensures data preservation in power-loss scenarios, offering a robust solution for increasing electronic system demands.
Certus Semiconductor's Digital I/O solutions are engineered to meet various GPIO/ODIO standards. These versatile libraries offer support for standards such as I2C, I3C, SPI, JEDEC CMOS, and more. Designed to withstand extreme conditions, these I/Os incorporate features like ultra-low power consumption, multiple drive strengths, and high levels of ESD protection. These attributes make them suitable for applications requiring resilient performance under harsh conditions. Certus Semiconductor’s offerings also include a variety of advanced features like RGMII-compliant IO cells, offering flexibility for different project needs.
SmartMem Subsystem is a fully synthesizable and configurable memory subsystem IP designed to propel significant improvements in power efficiency, performance, and endurance. It is not only tailored for NuRAM but also extends its benefits to other third-party memories such as MRAM, RRAM, and PCRAM, as well as embedded Flash. This versatile subsystem empowers significant ease of use and deployment in high-volume environments by facilitating a range of enhancements like customizable SOC Compute in Memory capabilities. The SmartMem IP offers unparalleled adaptability, supporting a spectrum of memory technologies and maintaining top-notch power and performance standards.
SRAM provided by DXCorr is designed for high-speed, low-power, and high-density applications. Leveraging cutting-edge technology, this IP variant focuses on reliability and performance, ensuring swift data access and efficient power consumption. The SRAM architecture supports various optimizations that cater to the specific needs of modern embedded systems, making it a versatile choice for developers. Characterized by its robust static logic, DXCorr's SRAM ensures data stability without frequent refresh cycles, optimizing performance in time-sensitive applications. With its compatibility across different process nodes, DXCorr's SRAM can be integrated into diverse systems, responding to varying demands from IoT devices to complex processors. The SRAM's low-leakage capabilities make it suitable for portable gadgets and battery-operated devices, enhancing endurance and operation times. Its scalable design supports memory expansion while maintaining speed and power efficiency. DXCorr continues to enhance its SRAM solutions, focusing on minimizing operational hurdles and improving integration within broader system infrastructures, a key to its lasting success in this critical IP sector.
Ideal for audio applications requiring precise data conversion, this Sigma-Delta ADC, built on SMIC’s 55nm technology, offers high-resolution 16-bit data processing at a speed of 16KSPS. Its flexible design supports various gain settings and microphone bias levels, delivering exceptional clarity with an SNR of 90dB. With provisions for four fully differential inputs and a versatile digital serial interface, it is tailored for seamless integration in sophisticated audio systems. Its low power consumption and extensive range of supply voltages promise efficient performance across diverse environments.
The LEE Flash G1 is a highly cost-effective Flash memory solution, leveraging SONOS technology. Designed to support harsh automotive environments, this memory IP is scalable down to 40nm technology. It is ideal for applications necessitating medium memory capacity, providing long retention life and low power operation. This Flash memory solution requires only two to three additional masks, showcasing its compatibility with standard CMOS processes without altering the characteristics of logic transistors. Its short testing and bake time further reduce chip costs, facilitating low-cost implementation for various applications. LEE Flash G1’s efficiency extends to its program and erase operations, utilizing Fowler Nordheim tunneling to minimize power consumption dramatically. This technology ensures smooth integration into existing design frameworks, offering extended data retention and high-temperature resilience.
Trion FPGAs by Efinix are engineered for the fast-paced edge and IoT markets. Built on a 40 nm process, these FPGAs offer a wide range of logic density from 4K to 120K logic elements. They bring power-performance-area advantages for general-purpose custom logic applications, including mobile and IoT markets, while also enhancing computing capabilities in emerging technologies such as deep learning and edge computing. The Trion family is known for its small packages, which enable its deployment in highly integrated systems. Features such as the DDR DRAM Controller and MIPI CSI-2 Controller are hardened into the architecture, ensuring smooth data management and transfer in applications that demand real-time processing. This makes Trion FPGAs an excellent choice for various industrial, medical, and consumer applications where space and power efficiency are critical. With a focus on longevity, Efinix supports Trion FPGAs with a stable product lifecycle, aligning with market requirements for dependable, production-ready solutions. These FPGAs are versatile enough to serve applications in edge computing, video processing, industrial automation, and more, offering a complete system solution with their embedded interfaces and soft processor systems.
