All IPs > Interface Controller & PHY > I2C
The I2C Interface Controller & PHY category in our semiconductor IP catalog presents a crucial array of technologies tailored for seamless communication within embedded systems and a variety of electronic devices. The I2C, or Inter-Integrated Circuit, standard is a well-established protocol that facilitates serial communication, primarily in microcontrollers and other integrated circuits. Within this category, developers will find both controller IPs and Physical Layer (PHY) IPs designed to optimize the efficiency and functionality of I2C communications.
The products in this category include comprehensive controller IP cores that manage the I2C protocol, enabling devices to communicate over a shared bus efficiently. These controllers are essential components for systems requiring robust data exchange, such as sensor networks, home automation systems, and industrial control environments. Leveraging these IP cores can lead to significant reductions in design time, providing developers with a ready-to-use solution that adheres to standard I2C specifications while offering flexibility for customization.
PHY semiconductor IPs are crucial for ensuring the physical transmission of I2C data complies with electronic standards needed in various environments. They handle critical functions such as signal transmission, clock generation, and power management, thereby ensuring that data integrity is maintained across different system components and operating conditions. These IPs are particularly vital for applications that demand high reliability and performance in their I2C communications, such as automotive electronics, consumer devices, and medical equipment.
Integrating I2C Interface Controller & PHY semiconductor IPs can considerably enhance the performance of multi-device systems, offering scalable solutions that adapt to the increasing complexity of modern electronic configurations. By focusing on high efficiency and compatibility, these IPs support the development of innovative products that require reliable and efficient communication protocols, paving the way for advancements in technology and connectivity across industries.
The AHB-Lite APB4 Bridge serves as a crucial interconnect that facilitates communication between the AMBA 3 AHB-Lite and AMBA APB bus protocols. As a parameterized soft IP, it offers flexibility and adaptability in managing system interconnections, bridging the gap between high-speed and low-speed peripherals with efficiency. The bridge's architecture is designed to maintain data integrity while transferring information across different protocol tiers. This bridge supports the implementation of a seamless transition for data exchanges, ensuring data packets are transmitted with minimal latency. It is ideal for systems that require stable connectivity across multiple peripheral interfaces, delivering a cohesive platform for system designers to enhance operational uniformity. By enabling efficient bus conversion, it supports broader system architectures, contributing to the overall efficiency of embedded designs. With its open-architecture design, the AHB-Lite APB4 Bridge caters to a wide range of applications, providing necessary adaptability to meet the unique demands of each project. Its robust design ensures that it can accommodate the complex architectures of modern embedded systems, enhancing both performance and reliability.
The ARINC 818 Product Suite is a comprehensive solution designed for professionals working with advanced avionics systems. It provides a robust framework for implementing, testing, and simulating ARINC 818 systems. The product suite includes a variety of tools and resources tailored for the lifecycle of ARINC 818 systems, ensuring that clients can develop mission-critical systems with confidence. With a primary focus on performance and scalability, the ARINC 818 Product Suite is developed to cater to complex requirements and to seamlessly integrate within existing technology stacks. Users benefit from its extensive compatibility and the ability to manage high-speed data effectively, making it a vital asset for those working in aviation and defense sectors.
eSi-Connect offers an extensive suite of AMBA-compliant peripheral IPs designed to streamline SoC integration. This suite encompasses versatile memory controllers, standard off-chip interface support, and essential control functions. Its configurability and compatibility with low-level software drivers make it suitable for real-time deployment in complex system architectures, promoting reliable connectivity across various applications.
The HOTLink II Product Suite is designed to facilitate high-speed connectivity and data transfer in demanding environments. This suite of products offers robust solutions for those needing reliable and fast data links, catering to industries where performance and precision are crucial. As part of Great River Technology's offerings, HOTLink II stands out by providing comprehensive support throughout product lifecycles and ensuring compatibility with various systems. With HOTLink II, users can expect exceptional levels of performance and reliability thanks to its advanced design, which is geared towards meeting the rigorous demands of aerospace and defense applications. Whether implementing new systems or upgrading existing infrastructures, the HOTLink II Product Suite provides the versatility and capability needed to meet diverse clients' needs. The suite is particularly beneficial for engineers requiring high-performance link solutions that integrate seamlessly within larger systems, enhancing operational effectiveness and efficiency. It includes all the necessary tools to ensure a smooth deployment process while minimizing potential downtime associated with new technology integration.
The Chipchain C100 is a pioneering solution in IoT applications, providing a highly integrated single-chip design that focuses on low power consumption without compromising performance. Its design incorporates a powerful 32-bit RISC-V CPU which can reach speeds up to 1.5GHz. This processing power ensures efficient and capable computing for diverse IoT applications. This chip stands out with its comprehensive integrated features including embedded RAM and ROM, making it efficient in both processing and computing tasks. Additionally, the C100 comes with integrated Wi-Fi and multiple interfaces for transmission, broadening its application potential significantly. Other notable features of the C100 include an ADC, LDO, and a temperature sensor, enabling it to handle a wide array of IoT tasks more seamlessly. With considerations for security and stability, the Chipchain C100 facilitates easier and faster development in IoT applications, proving itself as a versatile component in smart devices like security systems, home automation products, and wearable technology.
