All IPs > Analog & Mixed Signal > Temperature Sensor
The category of Analog & Mixed Signal > Temperature Sensor in the Silicon Hub encompasses a wide range of semiconductor IPs designed to enable precise temperature monitoring within various electronic systems. These IPs are pivotal in ensuring reliable performance of electronic products by providing accurate temperature data, which is essential for maintaining optimal operating conditions and preventing thermal-related failures.
Temperature sensors within this category come in diverse forms, including analog and digital outputs, leveraging innovative mixed signal design techniques to achieve high precision despite varying environmental conditions. Key applications of these semiconductor IPs can be found in sectors such as consumer electronics, automotive, industrial automation, and healthcare devices, where temperature monitoring is critical for operational efficiency and safety.
Integrating temperature sensor IPs into semiconductor designs simplifies system architecture by reducing the need for additional discrete components, thereby saving space and power while enhancing overall functionality. In automotive applications, for example, these sensors are crucial for monitoring engine temperature, battery thermal management, and cabin climate control systems. In consumer electronics, they ensure safe battery operation and efficient thermal management for gadgets like smartphones and laptops.
Overall, temperature sensor semiconductor IPs play a vital role in the development of modern electronic systems by providing the precise temperature measurement capabilities required for various thermal management applications. Silicon Hub offers a comprehensive selection of these IPs, tailored to meet the stringent demands of today’s advanced technology ecosystems, ensuring your products are equipped with the latest in thermal sensing innovation.
The Time-Triggered Protocol (TTP) stands out as a robust framework for ensuring synchronous communication in embedded control systems. Developed to meet stringent aerospace industry criteria, TTP offers a high degree of reliability with its fault-tolerant configuration, integral to maintaining synchrony across various systems. This technology excels in environments where timing precision and data integrity are critical, facilitating accurate information exchange across diverse subsystems. TTTech’s TTP implementation adheres to the SAE AS6003 standard, making it a trusted component among industry leaders. As part of its wide-ranging applications, this protocol enhances system communication within commercial avionic solutions, providing dependable real-time data handling that ensures system stability. Beyond aviation, TTP's applications can also extend into the energy sector, demonstrating its versatility and robustness. Characterized by its deterministic nature, TTP provides a framework where every operation is scheduled, leading to predictable data flow without unscheduled interruptions. Its suitability for field-programmable gate arrays (FPGAs) allows for easy adaptation into existing infrastructures, making it a versatile tool for companies aiming to upgrade their communication systems without a complete overhaul. For engineers and developers, TTP provides a dependable foundation that streamlines the integration process while safeguarding communication integrity.
The Chipchain C100 is a pioneering solution in IoT applications, providing a highly integrated single-chip design that focuses on low power consumption without compromising performance. Its design incorporates a powerful 32-bit RISC-V CPU which can reach speeds up to 1.5GHz. This processing power ensures efficient and capable computing for diverse IoT applications. This chip stands out with its comprehensive integrated features including embedded RAM and ROM, making it efficient in both processing and computing tasks. Additionally, the C100 comes with integrated Wi-Fi and multiple interfaces for transmission, broadening its application potential significantly. Other notable features of the C100 include an ADC, LDO, and a temperature sensor, enabling it to handle a wide array of IoT tasks more seamlessly. With considerations for security and stability, the Chipchain C100 facilitates easier and faster development in IoT applications, proving itself as a versatile component in smart devices like security systems, home automation products, and wearable technology.
ISELED represents a breakthrough in automotive lighting with its integration of RGB LED control and communication in a single, smart LED component. This innovative system simplifies lighting design by enabling digital color value input for immediate autonomous color mixing and temperature adjustments, reducing both complexity and cost in vehicles. ISELED operates by implementing a manufacturer-calibrated RGB LED setup suitable for diverse applications, from ambient to functional lighting systems within vehicles. Utilizing a bidirectional communication protocol, ISELED manages up to 4,079 addressable LEDs, offering easy installation and high precision control over individual light characteristics, ideal for creating dynamic and at times synchronized lighting across the automotive interior. This technology ultimately enhances network resilience with features like DC/DC conversion from a standard 12V battery, consistent communication despite power variations, and compatibility with software-free Ethernet bridge systems for streamlined connectivity. This strong focus on reducing production and operational costs, while simultaneously broadening lighting functionality, positions ISELED as a modern solution for smart automotive lighting architectures.