Silvaco's Embedded Memory Compilers are tailored for high-performance and power-efficient design needs. These compilers cater to diverse applications, providing high-density, low-power, and robust yields across various technologies. They are engineered to strike a balance between performance, power consumption, and spatial requirements, which is crucial for IoT and mobile devices, A key feature of these compilers is their power management capabilities, accommodating low-leakage and low-voltage operation requirements. These compilers offer flexibility in design architectures, facilitating processor speed cache with high performance while ensuring area efficiency. Support for multiple foundries and processing nodes ensures widespread applicability across different technology needs, thus broadening potential use scenarios from low-power IoT devices to high-performance computing systems. Advanced options like source biasing, segmented power control, and embedded switches integrate seamlessly into existing SoC frameworks, enhancing both design efficacy and operational longevity. With comprehensive support for redundancy and ECC, these compilers are ideal solutions for designs requiring high reliability and fault tolerance.
TwinBit Gen-1 represents an advanced non-volatile memory solution that is embedded within logic-based semiconductor designs, adapting seamlessly to CMOS logic processes without necessitating additional masks or process steps. This IP supports a range of process nodes from 180nm to 55nm, demonstrating high endurance through over 10,000 program and erase cycles. The memory solution excels in flexibility and efficiency, providing a sizeable range of memory density from 64 bits to 512K bits. Particularly beneficial for applications like analog trimming, security key storage, and system switches for ASIC and ASSP, it helps reduce manufacturing costs while maintaining compatibility with modern semiconductors. TwinBit Gen-1's remarkable features also include low-voltage, low-power operations, complemented by an automotive grade under AEC-Q100 conditions. Additionally, this technology's built-in test circuits streamline stress-free test environments, ensuring its integration doesn't hamper production. Compared to other technologies such as eFuses, TwinBit Gen-1 saves silicon area and simplifies test procedures without sacrificing operational capacity. Its design is particularly poised for embedded applications needing secure reprogrammable memory.
Built on a 65nm process node, this ADC offers an efficient solution for applications requiring high precision with minimal energy consumption. It operates at a 12-bit resolution and can achieve a conversion rate between 0.1MSPS to 1MSPS. The device supports a wide range of operating voltages with 8 channels that cater to single-ended inputs, providing flexibility for diverse system designs. With an excellent SFDR and SNR, coupled with a minimal power footprint, this ADC is adept at applications needing reliable performance on a constrained power budget, such as in wireless sensor networks.
EverOn is a single-port ultra-low voltage SRAM solution that provides excellent power savings by substantially reducing both dynamic and static power needs. Developed on the 40ULP bulk CMOS process, this IP is tailored for cutting-edge applications in wearables and IoT devices, where power efficiency is crucial. EverOn operates across an extensive voltage range, from as low as 0.6V to 1.21V, ensuring it is versatile and adaptable for various applications. The IP is known for delivering remarkable power performance, cutting dynamic power consumption by up to 80% and static power by up to 75%. These capabilities make EverOn an ideal choice for energy-efficient designs that need to strike a balance between performance and power consumption. Moreover, it supports a wide operating frequency, commencing at 20MHz at the lower voltage threshold and exceeding 300MHz at higher voltages. EverOn integrates sureCore's SMART-Assist technology, which strengthens its operation down to the retention voltage. An innovative feature of this SRAM is its subdivided memory banks, allowing for flexible power management where each bank can function independently. This feature, alongside advanced sleep modes, enables tailored product performance according to specific operational requirements, ultimately extending battery life and enhancing overall product efficiency.
Analog Bits provides a range of I/O solutions that are designed to meet the needs of high-speed, low-power applications. Featuring differential clocking/signaling and crystal oscillator IPs, these solutions are optimized for minimal transistor use and maximum signal integrity. Proven on silicon processes of 5nm with development underway for 3nm, they offer one of the lowest power I/O portfolios customizable to specific die-to-die connectivity requirements. Developed with expertise, these IPs are readily deployable at leading fabs, playing critical roles in applications that demand high signal quality and low power consumption.