The LightningBlu solution from Blu Wireless is a premier mmWave technology specifically designed to cater to the rigorous demands of high-speed rail connectivity. It provides multi-gigabit, continuous communication solutions between tracksides and trains. This connectivity ensures reliable on-board services such as internet access, entertainment, and passenger information systems. The versatile solution is engineered to perform seamlessly even at speeds greater than 300 km/h, enhancing the passenger experience by delivering consistent, high-speed internet and data services. Built to leverage the 57-71 GHz mmWave spectrum, LightningBlu guarantees carrier-grade connectivity that accommodates the surge of digital devices passengers bring aboard. The technology facilitates a robust communication network that empowers high-speed rail services amidst challenging dynamics and ensures that passengers enjoy uninterrupted service across wide geographic expanses. This significant technical prowess positions LightningBlu as an indispensable asset for the future of rail transport, effectively shaping the industry's move towards digital transformation. With a focus on sustainability, LightningBlu also supports the transition to a carbon-free transport ecosystem, providing an advanced data communication solution that interlinks seamless connectivity with environmentally responsible operation. Its application in rail systems positions it at the heart of modernizing rail services, fostering an era of enhanced rider satisfaction and operational efficiency.
The THOR platform is a versatile tool for developing application-specific NFC sensor and data logging solutions. It incorporates silicon-proven IP blocks, creating a comprehensive ASIC platform suitable for rigorous monitoring and continuous data logging applications across various industries. THOR is designed for accelerated development timelines, leveraging low power and high-security features. Equipped with multi-protocol NFC capabilities and integrated temperature sensors, the THOR platform supports a wide range of external sensors, enhancing its adaptability to diverse monitoring needs. Its energy-efficient design allows operations via energy harvesting or battery power, ensuring sustainability in its applications. This platform finds particular utility in sectors demanding precise environmental monitoring and data management, such as logistics, pharmaceuticals, and industrial automation. The platform's capacity for AES/DES encrypted data logging ensures secure data handling, making it a reliable choice for sectors with stringent data protection needs.
The RISCV SoC developed by Dyumnin Semiconductors is engineered with a 64-bit quad-core server-class RISCV CPU, aiming to bridge various application needs with an integrated, holistic system design. Each subsystem of this SoC, from AI/ML capabilities to automotive and multimedia functionalities, is constructed to deliver optimal performance and streamlined operations. Designed as a reference model, this SoC enables quick adaptation and deployment, significantly reducing the time-to-market for clients. The AI Accelerator subsystem enhances AI operations with its collaboration of a custom central processing unit, intertwined with a specialized tensor flow unit. In the multimedia domain, the SoC boasts integration capabilities for HDMI, Display Port, MIPI, and other advanced graphic and audio technologies, ensuring versatile application across various multimedia requirements. Memory handling is another strength of this SoC, with support for protocols ranging from DDR and MMC to more advanced interfaces like ONFI and SD/SDIO, ensuring seamless connectivity with a wide array of memory modules. Moreover, the communication subsystem encompasses a broad spectrum of connectivity protocols, including PCIe, Ethernet, USB, and SPI, crafting an all-rounded solution for modern communication challenges. The automotive subsystem, offering CAN and CAN-FD protocols, further extends its utility into automotive connectivity.
Certus Semiconductor's Digital I/O solutions are engineered to meet various GPIO/ODIO standards. These versatile libraries offer support for standards such as I2C, I3C, SPI, JEDEC CMOS, and more. Designed to withstand extreme conditions, these I/Os incorporate features like ultra-low power consumption, multiple drive strengths, and high levels of ESD protection. These attributes make them suitable for applications requiring resilient performance under harsh conditions. Certus Semiconductor’s offerings also include a variety of advanced features like RGMII-compliant IO cells, offering flexibility for different project needs.
The APB4 GPIO core from Roa Logic is a fully parameterized solution designed to provide a customizable number of general-purpose, bidirectional I/O pins. This core enables developers to define the I/O behavior precisely, adapting to a plethora of configurations to meet specific project requirements. It is essential for applications that require extensive interfacing capabilities, ensuring streamlined connectivity across multiple components. The GPIO core supports a range of operational modes, providing the flexibility to handle complex I/O operations. With capabilities like programmable drive strength and individual pin configuration, it offers a high degree of customization that can be tailored to precise application needs. Roa Logic’s offering enhances design functionality and accelerates development timelines by facilitating easy integration and application-specific optimization. This component serves as a cornerstone for designs requiring robust peripheral interaction, catering to both industrial projects and educational purposes. Its adaptability and ease of integration ensure it's an invaluable component in modern electronics design, adhering to the high standards expected in today's interconnected environments.