Tower Semiconductor's BCD technology is engineered to provide superior power management solutions by integrating Bipolar, CMOS, and DMOS processes on a single chip. This integration facilitates the development of power devices with high voltage withstand capabilities and efficient power handling properties. BCD technology is key in designing power ICs that support a range of applications from DC-DC converters to motor drivers. These integrated circuits benefit from the low on-resistance of DMOS, the digital control capabilities of CMOS, and the high gain of Bipolar components, making them versatile for various high-performance electronic devices. Furthermore, BCD technology's robustness and reliability are matched by its capacity to function at higher voltages and temperatures, which are critical in driving performance in automotive and industrial power applications. Its deployment in next-generation power management solutions underscores the commitment to efficiency and innovation in power electronics.
The MVDP2000 series represents MEMS Vision's advanced offering in differential pressure sensing, employing a proprietary capacitive sensing technology. These sensors are digitally calibrated across both pressure and temperature ranges, making them ideal for applications demanding high sensitivity, speed, and efficiency, such as medical, HVAC, and filter monitoring systems. The sensors are characterized by a quick response time of down to 1.0 ms and a substantial measurement range of ±5 kPa to ±10 kPa. They ensure precise readings with a total error band of less than 1.0 %FS and permit integration in a wide array of environmental conditions, from -40°C to 85°C. The compact 7 x 7 mm DFN package ensures easy deployment in constrained spaces. With digital I2C as well as analog output modes, the MVDP2000 sensors are highly adaptable to various system requirements. Despite their advanced capabilities, these sensors maintain a low power profile with a current consumption of just 2.85 µA at one measurement per second, making them suitable for battery-powered applications.
Analog Bits offers high-accuracy sensor IPs engineered to detect and measure various parameters crucial for maintaining device performance and reliability. These sensors are tailored for precision temperature measurement, power supply monitoring, and process variable tracking. By incorporating advanced features, they provide real-time data for optimizing operational efficiencies in various semiconductor applications. These sensor solutions are instrumental in managing system power integrity by providing detailed insights into power consumption patterns and environmental conditions. The integration of these sensors enables smart systems to adjust dynamically, enhancing overall performance while reducing power consumption. This capability is particularly valuable in sectors such as automotive, industrial automation, and edge computing where continuous monitoring and swift responsiveness are essential. Furthermore, Analog Bits’ sensors are constructed to operate under varying environmental conditions, ensuring they deliver reliable data across a wide range of temperatures and voltages. The use of such sensors in smart appliances and automotive systems underscores their importance in advancing the development of intelligent devices that require precise monitoring and control.
Microdul's Human Body Detector for Ultra-Low-Power is designed to detect proximity and presence with minimal energy consumption. Its efficient power usage extends the operational life of battery-driven devices, making it ideal for wearable technology. The device functions effectively in both dynamic and static modes, facilitating reduced power draw when the device is not actively being worn. This attention to power conservation makes the Human Body Detector a vital component for maintaining energy efficiency in modern electronic applications.
The MVH4000 series from MEMS Vision provides high-precision, fully calibrated sensors specifically designed for humidity and temperature measurements. These sensors are crafted using advanced Silicon Carbide MEMS technology, which ensures robust performance and excellent long-term stability. Their rapid response time and minimal power consumption make them ideal for applications where space is at a premium. MEMS Vision has equipped these sensors with on-chip calibration, facilitating easy integration and plug-and-play operation in industrial, consumer, medical, and automotive fields. One of the standout features of the MVH4000 series is its low power consumption, with current use as low as 0.62 µA. This extends battery life significantly, making the sensors suited for portable devices. Their compact size (2.5 x 2.5 x 0.9 mm) makes them ideal where PCB space is critical. The sensors maintain high accuracy, with RH precision of ±1.5% and temperature accuracy of ±0.2°C, alongside a fast RH response time of less than 4 seconds. The sensors are available in both digital and analog outputs, catering to various design requirements. Evaluation kits and modules can also be procured for testing and integration purposes. With a broad operating temperature range from -40°C to 125°C, these sensors prove to be exceptionally versatile for myriad applications.