The ReRAM Memory technology from CrossBar offers a revolutionary approach to data storage, diverging from conventional memory systems. This technology leverages a simple structure that allows it to scale down below 10nm and integrate directly with logic circuits in the same fabrication. This integration results in an optimal blend of low energy usage and high endurance, making it ideal for demanding applications such as data centers and IoT. ReRAM's capability to provide 1/20th the energy consumption, coupled with a 1000x improvement in endurance and dramatic enhancements in read/write performance, makes it a superior alternative to traditional memory technologies. The capacity for on-chip terabytes of storage further augments its appeal for modern computing needs. The innovation extends to ReRAM's ability to stack in 3D and serve various industries, from secure computing to artificial intelligence, providing the necessary performance and security for the emerging digital landscape.
DRAM modules are essential components used in a range of electronics, from gaming machines to medical devices. Avant's DRAM offerings are particularly noted for their compliance with JEDEC standards, which ensures interoperability and reliability across different systems and environments. Available in various configurations and designed to manage both low voltage and high power demands, Avant's DRAM caters to industrial, commercial, and consumer needs. Their embedded series of DIMMs offers extensive options, enabling a wide application spectrum, including use in point-of-sale and automation systems.
The LEE Flash G2 builds upon its predecessor, offering a Flash solution that harmoniously combines with logic circuits while minimizing costs and power consumption. It's based on a simple SONOS memory cell structure, allowing seamless integration with standard logic, thus converting volatile SRAM circuits into non-volatile versions. This innovation removes the need for isolation areas and additional high voltage requirements during read operations, enhancing layout flexibility and power efficiency. Capable of supporting large memory capacities up to a few Megabytes, LEE Flash G2 stands out for its compatibility with existing CMOS processes and its ability to maintain performance without altering design characteristics. The G2 utilizes a very low power Fowler-Nordheim tunneling mechanism, ensuring minimal current consumption during programming and erasing, which leads to significantly reduced testing time and expenses. Its architecture is particularly advantageous in automotive applications requiring high-temperature operations and long data retention periods.
Tailored towards specialty memory architectures, Spectral CustomIP delivers a versatile range suited for various IC applications. Its architecture supports Binary and Ternary CAMs, Multi-Ported memories, and Low Voltage SRAMs, among others, with high-density and low-power designs core to its offering. By using proprietary bit cells, this IP ensures robust performance across operations, coupled with high speed facilitated by performance-oriented circuitry. Spectral CustomIP, supporting standard CMOS, SOI, and embedded Flash processes, offers flexibility through its Memory Development Platform. Users can modify IP designs, supporting diverse technological needs while maintaining high density and low power consumption. This adaptability meets the varied demands of IC designs, suitable for consumer electronics, graphically intensive applications, and mission-critical devices. Providing rich specialty memory selections, Spectral's offerings promote differentiation for IC products within competitive markets. The memory compilers developed under platforms like MemoryCanvas and MemoryTime afford customizable options, including power management, multi-port configurations, and test mode integrations, aligning with intricate design requirements across technological fields.
PermSRAM is a versatile non-volatile memory solution integrated into foundry standard CMOS platforms accommodating process nodes from 180nm to 22nm and beyond. This memory technology offers various functionalities, such as one-time programmable ROM and pseudo multi-time PROM, which feature a multi-page configuration spread across memory sizes from 64 bits to 512K bits. A notable aspect of PermSRAM is its non-rewritable hardware safety lock that ensures the secure storage of critical security codes. In addition to its security features, PermSRAM delivers high reliability and a stable yield, making it suitable for automotive applications that require data retention at temperatures exceeding 150 degrees Celsius. This memory type is designed for seamless integration with existing system infrastructures as it doesn't need additional read operation circuitry like charge pumps. Its built-in self-test circuit is pivotal for supporting stress-free testing environments, ensuring ease of implementation in various applications like DRM and HDMI decoding, security code storage, and program storage. The benefits of PermSRAM extend to a smaller silicon footprint, achieved through a tamper-resistant design mechanism that uses an invisible charge trap memory system. This compactness is complemented by a fully testable architecture using conventional equipment. PermSRAM beams with capabilities that cater significantly to secure and reliable memory demands, whether for market differentiation or meeting stringent automotive standards.