The eSPI Master/Slave Controller adheres to the Enhanced Serial Peripheral Interface (eSPI) specification, facilitating communication either as a master or slave device within the eSPI protocol. It provides support for both the transaction and link layers of the eSPI bus, making it suitable for integration with a range of AMBA-compliant interconnect systems like AXI or AHB. This controller is particularly adept at bridging communications between various SPI devices and internal processing units, ensuring robust data exchange in complex system architectures.
Sofics has verified its ESD protection clamps on technology nodes between 0.25um CMOS down to 3nm across various fabs and foundries. The ESD clamps are silicon and product proven in more than 5000 mass produced IC-products. The cells provide competitive advantage through improved yield, reduced silicon footprint and enable low-leakage, high-speed or high voltage tolerant interfaces. The Analog I/O clamp described in this document can be used for 3.3V pads in the TSMC 3nm FinFET technology. The ESD clamp is designed to provide 2kV HBM protection for 3.3V interfaces. It features a small silicon footprint.
Designed for the burgeoning field of wireless connectivity, the 802.15.4 Transceiver Core from RF Integration is targeted towards low-rate wireless personal area networks (LR-WPANs). This core provides the backbone for connecting devices in home automation, industrial monitoring, and consumer electronics applications. Capable of supporting IEEE 802.15.4 standards, including Zigbee, the core facilitates low-power data communication, which is essential for devices where energy efficiency is paramount. The transceiver's design emphasizes reduced power consumption while maintaining robust wireless communication, making it an ideal choice for battery-powered devices. The flexibility of this core allows it to be integrated with various systems, enhancing the functionality of networked devices through secure and reliable connections. By leveraging RF Integration's expertise, this transceiver core not only meets the demand for energy-efficient solutions but also paves the way for future advancements in the Internet of Things (IoT).
The SPI Master/Slave Controller provides a comprehensive solution for serial communication via the SPI protocol, supporting both master and slave configurations. It is designed to interact seamlessly with AMBA interconnect protocols such as AXI, AHB, and APB, offering flexibility in connecting microprocessors to a wide range of SPI-enabled devices. The controller is well-suited for use in environments where efficient and reliable data transfer is critical, enhancing system functionality with options for programmability and integration ease.
Secure Protocol Engines by Secure-IC focus on enhancing security and network processing efficiency for System-on-Chip (SoC) designs. These high-performance IP blocks are engineered to handle intensive security tasks, offloading critical processes from the main CPU to improve overall system efficiency. Designed for seamless integration, these modules cater to various applications requiring stringent security standards. By leveraging cryptographic acceleration, Secure Protocol Engines facilitate rapid processing of secure communications, allowing SoCs to maintain fast response times even under high-demand conditions. The engines provide robust support for a broad range of security protocols and cryptographic functions, ensuring data integrity and confidentiality across communication channels. This ensures that devices remain secure from unauthorized access and data breaches, particularly in environments prone to cyber threats. Secure Protocol Engines are integral to designing resilient systems that need to process large volumes of secure transactions, such as in financial systems or highly regulated industrial applications. Their architecture allows for scalability and adaptability, making them suitable for both existing systems and new developments in the security technology domain.
This library is a production-quality, silicon-proven I/O library in TSMC 12nm technology. Supports multi-voltage GPIOs, capable of operating at 1.8V or 3.3V, dynamically selectable at the system level. Also included are various open-drain I/Os and hot plug detects capable of up to 5V operation. The library also includes a wide-variety of low-capacitance RF and analog ESD. There have operating ranges from 0 to 5V protection and support a wide range of high-performance interfaces including HDMI, LVDS, USB and wireless front-ends. Also included is a range of IEC 61000-4-2 system-level ESD protection that supports digital and analog I/O cells.
The UDP Offload Engine is an advanced FPGA IP Core tailored for high-speed communication needs, supporting a wide spectrum of Ethernet speeds ranging from 10 GbE to 400 GbE. It efficiently manages the UDP protocol stack offloading UDP operations from software to hardware, which significantly enhances data throughput and minimizes processor utilization. This IP core adheres to established UDP/IPv4 standards, incorporating advanced features like checksum computation, segmentation, reassembly, and L4 UDP multicast pre-selection, making it exceptionally suitable for high-performance network environments where efficiency and reliability are paramount. Its compatibility with industry-standard Ethernet MACs facilitates seamless integration into existing network architectures. Designed to support Super-Jumbo Frames and featuring an arbitrary datagram PDU limit up to 64K Bytes, the UDP Offload Engine delivers a robust solution for network and communication applications, prominently reducing overhead and providing swift yet reliable data transfer capabilities beneficial for modern networking tasks.
