All IPs > Analog & Mixed Signal > Temperature Sensor
The category of Analog & Mixed Signal > Temperature Sensor in the Silicon Hub encompasses a wide range of semiconductor IPs designed to enable precise temperature monitoring within various electronic systems. These IPs are pivotal in ensuring reliable performance of electronic products by providing accurate temperature data, which is essential for maintaining optimal operating conditions and preventing thermal-related failures.
Temperature sensors within this category come in diverse forms, including analog and digital outputs, leveraging innovative mixed signal design techniques to achieve high precision despite varying environmental conditions. Key applications of these semiconductor IPs can be found in sectors such as consumer electronics, automotive, industrial automation, and healthcare devices, where temperature monitoring is critical for operational efficiency and safety.
Integrating temperature sensor IPs into semiconductor designs simplifies system architecture by reducing the need for additional discrete components, thereby saving space and power while enhancing overall functionality. In automotive applications, for example, these sensors are crucial for monitoring engine temperature, battery thermal management, and cabin climate control systems. In consumer electronics, they ensure safe battery operation and efficient thermal management for gadgets like smartphones and laptops.
Overall, temperature sensor semiconductor IPs play a vital role in the development of modern electronic systems by providing the precise temperature measurement capabilities required for various thermal management applications. Silicon Hub offers a comprehensive selection of these IPs, tailored to meet the stringent demands of today’s advanced technology ecosystems, ensuring your products are equipped with the latest in thermal sensing innovation.
ISELED is an innovative technology that revolutionizes automotive interior lighting by integrating all necessary hardware functions for fully software-defined lighting. It features smart RGB LEDs which are pre-calibrated by manufacturers, ensuring consistent color temperature and exceptional lighting quality. This technology simplifies the integration process by allowing users to send simple digital commands to control the color output of the LEDs without needing additional complex setups for color mixing and temperature compensation. ISELED is equipped to handle synchronous lighting displays and dynamic effects across vehicle interiors. The connectivity aspect of ISELED is enhanced by its ILaS protocol, allowing direct cable connections between lighting systems and enabling efficient power conversion. This makes it suitable for applications requiring resilience in communication, despite potential power failures on the board. With capabilities for bridging data over Ethernet, ISELED supports centralized control and synchronization from a vehicle's ECU.
The Chipchain C100 is a pioneering solution in IoT applications, providing a highly integrated single-chip design that focuses on low power consumption without compromising performance. Its design incorporates a powerful 32-bit RISC-V CPU which can reach speeds up to 1.5GHz. This processing power ensures efficient and capable computing for diverse IoT applications. This chip stands out with its comprehensive integrated features including embedded RAM and ROM, making it efficient in both processing and computing tasks. Additionally, the C100 comes with integrated Wi-Fi and multiple interfaces for transmission, broadening its application potential significantly. Other notable features of the C100 include an ADC, LDO, and a temperature sensor, enabling it to handle a wide array of IoT tasks more seamlessly. With considerations for security and stability, the Chipchain C100 facilitates easier and faster development in IoT applications, proving itself as a versatile component in smart devices like security systems, home automation products, and wearable technology.
The Time-Triggered Protocol (TTP) is a technology that offers deterministic communication for distributed real-time systems. This protocol is vital in applications where timing precision is crucial, such as in the aerospace industry, ensuring tasks are executed at precisely scheduled intervals. TTP is known for its reliability, configuring data communication parameters by defining send/receive slots within a network, and is adaptable for use in high-integrity systems like those found in avionics and deep space missions. This protocol underpins systems where fault-tolerance and coordination are necessary across diverse nodes within the network, offering a redundant communication pathway that safeguards against data loss. With this protocol, TTTech ensures that methodologies for verification and scheduling are incorporated into the systems, facilitating smoother qualification and certification in civil aviation projects. TTP is also SAE AS6003 compliant, meeting the stringent requirements needed for critical applications and ensuring compatibility with various forms of systems, including both integrated circuits and more complex system-on-chip arrangements. Widely acknowledged in industries demanding high reliability, TTP continues to support industry needs for robust protocol solutions.