eSi-Analog offers a collection of silicon-proven analog IP blocks integral to the performance of systems requiring sophisticated analog functions. This diverse selection includes components such as oscillators, SMPSs, LDOs, temperature sensors, PLLs, and sensor interfaces, all optimized for low power consumption. These analog solutions boast a high degree of customizability to meet specific SoC requirements, aiding rapid integration and reducing time-to-market.
Designed for precision and reliability, the MVT4000D series of digital temperature sensors by MEMS Vision are ideal for high-accuracy applications. Utilizing their proprietary Silicon Carbide MEMS technology, these sensors deliver excellent stability and rapid response times. With a focus on minimizing power usage, they offer a perfect solution for battery-operated and portable devices, ensuring longevity and efficiency. The MVT4000D sensors boast an incredibly low power consumption of less than 0.18 µA, which significantly extends battery life, making them suitable for sensitive applications. Their high accuracy, typified by a temperature precision of ±0.2°C, supports tighter process control across a working range of -40°C to 125°C. Available with on-chip calibration, they are ready for immediate integration, supporting a range of industrial and consumer applications. Built with a small form factor (2.5 x 2.5 x 0.9 mm), these sensors are perfect where space is constrained. The sensors support digital I2C interfaces facilitating seamless connectivity in complex systems. The variations within the MVT4000D series allow for different accuracy grades, accommodating various budgetary and technical needs.
Designed for Internet of Things (IoT) and energy harvesting applications, Microdul's Ultra-Low-Power Temperature Sensor efficiently measures temperature with minimal power usage. This sensor helps conserve system power, thereby lengthening the battery-operated devices' lifespan. The design focuses on combining low energy consumption with precise temperature readings, which is ideal for various smart devices requiring consistent and reliable performance in tracking environmental changes.
Thermal oxide, often referred to as SiO2, is an essential film used in creating various semiconductor devices, ranging from simple to complex structures. This dielectric film is created by oxidizing silicon wafers under controlled conditions using high-purity, low-defect silicon substrates. This process produces a high-quality oxide layer that serves two main purposes: it acts as a field oxide to electrically insulate different layers, such as polysilicon or metal, from the silicon substrate, and as a gate oxide essential for device function. The thermal oxidation process occurs in furnaces set between 800°C to 1050°C. Utilizing high-purity steam and oxygen, the growth of thermal oxide is meticulously controlled, offering batch thickness uniformity of ±5% and within-wafer uniformity of ±3%. With different techniques used for growth, dry oxidation results in slower growth, higher density, and increased breakdown voltage, whereas wet oxidation allows faster growth, even at lower temperatures, facilitating the formation of thicker oxides. NanoSILICON, Inc. is equipped with state-of-the-art horizontal furnaces that manage such high-precision oxidation processes. These furnaces, due to their durable quartz construction, ensure stability and defect-free production. Additionally, the processing equipment, like the Nanometrics 210, inspects film thickness and uniformity using advanced optical reflection techniques, guaranteeing a high standard of production. With these capabilities, NanoSILICON Inc. supports a diverse range of wafer sizes and materials, ensuring superior quality oxide films that meet specific needs for your semiconductor designs.