Photowave optical communications hardware is expertly crafted for the emerging needs of AI memory applications requiring disaggregated resources. Specifically engineered to be compatible with PCIe 5.0/6.0 and CXL 2.0/3.0, Photowave capitalizes on photonics to provide superior latency and energy efficiency. This technology is a game-changer for data centers, offering managers the ability to scale resources flexibly either within individual racks or across multiple server racks, paving the way for more adaptive and powerful data management solutions. By embracing the fundamental strengths of photonics, Photowave empowers large-scale computing systems to achieve previously unattainable levels of efficiency and responsiveness. This optical communication solution ensures seamless integration with state-of-the-art computing infrastructure, thus facilitating the shift towards more intelligent and modular computing environments which underpin the growth of AI-driven applications. The Photowave hardware is meticulously designed to uphold the highest standards in optical communication, ensuring fast data transfer capabilities that drastically reduce latency and improve the overall performance of computing tasks. In environments where swift and reliable data processing is paramount, Photowave stands out as a crucial component, helping optimize technological investments and boost the performance of AI and machine learning workloads.
Sofics has verified its ESD protection clamps on technology nodes between 0.25um CMOS down to 3nm across various fabs and foundries. The ESD clamps are silicon and product proven in more than 5000 mass produced IC-products. The cells provide competitive advantage through improved yield, reduced silicon footprint and enable low-leakage, high-speed or high voltage tolerant interfaces. The Analog I/O clamp described in this document can be used for 3.3V pads in the TSMC 7nm FinFET technology. The ESD clamp is designed to provide 2kV HBM protection for 3.3V interfaces. It features a small silicon footprint.
The FireSpy Bus Analyzer by DapTechnology is a powerful tool designed for thorough analysis and diagnostic capabilities within the IEEE-1394 and Mil1394 protocols. Designed for aerospace applications, it offers comprehensive solutions for bus monitoring with advanced modules that support multiple bus configurations, including single, triple, and multi-bus setups. Enhanced by a suite of protocol modules, it facilitates high-precision testing and monitoring through various use cases. One of the key features of the FireSpy is its ability to support multiple IEEE-1394 buses, making it suitable for complex aerospace projects. The tool is indispensable for its detailed analysis capabilities, helping engineers troubleshoot and optimize data transmission systems. As a product matured over generations, it represents the cutting-edge in IEEE-1394 technology, providing unparalleled insight and reliability over multiple protocols. With its Gen4 lineup, the FireSpy introduces new functionalities like extended interfaces and scalability options, catering to evolving bus analysis demands. It is a testament to DapTechnology's commitment to providing advanced tools for aerospace projects, ensuring performance, reliability, and precision in fast-paced industry environments.
DapTechnology's FireCore is a suite of PHY and Link Layer solutions, meticulously crafted for the IEEE-1394 and AS5643 interfaces. These products are engineered to push beyond standard limitations, supporting data transmission speeds from S100 to S3200. FireCore integrates seamlessly into various systems, extensively tested within DapTechnology's FireSpy analyzers, setting a new standard for data capture and analytical precision in high-speed environments. Each FireCore product is built to meet distinct IEEE-1394b-2008 and AS5643 requirements, with customization options that cater to specific project needs. The Link and PHY layers provide sophisticated features like bit error injection and testing, allowing for precise monitoring and quality assurance in data transmission. This flexibility ensures that FireCore solutions are suited for cutting-edge applications, meeting the rigorous demands of modern avionics. Beyond performance, FireCore focuses on ease of integration, providing configurable host interfaces and robust data processing features. These capabilities facilitate streamlined data management, supporting high-level test and integration systems necessary for defense and aerospace industries. The suite represents DapTechnology’s ongoing commitment to advancing IEEE-1394 and AS5643 technologies through groundbreaking solutions that anticipate the future needs of these sectors.
The INAP375R Receiver is a component of the APIX2 technology suite, tailored to meet the stringent demands of automotive infotainment systems. It supports bi-directional, high-speed data transfer over a single twisted pair cable, up to distances of 12 meters, offering flexibility for complex vehicle architectures. The receiver integrates advanced error correction protocols and supports RGB and LVDS video interfaces, making it ideal for high-definition display applications in vehicles.
The I2C Master/Slave Controller is a highly adaptable IP core designed to interface a microprocessor with an I2C bus system, supporting both master and slave roles. Capable of operating in various speed modes including Standard, Fast, Fast Plus, and High-Speed, this controller adheres to the latest NXP I2C specifications, providing extensive system-level integration features for varied applications. It is ideal for scenarios demanding precise I2C protocol compliance and robust data transactional support.
Digital IP Solutions from MosChip include a wide range of digital components used in the creation of integrated circuits and systems. These solutions are tailor-made to fulfill specific design criteria, ensuring optimal performance and efficiency in electronic products. The portfolio encompasses modules that facilitate functions such as data processing, signal conversion, and system integration, allowing manufacturers to achieve superior design outcomes. Each module is created with a focus on scalability and robustness, catering to the diverse needs of industries such as automotive, consumer electronics, and telecommunications. The Digital IP Solutions are instrumental in boosting the processing power and performance reliability of devices, which are core to the demands of advanced computing environments. Moreover, the flexibility and customizability of these solutions allow them to be seamlessly integrated into existing architectures, enhancing both speed and functionality. As technology advances, the importance of adaptable, high-performance digital solutions will continue to grow, making these modules critical to the success of future electronic products.