Tower Semiconductor's BCD technology is engineered for power management solutions, offering a unique combination of bipolar, CMOS, and DMOS transistors. This technology efficiently addresses the need for high-performance power integrated circuits in portable, automotive, and consumer electronics. BCD processes allow for integrating high-voltage and low-voltage devices on the same chip, optimizing space and cost. The BCD technology shines in applications requiring robust power delivery and reliable performance under varying electrical conditions. By leveraging this technology, customers can achieve significant power conversion efficiency, essential for battery-powered and energy-efficient devices. High density integration of components ensures that power ICs remain compact yet versatile. A streamlined design process supports diverse applications from charging systems to energy management, catering to complex power architectures. This integration capability not only boosts device functionality but also enhances thermal management, making these solutions ideal for high-demand environments.
The MVDP2000 series introduces differential pressure sensors built on advanced capacitive sensing technology, delivering high sensitivity and stability. Calibrated to provide precise pressure and temperature data, these sensors are crafted for low power needs and rapid data feedback, ideal for situations demanding quick response. An essential component for OEM and portable devices like respiratory equipment and gas flow instruments, these sensors fulfill requirements for accuracy and energy efficiency. Their digital configuration eases integration, supporting applications in various environments with reliable performance. The sensors' specifications include a wide measurement range and a digital interface. They offer detailed data resolution aligned to 15-to-21 bits, with a compact DFN package making them suitable for space-constrained applications.
The MVH4000 series provides highly precise measurements of both humidity and temperature, making it ideal for applications that require dual environmental readings. Utilizing advanced Silicon Carbide MEMS technology, these sensors are known for their remarkable stability over time, quick response rates, and minimal energy use. The compact design allows for integration into various systems, especially where space and energy efficiency are critical. Offering low current consumption starting as low as 0.62 µA, these sensors are optimized for systems where battery life is crucial. Their performance remains consistent with a long-term stability of 0.1% RH per year. They come in a convenient small form factor of 2.5 x 2.5 x 0.9 mm, making it easier to allocate on PCBs. Accuracy is a prime feature, with humidity measurement accuracy up to ±1.5%RH and temperature accuracy within ±0.2°C, that aids in precise environmental monitoring. The pre-calibrated sensors simplify installation and support immediate implementation in various industries such as industrial, consumer, medical, and automotive sectors.
eSi-Analog integrates critical analog functionality into custom ASIC and SoC devices using leading foundry processes. It is optimized for low-power usage, ensuring efficiency and adaptability across a range of applications. This IP has been silicon-proven to meet custom specifications, providing reliability and performance in various high-demand sectors.
Analog Bits specializes in innovative sensor solutions designed for precise process, voltage, and temperature (PVT) monitoring. Their advanced sensor IP is crucial in maintaining the stability and performance of semiconductor devices by ensuring accurate monitoring of critical parameters. These sensors are integrally designed to be compact, consuming minimal power while providing high accuracy necessary for efficient power delivery systems. They are silicon-proven at scales down to 5nm and are adaptable for a wide range of applications, from consumer electronics to automotive markets. By detecting voltage spikes or other anomalies, these sensors enhance security and operational efficiency. Their integration capability allows for seamless on-die deployment, empowering software-based load balancing to optimize energy consumption across various technology platforms.
The MVT4000D series features meticulously calibrated digital temperature sensors designed for precision and power efficiency. Utilizing Silicon Carbide MEMS technology, these sensors are built to withstand rigorous conditions while offering incredible stability over long-term use. Their compact size and low energy consumption make them an optimal choice for diverse environments where space and power are limited. These digital sensors boast a minimal current draw, starting below 0.18 µA, perfect for sustaining battery life in portable and embedded systems. With rapid response capabilities typically within 2 seconds, they deliver swift results suitable for time-critical applications. Comprehensively accurate, maintaining temperature precision up to ±0.2°C, these sensors support multiple applications, from industrial monitoring to medical devices. The on-chip calibration ensures they are ready-to-use upon installation, providing a seamless integration experience.