NuRAM Low Power Memory is a state-of-the-art patented memory technology founded on industry-proven MRAM. It stands out due to its fast access times and strikingly low leakage power, making it a superior alternative to traditional SRAM, nvRAM, and even embedded Flash. This memory technology offers significant benefits by being 2-3x smaller in area and over 20x more power-efficient than SRAM, thereby minimizing the on-chip footprint. Additionally, it supports complete power-down without data loss, curtailing the need for unnecessary DDR memory access and thereby optimizing power consumption and latency. Given its innovative structure, it is uniquely poised for deployment in a wide variety of demanding applications such as AI model storage in edge devices, data centers, and automotive applications requiring robust testing and diagnostic abilities.
ASIC North's Sensor Interface Derivatives are specialized circuits designed to enhance sensor systems by improving their performance and integration into broader network architectures. These derivatives offer reliable operation across a wide range of applications, ensuring robust performance even in challenging environments. With a focus on customizability, the designs are adaptable to meet specific client needs, facilitating the development of efficient sensor networks.
I-fuse is designed for seamless integration into standard semiconductor processes, distinguished by its non-explosive mechanism. This one-time programmable memory (OTP) stands out for not requiring special processes or charge pumps, offering ease of use and high reliability. Encapsulated within it is a patented technology that spans processes from 0.7 µm to 22 nm, ensuring flexibility across various manufacturing environments. This innovative solution emphasizes robustness, qualifying to AEC-Q100 standards and making it ideal for automotive, industrial, and medical applications. Its compact design doesn't compromise on performance, providing low programming voltage and low power consumption. I-fuse's adaptability across multiple temperature ranges makes it suitable for both high and low-temperature environments. Incorporating I-fuse into products enhances their competitive edge, thanks to the extensive reliability and testability aspects intrinsically built into the design. It allows seamless product evolution, promoting innovation without sacrificing dependability.
ResQuant's Cyclone V FPGA with an integrated Post-Quantum Cryptography (PQC) processor is designed to provide a quantum-safe backbone for secure systems. Equipped with a complete set of NIST PQC cryptography suite, this FPGA offers straightforward integration with existing hardware and software architectures, particularly beneficial for validating quantum-secure applications. This FPGA solution provides a practical platform for testing and deploying post-quantum algorithms, making it a preferred choice for organizations looking to explore these next-gen security protocols. The integration of a PQC processor ensures that systems built on this FPGA can withstand potential quantum computing threats, securing data transmission and storage for future technologies. It's suitable for applications needing robust proof-of-concept validation of quantum-safe innovations, supporting an array of configurations for industry-specific applications. Given its comprehensive cryptography suite and integration capabilities, ResQuant's Cyclone V FPGA stands as a vital tool for security innovators paving the way to a quantum-resistant future.
Everspin's Parallel Interface MRAM offers a robust solution for environments demanding high-speed data access with non-volatility. This MRAM is SRAM-compatible, ensuring seamless integration with existing systems. With access timings as swift as 35ns, it stands out for its rapid response time and ability to endure numerous read/write cycles without degradation.\n\nThis MRAM design ensures data retention for over two decades, even in the absence of power. Through its low-voltage inhibit circuitry, data integrity is guarded by preventing unintended write actions during voltage fluctuations. Its compatibility with an 8-bit/16-bit interface further enhances its adaptability across diverse technological ecosystems.\n\nThe Parallel Interface MRAM is engineered for high reliability in mission-critical applications. Its structure effectively counteracts power loss scenarios, maintaining data integrity and availability. Such features make it ideal for sectors requiring fail-safe operation, including automotive, aerospace, and medical devices.
The LEE Flash ZT is crafted for trimming and parameter storage, especially focusing on automotive and analog IC applications. It boasts a Zero Additional Mask technology, requiring no new process steps, thus ensuring ease of implementation and significantly reduced cost. Operating efficiently in harsh environments, the ZT memory supports a wide temperature range and long retention life. It utilizes FN tunneling to achieve exceptionally low power consumption, which greatly shortens testing time and therefore contributes to cost savings. Flexible and robust, the LEE Flash ZT is compatible with standard CMOS processes, allowing existing design and IP reuse. This makes it an optimal solution for applications seeking minimal disruption in existing manufacturing workflows while requiring durable memory solutions for critical settings.