Sofics has verified its ESD protection clamps on technology nodes between 0.25um CMOS down to 3nm across various fabs and foundries. The ESD clamps are silicon and product proven in more than 5000 mass produced IC-products. The cells provide competitive advantage through improved yield, reduced silicon footprint and enable low-leakage, high-speed or high voltage tolerant interfaces. The Analog I/O clamp described in this document can be used for 2.5V pads in the TSMC 5nm FinFET technology. The ESD clamp is designed to provide 2kV HBM protection for 2.5V interfaces. It features a small silicon footprint.
The MIPI solutions crafted by L&T Technology Services cater specifically to the demands of mobile component integration, adhering strictly to MIPI standards. These solutions are formulated to enhance the interaction between various mobile components, which is crucial for ensuring seamless operations within smartphones and tablets. By focusing on optimized data transfer and communication protocols, these MIPI solutions significantly improve the efficiency and performance of mobile devices. They cater to the demands of high-speed, real-time communication, supporting the latest advancements in mobile technology. In essence, they facilitate an environment where multiple components can interact harmoniously, contributing to smoother mobile experiences. LTTS’s MIPI solutions are crucial for manufacturers looking to push the boundaries of mobile component integration, providing the key to unlocking enhanced functionality and usability within devices. The solutions are further characterized by their flexibility and adaptability, accommodating the rapid technological changes inherent in the mobile industry, ensuring devices remain competitive and operationally efficient.
This library is a production-quality, silicon-proven I/O library in TSMC 16nm technology. Supports multi-voltage GPIOs, capable of operating at 1.8V or 3.3V, dynamically selectable at the system level. Also included are various open-drain I/Os and hot plug detects capable of up to 5V operation. The library also includes a wide-variety of low-capacitance RF and analog ESD. There have operating ranges from 0 to 5V protection and support a wide range of high-performance interfaces including HDMI, LVDS, USB and wireless front-ends. Also included is a range of IEC 61000-4-2 system-level ESD protection that supports digital and analog I/O cells.
The LineSpeed FLEX Family offers a comprehensive suite of 100G PHY products specialized in various advanced functionalities like retimer, gearbox, multiplexing, and redundant link functions. These IPs are particularly suitable for integration on line cards or within modules, supporting data exchange rates of 10G, 25G, and 100G. Key features include on-chip 100G RS-FEC for both gearbox and retimer applications, providing substantial error correction capabilities and ensuring robust data transmission over extended distances. The Multi-Link Gearbox feature of the family facilitates high-density 10GbE aggregation and enables effective handling of mixed port speeds through its independent protocol capabilities. Designed with a common register structure and pin-compatible package options, the LineSpeed FLEX Family accommodates diverse use cases in Ethernet infrastructure and serial link schemes. It is ideal for configurations that benefit from enhanced performance, such as high-reliability data transfer frameworks in next-generation network setups.
The Bluetooth Low Energy (BLE) Wireless Sensor Network Library provides a comprehensive solution for designing and implementing low-power wireless sensor networks. This library is ideal for applications where energy efficiency is critical, such as in IoT devices and wearable technology. BLE technology enables devices to communicate wirelessly over short distances while consuming minimal power, making the library an essential tool for developers looking to integrate BLE capabilities into their products. The library simplifies the development process with a broad suite of functions and protocols that ensure reliable and effective network performance. By supporting a variety of sensor types and configurations, the library enhances the capability of IoT systems to monitor and analyze data efficiently. Its applications range from smart home devices to industrial monitoring systems, underscoring the versatility and utility of BLE in modern technology solutions.
The High-Performance FPGA & ASIC Networking Product by CetraC.io is a leading-edge solution for distributed architectures in critical systems across various sectors. It is specifically designed to cater to the demanding needs of industries requiring robust, high-speed networking capabilities with a primary focus on performance and reliability. This product combines FPGA and ASIC technologies, harnessing their synergies to deliver exceptional speed and precise control over data streams, making it ideal for complex, data-intensive environments. Engineered to support a wide range of protocols such as Ethernet, AFDX, PCI Express, and more, this networking product embodies flexibility and adaptability. Its ability to handle diverse data streams simultaneously, with ultra-low latency and high throughput, ensures that it can meet the needs of high-demand infrastructural setups, from aerospace and automotive to industrial networks. Moreover, this technology is pivotal in integrating seamlessly with existing network frameworks, enhancing overall system efficiency and communication accuracy. Security is a cornerstone of CetraC.io’s offering, with this product incorporating advanced hardware-based encryption mechanisms. Using AES256 GCM, the networking product ensures that all transmitted data remains secure and protected against unauthorized access, fulfilling stringent industry cybersecurity standards. This robust security framework works in tandem with its performance attributes to present a comprehensive solution to modern networking challenges. Furthermore, the product features high levels of cyber resilience and determinism, crucial for maintaining intact operations even under adverse conditions. Its hardware-based design replaces traditional software vulnerability points, offering a more secure, reliable, and efficient operation, perfectly suited to support the evolving landscape of industries transitioning towards increased automation and digitalization.