The MVWS4000 series combines humidity, pressure, and temperature sensing in a singular compact module, making it ideal for weather monitoring and other multi-sensor applications. These digital sensors are crafted with Silicon Carbide technology, offering reliability with minimal power demand, which is essential for battery-powered applications and original equipment manufacturers (OEM). Each sensor in the series delivers rapid and accurate environmental measurements, with humidity accuracy at ±1.5%, pressure accuracy to within ±1.0 hPa, and temperature precision of ±0.3°C. Their long-term stability and low current consumption underpin their lasting performance in critical systems. Operating within an extensive range—0 to 100 %RH, 300 to 1100 hPa, and -40°C to 85°C—they suit various environmental conditions and applications. Available in different accuracy specifications, these sensors ensure flexibility to meet distinct requirements and budgets. The small footprint (2.5 x 2.5 x 0.91 mm) allows them to be implemented in space-sensitive applications effectively, while the digital I2C and SPI output options provide easy integration with existing systems.
The agileTSENSE_D temperature sensor provides a digital output, extending the capabilities of traditional temperature sensing by incorporating digital signal processing. It retains the core analog sensing mechanism but wraps the output in a digital format for easier integration into modern digital systems, including IoT devices and data centers. This product is designed for environments where digital interfacing is critical. With its adaptable architecture, the agileTSENSE_D delivers precision temperature measurements over a broad operational range, ensuring that systems maintain optimal performance and safety. This functionality is crucial for thermal monitoring and management. Agile Analog designs are based on tried and tested architectures to ensure reliability and functionality. Our automated design methodology is programmatic, systematic and repeatable leading to analog IP that is more verifiable, more robust and more reliable. Our methodology also allows us to quickly re-target our IP to different process options. Our highly configurable and multi-node analog IP products are developed to meet the customer’s exact requirements. These digitally-wrapped and verified solutions can be seamlessly integrated into any SoC, significantly reducing complexity, time and costs.
The agileTSENSE_A is a general-purpose temperature sensor that utilizes a ΔVBE sensing mechanism to amplify and transform temperature-related voltages into a single-ended signal. This sensor is designed to work seamlessly with the agileADC to provide digital outputs with impressive accuracy of +/-0.25°C. It's especially significant for modern SoCs, where thermal management is crucial for power optimization and security threat detection. This sensor covers a wide operating range from -20°C to +100°C. It features a rapid startup time and minimal current consumption, making it apt for SoC integrations where efficiency is key. Further customization options allow for ease of incorporation into diverse systems. Agile Analog designs are based on tried and tested architectures to ensure reliability and functionality. Our automated design methodology is programmatic, systematic and repeatable leading to analog IP that is more verifiable, more robust and more reliable. Our methodology also allows us to quickly re-target our IP to different process options. Our highly configurable and multi-node analog IP products are developed to meet the customer’s exact requirements. These digitally-wrapped and verified solutions can be seamlessly integrated into any SoC, significantly reducing complexity, time and costs.
The LDPC Decoder caters to 5G Network Release (NR) standards, providing a reliable decoding process crucial for modern communication systems. Utilizing the Min-Sum decoding algorithm, it offers configurable bit widths and supports early termination through a concurrent parity check engine, enhancing decoding efficiency. In addition, the decoder’s architecture accommodates flexible iteration settings, optimal for applications reliant on re-transmission protocols such as HARQ. Embedded in its design is a focus on reducing power usage and maximizing throughput, suitable for various network scenarios and demanding 5G applications.
The CANsec Controller Core offers a secure and robust solution for Controller Area Network (CAN) communications. Built with advanced security protocols, it ensures the protection of data within automotive systems. This core supports both traditional and new-generation CAN and CAN FD protocols, providing flexibility and enhanced functionality in vehicle networks. Designed to meet stringent automotive safety standards, the controller core integrates seamlessly with existing systems, adding an additional layer of security. Engineers can easily implement this solution to guard against malicious intrusions and data tampering, ensuring reliable communication paths in automotive environments. Its architecture supports high-speed data processing while maintaining low power usage, vital for modern applications that demand efficiency and reliability. Automotive developers will find this core an invaluable asset in creating secure, interconnected vehicle systems.
The Capacitive Proximity Switch from Microdul is an energy-efficient solution for detecting touch and proximity in electronic devices. This switch is characterized by its low power requirements, aiding in the extension of battery life for handheld and portable gadgets. Its adaptability allows it to be used for single keys, keypads, sliders, or proximity switches. The device can efficiently distinguish between different types of touch events, helping select features or wake up devices without unnecessary energy consumption.