The MVWS4000 series encapsulates a trio of sensors in a single package, measuring humidity, pressure, and temperature. Crafted with sophisticated Silicon Carbide technology, these sensors are renowned for their accuracy and efficiency, presenting exceptionally fast sampling rates to serve precise, real-time environmental assessments. Designed for robustness, these units feature various grades of precision to accommodate different financial and operational requirements, ensuring high performance for sensitive applications. Their ultra-low energy needs and reliability position them as ideal candidates for OEM products and battery-powered devices. With their compact size yet comprehensive capabilities, the MVWS4000 series lends itself well to sectors including, but not limited to, industrial settings, the consumer marketplace, healthcare, and automotive systems.
The agileTSENSE_D temperature sensor provides a digital output, extending the capabilities of traditional temperature sensing by incorporating digital signal processing. It retains the core analog sensing mechanism but wraps the output in a digital format for easier integration into modern digital systems, including IoT devices and data centers. This product is designed for environments where digital interfacing is critical. With its adaptable architecture, the agileTSENSE_D delivers precision temperature measurements over a broad operational range, ensuring that systems maintain optimal performance and safety. This functionality is crucial for thermal monitoring and management. Agile Analog designs are based on tried and tested architectures to ensure reliability and functionality. Our automated design methodology is programmatic, systematic and repeatable leading to analog IP that is more verifiable, more robust and more reliable. Our methodology also allows us to quickly re-target our IP to different process options. Our highly configurable and multi-node analog IP products are developed to meet the customer’s exact requirements. These digitally-wrapped and verified solutions can be seamlessly integrated into any SoC, significantly reducing complexity, time and costs.
Thermal oxide, often referred to as SiO2, is an essential film used in creating various semiconductor devices, ranging from simple to complex structures. This dielectric film is created by oxidizing silicon wafers under controlled conditions using high-purity, low-defect silicon substrates. This process produces a high-quality oxide layer that serves two main purposes: it acts as a field oxide to electrically insulate different layers, such as polysilicon or metal, from the silicon substrate, and as a gate oxide essential for device function. The thermal oxidation process occurs in furnaces set between 800°C to 1050°C. Utilizing high-purity steam and oxygen, the growth of thermal oxide is meticulously controlled, offering batch thickness uniformity of ±5% and within-wafer uniformity of ±3%. With different techniques used for growth, dry oxidation results in slower growth, higher density, and increased breakdown voltage, whereas wet oxidation allows faster growth, even at lower temperatures, facilitating the formation of thicker oxides. NanoSILICON, Inc. is equipped with state-of-the-art horizontal furnaces that manage such high-precision oxidation processes. These furnaces, due to their durable quartz construction, ensure stability and defect-free production. Additionally, the processing equipment, like the Nanometrics 210, inspects film thickness and uniformity using advanced optical reflection techniques, guaranteeing a high standard of production. With these capabilities, NanoSILICON Inc. supports a diverse range of wafer sizes and materials, ensuring superior quality oxide films that meet specific needs for your semiconductor designs.
The Human Body Detector is an ultra-low-power sensing technology designed to identify the presence of the human body while minimizing power usage. Its robust design enables effective detection whether a wearable device is being actively used or not, thus optimizing the power consumption especially for devices that sit idle when not worn. By employing advanced touch detection, it provides reliable recognition of dynamic touch events, making it a suitable choice for applications requiring functionality selection or awaken states. An ideal component for energy-efficient systems, this sensor enhances the operational versatility of wearable electronics, contributing significantly to battery longevity. As the technology targets the IoT and wearable device sectors, its capacity for reducing power draw without sacrificing performance is of immense value. Incorporated into various interactive electronics, the Human Body Detector sensor offers sophisticated interfacing with minimal energy requirements. Devices integrating this technology benefit from extended lifecycles due to the reduced energy footprint, aligning well with the growing demand for sustainable technology in consumer electronics.