EASii IC's CoaXPress IP stands out as a global leader in high-speed imaging data transmission used across professional and industrial imaging applications such as machine vision, medical imaging, and broadcasting. This IP leverages the simplicity of coaxial cabling combined with high-speed serial data transfer capabilities. CoaXPress provides a high-bandwidth, low-cost interface solution using coaxial cables for video acquisition peripherals. It supports high-speed data streams from multiple cameras with impressive GenICam compliance, endorsing a unified software interface for diverse camera types. EASii IC’s CoaXPress Device and Host IP cores are engineered to accommodate the latest standards, offering unparalleled integration for embedded systems. Designed with flexibility, CoaXPress IP includes dynamic device and link management, allowing it to seamlessly operate across multiple system configurations and supporting bidirectional, low-latency, high-precision communications. This versatility ensures its efficacy for large-scale, multistream video processing, capturing, and transmission requirements.
The SPI Slave IP Core complies with the SPI Standard as detailed in Motorola’s M68H11 Reference Manual, ensuring seamless slave-directed operations in Serial Peripheral Interface (SPI) communications. By excelling in handling serial data exchanges, it supports efficient communications in a broad range of applications. This core facilitates synchronization of data transfer between the master and multiple slave devices in SPI configurations, enhancing the interoperability and functionality of electronic systems. It is crafted to ensure that data transactions are handled with high precision, crucial for systems demanding accurate data exchange protocols. With an architecture designed for flexibility, the SPI Slave core is suitable for deployment in various industrial and consumer applications. It offers a reliable interface for devices requiring effective communication pathways, bolstering system capabilities and ensuring robust data handling processes.
The INAP375T Transmitter is a high-speed data transmission solution specifically designed for the automotive industry. It employs the second generation APIX2 technology, which delivers high-speed differential data through a single twisted pair cable, supporting data rates up to 3Gbps. This transmitter can handle complex multimedia data like video and audio while maintaining robust error correction through the AShell protocol, ensuring reliable data communication within vehicles.
The I2C Slave IP Core aligns with the I2C-bus specification and user manual Rev. 5, released on October 9, 2012. It is crafted to function as a slave device in inter-integrated circuit setups, ensuring compliance across multiple bus modes, including Standard-mode, Fast-mode, and Fast-mode Plus (Fm+). This core is crucial for simplifying the integration of slave devices within the I2C protocol, maintaining effective communication across system components. It supports efficient data transactions between microcontrollers and peripheral devices, acting as a conduit for reliable information flow. The I2C Slave core's design flexibility makes it suitable for a variety of applications where device-to-device communication is fundamental. It supports widespread industrial and consumer devices, ensuring integrative harmony within complex digital systems, and providing a proven solution for communication challenges in electronic applications.
The I2C Master IP Core fully complies with the I2C-bus specification and user manual Rev. 5, dated October 9, 2012, supporting Standard-mode, Fast-mode, and Fast-mode Plus (Fm+). This core is integral for master-side control in inter-integrated circuit communications, providing a reliable protocol option for synchronous data transfer across microcontrollers and related components. Designed for flexibility and performance, the I2C Master enables efficient communication across multiple devices on the same bus, supporting various speed modes to accommodate different operational requirements. Its efficient design ensures seamless integration into existing systems, enhancing productivity and simplifying development. The adaptable nature of this IP allows for extensive customization, making it applicable across a wide spectrum of industrial and consumer electronics applications where reliable communication is essential. This core's robustness ensures dependable data exchanges, critical in environments with tightly coordinated communication needs.
The SPI Master IP Core adheres to the SPI Standard, as outlined in Motorola’s M68H11 Reference Manual. It functions to facilitate master-directed control in Serial Peripheral Interface (SPI) communications, essential for microcontroller interactions with peripheral devices. This core enables efficient serial data exchange by configuring electronic components for synchronous data transfer in a master-slave setup, making it indispensable in systems that require precise and rapid serial communication. Its robust architecture supports a wide variety of applications, enhancing system functionality and data integrity. Designed to operate seamlessly within various electronic environments, the SPI Master core provides the ability to execute high-speed data transactions, maintaining effective control over peripheral devices. Its customizable nature allows for tailored implementations to meet specific requirements of both industrial and consumer technology applications.
The D68HC11F is a synthesizable SOFT Microcontroller IP Core, fully compatible with the Motorola 68HC11F1 industry standard. It can be used as a direct replacement for the 68HC11F1 Microcontrollers. Major peripheral functions are integrated on-chip, including an asynchronous serial communications interface (SCI) and a synchronous serial peripheral interface (SPI). The main 16-bit, free-running timer system includes input capture and output-compare lines, and a real-time interrupt function. An 8-bit pulse accumulator subsystem counts external events or measures external periods. Self-monitoring on-chip circuitry protects the D68HC11F against system errors. The Computer Operating Properly (COP) watchdog system and illegal opcode detection circuit provide extra security features. Two power-saving modes, WAIT and STOP, make the IP core especially attractive for automotive and battery-driven applications. Additionally, the D68HC11F can be equipped with an ADC Controller, offering compatibility with external ADCs. Its customizable nature means it's delivered in configurations tailored to need, avoiding unnecessary features and silicon waste. The D68HC11F also includes a fully automated test bench and comprehensive tests for easy SoC design validation. It supports DCD’s DoCD™, a real-time hardware debugger, for non-intrusive debugging of complete SoCs. This IP Core is technology agnostic, ensuring 100% compatibility with all FPGA and ASIC vendors.