X-REL is EASii IC’s line of semiconductor products explicitly tailored for extreme environments, featuring extraordinary reliability at temperatures ranging from -60°C to +230°C. These high-reliability components address the rigorous demands across sectors like oil and gas, geothermal energy, aerospace, and automotive. Available in various packages, including ceramic, metal, and, for less constrained environments, plastic, X-REL products offer extended life with minimum system cost. These components are engineered to fulfill the need for continuous operation under severe conditions, delivering five years of guaranteed reliability. X-REL’s diverse lineup encompasses power management solutions, clock and timing circuits, discrete transistors and diodes, and interfaces. The robust performance of these components, coupled with certifications like ISO9001 and EN9100, underscores their suitability for mission-critical applications, where traditional designs may falter due to adverse heat and stress.
Tower Semiconductor’s Non Imaging Sensor Technology addresses the growing need for high-performance sensors in diverse applications. This technology specialization targets sensors that capture various forms of data excluding traditional visual data, playing a pivotal role in automotive, industrial, and consumer products. The sensors benefit from Tower Semiconductor's advances in process technology, ensuring high sensitivity and stability crucial for efficient operation in harsh environments. Applications range from environmental monitoring to safety and automation systems, where these sensor technologies provide critical data input. Furthermore, they are recognized for their reliability and robustness, supporting long-term operation in demanding settings. This sensor technology platform underlines Tower Semiconductor's commitment to innovating control and sensing solutions that enhance functionality in an array of electronic applications and systems.
TES's Linear Temperature Sensor is a precision device designed to provide accurate temperature measurements over a range of operating conditions. Engineered for linear response, it delivers consistent performance with minimal deviation across varying environmental parameters. This sensor is typically employed in applications requiring precise thermal monitoring, such as industrial automation, automotive climate control, and consumer electronics. Its compact design and low power consumption make it suitable for incorporation into a variety of systems with stringent size and energy constraints. The linear temperature sensor exemplifies reliability and precision, enabling sophisticated temperature regulation in advanced electronic apparatus.
The SAR ADC with Temperature Sensor is a highly precise, successive approximation register analog-to-digital converter designed for applications demanding accurate temperature monitoring. It features integrated temperature sensing capabilities, providing 0.1°C resolution. The ADC offers reliable conversion at speeds of up to 100 KSPS, ensuring swift data acquisition for control and monitoring systems. Its low-power design makes it suitable for portable and battery-operated devices, where power efficiency is crucial. This ADC is adaptable across multiple process nodes, allowing flexibility in integration for various electronic applications.
The TS5111 and TS5110 device incorporate thermal sensing capability which is controlled and read over two wire bus. These device operate on I2C and I3C two wire serial bus interface. The TS5 designed for Memory Module Applications. The TS5 device intended to operate up to 12.5 MHz on a I3C Basic Bus or up to 1 MHz on a I2C Bus. All TS5 devices respond to specific pre-defined device select code on the I2C/I3C Bus.
This digital temperature sensor utilizes a delta-sigma modulator for temperature tracking accuracy of less than ±2°C, offering flexible resolution in temperature monitoring applications. Engineered in a 180nm process, it is aimed at enhancing thermal management in silicon-based systems.
Using a SAR-based architecture, this self-contained sensor is optimized for rapid temperature acquisition with minimal power consumption. Situated in a 65nm process, it integrates a low-jitter ring oscillator, enhancing its suitability for low-power environments.
Join the world's most advanced semiconductor IP marketplace!
It's free, and you'll get all the tools you need to discover IP, meet vendors and manage your IP workflow!
No credit card or payment details required.
Join the world's most advanced AI-powered semiconductor IP marketplace!
It's free, and you'll get all the tools you need to advertise and discover semiconductor IP, keep up-to-date with the latest semiconductor news and more!
Plus we'll send you our free weekly report on the semiconductor industry and the latest IP launches!