The Ultra-Low-Power Temperature Sensor is meticulously designed to serve the ever-expanding IoT market, necessitating efficient power utilization. With its capacity to function at lower energy levels, this sensor is ideal for devices where maintaining battery life without compromising performance is essential. It offers precise thermal readings that are crucial for applications in temperature-sensitive environments, enhancing the operational efficiency of smart, connected devices. By providing accurate temperature monitoring with reduced energy draw, it supports the energy-saving facet of IoT integration. This sensor is particularly beneficial for energy harvesting applications, aligning with trends towards greener, more sustainable device operations. Its use case extends across various sectors, ensuring devices are thermally regulated without excessive power dependency, making it a staple for advanced IoT applications.
The agileTSENSE_A is a general-purpose temperature sensor that utilizes a ΔVBE sensing mechanism to amplify and transform temperature-related voltages into a single-ended signal. This sensor is designed to work seamlessly with the agileADC to provide digital outputs with impressive accuracy of +/-0.25°C. It's especially significant for modern SoCs, where thermal management is crucial for power optimization and security threat detection. This sensor covers a wide operating range from -20°C to +100°C. It features a rapid startup time and minimal current consumption, making it apt for SoC integrations where efficiency is key. Further customization options allow for ease of incorporation into diverse systems. Agile Analog designs are based on tried and tested architectures to ensure reliability and functionality. Our automated design methodology is programmatic, systematic and repeatable leading to analog IP that is more verifiable, more robust and more reliable. Our methodology also allows us to quickly re-target our IP to different process options. Our highly configurable and multi-node analog IP products are developed to meet the customer’s exact requirements. These digitally-wrapped and verified solutions can be seamlessly integrated into any SoC, significantly reducing complexity, time and costs.
The Capacitive Proximity Switch is engineered to achieve exceptional energy efficiency through its innovative design, allowing for precise touch and proximity detection with minimal power consumption. Its sharp sensitivity and low-power requisites make it a strong candidate for integration into energy-conscious devices that require efficient user interface solutions. With capabilities covering single keys, multi-keyboards, sliders, and proximity checks, this switch is diverse in its usability and applicability. It is particularly advantageous in scenarios requiring rapid response times for wake-up or functional shifts, ensuring seamless user experiences in daily electronic applications. This switch serves a vast array of industries, particularly enhancing products where low operational power is a critical feature. As technology trends move towards streamlined, battery-optimized gadgetry, the Capacitive Proximity Switch stands out as an essential component for future-forward electronic designs.
The X-REL series represents EASii IC's dedication to reliability and high-temperature endurance, crafted for extreme conditions. These semiconductor components are engineered to perform robustly in temperature ranges from -60°C to +230°C, serving a diverse range of sectors including aerospace, automotive, energy, and industrial applications. With a focus on longevity and system cost reduction, these components are ideal for environments demanding high durability over long periods. They are available in various packaging types, including ceramic and plastic, to accommodate different thermal management needs, supporting both harsh and moderate climates. X-REL semiconductors emphasize superior performance backed by worldwide distribution and customer support networks. The product line is ISO9001 and EN9100 certified, ensuring adherence to top international standards for aerospace and space applications.
The CANsec Controller Core is engineered to enhance the security of CAN networks by integrating robust cryptographic protocols and mechanisms that protect data integrity and confidentiality. This cutting-edge solution is tailored for automotive applications, providing an extra layer of security to combat the rising threats in vehicle systems as they increasingly connect to broader networks and the internet. CAN networks, widely used in vehicular communications, were originally designed without security in mind. This leaves them vulnerable to potential cyber-attacks, which is where the CANsec Controller Core comes into play. It bolsters the data transmission network by encrypting messages and authenticating commands, thus significantly mitigating the risk of interception or malicious tampering. With its seamless integration capabilities, the CANsec Controller Core can be adopted without major modifications to existing network infrastructures, making it an ideal choice for gradual implementation in both new and legacy systems. Its flexibility and robust security features make it an invaluable tool for manufacturers aiming to enhance the security resilience of their automotive technologies while adhering to evolving industry standards.