The I2C Master/Slave Controller from Atria Logic caters to efficient inter-device communication through its comprehensive adaptation of the I2C protocol. This two-wire bus system utilizes serial data and clock lines, facilitating seamless data exchanges across various embedded system interfaces, including AHB and APB fabrics. Designed for integration ease, this controller IP supports a multitude of functionalities, from setting configurable bus speeds to detecting multiples and synchronization of clock domains. Its adaptability and efficiency make it pivotal for embedded systems requiring robust data handling capabilities across diverse use cases in consumer electronics and industrial applications.
FireCore GPLink by DapTechnology enriches the IEEE-1394b-2008 and AS5643 standards, especially designed for applications needing greater processing power and versatility. Providing top-tier PHY and Link Layer solutions, it supports cutting-edge transmission speeds up to S3200 while offering built-in AS5643 features for advanced projects. The GPLink variant includes extended features beyond the basic offering, such as advanced error monitoring and expanded configurability, making it suitable for high-precision data handling. Its comprehensive set of tools ensures project adaptability and simplifies the integration process across various complex aerospace applications. DapTechnology has ensured that with FireCore GPLink, the emphasis is placed on reliability and performance, providing aerospace and defense sectors with the necessary toolkit to meet evolving technology standards. Its ability to handle demanding data integrity and processing needs marks it as an essential resource for those dealing with mission-critical Mil1394 data processes.
The FireCore Extended offers enhanced PHY and Link Layer solutions for IEEE-1394b-2008 and AS5643 interfaces, designed to go beyond basic implementations. It supports high data transmission speeds up to S3200, providing advanced functionality for complex aerospace and defense projects where robust data handling and precision are necessary. This solution comes with added features such as extended OHCI support, built-in AS5643 functions, and configurable host interfaces, which are critical for high-speed data applications. It also includes error detection capabilities, further enhancing data integrity across complex systems. The FireCore Extended is crucial for projects that demand meticulous data analysis and processing. Versatile in its nature, the FireCore Extended caters to applications where more sophisticated data pathways and processing power are required. It extends the operational value of both IEEE-1394 and AS5643 standards applications, making it a vital part of DapTechnology’s IP offerings, particularly for advanced technological demands in modern avionics.
The FireLink GPLink solution by DapTechnology is engineered for applications requiring advanced link layer solutions under the IEEE-1394b-2008 and AS5643 standards. It is tailored for high-performance environments where exceptional data integrity and processing power are mandatory. This product offers all the features of standard link layer technologies, plus additional support for extensive error monitoring and advanced data management capabilities. These improvements enhance system reliability and adaptability, crucial for fulfilling demanding avionics and aerospace project requirements. Designed with flexibility in mind, FireLink GPLink can support high-complexity projects seamlessly integrating into sophisticated test and measurement systems. Its emphasis on error correction and robust data processing ensures it remains a significant asset for any enterprise aiming to exploit the full potential of advanced data link technologies in modern aviation.
The FireGate solution represents DapTechnology's commitment to pushing IEEE-1394 and AS5643 capabilities further, explicitly focusing on boosting bus speeds and data throughput. It caters to applications needing enhanced data transmission capacities, supporting speeds beyond the S800 range to meet S1600 and S3200 thresholds. FireGate revolutionizes how high-speed data is processed and handled, offering users significantly improved transmission reliability and efficiency. It includes built-in error detection and correction features that ensure data integrity over extensive and rigorous testing environments common in aerospace and defense industries. This product underscores DapTechnology's innovative approach to network solutions, focusing on providing state-of-the-art bus technologies that drive efficiency and performance enhancements. FireGate is integral for applications that demand cutting-edge speed and reliability, paving the way for next-generation IEEE-1394 engagements in avionics.
This library is a production-ready I/O library built on the TSMC 12nm process. The library features 1.8V to 3.3V GPIOs with programmable drive strength, hysteresis, and control logic. It includes support cells for all power domains: 0.8V, 1.8V, and I/O and incorporates latch-up immune, JEDEC-compliant ESD structures. The library is designed for flip-chip packaging and includes vertical and horizontal variants to support all die edge orientations. All power domains include integrated power-on control (POC) cells for safe and reliable sequencing.
The I2S Controller from System Level Solutions is designed to implement the Inter-IC Sound (I2S) interface standard, primarily used for connecting digital audio devices. This controller facilitates seamless audio data exchange between components with minimal CPU intervention, optimizing sound quality and system performance. It supports various audio formats and clock signals, making it compatible with a broad array of audio devices and applications. With this controller, manufacturers can leverage improved sound systems, benefiting consumer audio products, automotive infotainment systems, and professional audio equipment. The I2S controller's robust architecture ensures efficiency in audio signal processing and transmission.