The SoC Platform by SEMIFIVE facilitates the rapid development of custom silicon chips, optimized for specific applications through the use of domain-specific architectures. Paired with a pool of pre-verified IPs, it lowers the cost, mitigates risks, and speeds up the development timeline compared to traditional methods. This platform effortlessly supports a multitude of applications by providing silicon-proven infrastructure. Supporting various process technologies, this platform integrates seamlessly with existing design methodologies, offering flexibility and the possibility to fine-tune specifications according to application needs. The core of the platform's design philosophy focuses on maximizing reusability and minimizing engineering overhead, key for reducing time-to-market. Designed for simplicity and comprehensiveness, the SoC Platform offers tools and models that ensure quality and reduce integration complexity, from architecture and physical design to software support. As an end-to-end solution, it stands out as a reliable partner for enterprises aiming to bring innovative products to market efficiently and effectively.
The Stream Buffer Controller is a versatile IP core optimized for AMD and Intel FPGA architectures, designed to facilitate communication between stream data and memory-mapped interfaces via DMA. It allows for data buffering on external memory, providing virtual FIFO capabilities with a capacity of up to 4 GB. The core efficiently manages up to 16 streams, each configurable in terms of operation modes and buffer sizes, which enhances flexibility across diverse applications. The IP core operates in various modes including FIFO, write, read, and ROM, which accommodate a wide range of needs in data handling. Special emphasis is placed on easy configuration via a memory-mapped slave interface using an embedded CPU or a dedicated FPGA controller, offering versatility in integration and operation without the need for additional CPUs. Noteworthy features include the support for AMBA AXI4-Stream interfaces, enabling seamless integration with existing communication infrastructures. Additionally, it offers conversion for data width in read and write streams and vendor-independent implementation options for collaboration across different systems. This IP core is particularly valuable for applications in data acquisition, image processing, and real-time data management, making it a critical component in modern processing systems.
TwinBit Gen-2 enhances the prior version by supporting more advanced process nodes, spanning from 40nm to 22nm and adapted for further processes. It retains the simplicity of integration found in Gen-1, with no requirement for additional process steps, masks, or auxiliary charges despite its sophistication and efficiency enhancements. This memory technology leverages a newly developed Pch Schottky Non-Volatile Memory Cell that optimizes power consumption for ultra-low-power operations. The tech allows controlled hot carrier injection by cell bias during the program/erase cycle, ensuring the retention and reliability of data throughout its lifecycle. TwinBit Gen-2 thus guarantees a heightened level of operational efficiency for modern electronic devices. Suitable for various memory applications demanding high security and low energy consumption, TwinBit Gen-2 is a valuable asset in fields like IoT and other high-volume consumer electronics requiring reprogrammable memory infrastructure. By achieving this balance, TwinBit Gen-2 establishes itself as a leading non-volatile memory solution in the evolving semiconductor market.
RAAAM's GCRAM On-Chip Memory is a state-of-the-art semiconductor memory solution that offers a groundbreaking approach to on-chip storage. Designed to bridge the limitations posed by conventional SRAM as technology nodes advance, GCRAM achieves significant reductions both in silicon area and power consumption, making it an ideal choice for next-generation chip designs. This technology stands out due to its full compatibility with standard CMOS processes, offering up to a 50% decrease in chip area and cutting power usage by as much as 10x compared to traditional SRAM.<br><br>GCRAM is ideally suited for cutting-edge applications including Artificial Intelligence, Machine Learning, Augmented and Virtual Reality, automotive systems, and high-performance computing environments like data centers. As these applications demand increasing amounts of on-chip memory, GCRAM provides an efficient solution without necessitating additional processing steps, thus lowering production costs while enhancing overall chip performance.<br><br>The patented technology behind GCRAM extends Moore's Law for on-chip memories, offering semiconductor firms a practical and efficient SRAM alternative. By leveraging RAAAM's technology, companies can achieve notable improvements in performance metrics while maintaining cost-effectiveness in manufacturing. This positions GCRAM as a leading choice for semiconductor manufacturers targeting advanced memory solutions to support the ever-growing computational requirements in diversified sectors.