Tower Semiconductor's non-imaging sensor technology is designed for a host of applications beyond visual data acquisition. These sensors play a critical role in diverse fields such as environmental monitoring, industrial automation, and automotive safety systems, where the capture of non-visual data is essential. These sensors leverage advanced analog and mixed-signal processing capabilities, providing accurate detection and measurement of various parameters like temperature, pressure, and proximity. This capability is crucial in scenarios requiring precise data for process control and environment sensing. Tower Semiconductor ensures these solutions maintain high levels of efficacy and reliability across different operating conditions. The non-imaging sensor technology integrates seamlessly with other systems, enabling real-time data evaluation and response. The versatility of these sensors makes them suitable for integration into complex systems, ensuring broader application coverage and enhanced system capabilities in technology-driven environments.
The LDPC Decoder for 5G NR by Mobiveil is crafted to ensure seamless decoding within modern cellular networks. Incorporating the Min-Sum decoding algorithm, it ensures optimal performance while reducing power consumption and silicon area usage. This decoder is equipped with programmable bit widths, allowing for tailored configurations to suit specific application requirements during the compile phase. The inclusion of an early iteration termination feature, driven by an integrated parity check engine, supports efficiency by enabling preemptive exits during iterative processes. By accommodating retries with hybrid automatic repeat requests (HARQ), the decoder maintains robustness across various transmission conditions. This adaptability makes it an invaluable component for 5G networks, where data integrity and fast processing are paramount.
Designed for accurate temperature monitoring applications, the Linear Temperature Sensor ensures precise thermal readings across a wide range of conditions. It integrates easily into a variety of systems, providing reliable data necessary for effective thermal management in electronic and industrial environments.
The SAR ADC with integrated temperature sensor is crafted for applications that demand precise voltage and temperature monitoring. It is designed to operate efficiently with low-frequency signals, making it perfect for DC measurements like temperature changes. The ADC's successive approximation technique ensures a meticulous conversion process, yielding a resolution of 12 bits. Operating at 20 kSPS, this ADC provides a differential input range of 1.0 V, making it well-suited for fine measurements in compact devices. Its temperature sensing capability covers a range from -40 to +125°C, with calibrations that can be executed at room temperature for optimized performance. What sets this ADC apart is its integration of a bandgap reference voltage, which allows for easy system incorporation due to reduced external component requirements. This enables its deployment across various demanding environments without compromising on precision or reliability.
The TS5111 and TS5110 device incorporate thermal sensing capability which is controlled and read over two wire bus. These device operate on I2C and I3C two wire serial bus interface. The TS5 designed for Memory Module Applications. The TS5 device intended to operate up to 12.5 MHz on a I3C Basic Bus or up to 1 MHz on a I2C Bus. All TS5 devices respond to specific pre-defined device select code on the I2C/I3C Bus.
The ADC / Temp. Sensor offered by M31 serves dual functions, delivering both analog-to-digital conversion capabilities and precise temperature sensing. This module is a valuable component in a variety of applications, including those in consumer electronics, automotive, and industrial systems, where accurate data acquisition and monitoring are crucial. The analog-to-digital converter part of the module ensures high fidelity conversion of analog signals into digital data, supporting a range of input signal frequencies with precision. The temperature sensing aspect complements this functionality by providing accurate real-time thermal readings, which are critical for maintaining device reliability and performance under varying environmental conditions. By offering these capabilities in a unified solution, M31's ADC / Temp. Sensor module reduces the need for additional components, streamlining system complexity and potentially lowering production costs. It is optimized for low power consumption, which is essential for modern devices aiming for extended battery life and energy efficiency.
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