This is an ultra-low leakage library. The GPIO has a typical leakage of only 150pA from VDDIO and 1nA from VDD. The library has a GPIO and an ODIO. The GPIO cell set can be configured as input or output and has an internal 50K ohm pull-up or pull-down resistor. Cells for I/O and core power and ground with built-in ESD circuitry are included. A power-on-control circuit is integrated into an available VDDIO cell. The library includes pads for analog signals and a 6.5V one-time-programming voltage. The GPIO can do TX and RX up to 100MHz. The ODIO is I2C compliant. ESD targets are 2KV HBM / 500V CDM with 2KV IEC 61000-4-2 system stress capability.
This library is a mixed Digital and Analog library built for the TSMC 65nm process. It is based around a Fail-Safe General Purpose Input/Output (FSGPIO) cell that is compatible with both I2C and I3C protocols. The FSGPIO operates with a power supply of 1.0 to 1.2V and can tolerate external signals up to 3.3V. The library contains all the power, ground, and ESD cells to support the FSGPIO as well as an Analog I/O cell. The cells are laid out in an inline wirebond format.
This is an ultra-low leakage library. The GPIO has a worst-case leakage of only 425nA. It works with a wide VDDIO supply range from 1.8V to 3.3V during system operation without the need for the customer to manually switch between high and low-voltage modes. The GPIO cell set can be configured as input or output and has an internal 50K ohm pull-up or pull-down resistor. It has a sleep function which - when enabled - puts the I/O into an ultra-low power state and latches the I/O in the previous state. Cells for I/O, core power, and ground with built-in ESD circuitry are included. A power-on-control circuit is integrated into an available VDDIO cell. The GPIO can do TX and RX up to 150MHz. ESD targets are 2KV HBM / 500V CDM with 2KV IEC 61000-4-2 system stress capability.
This silicon-proven, flip chip library in TSMC 22nm boasts three variants of GPIOs and one ODIO. All GPIO and ODIO cells have NS and EW orientation. All GPIO types are classified based on speed: 25MHz, 75MHz and 150MHz. All GPIO speed variants can operate at different post-driver voltage, which can be set at the system level and dynamically changed in the system if needed. The I/O includes a weak pull-up or pull-down resistor (approx. 60 Ohms). The ODIO is designed for lower speed interfaces but can be used as a high-voltage, high-speed input at up to 100MHz. The library is designed to allow for independent power sequences of any I/O cell, which is accomplished with an intrinsic power-on-control architecture. In the case of GPIO and ODIO, only when all powers are up and detected as ON, will the I/Os begin to function, otherwise they will remain in a high impedance state. Beyond standard ESD protection, the library is tolerant to 61000-4-2 IEC standard to 2kV.
The HF-mini LVDS Tx is a versatile transmitter designed for applications requiring efficient low-voltage differential signaling. It operates on a dual analog power supply of either 2.5V or 3.3V and a 1.1V digital supply. The device can handle output frequencies ranging from 90MHz to 300MHz, ensuring support for high-speed data transmission. A key feature of the HF-mini LVDS Tx is its individual power down modes, allowing selective shutdown of either the channel or the data driver, providing flexibility and energy efficiency in system operations. The transmitter includes an integrated PLL and supports a 4-to-1 serialization, offering four-channel output performance. Ideal for applications needing high data throughput and low electromagnetic interference, the HF-mini LVDS Tx is equipped with a patented 4-channel output system. This makes it suitable for a variety of data-intensive environments where data reliability and signal integrity are paramount.
This radiation-hardened, by design, library features both a 1.8 and 3.3V GPIO with multiple drive strengths of 2mA, 4mA, 8mA, and 16mA, along with a full-speed output enable function. The library includes an LDO to generate a 1.8V reference which has been optimized for use with the 3.3V GPIO. The library incorporates radiation-hardened ESD cells, which are silicon-proven. A fail-safe GPI allows user to interface with bus-type protocols like I2C. All cells support independent power sequencing and integrate power-on-control circuitry for a clean low-leakage power-up. A selectable Schmitt trigger receiver adds input flexibility, while a 50K ohm pull-up or pull-down resistor is available for termination configurations. The library is enriched with feed-through, filler, transition, and domain-break cells to allow for flexible pad ring construction while maintaining ESD robustness. ESD targets are 2KV HBM / 500V CDM with 2KV IEC 61000-4-2 system stress capability.
Join the world's most advanced semiconductor IP marketplace!
It's free, and you'll get all the tools you need to discover IP, meet vendors and manage your IP workflow!
No credit card or payment details required.
Join the world's most advanced AI-powered semiconductor IP marketplace!
It's free, and you'll get all the tools you need to advertise and discover semiconductor IP, keep up-to-date with the latest semiconductor news and more!
Plus we'll send you our free weekly report on the semiconductor industry and the latest IP launches!