Spectral MemoryIP is a comprehensive set of silicon-proven memory solutions that combine high-density and low-power architectures, ideal for a vast array of storage needs in complex systems. Comprising standard 6 compiler architectures like Single Port and Dual Port SRAMs, ROM, and various Register Files, Spectral MemoryIP leverages both foundry and tailor-made bit cells for reliable operation. Its architecture focuses on performance optimization and minimal power consumption, aimed at integrating high-speed functionality efficiently. The IP is built to adapt to standard CMOS technologies and is augmented by institutions like MemoryCanvas and MemoryTime, which aid in memory development and compilers. Users benefit from its customizable nature, with source code access allowing design modifications and technology porting, tailored to specific needs while optimizing embedded storage solutions. In addressing embedded memory requirements, Spectral's solutions like SpectralSPSRAM and SpectralDPSRAM are designed for sizable monolithic instances, with capabilities extending from scratch pad memories to nonvolatile storage needs. The innovations encompass low dynamic power usage and superior speed, ensuring the adaptability and efficiency necessary for advanced applications like IoT and AI.
The LEE Fuse ZA is a specialized Anti-Fuse memory solution, optimized for one-time programming needs such as memory redundancy and trimming applications. Its design philosophy embraces ease of implementation and cost effectiveness, requiring no additional masks or process steps beyond standard CMOS workflows. With capabilities extending from advanced nodes of sub-10nm to more classic 180nm processes, this memory is versatile across various technology scales. The LEE Fuse ZA stands out due to its high-temperature and long data retention attributes, aligned with the demands of automotive-grade applications. Its efficient design supports widespread application opportunities, enabling manufacturers to integrate this technology into existing systems without significant architectural overhaul. LEE Fuse ZA addresses critical memory needs while maintaining cost efficiency and reliability in challenging environments.
The Vega eFPGA is a flexible programmable solution crafted to enhance SoC designs with substantial ease and efficiency. This IP is designed to offer multiple advantages such as increased performance, reduced costs, secure IP handling, and ease of integration. The Vega eFPGA boasts a versatile architecture allowing for tailored configurations to suit varying application requirements. This IP includes configurable tiles like CLB (Configurable Logic Blocks), BRAM (Block RAM), and DSP (Digital Signal Processing) units. The CLB part includes eight 6-input Lookup Tables that provide dual outputs, and also an optional configuration with a fast adder having a carry chain. The BRAM supports 36Kb dual-port memory and offers flexibility for different configurations, while the DSP component is designed for complex arithmetic functions with its 18x20 multipliers and a wide 64-bit accumulator. Focused on allowing easy system design and acceleration, Vega eFPGA ensures seamless integration and verification into any SoC design. It is backed by a robust EDA toolset and features that allow significant customization, making it adaptable to any semiconductor fabrication process. This flexibility and technological robustness places the Vega eFPGA as a standout choice for developing innovative and complex programmable logic solutions.
This 12-bit ADC utilizing Samsung's 100nm CMOS technology delivers a versatile performance across a broad operating voltage range. Supporting up to 1MSPS conversion rate, it ensures high-quality signal processing over 16 channels. The ADC demonstrates precise linearity with DNL and INL of ±1.0LSB and ±1.5LSB respectively. It provides effective power management with a typical power consumption of just 8mW at 5.0V, and the option to enter a power-down state with minimal current use. Its superior signal-to-noise ratio and effective number of bits (ENOB) make it an excellent choice for applications demanding high-precision data measurement without sacrificing efficiency.
The Serial Peripheral Interface (SPI) MRAM by Everspin is crafted to meet the needs of applications requiring rapid data transactions with minimal pin usage. This memory solution excels in speed, offering reading and writing operations faster than many parallel MRAMs due to the efficiency of its four data lines in Quad SPI mode.\n\nThis device is encased in a compact 16-pin SOIC package and engineered for low power consumption while maintaining swift data access at 52MB per second. Such capabilities make it suitable for systems requiring efficient space management alongside robust performance, such as industrial computing and embedded system applications.\n\nSPI MRAM is designed for simplicity in integration, supporting both rapid prototyping and long-term deployments in data-intensive environments. Systems such as next-generation RAID controllers and embedded logs benefit from its fast access speeds and non-volatile characteristics, ensuring data retention even during unforeseen power outages.
AON1100 is acclaimed as the leading edge AI chip optimized for voice and sensor applications. With a power consumption of less than 260µW, it excels in delivering near-perfect accuracy even in challenging environments. This makes it indispensably suited for continuously active devices that require both precision and energy efficiency.
The High-Speed Low-Power SRAM from Xenergic is engineered to achieve an ideal balance between power consumption and performance efficiency. With significant reductions in dynamic power and leakage, reaching reductions up to 40% and 55% respectively, this SRAM is a versatile solution for diverse applications. Designed to address the power constraints in edge computing, it supports optimal speeds bringing computation close to the edge, proving particularly advantageous for IoT and always-on devices. This innovative SRAM helps extend device battery life by minimizing the power footprint within SoCs for products such as sensors and wearables. It's particularly suitable for applications that require low power use over extended periods, making it a pivotal component in modern mobile and IoT devices. Additionally, its architecture supports significant retention leakage reductions, ensuring it does not inadvertently become a key power consumer in various electronic designs. Xenergic’s High-Speed Low-Power SRAM ensures that developers can meet their stringent power requirements without compromising on speed or area, rendering it an essential component for edge computing and IoT development. The memory architecture facilitates seamless integration within existing design flows and dynamically addresses the power and performance needs of any given application.
The TSP1 Neural Network Accelerator is a state-of-the-art AI chip designed for versatile applications across various industries, including voice interfaces, biomedical monitoring, and industrial IoT. Engineered for efficiency, the TSP1 handles complex workloads with minimal power usage, making it ideal for battery-powered devices. This AI chip is capable of advanced bio-signal classification and natural voice interface integration, providing self-contained processing for numerous sensor signal applications. A notable feature is its high-efficiency neural network processing element fabric, which empowers signal pattern recognition and other neural network tasks, thereby reducing power, cost, and latency. The TSP1 supports powerful AI inference processes with low latency, enabling real-time applications like full vocabulary speech recognition and keyword spotting with minimal energy consumption. It's equipped with multiple interfaces for seamless integration and offers robust on-chip storage for secure network and firmware management. The chip is available in various packaging options to suit different application requirements.
Tower Semiconductor offers state-of-the-art Non-Volatile Memory (NVM) solutions, providing enhanced functionality and integration within complex System-on-Chip designs. This technology is vital for applications demanding reliable data retention and rapid access, such as automotive and industrial controls, where enduring operation under harsh conditions is critical. Their NVM solutions cover a broad spectrum of memory types, including Floating Gate, Magnetoresistive RAM, and electrically erasable programmable read-only memory (EEPROM), among others. The diversity in NVM technologies allows for tailored solutions that meet specific customer needs, providing strengths in both fast write/read cycles and energy efficiency. Through partnerships with leading NVM IP vendors and proprietary solutions like Y-Flash, Tower Semiconductor is equipped to offer flexible and reliable memory solutions with broad support for both analog and digital applications. The integration of their NVM solutions within their CMOS platforms further reflects their commitment to enhancing the functional capability of modern electronic designs.
NeoPUF by eMemory Technology is a pioneering hardware security solution utilizing Physical Unclonable Function (PUF) technology. Designed to provide robust protection against unauthorized access and duplication, NeoPUF offers a unique security feature by exploiting the natural variability in silicon characteristics. This randomness is used to generate device-specific keys that are virtually impossible to replicate, ensuring a high level of security for sensitive data and cryptographic processes. NeoPUF's architecture supports a variety of security applications, including secure key storage and identity authentication. Its scalability and flexibility allow it to be integrated across different process nodes, making it an essential security element in IoT devices, automotive security systems, and other critical sectors requiring stringent cybersecurity measures.
This low-power ADC is optimized for precision and efficiency, engineered using 55nm technology. It features a 12-bit resolution with a conversion rate ranging from 0.1MSPS to 1MSPS, ensuring high-quality data acquisition over its eight channels. The device operates between 2.4V to 3.6V on the analog side and 1.08V to 1.32V digitally, providing flexibility in various applications. Its superior dynamic performance is highlighted by an SFDR of 89dB and an SNR of 72dB, while maintaining minimal power use, making it suitable for battery-powered and portable systems.
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